KR102184248B1 - 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법 - Google Patents

물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법 Download PDF

Info

Publication number
KR102184248B1
KR102184248B1 KR1020197033934A KR20197033934A KR102184248B1 KR 102184248 B1 KR102184248 B1 KR 102184248B1 KR 1020197033934 A KR1020197033934 A KR 1020197033934A KR 20197033934 A KR20197033934 A KR 20197033934A KR 102184248 B1 KR102184248 B1 KR 102184248B1
Authority
KR
South Korea
Prior art keywords
substrate
unit
exposure
axis direction
holding frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020197033934A
Other languages
English (en)
Korean (ko)
Other versions
KR20190131146A (ko
Inventor
야스오 아오키
도모히데 하마다
히로시 시라스
마나부 도구치
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20190131146A publication Critical patent/KR20190131146A/ko
Application granted granted Critical
Publication of KR102184248B1 publication Critical patent/KR102184248B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816—Bearings
    • H01L21/68—
    • H01L21/6838—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020197033934A 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법 Active KR102184248B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US23549909P 2009-08-20 2009-08-20
US61/235,499 2009-08-20
US12/855,283 US20110042874A1 (en) 2009-08-20 2010-08-12 Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US12/855,283 2010-08-12
PCT/JP2010/064134 WO2011021711A1 (en) 2009-08-20 2010-08-17 Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020187014458A Division KR20180058854A (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법

Publications (2)

Publication Number Publication Date
KR20190131146A KR20190131146A (ko) 2019-11-25
KR102184248B1 true KR102184248B1 (ko) 2020-11-30

Family

ID=43604681

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020197033934A Active KR102184248B1 (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
KR1020127005322A Active KR101862001B1 (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
KR1020187014458A Ceased KR20180058854A (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020127005322A Active KR101862001B1 (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
KR1020187014458A Ceased KR20180058854A (ko) 2009-08-20 2010-08-17 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법

Country Status (6)

