SG10201504658WA - Chip spacing maintaining apparatus - Google Patents
Chip spacing maintaining apparatusInfo
- Publication number
- SG10201504658WA SG10201504658WA SG10201504658WA SG10201504658WA SG10201504658WA SG 10201504658W A SG10201504658W A SG 10201504658WA SG 10201504658W A SG10201504658W A SG 10201504658WA SG 10201504658W A SG10201504658W A SG 10201504658WA SG 10201504658W A SG10201504658W A SG 10201504658WA
- Authority
- SG
- Singapore
- Prior art keywords
- maintaining apparatus
- chip spacing
- spacing maintaining
- chip
- spacing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014135532A JP6425435B2 (en) | 2014-07-01 | 2014-07-01 | Tip spacing maintenance device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201504658WA true SG10201504658WA (en) | 2016-02-26 |
Family
ID=55018072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201504658WA SG10201504658WA (en) | 2014-07-01 | 2015-06-12 | Chip spacing maintaining apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9991151B2 (en) |
| JP (1) | JP6425435B2 (en) |
| KR (1) | KR102250467B1 (en) |
| CN (1) | CN105280553B (en) |
| SG (1) | SG10201504658WA (en) |
| TW (1) | TWI657727B (en) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6671794B2 (en) * | 2016-05-11 | 2020-03-25 | 株式会社ディスコ | Wafer processing method |
| JP6920629B2 (en) * | 2016-10-28 | 2021-08-25 | 株式会社東京精密 | Work dividing device and work dividing method |
| JP6870974B2 (en) | 2016-12-08 | 2021-05-12 | 株式会社ディスコ | How to divide the work piece |
| JP6901882B2 (en) * | 2017-03-22 | 2021-07-14 | 株式会社ディスコ | Processing method |
| JP6938212B2 (en) * | 2017-05-11 | 2021-09-22 | 株式会社ディスコ | Processing method |
| JP6901909B2 (en) * | 2017-06-05 | 2021-07-14 | 株式会社ディスコ | Expanding method and expanding device |
| JP7076204B2 (en) * | 2017-12-20 | 2022-05-27 | 株式会社ディスコ | Split device |
| JP7064749B2 (en) * | 2018-02-22 | 2022-05-11 | アスリートＦａ株式会社 | Ball mounting device |
| US20210217644A1 (en) * | 2018-02-28 | 2021-07-15 | Mitsui Chemicals Tohcello, Inc. | Component producing method, holding film, and holding tool forming device |
| JP7281873B2 (en) | 2018-05-14 | 2023-05-26 | 株式会社ディスコ | Wafer processing method |
| JP7130323B2 (en) | 2018-05-14 | 2022-09-05 | 株式会社ディスコ | Wafer processing method |
| JP6791208B2 (en) * | 2018-05-22 | 2020-11-25 | 信越半導体株式会社 | Manufacturing method of light emitting element |
| JP7154686B2 (en) * | 2018-06-06 | 2022-10-18 | 株式会社ディスコ | Wafer processing method |
| JP2019212784A (en) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | Wafer processing method |
| JP2019212783A (en) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | Wafer processing method |
| JP7143019B2 (en) * | 2018-06-06 | 2022-09-28 | 株式会社ディスコ | Wafer processing method |
| JP7154687B2 (en) * | 2018-06-19 | 2022-10-18 | 株式会社ディスコ | tape expansion unit |
| JP7139048B2 (en) | 2018-07-06 | 2022-09-20 | 株式会社ディスコ | Wafer processing method |
| JP7139047B2 (en) | 2018-07-06 | 2022-09-20 | 株式会社ディスコ | Wafer processing method |
| JP7175560B2 (en) * | 2018-09-06 | 2022-11-21 | 株式会社ディスコ | Wafer processing method |
| JP7154698B2 (en) | 2018-09-06 | 2022-10-18 | 株式会社ディスコ | Wafer processing method |
| JP7166718B2 (en) | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | Wafer processing method |
| JP7171134B2 (en) * | 2018-10-17 | 2022-11-15 | 株式会社ディスコ | Wafer processing method |
| JP7199786B2 (en) * | 2018-11-06 | 2023-01-06 | 株式会社ディスコ | Wafer processing method |
| JP7503886B2 (en) * | 2018-11-06 | 2024-06-21 | 株式会社ディスコ | Wafer Processing Method |
| JP7246825B2 (en) * | 2018-12-06 | 2023-03-28 | 株式会社ディスコ | Wafer processing method |
| JP7251898B2 (en) * | 2018-12-06 | 2023-04-04 | 株式会社ディスコ | Wafer processing method |
| KR20210092321A (en) * | 2018-12-14 | 2021-07-23 | 어플라이드 머티어리얼스, 인코포레이티드 | Handling and processing of double-sided devices on brittle substrates |
