JP2016015360A - チップ間隔維持装置 - Google Patents
チップ間隔維持装置 Download PDFInfo
- Publication number
- JP2016015360A JP2016015360A JP2014135532A JP2014135532A JP2016015360A JP 2016015360 A JP2016015360 A JP 2016015360A JP 2014135532 A JP2014135532 A JP 2014135532A JP 2014135532 A JP2014135532 A JP 2014135532A JP 2016015360 A JP2016015360 A JP 2016015360A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- far
- expanded
- sheet
- expanded sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 20
- 230000001678 irradiating effect Effects 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 claims abstract description 9
- 239000007924 injection Substances 0.000 claims abstract description 9
- 238000011109 contamination Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 239000000243 solution Substances 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】エキスパンドシート(23)に貼着された被加工物(11)を分割して形成した複数のチップ(27)の間隔を拡張した状態に維持するチップ間隔維持装置(2)であって、被加工物の外周縁と環状フレーム(25)の内周との間の拡張されたエキスパンドシートに向けて遠赤外線(A)を照射し、エキスパンドシートを収縮させる遠赤外線照射手段(42)と、遠赤外線照射手段に隣接して配設され、遠赤外線照射手段がエキスパンドシートに向けて遠赤外線を照射する際に被加工物に対して気体(B)を噴射する噴射口(44a)を有し、被加工物の上方にエアー層を形成するエアー層形成手段(44)と、を備える構成とした。
【選択図】図2
Description
4 支持テーブル(テーブル)
6 枠体
8 多孔質部材
8a 支持面
10 吸引路
12 バルブ
14 吸引源
16 シートヒータ
18 支持テーブル昇降機構(拡張手段)
20 シリンダケース
22 ピストンロッド
24 外周テーブル
26 外周テーブル昇降機構(拡張手段)
28 シリンダケース
30 ピストンロッド
32 載置テーブル
32a 開口
34 載置テーブル昇降機構
36 シリンダケース
38 ピストンロッド
40 プレート(固定手段)
40a 開口
42 遠赤外線ヒータ(遠赤外線照射手段)
44 エアー層形成ユニット(エアー層形成手段)
44a 噴射口
46 回転軸
46a 供給路
48 バルブ
50 気体供給源
11 被加工物
11a 表面
11b 裏面
13 デバイス領域
15 外周余剰領域
17 ストリート(分割予定ライン)
19 デバイス
21 改質層
23 エキスパンドシート
25 環状フレーム
27 チップ
A 遠赤外線
B 気体
Claims (1)
- エキスパンドシートに貼着された被加工物を分割して形成した複数のチップの間隔を拡張した状態に維持するチップ間隔維持装置であって、
被加工物を支持する支持面を有し、エキスパンドシートを介して複数のチップに分割された被加工物を吸引保持可能なテーブルと、
該エキスパンドシートが装着された環状フレームを該テーブルの外周部に固定する固定手段と、
該エキスパンドシートを拡張し、複数の該チップ間に間隔を形成する拡張手段と、
該テーブルの該支持面の上方に配設され、被加工物の外周縁と該環状フレームの内周との間の拡張された該エキスパンドシートに向けて遠赤外線を照射し、該エキスパンドシートを収縮させる遠赤外線照射手段と、
該遠赤外線照射手段を、該エキスパンドシートに対して遠赤外線を照射する照射位置と退避位置とに位置付ける位置付け手段と、
該遠赤外線照射手段に隣接して配設され、該遠赤外線照射手段が該エキスパンドシートに向けて遠赤外線を照射する際に被加工物に対して気体を噴射する噴射口を有し、被加工物の上方にエアー層を形成するエアー層形成手段と、を備えたことを特徴とするチップ間隔維持装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014135532A JP6425435B2 (ja) | 2014-07-01 | 2014-07-01 | チップ間隔維持装置 |
TW104116806A TWI657727B (zh) | 2014-07-01 | 2015-05-26 | Wafer interval maintaining device |
SG10201504658WA SG10201504658WA (en) | 2014-07-01 | 2015-06-12 | Chip spacing maintaining apparatus |
KR1020150089517A KR102250467B1 (ko) | 2014-07-01 | 2015-06-24 | 칩 간격 유지 장치 |
CN201510363748.2A CN105280553B (zh) | 2014-07-01 | 2015-06-26 | 芯片间隔维持装置 |
US14/789,572 US9991151B2 (en) | 2014-07-01 | 2015-07-01 | Chip spacing maintaining apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014135532A JP6425435B2 (ja) | 2014-07-01 | 2014-07-01 | チップ間隔維持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016015360A true JP2016015360A (ja) | 2016-01-28 |
JP6425435B2 JP6425435B2 (ja) | 2018-11-21 |