Country Link
US (1) US20110042874A1 (https=)
JP (5) JP5776923B2 (https=)
KR (3) KR102184248B1 (https=)
CN (4) CN105954982B (https=)
TW (4) TW202021037A (https=)
WO (1) WO2011021711A1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102483580B (zh) * 2009-08-20 2015-04-01 株式会社尼康 物体处理装置、曝光装置及曝光方法、以及元件制造方法
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US8598538B2 (en) 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
CN103782239B (zh) * 2011-08-30 2017-09-05 株式会社尼康 基板处理装置及基板处理方法、曝光方法及曝光装置、以及元件制造方法、及平板显示器的制造方法
JP5464186B2 (ja) * 2011-09-07 2014-04-09 信越化学工業株式会社 フォトマスクブランク、フォトマスク及びその製造方法
KR102000430B1 (ko) * 2012-04-03 2019-07-15 가부시키가이샤 니콘 패턴 형성 장치
JP5863149B2 (ja) * 2012-04-04 2016-02-16 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
NL2010679A (en) 2012-05-23 2013-11-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
TWI464795B (zh) * 2012-07-13 2014-12-11 Apone Technology Ltd 局部表面處理的遮罩方法
CN103572342B (zh) * 2012-07-23 2016-04-20 崇鼎科技有限公司 局部表面处理的屏蔽方法
DE102012219332B4 (de) * 2012-10-23 2014-11-13 Mdi Schott Advanced Processing Gmbh Vorrichtung und Verfahren zum Lagern und Fixieren einer Glasscheibe
EP3183091B8 (en) * 2014-08-19 2018-09-05 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
JP6712411B2 (ja) * 2015-03-30 2020-06-24 株式会社ニコン 物体搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体搬送方法、及び露光方法
HK1246870A1 (zh) * 2015-03-31 2018-09-14 株式会社尼康 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法
KR102572643B1 (ko) * 2015-05-13 2023-08-31 루미리즈 홀딩 비.브이. 다이 레벨의 레이저 리프트-오프 중에 기계적 손상을 줄이기 위한 사파이어 수집기
WO2017057465A1 (ja) * 2015-09-30 2017-04-06 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに計測方法
US10520834B2 (en) 2015-09-30 2019-12-31 Nikon Corporation Movable body apparatus, exposure apparatus, manufacturing method of flat-panel display and device manufacturing method, and movement method of object
KR102676391B1 (ko) * 2015-09-30 2024-06-18 가부시키가이샤 니콘 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
CN108139679B (zh) * 2015-09-30 2021-06-22 株式会社尼康 曝光装置、平面显示器的制造方法、组件制造方法、及曝光方法
CN106814551B (zh) * 2015-11-30 2019-04-12 上海微电子装备（集团）股份有限公司 一种基板交接装置及交接方法
WO2018001709A1 (en) * 2016-07-01 2018-01-04 Asml Netherlands B.V. Stage system, lithographic apparatus, method for positioning and device manufacturing method
TWI784972B (zh) * 2016-09-30 2022-12-01 日商尼康股份有限公司 曝光裝置、平板顯示器的製造方法、元件製造方法以及曝光方法
US20200019071A1 (en) * 2016-09-30 2020-01-16 Nikon Corporation Carrier device, exposure apparatus, exposure method, manufacturing method of flat-panel display, device manufacturing method, and carrying method
JP6805018B2 (ja) * 2017-02-10 2020-12-23 東京エレクトロン株式会社 塗布装置、および塗布方法
KR20230110827A (ko) * 2017-03-31 2023-07-25 가부시키가이샤 니콘 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조방법, 및, 디바이스 제조 방법
JP6573131B2 (ja) * 2017-04-19 2019-09-11 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6983578B2 (ja) * 2017-08-25 2021-12-17 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
JP7114277B2 (ja) 2018-03-07 2022-08-08 キヤノン株式会社 パターン形成装置及び物品の製造方法
JP2019045875A (ja) * 2018-12-07 2019-03-22 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
JP7285648B2 (ja) * 2019-01-31 2023-06-02 株式会社Ｓｃｒｅｅｎホールディングス 搬送装置、露光装置および搬送方法
JP7435613B2 (ja) * 2019-09-03 2024-02-21 株式会社ニコン 移動体装置及び加工システム
JP2021067925A (ja) * 2019-10-21 2021-04-30 キヤノン株式会社 支持装置、投影光学系、露光装置、支持装置の調整方法および物品製造方法
JP2021035682A (ja) * 2020-12-03 2021-03-04 東京エレクトロン株式会社 塗布装置、および塗布方法
CN112739028B (zh) * 2020-12-29 2025-02-07 中山新诺科技股份有限公司 一种用于双面数字化曝光的基材平整装置
JP7681437B2 (ja) * 2021-06-07 2025-05-22 株式会社ジャパンディスプレイ 表示装置の製造方法
CN113247627B (zh) * 2021-06-28 2021-11-12 新沂市铭达玻璃有限公司 一种基于玻璃输送的自动化装置
JP7756535B2 (ja) * 2021-10-06 2025-10-20 キヤノン株式会社 位置決め装置、リソグラフィ装置、および物品製造方法
CN114509923B (zh) * 2022-01-28 2023-11-24 复旦大学 一种深紫外物镜设计中的调焦调平装置及其应用
CN115236941B (zh) * 2022-02-25 2025-06-24 深圳市先地图像科技有限公司 一种在柔性感光胶片上激光成像的装置及方法
US12533818B2 (en) * 2022-04-11 2026-01-27 Asmpt Singapore Pte. Ltd. Pick-up chuck with gas bearing structure
US20230375945A1 (en) * 2022-05-19 2023-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Workpiece support

