JP5939451B2 - Work dividing apparatus and work dividing method - Google Patents

Description

  The present invention relates to a workpiece dividing apparatus and a workpiece dividing method, and in particular, to a semiconductor wafer mounted on a ring-shaped frame via an adhesive sheet and diced and grooved into individual chips, the adhesive sheet is applied after dicing. The present invention relates to a workpiece dividing apparatus and a workpiece dividing method for expanding and dividing into individual chips.

  Conventionally, in the manufacture of semiconductor chips, for example, a semiconductor wafer in which a line to be cut is formed in advance by laser irradiation or the like has been attached with a film-like adhesive for die bonding called DAF (Die Attach Film die attach film). In a work attached to a frame via a dicing tape, the dicing tape is expanded (expanded) to divide the semiconductor wafer and the DAF into individual chips.

  Fig. 7 shows the workpiece. FIG. 7A is a perspective view, and FIG. 7B is a cross-sectional view. As shown in the figure, the semiconductor wafer W has a pressure-sensitive adhesive sheet (dicing tape) S having a thickness of about 100 μm and a pressure-sensitive adhesive layer formed on one side of the back surface of the semiconductor wafer W via DAF (D). Then, the adhesive sheet S is mounted on a rigid ring-shaped frame F, and in the work dividing device, the semiconductor wafer W is placed on the chuck stage, the adhesive sheet S is expanded, and is divided into individual chips (divided). )

  Here, DAF is hard even at room temperature and can be divided by applying stress as it is, and DAF has high viscosity near room temperature and needs to be made brittle by cooling in order to split by applying stress. .

  For example, in the workpiece dividing apparatus described in Patent Document 1, a DAF that needs to be cooled is used to divide the workpiece, and the workpiece is placed on the dividing means disposed in the cover. After the cooled air is blown out and the work is cooled by atmospheric cooling that cools the entire DAF together with the dicing tape, the DAF is made brittle, the dicing tape is expanded and the wafer is divided into a large number of chips. Is conveyed to the heating means by the conveying means, and the dicing tape is expanded and the slack area is heated and contracted.

JP 2010-206136 A

  However, when the semiconductor wafer and DAF are separated into chips by expanding (expanding) the adhesive tape (dicing tape) as described above, the DAF on the outer periphery of the semiconductor wafer may be peeled off from the adhesive tape. However, DAF peeled from this adhesive tape causes the following problems.

  That is, when the adhesive tape is expanded, the DAF peeled off from the adhesive tape is fragmented to become debris and get on the device surface of the semiconductor wafer, or when the tension that expands the adhesive tape is released, the rising DAF falls down Therefore, there is a problem that it may cause a defective chip by contacting the semiconductor wafer.

  The present invention has been made in view of such a problem, and prevents the DAF from falling into the semiconductor wafer surface when the tension of the adhesive tape is released, and also removes the DAF contacting the wafer surface to remove the chip. An object of the present invention is to provide a workpiece dividing device and a workpiece dividing method that improve the yield of the workpiece.

  In order to achieve the above-mentioned object, the workpiece dividing device of the present invention is attached to an adhesive sheet via a die attach film, mounted on a ring-shaped frame, and individually formed along a predetermined dividing line. A frame fixing means for fixing a work made of a semiconductor wafer diced into a chip, an expanding means for expanding a pressure sensitive adhesive sheet of the work, and a surface of the semiconductor wafer attached to the pressure sensitive adhesive sheet can be covered. A wafer cover, a cover raising / lowering mechanism for raising and lowering the wafer cover, and an airflow forming mechanism for forming an air flow from the center of the workpiece toward the peripheral portion between the wafer cover and the workpiece. And

  This prevents the DAF from falling onto the semiconductor wafer surface when the tension of the adhesive tape is released, and removes the DAF that has contacted the wafer surface to improve the chip yield.

