KR102468904B1 - 이격 장치 및 이격 방법 - Google Patents

이격 장치 및 이격 방법 Download PDF

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Publication number
KR102468904B1
KR102468904B1 KR1020150170398A KR20150170398A KR102468904B1 KR 102468904 B1 KR102468904 B1 KR 102468904B1 KR 1020150170398 A KR1020150170398 A KR 1020150170398A KR 20150170398 A KR20150170398 A KR 20150170398A KR 102468904 B1 KR102468904 B1 KR 102468904B1
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KR
South Korea
Prior art keywords
holding
tension
adhesive sheet
moving
holding means
Prior art date
Application number
KR1020150170398A
Other languages
English (en)
Korean (ko)
Other versions
KR20160068669A (ko
Inventor
기미히코 가와사키
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20160068669A publication Critical patent/KR20160068669A/ko
Application granted granted Critical
Publication of KR102468904B1 publication Critical patent/KR102468904B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020150170398A 2014-12-05 2015-12-02 이격 장치 및 이격 방법 KR102468904B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014247092A JP6408366B2 (ja) 2014-12-05 2014-12-05 離間装置および離間方法
JPJP-P-2014-247092 2014-12-05

Publications (2)

Publication Number Publication Date
KR20160068669A KR20160068669A (ko) 2016-06-15
KR102468904B1 true KR102468904B1 (ko) 2022-11-18

Family

ID=56124808

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150170398A KR102468904B1 (ko) 2014-12-05 2015-12-02 이격 장치 및 이격 방법

Country Status (4)

Country Link
JP (1) JP6408366B2 (zh)
KR (1) KR102468904B1 (zh)
CN (1) CN105679694B (zh)
TW (1) TWI665755B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018160580A (ja) * 2017-03-23 2018-10-11 株式会社ディスコ 拡張装置及び拡張方法
JP6880431B2 (ja) * 2017-04-11 2021-06-02 リンテック株式会社 離間装置および離間方法
JP7073606B2 (ja) * 2017-04-11 2022-05-24 リンテック株式会社 離間装置および離間方法
JP6996046B2 (ja) * 2017-05-10 2022-01-17 リンテック株式会社 離間装置および離間方法
JP6884961B2 (ja) * 2017-05-10 2021-06-09 リンテック株式会社 離間装置および離間方法
JP6880433B2 (ja) * 2017-05-10 2021-06-02 リンテック株式会社 離間装置および離間方法
JP6820099B2 (ja) * 2017-05-10 2021-01-27 リンテック株式会社 離間装置および離間方法
JP6848151B2 (ja) * 2017-05-29 2021-03-24 リンテック株式会社 離間装置および離間方法
JP6912938B2 (ja) * 2017-05-29 2021-08-04 リンテック株式会社 離間装置および離間方法
JP6941022B2 (ja) * 2017-10-06 2021-09-29 株式会社ディスコ 拡張方法及び拡張装置
JP7076204B2 (ja) * 2017-12-20 2022-05-27 株式会社ディスコ 分割装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151231A (ja) 2010-01-22 2011-08-04 Sanyo Electric Co Ltd 半導体モジュールの製造方法
JP2013026544A (ja) * 2011-07-25 2013-02-04 Disco Abrasive Syst Ltd ウェーハ拡張装置
JP2014143313A (ja) * 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd 拡張装置および拡張方法
JP2014207358A (ja) 2013-04-15 2014-10-30 株式会社ディスコ テープ拡張装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339854A (en) * 1976-09-24 1978-04-12 Hitachi Ltd Jig for spacing
JPS5898940A (ja) * 1981-12-09 1983-06-13 Nec Corp 半導体素子取出し装置
CN100547752C (zh) * 2005-05-19 2009-10-07 琳得科株式会社 粘附装置
JP4880293B2 (ja) * 2005-11-24 2012-02-22 リンテック株式会社 シート貼付装置及び貼付方法
JP5485570B2 (ja) * 2009-03-23 2014-05-07 リンテック株式会社 光照射装置及び光照射方法
JP6009885B2 (ja) * 2012-09-24 2016-10-19 株式会社ディスコ テープ拡張装置
US20140339673A1 (en) * 2013-05-14 2014-11-20 Texas Instruments Incorporated Wafer processing
CN204789359U (zh) * 2015-05-27 2015-11-18 中科瑞阳膜技术（北京）有限公司 一种膜片缺陷检测器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151231A (ja) 2010-01-22 2011-08-04 Sanyo Electric Co Ltd 半導体モジュールの製造方法
JP2013026544A (ja) * 2011-07-25 2013-02-04 Disco Abrasive Syst Ltd ウェーハ拡張装置
JP2014143313A (ja) * 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd 拡張装置および拡張方法
JP2014207358A (ja) 2013-04-15 2014-10-30 株式会社ディスコ テープ拡張装置

Also Published As

Publication number Publication date
TWI665755B (zh) 2019-07-11
TW201633446A (zh) 2016-09-16
JP2016111188A (ja) 2016-06-20
KR20160068669A (ko) 2016-06-15
CN105679694A (zh) 2016-06-15
JP6408366B2 (ja) 2018-10-17
CN105679694B (zh) 2020-07-28

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