KR101922259B1 - 기판 처리 장치, 기판 처리 방법 및 스크러버 - Google Patents

기판 처리 장치, 기판 처리 방법 및 스크러버 Download PDF

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Publication number
KR101922259B1
KR101922259B1 KR1020130015794A KR20130015794A KR101922259B1 KR 101922259 B1 KR101922259 B1 KR 101922259B1 KR 1020130015794 A KR1020130015794 A KR 1020130015794A KR 20130015794 A KR20130015794 A KR 20130015794A KR 101922259 B1 KR101922259 B1 KR 101922259B1
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South Korea
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substrate
scrubber
tape
wafer
cleaning
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KR20130096185A (ko
Inventor
유 이시이
히로유키 가와사키
겐이치 나가오카
겐야 이토
마사코 고데라
히로시 도미타
다케시 니시오카
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가부시키가이샤 에바라 세이사꾸쇼
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020130015794A 2012-02-21 2013-02-14 기판 처리 장치, 기판 처리 방법 및 스크러버 Active KR101922259B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-035365 2012-02-21
JP2012035365A JP6113960B2 (ja) 2012-02-21 2012-02-21 基板処理装置および基板処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180128710A Division KR101996763B1 (ko) 2012-02-21 2018-10-26 기판 처리 장치, 기판 처리 방법 및 스크러버

Publications (2)

Publication Number Publication Date
KR20130096185A KR20130096185A (ko) 2013-08-29
KR101922259B1 true KR101922259B1 (ko) 2018-11-26

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KR1020130015794A Active KR101922259B1 (ko) 2012-02-21 2013-02-14 기판 처리 장치, 기판 처리 방법 및 스크러버
KR1020180128710A Active KR101996763B1 (ko) 2012-02-21 2018-10-26 기판 처리 장치, 기판 처리 방법 및 스크러버

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Country Status (4)

Country Link
US (3) US10328465B2 (enExample)
JP (2) JP6113960B2 (enExample)
KR (2) KR101922259B1 (enExample)
TW (3) TWI669160B (enExample)

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DE102008041250A1 (de) * 2008-08-13 2010-02-25 Ers Electronic Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern
US20130217228A1 (en) 2012-02-21 2013-08-22 Masako Kodera Method for fabricating semiconductor device
JP6113960B2 (ja) * 2012-02-21 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
JP6100002B2 (ja) 2013-02-01 2017-03-22 株式会社荏原製作所 基板裏面の研磨方法および基板処理装置
JP2014220495A (ja) * 2013-04-12 2014-11-20 レーザーテック株式会社 異物除去装置
JP6145334B2 (ja) 2013-06-28 2017-06-07 株式会社荏原製作所 基板処理装置
US9947572B2 (en) * 2014-03-26 2018-04-17 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP6312534B2 (ja) 2014-06-10 2018-04-18 株式会社荏原製作所 基板洗浄装置
US10163664B2 (en) 2014-10-31 2018-12-25 Ebara Corporation Substrate cleaning apparatus and substrate cleaning method
JP6554864B2 (ja) * 2015-03-30 2019-08-07 大日本印刷株式会社 ペリクル接着剤除去装置及びペリクル接着剤除去方法
US10276365B2 (en) 2016-02-01 2019-04-30 SCREEN Holdings Co., Ltd. Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
JP6726575B2 (ja) 2016-02-01 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
JP6666214B2 (ja) * 2016-07-22 2020-03-13 株式会社荏原製作所 基板の表面を研磨する装置および方法、プログラムを記録したコンピュータ読み取り可能な記録媒体
JP7052280B2 (ja) * 2016-11-29 2022-04-12 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6882017B2 (ja) * 2017-03-06 2021-06-02 株式会社荏原製作所 研磨方法、研磨装置、および基板処理システム
JP6836432B2 (ja) * 2017-03-22 2021-03-03 株式会社荏原製作所 基板処理装置および基板処理方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6873782B2 (ja) * 2017-03-29 2021-05-19 株式会社荏原製作所 研磨装置、研磨方法、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
JP6779173B2 (ja) * 2017-05-18 2020-11-04 株式会社荏原製作所 基板処理装置、プログラムを記録した記録媒体
JP6908496B2 (ja) * 2017-10-25 2021-07-28 株式会社荏原製作所 研磨装置
JP6974116B2 (ja) 2017-10-27 2021-12-01 株式会社荏原製作所 基板保持装置並びに基板保持装置を備えた基板処理装置および基板処理方法
JP2019091746A (ja) * 2017-11-13 2019-06-13 株式会社荏原製作所 基板の表面を処理する装置および方法
JP6887371B2 (ja) 2017-12-20 2021-06-16 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP7020986B2 (ja) * 2018-04-16 2022-02-16 株式会社荏原製作所 基板処理装置および基板保持装置
CN108656721B (zh) * 2018-05-24 2023-10-13 中策橡胶集团股份有限公司 一种反光带热转印贴合设备
KR102570220B1 (ko) * 2018-05-29 2023-08-25 주식회사 케이씨텍 기판 처리 장치
JP2019216207A (ja) * 2018-06-14 2019-12-19 株式会社荏原製作所 基板処理方法
JP7055720B2 (ja) * 2018-08-10 2022-04-18 株式会社荏原製作所 基板回転装置、基板洗浄装置および基板処理装置ならびに基板回転装置の制御方法
JP7037459B2 (ja) * 2018-09-10 2022-03-16 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JP7145019B2 (ja) * 2018-09-19 2022-09-30 株式会社Ｓｃｒｅｅｎホールディングス レシピ変換方法、レシピ変換プログラム、レシピ変換装置および基板処理システム
JP6979935B2 (ja) * 2018-10-24 2021-12-15 三菱電機株式会社 半導体製造装置および半導体製造方法
JP7564811B2 (ja) * 2019-01-31 2024-10-09 アプライド マテリアルズ インコーポレイテッド 基板洗浄デバイス及び基板洗浄方法
CN110332616B (zh) * 2019-06-20 2023-10-20 宁波奥克斯电气股份有限公司 一种空调器室内机自清洁装置及其控制方法
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CN112946957B (zh) * 2019-11-26 2023-06-02 上海微电子装备（集团）股份有限公司 光配向装置、双台光配向装置、光配向方法及光配向系统
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IT202000016279A1 (it) * 2020-07-06 2022-01-06 St Microelectronics Srl Procedimento di fabbricazione di un dispositivo semiconduttore in carburo di silicio con migliorate caratteristiche
KR102396431B1 (ko) * 2020-08-14 2022-05-10 피에스케이 주식회사 기판 처리 장치 및 기판 반송 방법
JP7682690B2 (ja) * 2021-05-11 2025-05-26 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN114038734A (zh) * 2021-11-04 2022-02-11 至微半导体(上海)有限公司 一种解决先进节点的图案化崩毁的清洗工艺
JP2024046219A (ja) * 2022-09-22 2024-04-03 芝浦メカトロニクス株式会社 洗浄装置
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US20130213437A1 (en) 2013-08-22
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