HK1225513A1 - 曝光裝置及曝光方法、以及器件製造方法 - Google Patents
曝光裝置及曝光方法、以及器件製造方法Info
- Publication number
- HK1225513A1 HK1225513A1 HK16113798A HK16113798A HK1225513A1 HK 1225513 A1 HK1225513 A1 HK 1225513A1 HK 16113798 A HK16113798 A HK 16113798A HK 16113798 A HK16113798 A HK 16113798A HK 1225513 A1 HK1225513 A1 HK 1225513A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- exposure
- device manufacturing
- exposure apparatus
- exposure method
- manufacturing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70583—Speckle reduction, e.g. coherence control or amplitude/wavefront splitting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70533—Controlling abnormal operating mode, e.g. taking account of waiting time, decision to rework or rework flow
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014005684 | 2014-01-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1225513A1 true HK1225513A1 (zh) | 2017-09-08 |
Family
ID=53542866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16113798A HK1225513A1 (zh) | 2014-01-16 | 2016-12-02 | 曝光裝置及曝光方法、以及器件製造方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US9915878B2 (zh) |
EP (1) | EP3096346A4 (zh) |
JP (2) | JP6380412B2 (zh) |
KR (2) | KR101963012B1 (zh) |
CN (1) | CN105917441A (zh) |
HK (1) | HK1225513A1 (zh) |
TW (1) | TW201530264A (zh) |
WO (1) | WO2015107976A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10281830B2 (en) * | 2015-07-14 | 2019-05-07 | Asml Netherlands B.V. | Patterning device cooling systems in a lithographic apparatus |
NL2017904A (en) | 2015-12-18 | 2017-06-26 | Asml Netherlands Bv | Optical System and Method |
JP6925783B2 (ja) * | 2016-05-26 | 2021-08-25 | 株式会社アドテックエンジニアリング | パターン描画装置及びパターン描画方法 |
KR101971272B1 (ko) | 2016-06-02 | 2019-08-27 | 주식회사 더웨이브톡 | 패턴 구조물 검사 장치 및 검사 방법 |
CN107883884B (zh) | 2016-09-30 | 2019-10-25 | 上海微电子装备(集团)股份有限公司 | 一种光学测量装置和方法 |
CN107883887B (zh) * | 2016-09-30 | 2019-11-26 | 上海微电子装备(集团)股份有限公司 | 一种光学测量装置和方法 |
CN110337707B (zh) * | 2017-02-13 | 2021-09-28 | 株式会社日立高新技术 | 带电粒子线装置 |
JP2022110461A (ja) * | 2021-01-18 | 2022-07-29 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及びその調整方法 |
TWI776680B (zh) * | 2021-09-16 | 2022-09-01 | 日商新川股份有限公司 | 安裝裝置以及安裝裝置中的平行度檢測方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4780617A (en) | 1984-08-09 | 1988-10-25 | Nippon Kogaku K.K. | Method for successive alignment of chip patterns on a substrate |
JPS6386429A (ja) * | 1986-09-30 | 1988-04-16 | Toshiba Corp | X線マスクのひずみ測定法 |
JPH01230046A (ja) * | 1988-03-10 | 1989-09-13 | Toshiba Corp | 露光監視装置 |
JP2787699B2 (ja) * | 1989-04-03 | 1998-08-20 | 株式会社ニコン | 干渉パターンの強度測定方法および露光装置 |
JP3047461B2 (ja) * | 1990-11-26 | 2000-05-29 | 株式会社ニコン | 投影露光装置、投影露光方法、及び半導体集積回路製造方法 |
KR100300618B1 (ko) | 1992-12-25 | 2001-11-22 | 오노 시게오 | 노광방법,노광장치,및그장치를사용하는디바이스제조방법 |
JP3412704B2 (ja) | 1993-02-26 | 2003-06-03 | 株式会社ニコン | 投影露光方法及び装置、並びに露光装置 |
JP3265503B2 (ja) * | 1993-06-11 | 2002-03-11 | 株式会社ニコン | 露光方法及び装置 |
SG102627A1 (en) | 1996-11-28 | 2004-03-26 | Nikon Corp | Lithographic device |
JP2000505958A (ja) | 1996-12-24 | 2000-05-16 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 2個の物品ホルダを有する二次元バランス位置決め装置及びこの位置決め装置を有するリソグラフ装置 |
JPH10247617A (ja) * | 1997-03-03 | 1998-09-14 | Nikon Corp | 投影露光方法及び投影露光装置 |
US6208407B1 (en) | 1997-12-22 | 2001-03-27 | Asm Lithography B.V. | Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement |
IL138374A (en) | 1998-03-11 | 2004-07-25 | Nikon Corp | An ultraviolet laser device and an exposure device that includes such a device |
SG124257A1 (en) | 2000-02-25 | 2006-08-30 | Nikon Corp | Exposure apparatus and exposure method capable of controlling illumination distribution |
JP2002222761A (ja) * | 2000-11-22 | 2002-08-09 | Nikon Corp | 照明光学装置および該照明光学装置を備えた露光装置 |
EP1364257A1 (en) | 2001-02-27 | 2003-11-26 | ASML US, Inc. | Simultaneous imaging of two reticles |
JP2003142365A (ja) * | 2001-10-31 | 2003-05-16 | Canon Inc | 露光装置及び露光方法 |
JP2004165250A (ja) * | 2002-11-11 | 2004-06-10 | Nikon Corp | マスク検査方法、マスク検査装置、露光方法、及び露光装置 |
KR100585476B1 (ko) | 2002-11-12 | 2006-06-07 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 디바이스 제조방법 |
EP1420298B1 (en) | 2002-11-12 | 2013-02-20 | ASML Netherlands B.V. | Lithographic apparatus |
DE60326384D1 (de) | 2002-12-13 | 2009-04-09 | Koninkl Philips Electronics Nv | Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht |
US6937349B2 (en) | 2003-05-02 | 2005-08-30 | Mitutoyo Corporation | Systems and methods for absolute positioning using repeated quasi-random pattern |
JP2006019560A (ja) * | 2004-07-02 | 2006-01-19 | Canon Inc | 露光装置、走査型露光装置およびデバイス製造方法 |
JP4545580B2 (ja) | 2004-12-27 | 2010-09-15 | 株式会社ミツトヨ | 面内方向変位計 |
JP4817700B2 (ja) * | 2005-04-04 | 2011-11-16 | キヤノン株式会社 | 露光装置及び方法、並びに、デバイス製造方法 |
JP5017556B2 (ja) * | 2007-03-19 | 2012-09-05 | 埼玉県 | 変形測定装置、変形測定方法および変形測定プログラム |
US8994918B2 (en) * | 2010-10-21 | 2015-03-31 | Nikon Corporation | Apparatus and methods for measuring thermally induced reticle distortion |
NL2007615A (en) * | 2010-11-30 | 2012-05-31 | Asml Netherlands Bv | Method of operating a patterning device and lithographic apparatus. |
JP2013175541A (ja) * | 2012-02-24 | 2013-09-05 | Nikon Corp | マスク及びその変形量計測方法、並びに露光方法及び装置 |
JP2013247258A (ja) * | 2012-05-28 | 2013-12-09 | Nikon Corp | アライメント方法、露光方法、及びデバイス製造方法、並びにデバイス製造システム |
-
2015
- 2015-01-08 EP EP15737108.9A patent/EP3096346A4/en not_active Withdrawn
- 2015-01-08 KR KR1020167021913A patent/KR101963012B1/ko active IP Right Grant
- 2015-01-08 CN CN201580004839.5A patent/CN105917441A/zh active Pending
- 2015-01-08 WO PCT/JP2015/050404 patent/WO2015107976A1/ja active Application Filing
- 2015-01-08 KR KR1020197008040A patent/KR20190032647A/ko not_active Application Discontinuation
- 2015-01-08 JP JP2015557811A patent/JP6380412B2/ja active Active
- 2015-01-13 TW TW104101058A patent/TW201530264A/zh unknown
-
2016
- 2016-07-07 US US15/204,389 patent/US9915878B2/en active Active
- 2016-12-02 HK HK16113798A patent/HK1225513A1/zh unknown
-
2018
- 2018-01-03 US US15/861,000 patent/US20180143539A1/en not_active Abandoned
- 2018-08-01 JP JP2018144707A patent/JP2018173663A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP6380412B2 (ja) | 2018-08-29 |
TW201530264A (zh) | 2015-08-01 |
JP2018173663A (ja) | 2018-11-08 |
JPWO2015107976A1 (ja) | 2017-03-23 |
EP3096346A1 (en) | 2016-11-23 |
CN105917441A (zh) | 2016-08-31 |
US20180143539A1 (en) | 2018-05-24 |
KR101963012B1 (ko) | 2019-03-27 |
US20160357116A1 (en) | 2016-12-08 |
EP3096346A4 (en) | 2017-09-27 |
WO2015107976A1 (ja) | 2015-07-23 |
KR20190032647A (ko) | 2019-03-27 |
KR20160106733A (ko) | 2016-09-12 |
US9915878B2 (en) | 2018-03-13 |
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