KR102092990B1 - 도전성 페이스트 조성물 - Google Patents

도전성 페이스트 조성물 Download PDF

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Publication number
KR102092990B1
KR102092990B1 KR1020157014404A KR20157014404A KR102092990B1 KR 102092990 B1 KR102092990 B1 KR 102092990B1 KR 1020157014404 A KR1020157014404 A KR 1020157014404A KR 20157014404 A KR20157014404 A KR 20157014404A KR 102092990 B1 KR102092990 B1 KR 102092990B1
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KR
South Korea
Prior art keywords
conductive paste
paste composition
solvent
conductive
green sheet
Prior art date
Application number
KR1020157014404A
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English (en)
Korean (ko)
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KR20150083097A (ko
Inventor
가즈히사 히라오
고지 이나오카
주지 다카다
히로유키 나이토
Original Assignee
가부시키가이샤 노리타케 캄파니 리미티드
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Publication of KR20150083097A publication Critical patent/KR20150083097A/ko
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Publication of KR102092990B1 publication Critical patent/KR102092990B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20Diluents or solvents
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020157014404A 2012-11-06 2013-11-05 도전성 페이스트 조성물 KR102092990B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-244846 2012-11-06
JP2012244846 2012-11-06
PCT/JP2013/079896 WO2014073530A1 (ja) 2012-11-06 2013-11-05 導電性ペースト組成物

Publications (2)

Publication Number Publication Date
KR20150083097A KR20150083097A (ko) 2015-07-16
KR102092990B1 true KR102092990B1 (ko) 2020-03-24

Family

ID=50684633

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157014404A KR102092990B1 (ko) 2012-11-06 2013-11-05 도전성 페이스트 조성물

Country Status (5)

Country Link
JP (1) JP5890036B2 (zh)
KR (1) KR102092990B1 (zh)
CN (1) CN104769044B (zh)
TW (1) TWI601793B (zh)
WO (1) WO2014073530A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102410080B1 (ko) * 2014-07-31 2022-06-16 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 페이스트
JP6967845B2 (ja) * 2016-09-27 2021-11-17 株式会社ノリタケカンパニーリミテド 銀ペーストおよび電子素子
JP6939015B2 (ja) * 2017-03-29 2021-09-22 住友金属鉱山株式会社 積層セラミックコンデンサ内部電極用のグラビア印刷用導電性ペースト
JP6853606B2 (ja) * 2017-08-10 2021-03-31 株式会社ノリタケカンパニーリミテド 導電性ペースト
JP6521138B1 (ja) * 2018-04-19 2019-05-29 東洋インキScホールディングス株式会社 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法
JPWO2020137290A1 (ja) * 2018-12-25 2021-11-04 住友金属鉱山株式会社 導電性ペースト、電子部品、及び積層セラミックコンデンサ
JP7053527B2 (ja) * 2019-03-29 2022-04-12 株式会社ノリタケカンパニーリミテド 導電性ペースト
KR20220106108A (ko) * 2019-11-29 2022-07-28 스미토모 긴조쿠 고잔 가부시키가이샤 그라비어 인쇄용 도전성 페이스트, 전자 부품, 및 적층 세라믹 콘덴서
KR20240016966A (ko) * 2021-06-02 2024-02-06 스미토모 긴조쿠 고잔 가부시키가이샤 그라비어 인쇄용 도전성 페이스트, 전자 부품, 및 적층 세라믹 콘덴서

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270456A (ja) 2001-03-07 2002-09-20 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品
JP2007214452A (ja) 2006-02-10 2007-08-23 Tdk Corp 剥離層用ペースト及び積層型電子部品の製造方法
JP2010287763A (ja) 2009-06-12 2010-12-24 Sekisui Chem Co Ltd 積層セラミックコンデンサの製造方法
JP2011159393A (ja) * 2010-01-29 2011-08-18 Sumitomo Metal Mining Co Ltd 導電性ペースト
JP2012226865A (ja) 2011-04-15 2012-11-15 Sumitomo Metal Mining Co Ltd 導電性ペースト組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4487596B2 (ja) * 2004-02-27 2010-06-23 Tdk株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4487595B2 (ja) * 2004-02-27 2010-06-23 Tdk株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4299765B2 (ja) 2004-11-05 2009-07-22 株式会社ノリタケカンパニーリミテド 導電性ペースト
JP4953626B2 (ja) 2004-12-24 2012-06-13 京セラ株式会社 セラミック電子部品の製造方法
JP4462493B2 (ja) 2005-01-18 2010-05-12 ヤスハラケミカル株式会社 導電性ペースト
JP2007084690A (ja) 2005-09-22 2007-04-05 Toppan Printing Co Ltd 凸版反転オフセット法用インキ及び印刷体
JP4471924B2 (ja) 2005-11-28 2010-06-02 京セラ株式会社 電子部品の製造方法
JP4340674B2 (ja) * 2006-09-29 2009-10-07 Tdk株式会社 導電性ペースト、積層セラミック電子部品及びその製造方法
CN102169755B (zh) * 2010-02-26 2015-07-15 住友金属矿山株式会社 层叠陶瓷电容器内部电极用导电性糊剂

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270456A (ja) 2001-03-07 2002-09-20 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品
JP2007214452A (ja) 2006-02-10 2007-08-23 Tdk Corp 剥離層用ペースト及び積層型電子部品の製造方法
JP2010287763A (ja) 2009-06-12 2010-12-24 Sekisui Chem Co Ltd 積層セラミックコンデンサの製造方法
JP2011159393A (ja) * 2010-01-29 2011-08-18 Sumitomo Metal Mining Co Ltd 導電性ペースト
JP2012226865A (ja) 2011-04-15 2012-11-15 Sumitomo Metal Mining Co Ltd 導電性ペースト組成物

Also Published As

Publication number Publication date
KR20150083097A (ko) 2015-07-16
CN104769044A (zh) 2015-07-08
TW201431982A (zh) 2014-08-16
JP5890036B2 (ja) 2016-03-22
WO2014073530A1 (ja) 2014-05-15
TWI601793B (zh) 2017-10-11
JPWO2014073530A1 (ja) 2016-09-08
CN104769044B (zh) 2017-03-08

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