  Further, as one embodiment, the airflow forming mechanism includes a supply path for ejecting ionized static elimination air radially from the inner central portion of the wafer cover toward the peripheral portion, and downward air from the inner peripheral portion of the wafer cover. It is preferable to provide a supply path that ejects toward the surface.

  Thereby, it is possible to easily remove a piece of die attach film attached to a semiconductor wafer or the like due to static electricity generated when the workpiece is divided.

  Further, as one embodiment, the expanding means includes a push-up ring that expands by pushing up the adhesive sheet of the workpiece from below, and a ring lift mechanism that lifts and lowers the push-up ring. It is preferable that the pressure-sensitive adhesive sheet of the workpiece can be suppressed by the ring and the front end surface of the side portion of the wafer cover.

  In this way, by suppressing the adhesive sheet of the workpiece with the thrust ring and the tip end surface of the side of the wafer cover, the die attach film that has been tilted outward is released again even if the expansion is released after dividing the workpiece. It is possible to prevent standing up.

  Moreover, as one embodiment, it is preferable that the work dividing apparatus of the present invention further includes a freezing chuck table that selectively cools the adhesive sheet in the area of the die attach film of the fixed work.

  Even when it is necessary to cool the die attach film to make it brittle, it is possible to remove fragments of the die attach film adhering to the semiconductor wafer, etc., by using static elimination air by cooling with the freezing chuck table. can do.

  The work dividing method of the present invention is affixed to a pressure-sensitive adhesive sheet via a die attach film, mounted on a ring-shaped frame, and diced into individual chips along a pre-scheduled dividing line. A frame fixing step for fixing a work frame made of a semiconductor wafer, and a wafer cover capable of covering the semiconductor wafer portion of the work are arranged above the work, and air is blown out from the inside of the wafer cover. An airflow forming step for forming a flow of air from a central portion to a peripheral portion with respect to the surface of the fixed workpiece; an expanding step for expanding the pressure-sensitive adhesive sheet of the workpiece by raising a push-up ring; and The wafer cover is gradually lowered to strengthen the airflow on the workpiece surface, and the expand is generated by the expand. The debris removal step of removing the debris of the ear attach film and depressing the die attach film in the peripheral portion that has stood up outward, and suppressing the pressure-sensitive adhesive sheet with the front end surface of the side portion of the wafer cover and the push-up ring, An expansion release step for stopping the air flow and releasing the expansion by the push-up ring.

  This prevents the DAF from falling onto the semiconductor wafer surface when the tension of the adhesive tape is released, and removes the DAF that has contacted the wafer surface to improve the chip yield.

  Further, as one embodiment, the airflow forming step ejects the ionized air radially ionized from the inner central portion of the wafer cover toward the peripheral portion, and directs from the inner peripheral portion of the wafer cover directly below. It is preferable to eject air.

  Thereby, it is possible to easily remove a piece of die attach film attached to a semiconductor wafer or the like due to static electricity generated when the workpiece is divided.

  The work dividing method of the present invention is affixed to a pressure-sensitive adhesive sheet via a die attach film, mounted on a ring-shaped frame, and diced into individual chips along a pre-scheduled dividing line. A frame fixing step for fixing a workpiece frame made of a semiconductor wafer, a selective cooling step for selectively cooling the adhesive sheet in the die attach film region of the fixed workpiece by a freezing chuck table, and above the workpiece, A wafer cover capable of covering the semiconductor wafer portion of the workpiece is disposed, air is blown out from the inside of the wafer cover, and air flowing from the central portion to the peripheral portion with respect to the surface of the fixed workpiece is disposed. The airflow forming step for forming a flow and the pressure-sensitive adhesive sheet of the cooled workpiece are raised by raising the thrusting ring. The expanding step of expanding, and gradually lowering the wafer cover to strengthen the airflow on the work surface to remove the debris of the die attach film generated by the expand, and tilt the die attach film at the peripheral portion that has risen outward A debris removing step, and an expansion releasing step of suppressing the pressure-sensitive adhesive sheet by the front end surface of the side portion of the wafer cover and the push-up ring, stopping the air flow, and releasing the expansion by the push-up ring And.