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007533153A (ja) 2004-04-14 2007-11-15 コアフロー サイエンティフィック ソリューションズ リミテッド 距離調整用非接触支持台
WO2008078688A1 (ja) 2006-12-27 2008-07-03 Nikon Corporation ステージ装置、露光装置、及びデバイスの製造方法
JP2009085865A (ja) 2007-10-02 2009-04-23 Olympus Corp 基板検査装置
JP2009128830A (ja) 2007-11-27 2009-06-11 Sharp Corp 基板処理装置及び基板処理装置の制御方法
WO2009078154A1 (ja) 2007-12-14 2009-06-25 Nikon Corporation 移動体システム、パターン形成装置、露光装置、及び計測装置、並びにデバイス製造方法
JP2009147240A (ja) 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4642908B1 (https=) * 1968-09-19 1971-12-18
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JP3689949B2 (ja) * 1995-12-19 2005-08-31 株式会社ニコン 投影露光装置、及び該投影露光装置を用いたパターン形成方法
EP0866375A3 (en) * 1997-03-17 2000-05-24 Nikon Corporation Article positioning apparatus and exposing apparatus having the same
JP2000078830A (ja) * 1998-09-01 2000-03-14 Nikon Corp リニアモータ及びステージ装置並びに露光装置
JP2000243693A (ja) * 1999-02-23 2000-09-08 Nikon Corp ステージ装置及び露光装置
JP2001215718A (ja) * 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
EP1160628B1 (en) * 2000-06-02 2007-07-18 ASML Netherlands B.V. Lithographic projection apparatus with a supporting assembly
TW527526B (en) * 2000-08-24 2003-04-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US20030098965A1 (en) * 2001-11-29 2003-05-29 Mike Binnard System and method for supporting a device holder with separate components
US6888620B2 (en) * 2001-11-29 2005-05-03 Nikon Corporation System and method for holding a device with minimal deformation
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
TWI226303B (en) * 2002-04-18 2005-01-11 Olympus Corp Substrate carrying device
JP2004079630A (ja) * 2002-08-12 2004-03-11 Nikon Corp 支持装置とその製造方法およびステージ装置並びに露光装置
JP2004238133A (ja) * 2003-02-05 2004-08-26 Sharp Corp 薄板把持装置、薄板搬送装置および薄板検査装置
US7077019B2 (en) * 2003-08-08 2006-07-18 Photon Dynamics, Inc. High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
JP4373175B2 (ja) * 2003-10-17 2009-11-25 オリンパス株式会社 基板搬送装置
US20080013060A1 (en) * 2004-07-23 2008-01-17 Nikon Corporation Support Apparatus, Stage Apparatus, Exposure Apparatus, And Device Manufacturing Method
US7440081B2 (en) * 2004-11-05 2008-10-21 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and substrate table
US7864293B2 (en) * 2005-01-25 2011-01-04 Nikon Corporation Exposure apparatus, exposure method, and producing method of microdevice
JP2006265020A (ja) * 2005-03-23 2006-10-05 Nippon Sheet Glass Co Ltd ガラス板搬送支持装置
EP1865381A4 (en) * 2005-03-29 2010-03-03 Nikon Corp EXPOSURE DEVICE, METHOD FOR THE PRODUCTION OF AN EXPOSURE DEVICE AND METHOD FOR THE PRODUCTION OF A MICRO-BUILDING ELEMENT
KR100949502B1 (ko) * 2005-06-20 2010-03-24 엘지디스플레이 주식회사 액정표시장치 제조 공정용 기판 반송장치
JP4553376B2 (ja) * 2005-07-19 2010-09-29 東京エレクトロン株式会社 浮上式基板搬送処理装置及び浮上式基板搬送処理方法
US7543867B2 (en) * 2005-09-30 2009-06-09 Photon Dynamics, Inc. Vacuum gripping system for positioning large thin substrates on a support table
WO2007074798A1 (ja) * 2005-12-27 2007-07-05 Sharp Kabushiki Kaisha 基板処理装置への基板搬送方法
TWI605491B (zh) * 2006-01-19 2017-11-11 尼康股份有限公司 曝光裝置及曝光方法、以及元件製造方法
JP4702083B2 (ja) * 2006-02-10 2011-06-15 ウシオ電機株式会社 ＸＹθ移動ステージ
EP3327507B1 (en) * 2006-02-21 2019-04-03 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
KR101356270B1 (ko) * 2006-02-21 2014-01-28 가부시키가이샤 니콘 패턴 형성 장치, 마크 검출 장치, 노광 장치, 패턴 형성 방법, 노광 방법 및 디바이스 제조 방법
US20070236854A1 (en) * 2006-04-11 2007-10-11 Lee Martin E Anti-Gravity Device for Supporting Weight and Reducing Transmissibility
JP2008063020A (ja) * 2006-09-04 2008-03-21 Olympus Corp 基板搬送装置およびそれを用いた基板検査システム
JP2008192678A (ja) * 2007-02-01 2008-08-21 Toppan Printing Co Ltd 基板処理装置
JP4652351B2 (ja) * 2007-02-02 2011-03-16 大日本印刷株式会社 基板支持装置、基板支持方法
KR101547784B1 (ko) * 2007-03-05 2015-08-26 가부시키가이샤 니콘 이동체 장치, 패턴 형성 장치 및 패턴 형성 방법, 디바이스 제조 방법, 이동체 장치의 제조 방법, 및 이동체 구동 방법
JP4743716B2 (ja) * 2007-03-06 2011-08-10 東京エレクトロン株式会社 基板処理装置
US7607647B2 (en) 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
JP5279207B2 (ja) * 2007-06-11 2013-09-04 Ｎｓｋテクノロジー株式会社 露光装置用基板搬送機構
JP2009256029A (ja) * 2008-04-15 2009-11-05 Toray Eng Co Ltd 板状部材の搬送装置および板状部材の搬送方法
KR20100018950A (ko) 2008-08-08 2010-02-18 하명찬 타이어 가황기용 단열판
JP5254073B2 (ja) * 2008-08-21 2013-08-07 Ｎｓｋテクノロジー株式会社 スキャン露光装置およびスキャン露光装置の基板搬送方法
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
JP2010132460A (ja) * 2010-01-13 2010-06-17 Toray Eng Co Ltd 板状部材の搬送装置および板状部材の搬送方法
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064460A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007533153A (ja) 2004-04-14 2007-11-15 コアフロー サイエンティフィック ソリューションズ リミテッド 距離調整用非接触支持台
WO2008078688A1 (ja) 2006-12-27 2008-07-03 Nikon Corporation ステージ装置、露光装置、及びデバイスの製造方法
JP2009085865A (ja) 2007-10-02 2009-04-23 Olympus Corp 基板検査装置
JP2009128830A (ja) 2007-11-27 2009-06-11 Sharp Corp 基板処理装置及び基板処理装置の制御方法
WO2009078154A1 (ja) 2007-12-14 2009-06-25 Nikon Corporation 移動体システム、パターン形成装置、露光装置、及び計測装置、並びにデバイス製造方法
JP2009147240A (ja) 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法

