JP5890036B2 - 導電性ペースト組成物 - Google Patents

導電性ペースト組成物 Download PDF

Info

Publication number
JP5890036B2
JP5890036B2 JP2014545707A JP2014545707A JP5890036B2 JP 5890036 B2 JP5890036 B2 JP 5890036B2 JP 2014545707 A JP2014545707 A JP 2014545707A JP 2014545707 A JP2014545707 A JP 2014545707A JP 5890036 B2 JP5890036 B2 JP 5890036B2
Authority
JP
Japan
Prior art keywords
paste composition
conductive paste
solvent
group
linear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014545707A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2014073530A1 (ja
Inventor
和久 平尾
和久 平尾
康二 稲岡
康二 稲岡
重治 高田
重治 高田
宏之 内藤
宏之 内藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Original Assignee
Noritake Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Priority to JP2014545707A priority Critical patent/JP5890036B2/ja
Application granted granted Critical
Publication of JP5890036B2 publication Critical patent/JP5890036B2/ja
Publication of JPWO2014073530A1 publication Critical patent/JPWO2014073530A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20Diluents or solvents
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2014545707A 2012-11-06 2013-11-05 導電性ペースト組成物 Active JP5890036B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014545707A JP5890036B2 (ja) 2012-11-06 2013-11-05 導電性ペースト組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012244846 2012-11-06
JP2012244846 2012-11-06
JP2014545707A JP5890036B2 (ja) 2012-11-06 2013-11-05 導電性ペースト組成物
PCT/JP2013/079896 WO2014073530A1 (ja) 2012-11-06 2013-11-05 導電性ペースト組成物

Publications (2)

Publication Number Publication Date
JP5890036B2 true JP5890036B2 (ja) 2016-03-22
JPWO2014073530A1 JPWO2014073530A1 (ja) 2016-09-08

Family

ID=50684633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014545707A Active JP5890036B2 (ja) 2012-11-06 2013-11-05 導電性ペースト組成物

Country Status (5)

Country Link
JP (1) JP5890036B2 (zh)
KR (1) KR102092990B1 (zh)
CN (1) CN104769044B (zh)
TW (1) TWI601793B (zh)
WO (1) WO2014073530A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102410080B1 (ko) * 2014-07-31 2022-06-16 스미토모 긴조쿠 고잔 가부시키가이샤 도전성 페이스트
JP6967845B2 (ja) * 2016-09-27 2021-11-17 株式会社ノリタケカンパニーリミテド 銀ペーストおよび電子素子
JP6939015B2 (ja) * 2017-03-29 2021-09-22 住友金属鉱山株式会社 積層セラミックコンデンサ内部電極用のグラビア印刷用導電性ペースト
JP6853606B2 (ja) * 2017-08-10 2021-03-31 株式会社ノリタケカンパニーリミテド 導電性ペースト
JP6521138B1 (ja) * 2018-04-19 2019-05-29 東洋インキScホールディングス株式会社 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法
JPWO2020137290A1 (ja) * 2018-12-25 2021-11-04 住友金属鉱山株式会社 導電性ペースト、電子部品、及び積層セラミックコンデンサ
JP7053527B2 (ja) * 2019-03-29 2022-04-12 株式会社ノリタケカンパニーリミテド 導電性ペースト
KR20220106108A (ko) * 2019-11-29 2022-07-28 스미토모 긴조쿠 고잔 가부시키가이샤 그라비어 인쇄용 도전성 페이스트, 전자 부품, 및 적층 세라믹 콘덴서
KR20240016966A (ko) * 2021-06-02 2024-02-06 스미토모 긴조쿠 고잔 가부시키가이샤 그라비어 인쇄용 도전성 페이스트, 전자 부품, 및 적층 세라믹 콘덴서

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270456A (ja) * 2001-03-07 2002-09-20 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品
JP2007214452A (ja) * 2006-02-10 2007-08-23 Tdk Corp 剥離層用ペースト及び積層型電子部品の製造方法
JP2010287763A (ja) * 2009-06-12 2010-12-24 Sekisui Chem Co Ltd 積層セラミックコンデンサの製造方法
JP2011159393A (ja) * 2010-01-29 2011-08-18 Sumitomo Metal Mining Co Ltd 導電性ペースト
JP2012226865A (ja) * 2011-04-15 2012-11-15 Sumitomo Metal Mining Co Ltd 導電性ペースト組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4487596B2 (ja) * 2004-02-27 2010-06-23 Tdk株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4487595B2 (ja) * 2004-02-27 2010-06-23 Tdk株式会社 積層セラミック電子部品用の積層体ユニットの製造方法
JP4299765B2 (ja) 2004-11-05 2009-07-22 株式会社ノリタケカンパニーリミテド 導電性ペースト
JP4953626B2 (ja) 2004-12-24 2012-06-13 京セラ株式会社 セラミック電子部品の製造方法
JP4462493B2 (ja) 2005-01-18 2010-05-12 ヤスハラケミカル株式会社 導電性ペースト
JP2007084690A (ja) 2005-09-22 2007-04-05 Toppan Printing Co Ltd 凸版反転オフセット法用インキ及び印刷体
JP4471924B2 (ja) 2005-11-28 2010-06-02 京セラ株式会社 電子部品の製造方法
JP4340674B2 (ja) * 2006-09-29 2009-10-07 Tdk株式会社 導電性ペースト、積層セラミック電子部品及びその製造方法
CN102169755B (zh) * 2010-02-26 2015-07-15 住友金属矿山株式会社 层叠陶瓷电容器内部电极用导电性糊剂

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270456A (ja) * 2001-03-07 2002-09-20 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミック電子部品
JP2007214452A (ja) * 2006-02-10 2007-08-23 Tdk Corp 剥離層用ペースト及び積層型電子部品の製造方法
JP2010287763A (ja) * 2009-06-12 2010-12-24 Sekisui Chem Co Ltd 積層セラミックコンデンサの製造方法
JP2011159393A (ja) * 2010-01-29 2011-08-18 Sumitomo Metal Mining Co Ltd 導電性ペースト
JP2012226865A (ja) * 2011-04-15 2012-11-15 Sumitomo Metal Mining Co Ltd 導電性ペースト組成物

Also Published As

Publication number Publication date
KR102092990B1 (ko) 2020-03-24
KR20150083097A (ko) 2015-07-16
CN104769044A (zh) 2015-07-08
TW201431982A (zh) 2014-08-16
WO2014073530A1 (ja) 2014-05-15
TWI601793B (zh) 2017-10-11
JPWO2014073530A1 (ja) 2016-09-08
CN104769044B (zh) 2017-03-08

Similar Documents

Publication Publication Date Title
JP5890036B2 (ja) 導電性ペースト組成物
JP5569747B2 (ja) 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト
JP4355010B2 (ja) 積層電子部品用導体ペースト
JP2012174797A5 (zh)
JP7420076B2 (ja) 導電性ペースト、電子部品、及び積層セラミックコンデンサ
WO2019220667A1 (ja) 導電性ペースト、電子部品及び積層セラミックコンデンサ
WO2020137290A1 (ja) 導電性ペースト、電子部品、及び積層セラミックコンデンサ
JP2007194122A (ja) 導電性ペーストおよびそれを用いた配線基板
WO2016017463A1 (ja) 積層セラミックコンデンサ内部電極用ペースト、及び積層セラミックコンデンサ
KR20070048257A (ko) 은 페이스트 조성물
JP2018055933A (ja) 導電性ペースト
CN113168930B (zh) 导电性糊剂
CN111902882B (zh) 导电性浆料、电子部件以及叠层陶瓷电容器
KR20110013279A (ko) 적층 세라믹 부품 제조용 용제 조성물
CN109390073B (zh) 导电性糊剂
JP4711178B2 (ja) 積層電子部品の製造方法
JPWO2015040916A1 (ja) 導電性ペーストおよびセラミック電子部品
JP2015060652A (ja) 導電性ペーストおよびセラミック電子部品
TW202141532A (zh) 導電性漿料、電子零件以及積層陶瓷電容器
JP7059636B2 (ja) 導電性ペースト及びその乾燥膜並びに該乾燥膜を焼成してなる内部電極及び該内部電極を有する積層セラミックコンデンサ
KR20230153615A (ko) 니켈 착화합물 잉크 조성물을 포함하는 도전성 페이스트 조성물 및 이를 포함하는 내부전극
JP2020035761A (ja) 導電性ペースト
TW202313866A (zh) 凹版印刷用導電性漿料、電子零件、及積層陶瓷電容器
JP2023140270A (ja) 導電性ペースト組成物
JP2019099876A (ja) 金属粉末分散剤および金属粉末スラリー

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160112

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160217

R150 Certificate of patent or registration of utility model

Ref document number: 5890036

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250