  Further, as one embodiment, the air flow forming step ejects the ionized air radially ionized from the inner central portion of the wafer cover toward the peripheral portion, and downward from the inner peripheral portion of the wafer cover. It is preferable to eject air.

  Even when it is necessary to cool the die attach film to make it brittle, it is possible to remove fragments of the die attach film adhering to the semiconductor wafer, etc., by using static elimination air by cooling with the freezing chuck table. can do.

  As described above, according to the present invention, the DAF is prevented from falling onto the semiconductor wafer surface when the tension of the adhesive tape is released, and the DAF in contact with the wafer surface is removed to improve the chip yield. It becomes possible. In particular, even when it is necessary to cool the die attach film to make it brittle, by using a freezing chuck table, it is possible to remove fragments of the die attach film adhering to the semiconductor wafer or the like using static elimination air. It becomes possible.

It is principal part sectional drawing which shows one Embodiment of the workpiece | work division | segmentation apparatus of this invention. It is a flowchart which shows the workpiece | work division | segmentation method which is an effect | action of the workpiece | work division | segmentation apparatus of this embodiment. It is principal part sectional drawing which shows the state which has expanded the adhesive sheet with the ring for pushing up. It is principal part sectional drawing which shows the state which has lowered | hung the wafer cover gradually during expansion. It is principal part sectional drawing which shows the state which is closely_contact | adhering the edge part of a wafer cover to DAF of a peripheral part. It is principal part sectional drawing which shows the example of the workpiece | work division apparatus provided with the freezing chuck table. It is explanatory drawing which shows a workpiece | work, (a) is a perspective view, (b) is sectional drawing.

  Hereinafter, a work dividing apparatus and a work dividing method according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view of an essential part showing an embodiment of a workpiece dividing device of the present invention. The workpiece dividing apparatus 1 divides the workpiece 2 as shown in FIG. 7 along a predetermined division line and divides it into chips. As shown in FIG. 7, DAF (Die Attach Film Die attach film) D (hereinafter, referred to as DAF (D)) is adhered to the back surface of the semiconductor wafer W, and the workpiece is interposed through the adhesive sheet S. Mounted on frame F.

  Here, for example, it is assumed that the semiconductor wafer W has a thickness of about 50 μm, and the DAF (D) and the adhesive sheet S each have a thickness of about several μm to 100 μm.

  As shown in FIG. 1, the workpiece dividing apparatus 1 has a frame fixing mechanism 18 that holds the frame F of the workpiece 2 and an adhesive sheet S of the workpiece 2 that is expanded (expanded) to divide the semiconductor wafer W. A ring 12 is provided. The push-up ring 12 is arranged in a ring shape along the adhesive sheet S around the semiconductor wafer W, and is configured to be moved up and down by the ring lifting mechanism 16. A roller (roller) for reducing the frictional force may be provided at the tip of the push-up ring 12. In FIG. 1, the push-up ring 12 is located at the lowered position (standby position).

  When the DAF (D) attached to the back surface of the semiconductor wafer W has a high viscosity near room temperature and needs to be cooled, a freezing chuck table for cooling the DAF (D) is provided for the push-up ring 12. It is arranged on the lower surface of the inner work 2.

  As shown in FIG. 1, the workpiece dividing apparatus 1 according to the present embodiment includes a wafer cover 20 in order to prevent the rising DAF from falling onto the semiconductor wafer surface.

  The wafer cover 20 is a circular lid-like member that covers the semiconductor wafer W, and has an edge portion 20a around it. A cover holding member 22 is formed on the upper portion of the wafer cover 20, and the cover holding member 22 is connected to a cover lifting / lowering means 24 that lifts and lowers the wafer cover 20. The cover lifting / lowering means 24 is not particularly limited, but for example, an air cylinder is preferably exemplified.

