HK1246870A1 - 曝光裝置、平板顯示器的製造方法、器件製造方法及曝光方法 - Google Patents
曝光裝置、平板顯示器的製造方法、器件製造方法及曝光方法Info
- Publication number
- HK1246870A1 HK1246870A1 HK18106084.4A HK18106084A HK1246870A1 HK 1246870 A1 HK1246870 A1 HK 1246870A1 HK 18106084 A HK18106084 A HK 18106084A HK 1246870 A1 HK1246870 A1 HK 1246870A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- production method
- exposure
- panel
- flat
- exposure apparatus
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015070595 | 2015-03-31 | ||
PCT/JP2016/060551 WO2016159176A1 (ja) | 2015-03-31 | 2016-03-30 | 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1246870A1 true HK1246870A1 (zh) | 2018-09-14 |
Family
ID=57004776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18106084.4A HK1246870A1 (zh) | 2015-03-31 | 2018-05-10 | 曝光裝置、平板顯示器的製造方法、器件製造方法及曝光方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10564548B2 (zh) |
JP (2) | JP6738542B2 (zh) |
KR (1) | KR102584657B1 (zh) |
CN (2) | CN107407893B (zh) |
HK (1) | HK1246870A1 (zh) |
TW (3) | TWI719975B (zh) |
WO (1) | WO2016159176A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI735438B (zh) * | 2015-03-30 | 2021-08-11 | 日商尼康股份有限公司 | 物體搬運裝置、曝光裝置、平板顯示器的製造方法、元件製造方法、物體搬運方法以及曝光方法 |
JP6738542B2 (ja) * | 2015-03-31 | 2020-08-12 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法 |
KR102318643B1 (ko) * | 2016-09-30 | 2021-10-27 | 가부시키가이샤 니콘 | 이동체 장치, 이동 방법, 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 그리고 디바이스 제조 방법 |
CN106876233B (zh) * | 2017-03-09 | 2018-09-14 | 成都京东方光电科技有限公司 | 承载装置及离子注入设备 |
WO2018181913A1 (ja) * | 2017-03-31 | 2018-10-04 | 株式会社ニコン | 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法 |
CN112470078A (zh) | 2018-06-05 | 2021-03-09 | Asml荷兰有限公司 | 包括低温保持器和超导线圈层的组件以及设置有这种组件的电机系统 |
KR20210011536A (ko) | 2019-07-22 | 2021-02-02 | 삼성디스플레이 주식회사 | 미세 소자의 전사 장치 및 전사 방법 |
US11903302B2 (en) * | 2020-12-16 | 2024-02-13 | Universal Display Corporation | Organic vapor jet printing system |
CN114111691B (zh) * | 2021-11-19 | 2024-06-14 | 三英精控(天津)仪器设备有限公司 | 一种晶圆检测高精度气浮运动平台及方法 |
CN115790455B (zh) * | 2022-12-26 | 2023-12-01 | 武汉国创科光电装备有限公司 | 一种喷墨打印基板平整度检测系统 |
Family Cites Families (28)
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US5729331A (en) | 1993-06-30 | 1998-03-17 | Nikon Corporation | Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus |
JP2001215718A (ja) | 1999-11-26 | 2001-08-10 | Nikon Corp | 露光装置及び露光方法 |
JP2004087593A (ja) * | 2002-08-23 | 2004-03-18 | Nikon Corp | ステージ装置および露光装置 |
JP4553376B2 (ja) * | 2005-07-19 | 2010-09-29 | 東京エレクトロン株式会社 | 浮上式基板搬送処理装置及び浮上式基板搬送処理方法 |
JP5448070B2 (ja) * | 2007-03-05 | 2014-03-19 | 株式会社ニコン | 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、並びに移動体駆動方法 |
US7607647B2 (en) * | 2007-03-20 | 2009-10-27 | Kla-Tencor Technologies Corporation | Stabilizing a substrate using a vacuum preload air bearing chuck |
JP5279207B2 (ja) * | 2007-06-11 | 2013-09-04 | Nskテクノロジー株式会社 | 露光装置用基板搬送機構 |
WO2009011356A1 (ja) * | 2007-07-18 | 2009-01-22 | Nikon Corporation | 計測方法、ステージ装置、及び露光装置 |
JP5304017B2 (ja) * | 2008-05-09 | 2013-10-02 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
US20110062641A1 (en) * | 2008-06-03 | 2011-03-17 | Seiichi Sato | Stage equipped with alignment function, processing apparatus having the stage equipped with alignment function, and method of aligning substrate |
JP5254073B2 (ja) * | 2008-08-21 | 2013-08-07 | Nskテクノロジー株式会社 | スキャン露光装置およびスキャン露光装置の基板搬送方法 |
US8760629B2 (en) * | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
