WO2008078688A1 - ステージ装置、露光装置、及びデバイスの製造方法 - Google Patents

ステージ装置、露光装置、及びデバイスの製造方法 Download PDF

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Publication number
WO2008078688A1
WO2008078688A1 PCT/JP2007/074673 JP2007074673W WO2008078688A1 WO 2008078688 A1 WO2008078688 A1 WO 2008078688A1 JP 2007074673 W JP2007074673 W JP 2007074673W WO 2008078688 A1 WO2008078688 A1 WO 2008078688A1
Authority
WO
WIPO (PCT)
Prior art keywords
substages
moving surface
moving
device manufacturing
stage apparatus
Prior art date
Application number
PCT/JP2007/074673
Other languages
English (en)
French (fr)
Inventor
Kazuya Ono
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2008551084A priority Critical patent/JP5146323B2/ja
Priority to KR20157004515A priority patent/KR20150036734A/ko
Priority to KR1020097015661A priority patent/KR20090106555A/ko
Priority to EP07859953A priority patent/EP2109133A4/en
Publication of WO2008078688A1 publication Critical patent/WO2008078688A1/ja
Priority to US12/457,914 priority patent/US20100066992A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

　所定の移動面（１６ａ）を備えた固定部（１６）と、移動面（１６ａ）に沿って第１方向を含む複数の方向に移動可能な第１移動体とを有する。第１移動体の移動と同期して、移動面（１６ａ）に対して第１方向に移動するサブステージ（６１Ａ、６１Ｂ）と、サブステージ（６１Ａ、６１Ｂ）に少なくとも一部が設けられ、サブステージ（６１Ａ、６１Ｂ）と移動面（１６ａ）との間の第１方向の相対位置に関する情報を検出する第１計測装置（６７）と、サブステージ（６１Ａ、６１Ｂ）に少なくとも一部が設けられ、サブステージと第１移動体との間の第１方向と略直交しかつ移動面（１６ａ）に沿う第２方向の相対位置に関する情報を検出する第２計測装置（７１、７２）とを有する。
PCT/JP2007/074673 2006-12-27 2007-12-21 ステージ装置、露光装置、及びデバイスの製造方法 WO2008078688A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008551084A JP5146323B2 (ja) 2006-12-27 2007-12-21 ステージ装置、露光装置、及びデバイスの製造方法
KR20157004515A KR20150036734A (ko) 2006-12-27 2007-12-21 스테이지 장치, 노광 장치, 및 디바이스의 제조 방법
KR1020097015661A KR20090106555A (ko) 2006-12-27 2007-12-21 스테이지 장치, 노광 장치, 및 디바이스의 제조 방법
EP07859953A EP2109133A4 (en) 2006-12-27 2007-12-21 PLATTER APPARATUS, EXPOSURE APPARATUS, AND METHOD FOR MANUFACTURING THE APPARATUS
US12/457,914 US20100066992A1 (en) 2006-12-27 2009-06-25 Stage apparatus, exposure apparatus, and device fabricating method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006351479 2006-12-27
JP2006-351479 2006-12-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/457,914 Continuation US20100066992A1 (en) 2006-12-27 2009-06-25 Stage apparatus, exposure apparatus, and device fabricating method

Publications (1)

Publication Number Publication Date
WO2008078688A1 true WO2008078688A1 (ja) 2008-07-03

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PCT/JP2007/074673 WO2008078688A1 (ja) 2006-12-27 2007-12-21 ステージ装置、露光装置、及びデバイスの製造方法

Country Status (7)

Country Link
US (1) US20100066992A1 (ja)
EP (2) EP2998983B1 (ja)
JP (1) JP5146323B2 (ja)
KR (2) KR20090106555A (ja)
HK (1) HK1218185A1 (ja)
TW (1) TWI457978B (ja)
WO (1) WO2008078688A1 (ja)

Cited By (16)

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JP2010062209A (ja) * 2008-09-01 2010-03-18 Nikon Corp 露光装置、露光方法、及びデバイス製造方法
JP2011211180A (ja) * 2010-03-29 2011-10-20 Nikon Corp 露光方法及び露光装置、並びにデバイス製造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8446579B2 (en) 2008-05-28 2013-05-21 Nikon Corporation Inspection device and inspecting method for spatial light modulator, illumination optical system, method for adjusting the illumination optical system, exposure apparatus, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8462317B2 (en) 2007-10-16 2013-06-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8520291B2 (en) 2007-10-16 2013-08-27 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
US8854601B2 (en) 2005-05-12 2014-10-07 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9140993B2 (en) 2003-10-28 2015-09-22 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9164209B2 (en) 2003-11-20 2015-10-20 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power having different thicknesses to rotate linear polarization direction
JP2017142522A (ja) * 2009-08-20 2017-08-17 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
JP2022048443A (ja) * 2020-09-15 2022-03-28 キオクシア株式会社 位置計測装置及び計測方法

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CN108983554A (zh) 2012-10-02 2018-12-11 株式会社尼康 曝光装置以及器件制造方法
US9785051B2 (en) * 2012-10-15 2017-10-10 Asml Netherlands B.V. Actuation mechanism, optical apparatus, lithography apparatus and method of manufacturing devices
CN105684108A (zh) 2013-09-04 2016-06-15 Ckd株式会社 电磁致动器用电枢线圈、电磁致动器、曝光装置及器件制造方法
WO2016104511A1 (ja) 2014-12-24 2016-06-30 株式会社ニコン 計測装置及び計測方法、露光装置及び露光方法、並びにデバイス製造方法
KR102294481B1 (ko) 2014-12-24 2021-08-27 가부시키가이샤 니콘 이동체의 제어 방법, 노광 방법, 디바이스 제조 방법, 이동체 장치, 및 노광 장치
CN108168442B (zh) * 2018-03-28 2023-09-08 河北省同创交通工程配套产品产业技术研究院 一种止水带凹凸槽动态测量装置的动态测量方法
DE202019000816U1 (de) * 2019-02-20 2020-05-28 isel GmbH & Co. KG Planarläuferpositionsmesssystem

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EP2998983B1 (en) 2018-03-21
EP2109133A1 (en) 2009-10-14
EP2998983A3 (en) 2016-06-08
TW200845118A (en) 2008-11-16
EP2109133A4 (en) 2011-12-28
KR20150036734A (ko) 2015-04-07
JPWO2008078688A1 (ja) 2010-04-22
HK1218185A1 (zh) 2017-02-03
JP5146323B2 (ja) 2013-02-20
KR20090106555A (ko) 2009-10-09
TWI457978B (zh) 2014-10-21
EP2998983A2 (en) 2016-03-23
US20100066992A1 (en) 2010-03-18

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