Also Published As

Publication number Publication date
CN105954976B (zh) 2019-11-26
JP5776923B2 (ja) 2015-09-09
KR20120053020A (ko) 2012-05-24
TWI686896B (zh) 2020-03-01
CN105954976A (zh) 2016-09-21
KR20190131146A (ko) 2019-11-25
TW202021037A (zh) 2020-06-01
TWI632640B (zh) 2018-08-11
WO2011021711A1 (en) 2011-02-24
CN105957827B (zh) 2019-11-26
CN105954982A (zh) 2016-09-21
US20110042874A1 (en) 2011-02-24
KR20180058854A (ko) 2018-06-01
JP6628154B2 (ja) 2020-01-08
TW201727819A (zh) 2017-08-01
JP2015232718A (ja) 2015-12-24
CN105954982B (zh) 2018-06-01
JP2011044713A (ja) 2011-03-03
JP2017142522A (ja) 2017-08-17
TWI582893B (zh) 2017-05-11
KR101862001B1 (ko) 2018-05-29
TW201126641A (en) 2011-08-01
CN102483578B (zh) 2016-05-25
CN102483578A (zh) 2012-05-30
JP2020043369A (ja) 2020-03-19
CN105957827A (zh) 2016-09-21
TW201839901A (zh) 2018-11-01
JP6508576B2 (ja) 2019-05-08
JP2017142523A (ja) 2017-08-17

Similar Documents

Publication Publication Date Title
KR102184248B1 (ko) 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
JP6587160B2 (ja) 移動体装置、物体処理装置、露光装置、露光方法、フラットパネルディスプレイの製造方法及びデバイス製造方法
JP5573849B2 (ja) 物体処理装置、露光装置及び露光方法、並びにデバイス製造方法
HK1166141A (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
HK1229531A1 (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
HK1229441A1 (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
HK1229440A1 (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
HK1166142B (en) Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
HK1229441B (zh) 物体处理装置、曝光装置及曝光方法、以及元件制造方法
HK1166140B (en) Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000