TW201100975A (en) * | 2009-04-21 | 2011-01-01 | Nikon Corp | Moving-object apparatus, exposure apparatus, exposure method, and device manufacturing method |
US8970820B2 (en) * | 2009-05-20 | 2015-03-03 | Nikon Corporation | Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method |
CN102483580B (zh) * | 2009-08-20 | 2015-04-01 | 株式会社尼康 | 物体处理装置、曝光装置及曝光方法、以及元件制造方法 |
US20110042874A1 (en) * | 2009-08-20 | 2011-02-24 | Nikon Corporation | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method |
US20110244396A1 (en) * | 2010-04-01 | 2011-10-06 | Nikon Corporation | Exposure apparatus, exchange method of object, exposure method, and device manufacturing method |
US20120064460A1 (en) * | 2010-09-07 | 2012-03-15 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
US8598538B2 (en) * | 2010-09-07 | 2013-12-03 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
CN103782239B (zh) * | 2011-08-30 | 2017-09-05 | 株式会社尼康 | 基板处理装置及基板处理方法、曝光方法及曝光装置、以及元件制造方法、及平板显示器的制造方法 |
JP2013219068A (ja) * | 2012-04-04 | 2013-10-24 | Nikon Corp | 物体駆動システム、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体の駆動方法 |
JP2013221961A (ja) * | 2012-04-13 | 2013-10-28 | Nikon Corp | 露光方法、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光装置 |
JP2014035349A (ja) * | 2012-08-07 | 2014-02-24 | Nikon Corp | 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
US9772564B2 (en) * | 2012-11-12 | 2017-09-26 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method |
EP3001451A4 (en) * | 2013-05-23 | 2017-01-11 | Nikon Corporation | Substrate holding method, substrate holding apparatus, exposure method, and exposure apparatus |
WO2015147039A1 (ja) * | 2014-03-26 | 2015-10-01 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
WO2015158390A1 (en) * | 2014-04-17 | 2015-10-22 | Applied Materials, Inc. | Carrier for substrates |
JP6738542B2 (ja) * | 2015-03-31 | 2020-08-12 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法 |
-
2016
- 2016-03-30 JP JP2017510152A patent/JP6738542B2/ja active Active
- 2016-03-30 WO PCT/JP2016/060551 patent/WO2016159176A1/ja active Application Filing
- 2016-03-30 CN CN201680020108.4A patent/CN107407893B/zh active Active
- 2016-03-30 CN CN202110472738.8A patent/CN113204177A/zh active Pending
- 2016-03-30 KR KR1020177031050A patent/KR102584657B1/ko active IP Right Grant
- 2016-03-31 TW TW105110201A patent/TWI719975B/zh active
- 2016-03-31 TW TW111147390A patent/TW202311869A/zh unknown
- 2016-03-31 TW TW110101993A patent/TWI789689B/zh active
-
2017
- 2017-09-21 US US15/711,377 patent/US10564548B2/en active Active
-
2018
- 2018-05-10 HK HK18106084.4A patent/HK1246870A1/zh unknown
-
2020
- 2020-02-04 US US16/781,370 patent/US10983438B2/en active Active
- 2020-07-17 JP JP2020122860A patent/JP2020190740A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN107407893A (zh) | 2017-11-28 |
KR20170128602A (ko) | 2017-11-22 |
TW201643556A (zh) | 2016-12-16 |
US20200174373A1 (en) | 2020-06-04 |
US10564548B2 (en) | 2020-02-18 |
CN113204177A (zh) | 2021-08-03 |
TWI719975B (zh) | 2021-03-01 |
WO2016159176A1 (ja) | 2016-10-06 |
US10983438B2 (en) | 2021-04-20 |
KR102584657B1 (ko) | 2023-10-04 |
TW202311869A (zh) | 2023-03-16 |
CN107407893B (zh) | 2021-06-01 |
US20180067397A1 (en) | 2018-03-08 |
JP2020190740A (ja) | 2020-11-26 |
TW202117466A (zh) | 2021-05-01 |
TWI789689B (zh) | 2023-01-11 |
JP6738542B2 (ja) | 2020-08-12 |
JPWO2016159176A1 (ja) | 2018-02-01 |
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