Family
ID=55018072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014135532A Active JP6425435B2 (ja) | 2014-07-01 | 2014-07-01 | チップ間隔維持装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9991151B2 (ja) |
JP (1) | JP6425435B2 (ja) |
KR (1) | KR102250467B1 (ja) |
CN (1) | CN105280553B (ja) |
SG (1) | SG10201504658WA (ja) |
TW (1) | TWI657727B (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017204557A (ja) * | 2016-05-11 | 2017-11-16 | 株式会社ディスコ | ウェーハの加工方法 |
JP2018190940A (ja) * | 2017-05-11 | 2018-11-29 | 株式会社ディスコ | シート貼着方法 |
CN108987270A (zh) * | 2017-06-05 | 2018-12-11 | 株式会社迪思科 | 扩展方法和扩展装置 |
JP2019110268A (ja) * | 2017-12-20 | 2019-07-04 | 株式会社ディスコ | 分割装置 |
JP2019145707A (ja) * | 2018-02-22 | 2019-08-29 | アスリートFa株式会社 | ボール搭載装置 |
JP2019204842A (ja) * | 2018-05-22 | 2019-11-28 | 信越半導体株式会社 | 発光素子の製造方法 |
JP2019212782A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019212783A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019212784A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2021168419A (ja) * | 2016-10-28 | 2021-10-21 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6870974B2 (ja) | 2016-12-08 | 2021-05-12 | 株式会社ディスコ | 被加工物の分割方法 |
JP6901882B2 (ja) * | 2017-03-22 | 2021-07-14 | 株式会社ディスコ | 加工方法 |
JP7061664B2 (ja) * | 2018-02-28 | 2022-04-28 | 三井化学東セロ株式会社 | 部品製造方法、保持フィルム及び保持具形成装置 |
JP7281873B2 (ja) | 2018-05-14 | 2023-05-26 | 株式会社ディスコ | ウェーハの加工方法 |
JP7130323B2 (ja) | 2018-05-14 | 2022-09-05 | 株式会社ディスコ | ウェーハの加工方法 |
JP7143019B2 (ja) * | 2018-06-06 | 2022-09-28 | 株式会社ディスコ | ウェーハの加工方法 |
JP7154687B2 (ja) * | 2018-06-19 | 2022-10-18 | 株式会社ディスコ | テープ拡張装置 |
JP7139047B2 (ja) | 2018-07-06 | 2022-09-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP7139048B2 (ja) | 2018-07-06 | 2022-09-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP7154698B2 (ja) * | 2018-09-06 | 2022-10-18 | 株式会社ディスコ | ウェーハの加工方法 |
JP7175560B2 (ja) * | 2018-09-06 | 2022-11-21 | 株式会社ディスコ | ウェーハの加工方法 |
JP7166718B2 (ja) | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
JP7171134B2 (ja) * | 2018-10-17 | 2022-11-15 | 株式会社ディスコ | ウェーハの加工方法 |
JP7199786B2 (ja) * | 2018-11-06 | 2023-01-06 | 株式会社ディスコ | ウェーハの加工方法 |
JP2020077681A (ja) * | 2018-11-06 | 2020-05-21 | 株式会社ディスコ | ウェーハの加工方法 |
JP7251898B2 (ja) * | 2018-12-06 | 2023-04-04 | 株式会社ディスコ | ウェーハの加工方法 |
JP7246825B2 (ja) * | 2018-12-06 | 2023-03-28 | 株式会社ディスコ | ウェーハの加工方法 |
KR20210092321A (ko) * | 2018-12-14 | 2021-07-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 취성 기판들 상의 양면 디바이스들의 핸들링 및 프로세싱 |
JP7224719B2 (ja) * | 2019-01-17 | 2023-02-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP7229636B2 (ja) * | 2019-01-17 | 2023-02-28 | 株式会社ディスコ | ウェーハの加工方法 |
JP7282452B2 (ja) | 2019-02-15 | 2023-05-29 | 株式会社ディスコ | ウェーハの加工方法 |
JP7282453B2 (ja) | 2019-02-15 | 2023-05-29 | 株式会社ディスコ | ウェーハの加工方法 |
JP7282455B2 (ja) | 2019-03-05 | 2023-05-29 | 株式会社ディスコ | ウェーハの加工方法 |
JP7277019B2 (ja) * | 2019-03-05 | 2023-05-18 | 株式会社ディスコ | ウェーハの加工方法 |