  The cover holding member 22 is connected to two supply paths 26 (first supply path 26a and second supply path 26b) for supplying air. Each supply path 26 (first supply path 26a, second supply path 26b) is connected to an air pressure control system (not shown) so that air of a predetermined pressure is supplied.

  Each supply path 26 (the first supply path 26a and the second supply path 26b) communicates with a flow path (indicated by two types of broken lines in the figure) formed inside the cover holding member 22. The air supplied from the supply path 26 a is ejected from a blow-out port 28 a provided in the inner center portion of the wafer cover 20, and the air supplied from the second supply path 26 b is provided in the vicinity of the edge portion 20 a of the wafer cover 20. It is ejected from the outlet 28b.

  At this time, in particular, ionized static elimination air is supplied from the first supply path 26a through an ionizer. The reason why the static elimination air is supplied in this way is that static electricity is generated when the DAF (D) is broken, and debris is stuck to the semiconductor wafer W or the like by this Coulomb force.

  Static electricity is generated everywhere when the work is divided. When the pressure-sensitive adhesive sheet S is expanded, for example, the pressure-sensitive adhesive sheet S is charged by friction with a roller for reducing the frictional force attached to the tip of the push-up ring 12. DAF (D) is also charged by being sheared. In particular, since the pressure-sensitive adhesive sheet S is an insulator, once it is charged, it cannot be easily discharged. Therefore, here, it is easy to remove the debris by removing electricity by flowing the electricity removal air.

  In addition to these, the workpiece dividing apparatus 1 of the present embodiment holds the workpiece 2 by the frame fixing mechanism 18, raises and lowers the thrust ring 12, raises and lowers the wafer cover 20, supplies air from the supply path 26, and the like. A control system for performing the control is provided.

  Hereinafter, as an operation of the work dividing apparatus according to the present embodiment, a work dividing method for preventing the DAF from falling onto the semiconductor wafer surface and removing the DAF contacting the wafer surface to improve the chip yield will be described.

  FIG. 2 is a flowchart showing a work dividing method which is an operation of the work dividing apparatus of the present embodiment. Hereinafter, it demonstrates along this flowchart.

  First, in step S100 of FIG. 2, as shown in FIG. 1, the frame F of the workpiece 2 is held by the frame fixing mechanism 18, and the workpiece 2 is set in the workpiece dividing apparatus 1.

  Next, in step S110, the air pressure control system is controlled by a control system (not shown) to supply air from the supply path 26. From the 1st supply path 26a, the ionized static elimination air is supplied through an ionizer. This static elimination air is ejected from a blowout port 28a provided in the inner center portion of the wafer cover 20, and flows so as to spread radially along the inside of the wafer cover 20 as indicated by an arrow A in the figure. Further, the air supplied from the second supply path 26 b is ejected downward as indicated by an arrow B from a blow-out port 28 b provided around the wafer cover 20.

  Due to the two air flows, an air flow from the central portion to the peripheral portion is generated in the space between the wafer cover 20 and the workpiece 2.

  Next, in step S <b> 120, the ring lifting mechanism 16 is controlled by a control system (not shown) to raise the thrusting ring 12, and the adhesive sheet S is expanded (expanded) by the thrusting ring 12. Here, although depending on the work 2, the distance for raising the push-up ring 12 to expand is about 10 mm to 30 mm. At this time, the wafer cover 20 is at a distance of about 100 mm above the position of the workpiece 2 before expanding.

  FIG. 3 shows a state where the adhesive sheet S is expanded (expanded) by the push-up ring 12. By expanding the pressure-sensitive adhesive sheet S in this way, the pressure-sensitive adhesive sheet S is stretched and a shearing force acts on the semiconductor wafer W and DAF (D), so that the semiconductor wafer W and DAF (D) are aligned along the planned cutting line. Divided into chips T.