| JP7224719B2 (en) * | 2019-01-17 | 2023-02-20 | 株式会社ディスコ | Wafer processing method |
| JP7229636B2 (en) * | 2019-01-17 | 2023-02-28 | 株式会社ディスコ | Wafer processing method |
| JP7282452B2 (en) * | 2019-02-15 | 2023-05-29 | 株式会社ディスコ | Wafer processing method |
| JP7282453B2 (en) * | 2019-02-15 | 2023-05-29 | 株式会社ディスコ | Wafer processing method |
| JP7282455B2 (en) * | 2019-03-05 | 2023-05-29 | 株式会社ディスコ | Wafer processing method |
| JP7277019B2 (en) * | 2019-03-05 | 2023-05-18 | 株式会社ディスコ | Wafer processing method |
| JP7313767B2 (en) * | 2019-04-10 | 2023-07-25 | 株式会社ディスコ | Wafer processing method |
| JP2020174100A (en) * | 2019-04-10 | 2020-10-22 | 株式会社ディスコ | Wafer processing method |
| JP7345973B2 (en) | 2019-08-07 | 2023-09-19 | 株式会社ディスコ | Wafer processing method |
| JP7305268B2 (en) | 2019-08-07 | 2023-07-10 | 株式会社ディスコ | Wafer processing method |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000058489A (en) * | 1998-08-07 | 2000-02-25 | Disco Abrasive Syst Ltd | Work dividing method and device |
| JP4744742B2 (en) * | 2001-08-06 | 2011-08-10 | 株式会社ディスコ | Workpiece division processing method and chip interval expansion apparatus used in the division processing method |
| JP2004273895A (en) * | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | Dividing method of semiconductor wafer |
| JP4694795B2 (en) * | 2004-05-18 | 2011-06-08 | 株式会社ディスコ | Wafer division method |
| JP2007027562A (en) | 2005-07-20 | 2007-02-01 | Disco Abrasive Syst Ltd | Method of fracturing bonding film attached on wafer |
| JP2009064905A (en) * | 2007-09-05 | 2009-03-26 | Disco Abrasive Syst Ltd | Extension method and extension apparatus |
| TWM341921U (en) * | 2007-11-15 | 2008-10-01 | Honjig Tech Machine Co Ltd | Wafer expander |
| JP2009272503A (en) | 2008-05-09 | 2009-11-19 | Disco Abrasive Syst Ltd | Breaking device and breaking method for filmy adhesive |
| JP2011077482A (en) * | 2009-10-02 | 2011-04-14 | Disco Abrasive Syst Ltd | Tape expanding device |
| JP5409280B2 (en) | 2009-11-09 | 2014-02-05 | 株式会社ディスコ | Tip interval expansion method |
| JP5536555B2 (en) * | 2010-06-22 | 2014-07-02 | 株式会社ディスコ | Expansion tape shrink device |
| JP2012156400A (en) * | 2011-01-27 | 2012-08-16 | Disco Abrasive Syst Ltd | Tape expanding device |
| CN102646584B (en) * | 2011-02-16 | 2014-06-25 | 株式会社东京精密 | Workpiece dividing device and method for dividing workpiece |
| JP5939451B2 (en) * | 2011-02-18 | 2016-06-22 | 株式会社東京精密 | Work dividing apparatus and work dividing method |
| JP6249586B2 (en) * | 2011-08-31 | 2017-12-20 | 株式会社東京精密 | Work dividing apparatus and work dividing method |
| JP5294358B2 (en) * | 2012-01-06 | 2013-09-18 | 古河電気工業株式会社 | Wafer processing tape and semiconductor device manufacturing method using the same |
| JP5885033B2 (en) * | 2012-09-24 | 2016-03-15 | 株式会社東京精密 | Work dividing apparatus and work dividing method |
| JP2016001677A (en) * | 2014-06-12 | 2016-01-07 | 株式会社ディスコ | Wafer processing method |
-
2014
- 2014-07-01 JP JP2014135532A patent/JP6425435B2/en active Active
-
2015
- 2015-05-26 TW TW104116806A patent/TWI657727B/en active
- 2015-06-12 SG SG10201504658WA patent/SG10201504658WA/en unknown
- 2015-06-24 KR KR1020150089517A patent/KR102250467B1/en active IP Right Grant
- 2015-06-26 CN CN201510363748.2A patent/CN105280553B/en active Active
- 2015-07-01 US US14/789,572 patent/US9991151B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI657727B (en) | 2019-04-21 |
| KR102250467B1 (en) | 2021-05-12 |
| KR20160003556A (en) | 2016-01-11 |
| US20160007479A1 (en) | 2016-01-07 |
| US9991151B2 (en) | 2018-06-05 |
| JP2016015360A (en) | 2016-01-28 |
| CN105280553A (en) | 2016-01-27 |
| CN105280553B (en) | 2019-09-06 |
| JP6425435B2 (en) | 2018-11-21 |
| TW201613436A (en) | 2016-04-01 |
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