JP7313767B2 (ja) * | 2019-04-10 | 2023-07-25 | 株式会社ディスコ | ウェーハの加工方法 |
JP2020174100A (ja) * | 2019-04-10 | 2020-10-22 | 株式会社ディスコ | ウェーハの加工方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009464A (ja) * | 2010-06-22 | 2012-01-12 | Disco Abrasive Syst Ltd | 拡張テープ収縮装置 |
JP2012156400A (ja) * | 2011-01-27 | 2012-08-16 | Disco Abrasive Syst Ltd | テープ拡張装置 |
JP2012174795A (ja) * | 2011-02-18 | 2012-09-10 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
JP2013051368A (ja) * | 2011-08-31 | 2013-03-14 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
JP2014063953A (ja) * | 2012-09-24 | 2014-04-10 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000058489A (ja) * | 1998-08-07 | 2000-02-25 | Disco Abrasive Syst Ltd | 被加工物の分割方法及び分割装置 |
JP4744742B2 (ja) * | 2001-08-06 | 2011-08-10 | 株式会社ディスコ | 被加工物の分割処理方法および分割処理方法に用いるチップ間隔拡張装置 |
JP2004273895A (ja) * | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | 半導体ウエーハの分割方法 |
JP4694795B2 (ja) * | 2004-05-18 | 2011-06-08 | 株式会社ディスコ | ウエーハの分割方法 |
JP2007027562A (ja) | 2005-07-20 | 2007-02-01 | Disco Abrasive Syst Ltd | ウエーハに装着された接着フィルムの破断方法 |
JP2009064905A (ja) * | 2007-09-05 | 2009-03-26 | Disco Abrasive Syst Ltd | 拡張方法および拡張装置 |
TWM341921U (en) * | 2007-11-15 | 2008-10-01 | Honjig Tech Machine Co Ltd | Wafer expander |
JP2009272503A (ja) | 2008-05-09 | 2009-11-19 | Disco Abrasive Syst Ltd | フィルム状接着剤の破断装置及び破断方法 |
JP2011077482A (ja) * | 2009-10-02 | 2011-04-14 | Disco Abrasive Syst Ltd | テープ拡張装置 |
JP5409280B2 (ja) | 2009-11-09 | 2014-02-05 | 株式会社ディスコ | チップ間隔拡張方法 |
CN102646584B (zh) * | 2011-02-16 | 2014-06-25 | 株式会社东京精密 | 工件分割装置及工件分割方法 |
JP5294358B2 (ja) * | 2012-01-06 | 2013-09-18 | 古河電気工業株式会社 | ウエハ加工用テープ及びこれを使用した半導体装置の製造方法 |
JP2016001677A (ja) * | 2014-06-12 | 2016-01-07 | 株式会社ディスコ | ウエーハの加工方法 |
-
2014
- 2014-07-01 JP JP2014135532A patent/JP6425435B2/ja active Active
-
2015
- 2015-05-26 TW TW104116806A patent/TWI657727B/zh active
- 2015-06-12 SG SG10201504658WA patent/SG10201504658WA/en unknown
- 2015-06-24 KR KR1020150089517A patent/KR102250467B1/ko active IP Right Grant
- 2015-06-26 CN CN201510363748.2A patent/CN105280553B/zh active Active
- 2015-07-01 US US14/789,572 patent/US9991151B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009464A (ja) * | 2010-06-22 | 2012-01-12 | Disco Abrasive Syst Ltd | 拡張テープ収縮装置 |
JP2012156400A (ja) * | 2011-01-27 | 2012-08-16 | Disco Abrasive Syst Ltd | テープ拡張装置 |
JP2012174795A (ja) * | 2011-02-18 | 2012-09-10 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
JP2013051368A (ja) * | 2011-08-31 | 2013-03-14 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
JP2014063953A (ja) * | 2012-09-24 | 2014-04-10 | Tokyo Seimitsu Co Ltd | ワーク分割装置及びワーク分割方法 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017204557A (ja) * | 2016-05-11 | 2017-11-16 | 株式会社ディスコ | ウェーハの加工方法 |
JP2021168419A (ja) * | 2016-10-28 | 2021-10-21 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
