TWI782160B - 分割裝置 - Google Patents

分割裝置 Download PDF

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Publication number
TWI782160B
TWI782160B TW107145842A TW107145842A TWI782160B TW I782160 B TWI782160 B TW I782160B TW 107145842 A TW107145842 A TW 107145842A TW 107145842 A TW107145842 A TW 107145842A TW I782160 B TWI782160 B TW I782160B
Authority
TW
Taiwan
Prior art keywords
unit
workpiece
sheet
gas
heating
Prior art date
Application number
TW107145842A
Other languages
English (en)
Chinese (zh)
Other versions
TW201929064A (zh
Inventor
服部篤
木篤
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201929064A publication Critical patent/TW201929064A/zh
Application granted granted Critical
Publication of TWI782160B publication Critical patent/TWI782160B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Seal Device For Vehicle (AREA)
TW107145842A 2017-12-20 2018-12-19 分割裝置 TWI782160B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-244119 2017-12-20
JP2017244119A JP7076204B2 (ja) 2017-12-20 2017-12-20 分割装置

Publications (2)

Publication Number Publication Date
TW201929064A TW201929064A (zh) 2019-07-16
TWI782160B true TWI782160B (zh) 2022-11-01

Family

ID=67066277

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107145842A TWI782160B (zh) 2017-12-20 2018-12-19 分割裝置

Country Status (4)

Country Link
JP (1) JP7076204B2 (ja)
KR (1) KR20190074961A (ja)
CN (1) CN110010522B (ja)
TW (1) TWI782160B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7325258B2 (ja) * 2019-08-14 2023-08-14 株式会社ディスコ エキスパンド装置
CN117957637A (zh) * 2021-09-14 2024-04-30 雅马哈发动机株式会社 扩展装置
KR102542890B1 (ko) * 2023-04-03 2023-06-13 남진우 웨이퍼 신장 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014140856A (ja) * 2013-01-22 2014-08-07 Disco Abrasive Syst Ltd レーザー加工装置
TW201613436A (en) * 2014-07-01 2016-04-01 Disco Corp Chip spacing maintaining apparatus
TW201633446A (zh) * 2014-12-05 2016-09-16 Lintec Corp 間離裝置及間離方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791866A (en) 1980-11-26 1982-06-08 Kubota Ltd Production of composite roll for rolling which is not constant in thickness of outside shell layer
JP3290943B2 (ja) * 1997-01-16 2002-06-10 東京エレクトロン株式会社 レジスト塗布現像処理装置およびレジスト処理方法
JP2007059633A (ja) * 2005-08-24 2007-03-08 Tokyo Electron Ltd 基板加熱装置及び基板加熱方法
JP6249586B2 (ja) * 2011-08-31 2017-12-20 株式会社東京精密 ワーク分割装置及びワーク分割方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014140856A (ja) * 2013-01-22 2014-08-07 Disco Abrasive Syst Ltd レーザー加工装置
TW201613436A (en) * 2014-07-01 2016-04-01 Disco Corp Chip spacing maintaining apparatus
TW201633446A (zh) * 2014-12-05 2016-09-16 Lintec Corp 間離裝置及間離方法

Also Published As

Publication number Publication date
CN110010522A (zh) 2019-07-12
CN110010522B (zh) 2024-05-03
JP7076204B2 (ja) 2022-05-27
TW201929064A (zh) 2019-07-16
JP2019110268A (ja) 2019-07-04
KR20190074961A (ko) 2019-06-28

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