  At this time, since the adhesive sheet S is expanded by generating an air flow from the center part to the peripheral part in the space between the wafer cover 20 and the work 2 before the expansion, the DAF (D ), It can be prevented from getting on the semiconductor wafer W.

  Further, as shown in the drawing, a part of DAF (D 0) protruding from the outer peripheral portion of the semiconductor wafer W may be peeled off from the adhesive sheet S. When releasing the expansion of the pressure-sensitive adhesive sheet S, the DAF (D0) partially peeled in this way may rise or become debris and contact the surface of the semiconductor wafer W.

  Then, next, in step S130, as shown in FIG. 4, the cover lifting means 24 is controlled by the control system to gradually lower the wafer cover 20.

  When the wafer cover 20 is lowered and the distance between the wafer cover 20 and the workpiece 2 is narrowed, the flow velocity of the air flow from the central part to the peripheral part generated by the air ejected from the air outlets 28a and 28b increases. . In particular, immediately before the lower side of the edge portion 20a of the wafer cover 20 comes into contact with DAF (D) (or the adhesive sheet S), the wind speed blown outward becomes very large after the distance of less than 10 mm.

  As a result, as shown in the figure, the DAF (D0) in the peripheral portion that has risen away from the adhesive sheet S falls to the outside due to the wind force. On the other hand, fragments of the semiconductor wafer W (debris) adhering to the semiconductor wafer W or the like due to electrostatic force were removed by static electricity supplied from the first supply path 26a and ejected from the outlet 28a. It becomes easy to leave the semiconductor wafer W or the like and is discharged to the outside by the force of the wind.

  Next, in step S140, as shown in FIG. 5, the wafer cover 20 is further lowered so that the edge 20a is brought into close contact with the peripheral adhesive sheet S. At this time, the edge portion 20a of the wafer cover 20 presses the DAF (D0), which has fallen outward due to the wind force, from above.

  In step S150, the supply of air from the supply path 26 is stopped.

  Finally, in step S160, while maintaining the close contact between the wafer cover 20 and the adhesive sheet S (DAF (D0)), the push-up ring 12 is lowered to release the expansion of the adhesive sheet S. At this time, in order to maintain the close contact between the wafer cover 20 and the adhesive sheet S, the wafer cover 20 is also lowered together.

  If the expansion of the adhesive sheet S is simply released here, the DAF (D) may rise again when the adhesive sheet S is returned, so that the adhesion between the wafer cover 20 and the adhesive sheet S is maintained. It is said.

  As a result, as shown in FIG. 5, the edge portion 20a of the wafer cover 20 holds the peripheral DAF (D0) from above, so the push-up ring 12 is lowered (together with the wafer cover 20) to form the adhesive sheet S. Even if the expansion is released, the DAF (D0) away from the adhesive sheet S does not rise again.

  Further, while maintaining the close contact between the wafer cover 20 and the adhesive sheet S (DAF (D0)), the push-up ring 12 is lowered (the wafer cover 20 is also lowered simultaneously) to release the expansion of the adhesive sheet S. The adhesive sheet S in the peripheral part that has been expanded until now is loosened. For this, an expansion ring (caulking) is inserted into the loosened part to maintain the expanded state of the adhesive sheet S, or Depending on the material of the adhesive sheet S, the adhesive sheet S is contracted by heating or cooling to eliminate slack.

  The workpiece 2 that has been divided into the chips T in this way is taken out from the workpiece dividing apparatus 1 and conveyed to the next step.

  In the example described above, the DAF that does not need to be cooled before expansion is used. However, when the DAF needs to be cooled, it is frozen at the lower side of the work 2 as shown in FIG. The chuck table 10 is disposed. The freezing chuck table 10 has a circular shape with a diameter of about 300 mm to 307 mm.

  In this case, when the frame F of the work 2 is held by the frame fixing mechanism 18 and the work 2 is installed in the work dividing apparatus 1, the adhesive sheet S of the part of the work 2 to which the semiconductor wafer W is adhered is attached to the freezing chuck table. 10, the adhesive sheet S is brought into contact with the freezing chuck table 10. The adhesive sheet S is cooled by coming into contact with the freezing chuck table 10.

  When the DAF (D) becomes brittle by being cooled by the freezing chuck table 10, the push-up ring 12 is raised to expand the adhesive sheet S and divide the semiconductor wafer W together with the DAF (D). The subsequent steps are the same as in the example described above.

  That is, when DAF (D) becomes brittle by cooling, air is supplied from the supply path 26. The ionized static electricity discharged from the outlet 28a communicating with the first supply path 26a spreads radially along the inside of the wafer cover 20, and is ejected from the outlet 28b communicating with the second supply path 26b directly below the periphery. Together with the air to be generated, an air flow from the center portion to the peripheral portion is formed in the space between the wafer cover 20 and the workpiece 2.

  In this manner, the push-up ring is formed in a state in which the airflow including the static elimination air from the center to the peripheral part is formed from the upper side of the work 2 from the lower side of the adhesive sheet S of the work 2 and cooled from the upper side of the work 2. 12 is used to expand the adhesive sheet S.

  Thereafter, when the wafer cover 20 is gradually lowered, the air flow in the peripheral portion becomes stronger because the space below the edge portion 20a of the wafer cover 20 is narrowed in particular. It is possible to remove (D0) outward or to remove debris that has occurred due to the work division.

  As described above, in this example, the refrigeration chuck table 10 is used for cooling and embrittlement of the DAF (D). However, the airflow generated by the static electricity for removing the rise of DAF and debris in the peripheral portion due to the expand. In order to achieve both the cooling of DAF (D) and the cooling method, it is important to use the freezing chuck table 10 as a cooling method.

  That is, if the DAF (D) is cooled by atmospheric cooling in which the entire work 2 is placed in the cold air, there is a problem that the atmospheric cooling and the static elimination air are incompatible. When the atmosphere is cooled and the ambient temperature rises due to the outside air flowing in and out of the workpiece while the cold air is flowing into the ionizer, for example, the discharge needle of the ionizer immediately condenses, This is because it is difficult to generate cold static elimination air.

  As described above, when expanding and dividing the semiconductor wafer W and DAF (D), the wafer cover is arranged above the workpiece, and the static elimination air is flowed radially from the inner center portion of the wafer cover toward the peripheral portion. In the peripheral area, air is blown directly below, and while expanding the airflow by these two types of air, the wafer cover is gradually lowered, and the edge is brought into close contact with the adhesive sheet (or DAF). As a result, it is possible to prevent the DAF from falling onto the semiconductor wafer surface when the tension of the adhesive tape is released, and to remove the DAF contacting the wafer surface and improve the chip yield.

  In particular, when it is necessary to cool the DAF before embrittlement and to make it brittle, cooling the DAF using a refrigeration chuck table makes it possible to achieve both cooling of the DAF and static elimination air. In addition, it is possible to prevent the DAF from falling on the semiconductor wafer surface when the tension of the adhesive tape is released, and to remove the DAF contacting the wafer surface, thereby improving the yield of the chip.

  The work dividing apparatus and the work dividing method of the present invention have been described in detail above. However, the present invention is not limited to the above examples, and various improvements and modifications are made without departing from the gist of the present invention. Of course it is also good.

  DESCRIPTION OF SYMBOLS 1 ... Work dividing device, 2 ... Work, 10 ... Refrigeration chuck table, 12 ... Push-up ring, 16 ... Ring raising / lowering mechanism, 18 ... Frame fixing mechanism, 20 ... Wafer cover, 22 ... Cover holding member, 24 ... Cover raising / lowering Means, 26 (26a, 26b) ... supply path, 28a, 28b ... outlet

Claims (8)

Frame fixing for fixing workpieces made of semiconductor wafers, which are attached to an adhesive sheet via a die attach film, mounted on a ring-shaped frame, and diced into individual chips along a pre-scheduled dividing line Means,
Expanding means for expanding the adhesive sheet of the workpiece;
A wafer cover capable of covering the surface of the semiconductor wafer adhered to the adhesive sheet;
A cover elevating mechanism for elevating the wafer cover;
An airflow forming mechanism that forms a flow of air from the work center to the periphery between the wafer cover and the work;
Means for gradually lowering the wafer cover by controlling the cover lifting mechanism so that the airflow on the workpiece surface is strengthened after expansion;
A workpiece dividing device characterized by comprising:   The airflow forming mechanism includes: a supply path for radially discharging ionized static elimination air from the wafer cover inner central portion toward the peripheral portion; and a supply passage for discharging air downward from the wafer cover inner peripheral portion. The work dividing apparatus according to claim 1, further comprising: The expanding means includes a push-up ring that expands by pushing up the adhesive sheet of the workpiece from below, and a ring lifting mechanism that lifts and lowers the push-up ring, and the side of the push-up ring and the wafer cover work dividing apparatus according to claim 1 or 2, characterized in that it is possible to suppress the pressure-sensitive adhesive sheet of the workpiece at the distal end surface of the. The workpiece dividing device according to any one of claims 1 to 3 , further comprising a freezing chuck table that selectively cools the adhesive sheet in the area of the die attach film of the fixed workpiece. Work dividing device. Affixed to a pressure-sensitive adhesive sheet via a die attach film, mounted on a ring-shaped frame, and fixed to a workpiece frame made of a semiconductor wafer diced into individual chips along a pre-scheduled dividing line. Frame fixing process;
A wafer cover capable of covering the semiconductor wafer portion of the workpiece is disposed above the workpiece, and air is blown out from the inside of the wafer cover so that the surface of the fixed workpiece is surrounded from the center. An air flow forming step for forming a flow of air toward the part,
An expanding step of expanding the work-up adhesive sheet by raising the push-up ring; and
A debris removal step of gradually lowering the wafer cover to remove the debris of the die attach film generated by the expansion by strengthening the airflow on the work surface and tilting the die attach film at the peripheral portion raised to the outside;
An expansion release step for suppressing the adhesive sheet with the front end surface of the side portion of the wafer cover and the push-up ring, stopping the air flow, and releasing the expansion by the push-up ring;
A work dividing method characterized by comprising: In the airflow forming step, the neutralized air that is radially ionized from the inner central portion of the wafer cover toward the peripheral portion is ejected, and the air is ejected from the inner peripheral portion of the wafer cover toward directly below. The work dividing method according to claim 5 . Affixed to a pressure-sensitive adhesive sheet via a die attach film, mounted on a ring-shaped frame, and fixed to a workpiece frame made of a semiconductor wafer diced into individual chips along a pre-scheduled dividing line. Frame fixing process;
A selective cooling step of selectively cooling the adhesive sheet in the area of the die attach film of the fixed workpiece by a freezing chuck table;
A wafer cover capable of covering the semiconductor wafer portion of the workpiece is disposed above the workpiece, and air is blown out from the inside of the wafer cover so that the surface of the fixed workpiece is surrounded from the center. An air flow forming step for forming a flow of air toward the part,
An expanding step for expanding the cooled pressure-sensitive adhesive sheet by raising the push-up ring; and
A debris removal step of gradually lowering the wafer cover to remove the debris of the die attach film generated by the expansion by strengthening the airflow on the work surface and tilting the die attach film at the peripheral portion raised to the outside;
The pressure-sensitive adhesive sheet is suppressed with the front end surface of the side portion of the wafer cover and the push-up ring,
An expansion release step for stopping the air flow and releasing the expansion by the push-up ring;
A work dividing method characterized by comprising: In the air flow forming step, the neutralized air that is radially ionized from the inner central portion of the wafer cover toward the peripheral portion is ejected, and the air is ejected downward from the inner peripheral portion of the wafer cover. The work dividing method according to claim 7 .

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