JP7214958B2 (ja) | 2016-10-28 | 2023-01-31 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
JP2018190940A (ja) * | 2017-05-11 | 2018-11-29 | 株式会社ディスコ | シート貼着方法 |
KR102388514B1 (ko) * | 2017-06-05 | 2022-04-20 | 가부시기가이샤 디스코 | 확장 방법 및 확장 장치 |
JP2018206939A (ja) * | 2017-06-05 | 2018-12-27 | 株式会社ディスコ | エキスパンド方法及びエキスパンド装置 |
CN108987270B (zh) * | 2017-06-05 | 2024-02-02 | 株式会社迪思科 | 扩展方法和扩展装置 |
CN108987270A (zh) * | 2017-06-05 | 2018-12-11 | 株式会社迪思科 | 扩展方法和扩展装置 |
KR20180133204A (ko) * | 2017-06-05 | 2018-12-13 | 가부시기가이샤 디스코 | 확장 방법 및 확장 장치 |
JP7076204B2 (ja) | 2017-12-20 | 2022-05-27 | 株式会社ディスコ | 分割装置 |
JP2019110268A (ja) * | 2017-12-20 | 2019-07-04 | 株式会社ディスコ | 分割装置 |
JP7064749B2 (ja) | 2018-02-22 | 2022-05-11 | アスリートFa株式会社 | ボール搭載装置 |
JP2019145707A (ja) * | 2018-02-22 | 2019-08-29 | アスリートFa株式会社 | ボール搭載装置 |
JP2019204842A (ja) * | 2018-05-22 | 2019-11-28 | 信越半導体株式会社 | 発光素子の製造方法 |
JP2019212784A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019212783A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP2019212782A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
JP7154686B2 (ja) | 2018-06-06 | 2022-10-18 | 株式会社ディスコ | ウェーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105280553B (zh) | 2019-09-06 |
KR20160003556A (ko) | 2016-01-11 |
KR102250467B1 (ko) | 2021-05-12 |
TW201613436A (en) | 2016-04-01 |
TWI657727B (zh) | 2019-04-21 |
US9991151B2 (en) | 2018-06-05 |
US20160007479A1 (en) | 2016-01-07 |
CN105280553A (zh) | 2016-01-27 |
SG10201504658WA (en) | 2016-02-26 |
JP6425435B2 (ja) | 2018-11-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2016015360A (ja) | チップ間隔維持装置 | |
JP6266429B2 (ja) | チップ間隔維持装置及びチップ間隔維持方法 | |
JP2015204362A (ja) | チップ間隔維持方法 | |
KR102356848B1 (ko) | 웨이퍼의 가공 방법 | |
JP6320198B2 (ja) | テープ拡張装置 | |
TWI687985B (zh) | 分割裝置及晶圓之分割方法 | |
JP5409280B2 (ja) | チップ間隔拡張方法 | |
KR20180133204A (ko) | 확장 방법 및 확장 장치 | |
CN109860110B (zh) | 晶片的分割方法和晶片的分割装置 | |
TWI745561B (zh) | 分割方法 | |
JP2013239557A (ja) | チップ間隔維持装置 | |
JP2014232782A (ja) | チップ間隔維持装置 | |
JP6226803B2 (ja) | 加工方法 | |
JP2019140266A (ja) | 分割装置及び分割方法 | |
JP2018067678A (ja) | チップ間隔維持方法 | |
JP6061788B2 (ja) | チップ間隔維持方法 | |
JP7130324B2 (ja) | デバイスチップの形成方法 | |
KR102670207B1 (ko) | 분할 장치 및 분할 방법 | |
JP2019117896A (ja) | 被加工物の分割方法及び分割装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170516 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180116 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180123 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180323 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20180626 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180921 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20180928 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20181023 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20181023 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6425435 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |