KR102092990B1 - 도전성 페이스트 조성물 - Google Patents
도전성 페이스트 조성물 Download PDFInfo
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- KR102092990B1 KR102092990B1 KR1020157014404A KR20157014404A KR102092990B1 KR 102092990 B1 KR102092990 B1 KR 102092990B1 KR 1020157014404 A KR1020157014404 A KR 1020157014404A KR 20157014404 A KR20157014404 A KR 20157014404A KR 102092990 B1 KR102092990 B1 KR 102092990B1
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- conductive paste
- paste composition
- solvent
- conductive
- green sheet
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Classifications
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
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- H—ELECTRICITY
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KR102410080B1 (ko) * | 2014-07-31 | 2022-06-16 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 도전성 페이스트 |
JP6967845B2 (ja) * | 2016-09-27 | 2021-11-17 | 株式会社ノリタケカンパニーリミテド | 銀ペーストおよび電子素子 |
JP6939015B2 (ja) * | 2017-03-29 | 2021-09-22 | 住友金属鉱山株式会社 | 積層セラミックコンデンサ内部電極用のグラビア印刷用導電性ペースト |
JP6853606B2 (ja) * | 2017-08-10 | 2021-03-31 | 株式会社ノリタケカンパニーリミテド | 導電性ペースト |
JP6521138B1 (ja) * | 2018-04-19 | 2019-05-29 | 東洋インキScホールディングス株式会社 | 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法 |
JPWO2020137290A1 (ja) * | 2018-12-25 | 2021-11-04 | 住友金属鉱山株式会社 | 導電性ペースト、電子部品、及び積層セラミックコンデンサ |
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JP2007214452A (ja) | 2006-02-10 | 2007-08-23 | Tdk Corp | 剥離層用ペースト及び積層型電子部品の製造方法 |
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JP4471924B2 (ja) | 2005-11-28 | 2010-06-02 | 京セラ株式会社 | 電子部品の製造方法 |
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JP2002270456A (ja) | 2001-03-07 | 2002-09-20 | Murata Mfg Co Ltd | 導電性ペーストおよび積層セラミック電子部品 |
JP2007214452A (ja) | 2006-02-10 | 2007-08-23 | Tdk Corp | 剥離層用ペースト及び積層型電子部品の製造方法 |
JP2010287763A (ja) | 2009-06-12 | 2010-12-24 | Sekisui Chem Co Ltd | 積層セラミックコンデンサの製造方法 |
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KR20150083097A (ko) | 2015-07-16 |
CN104769044A (zh) | 2015-07-08 |
TW201431982A (zh) | 2014-08-16 |
JP5890036B2 (ja) | 2016-03-22 |
WO2014073530A1 (ja) | 2014-05-15 |
TWI601793B (zh) | 2017-10-11 |
JPWO2014073530A1 (ja) | 2016-09-08 |
CN104769044B (zh) | 2017-03-08 |
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