JP7076204B2 - 分割装置 - Google Patents
分割装置 Download PDFInfo
- Publication number
- JP7076204B2 JP7076204B2 JP2017244119A JP2017244119A JP7076204B2 JP 7076204 B2 JP7076204 B2 JP 7076204B2 JP 2017244119 A JP2017244119 A JP 2017244119A JP 2017244119 A JP2017244119 A JP 2017244119A JP 7076204 B2 JP7076204 B2 JP 7076204B2
- Authority
- JP
- Japan
- Prior art keywords
- unit
- workpiece
- sheet
- gas
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Description
3 分割予定ライン
5 表面
7 エキスパンドシート
8 環状フレーム
9 被加工物ユニット
10 分割装置
20 チャンバ
30 保持テーブル
40 フレーム固定部
50 シート拡張ユニット
60 加熱ユニット
62 加熱部
70 気体供給ユニット
71 噴射口
80 吸引排気ユニット
81 排気ブロック
811 吸気口
90 補助吸引排気ユニット
91 排気筒
96 制御ユニット
100 改質層(分割起点)
101 環状領域
110 チップ
111 間隔
150 供給気体
160 発生ガス
Claims (1)
- 分割予定ラインに沿って分割起点が形成された板状の被加工物と、該被加工物が貼着されたエキスパンドシートと、該エキスパンドシートの外周が貼着された環状フレームとからなる被加工物ユニットの該エキスパンドシートを拡張して該被加工物を破断する分割装置であって、
該被加工物ユニットの該環状フレームを固定するフレーム固定部と、
該被加工物の外周と該環状フレームの内周の該エキスパンドシートの環状領域を該被加工物と直交する方向に押圧して該エキスパンドシートを拡張し、該分割起点から該被加工物を破断するシート拡張ユニットと、
該拡張された該エキスパンドシートの該環状領域を加熱して収縮させる加熱部を有する加熱ユニットと、
該エキスパンドシートの加熱中、該被加工物の表面に気体を供給して、この供給気体で該被加工物の表面を覆い、該エキスパンドシートから発生する発生ガスから該被加工物を遮蔽する気体供給ユニットと、
該被加工物の外周で該発生ガス及び該供給気体を吸引して排気する吸引排気ユニットと、
を備え、
該吸引排気ユニットの吸気口は、該環状領域に対面して該加熱部に隣接して配置される分割装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017244119A JP7076204B2 (ja) | 2017-12-20 | 2017-12-20 | 分割装置 |
KR1020180153354A KR20190074961A (ko) | 2017-12-20 | 2018-12-03 | 분할 장치 |
CN201811550001.8A CN110010522B (zh) | 2017-12-20 | 2018-12-18 | 分割装置 |
TW107145842A TWI782160B (zh) | 2017-12-20 | 2018-12-19 | 分割裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017244119A JP7076204B2 (ja) | 2017-12-20 | 2017-12-20 | 分割装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019110268A JP2019110268A (ja) | 2019-07-04 |
JP7076204B2 true JP7076204B2 (ja) | 2022-05-27 |
Family
ID=67066277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017244119A Active JP7076204B2 (ja) | 2017-12-20 | 2017-12-20 | 分割装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7076204B2 (ja) |
KR (1) | KR20190074961A (ja) |
TW (1) | TWI782160B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7325258B2 (ja) | 2019-08-14 | 2023-08-14 | 株式会社ディスコ | エキスパンド装置 |
KR20240021306A (ko) * | 2021-09-14 | 2024-02-16 | 야마하하쓰도키 가부시키가이샤 | 익스팬드 장치 |
KR102542890B1 (ko) * | 2023-04-03 | 2023-06-13 | 남진우 | 웨이퍼 신장 장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013051368A (ja) | 2011-08-31 | 2013-03-14 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
JP2014140856A (ja) | 2013-01-22 | 2014-08-07 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2016015360A (ja) | 2014-07-01 | 2016-01-28 | 株式会社ディスコ | チップ間隔維持装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5791866A (en) | 1980-11-26 | 1982-06-08 | Kubota Ltd | Production of composite roll for rolling which is not constant in thickness of outside shell layer |
JP6408366B2 (ja) * | 2014-12-05 | 2018-10-17 | リンテック株式会社 | 離間装置および離間方法 |
-
2017
- 2017-12-20 JP JP2017244119A patent/JP7076204B2/ja active Active
-
2018
- 2018-12-03 KR KR1020180153354A patent/KR20190074961A/ko not_active Application Discontinuation
- 2018-12-19 TW TW107145842A patent/TWI782160B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013051368A (ja) | 2011-08-31 | 2013-03-14 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
JP2014140856A (ja) | 2013-01-22 | 2014-08-07 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2016015360A (ja) | 2014-07-01 | 2016-01-28 | 株式会社ディスコ | チップ間隔維持装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20190074961A (ko) | 2019-06-28 |
TWI782160B (zh) | 2022-11-01 |
CN110010522A (zh) | 2019-07-12 |
JP2019110268A (ja) | 2019-07-04 |
TW201929064A (zh) | 2019-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102250467B1 (ko) | 칩 간격 유지 장치 | |
JP7076204B2 (ja) | 分割装置 | |
JP5409280B2 (ja) | チップ間隔拡張方法 | |
JP6901909B2 (ja) | エキスパンド方法及びエキスパンド装置 | |
JP2011077482A (ja) | テープ拡張装置 | |
JP7030469B2 (ja) | テープ拡張装置及びテープ拡張方法 | |
JP2015204362A (ja) | チップ間隔維持方法 | |
JP6266429B2 (ja) | チップ間隔維持装置及びチップ間隔維持方法 | |
JP2016181659A (ja) | 拡張装置 | |
CN112397416A (zh) | 扩展装置 | |
CN110010522B (zh) | 分割装置 | |
JP7313219B2 (ja) | エキスパンド方法及びエキスパンド装置 | |
JP7437963B2 (ja) | エキスパンド装置 | |
JP7242130B2 (ja) | エキスパンド装置 | |
JP2021153113A (ja) | 拡張装置及びデバイスチップの製造方法 | |
KR20190079512A (ko) | 피가공물의 분할 방법 및 분할 장치 | |
KR20230136532A (ko) | 확장 방법 | |
JP2021034697A (ja) | テープ拡張装置 | |
JP2023047339A (ja) | レーザビーム式ウェハダイシング装置のためのウェハチャック | |
KR20210111696A (ko) | 분할 방법 및 분할 장치 | |
JP2023000270A (ja) | ウェーハの加工方法及び拡張装置 | |
KR20240021304A (ko) | 익스팬드 장치 및 익스팬드 방법 | |
JP2022129009A (ja) | 拡張装置 | |
JP2020177951A (ja) | エキスパンド装置、エキスパンド方法 | |
JP2022119535A (ja) | 拡張装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201015 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210930 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211005 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211201 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220426 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220517 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7076204 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |