JP6974116B2 - 基板保持装置並びに基板保持装置を備えた基板処理装置および基板処理方法 - Google Patents
基板保持装置並びに基板保持装置を備えた基板処理装置および基板処理方法 Download PDFInfo
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- B24—GRINDING; POLISHING
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- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
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- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Description
本発明の好ましい態様は、前記偏心軸に固定されたカウンターウェイトをさらに備え、前記偏心軸は、前記第2トルク伝達機構に連結された第1軸部と、前記第1軸部から偏心した第2軸部を有しており、前記クランプローラーは前記第2軸部に回転可能に連結されており、前記カウンターウェイトと前記クランプローラーは、前記第1軸部に関して対称に配置されていることを特徴とする。
本発明の好ましい態様は、前記基板保持装置は動作制御部をさらに備えており、前記並進回転運動機構は、前記オービタルテーブルに回転可能に連結された偏心主軸と、前記偏心主軸に連結された第2モータと、前記オービタルテーブルと前記ベースプレートとを連結する複数の偏心継手を備えており、前記第2モータは前記ベースプレートに固定されており、前記動作制御部は、前記第1モータおよび前記第2モータの回転速度を独立に制御可能に構成されていることを特徴とする。
本発明の好ましい態様は、前記並進回転運動機構は、前記偏心継手に固定されたカウンターウェイトを有しており、前記偏心継手は、前記ベースプレートに回転可能に連結された第1継手軸部と、前記オービタルテーブルに回転可能に連結された第2継手軸部とを備え、前記第2継手軸部は前記第1継手軸部から偏心しており、前記偏心継手に固定された前記カウンターウェイトと、前記第2継手軸部は、前記第1継手軸部に関して対称に配置されており、前記偏心主軸は、前記第2モータに連結された第1主軸部と、前記オービタルテーブルに回転可能に連結された第2主軸部とを備え、前記第2主軸部は前記第1主軸部から偏心していることを特徴とする。
本発明の好ましい態様は、前記第1トルク伝達機構は、ユニバーサルジョイントまたはマグネットギヤであることを特徴とする。
本発明の好ましい態様は、前記第2トルク伝達機構は、ユニバーサルジョイントまたはマグネットギヤであることを特徴とする。
11a,11b ローラー
12 ローラー回転機構
13a,13b 偏心軸
14a,14b 第1軸部
15a,15b 第2軸部
16a,16b 中間軸部
17a,17b カウンターウェイト
18 アクチュエータ
19 軸受
20 ベースプレート
21 可動台
23 ピボット軸
24 軸受
25 支持プレート
26 直動ガイド
27a,27b モータ支持体
28 軸受
29a,29b モータ
31a,31b ウェーハ保持面(基板保持面)
40 動作制御部
61 駆動ローラー
61a ウェーハ保持面(基板保持面)
64 駆動軸
66 オービタルテーブル
68 ベースプレート
71 第1モータ
71a 軸
72 第1ユニバーサルジョイント
75 軸受
82 台座
85 第1モータ台
86 軸受
90 クランプローラー
90a ウェーハ保持面(基板保持面)
93 偏心軸
93a 第1軸部
93b 第2軸部
96 ロータリーアクチュエータ
98 第2ユニバーサルジョイント
100 カウンターウェイト
101 軸受
104 軸受
110 エアシリンダ
110a ピストンロッド
111 クランク
112 回転軸
115 ピボット軸
117 軸受
120 並進回転運動機構
121 偏心主軸
121a 第1主軸部
121b 第2主軸部
124 第2モータ
125 軸受
127 軸受
128 偏心継手
128a 第1継手軸部
128b 第2継手軸部
128c 中間軸部
129 第2モータ台
134 動作制御部
135 軸受
136 軸受
140 カウンターウェイト
151 第1マグネットギヤ
152 第2マグネットギヤ
156 駆動側マグネットロータ
157 被駆動側マグネットロータ
160 駆動側連結軸
161 被駆動側連結軸
164 永久磁石
165 永久磁石
200 研磨ヘッド
201 処理具
Claims (11)
- 基板を保持し、該基板を回転させる基板保持装置であって、
前記基板の周縁部に接触可能な複数のローラーと、
前記複数のローラーを回転させるローラー回転機構と、
前記複数のローラーと前記ローラー回転機構を連結する複数の偏心軸と、
前記複数の偏心軸にそれぞれ固定された複数のカウンターウェイトを備え、
前記複数の偏心軸は、複数の第1軸部と、前記複数の第1軸部からそれぞれ偏心した複数の第2軸部を有しており、
前記カウンターウェイトと前記ローラーは、前記第1軸部に関して対称に配置されており、
前記複数の第1軸部は前記ローラー回転機構に固定され、前記複数のローラーは前記複数の第2軸部にそれぞれ固定されていることを特徴とする基板保持装置。 - 前記ローラー回転機構は、前記複数の第1軸部にそれぞれ連結された複数のモータと、前記複数のモータを同じ速度かつ同じ位相で回転させる動作制御部を備えていることを特徴とする請求項1に記載の基板保持装置。
- 基板を保持し、該基板を回転させる基板保持装置であって、
前記基板の周縁部に接触可能な駆動ローラーと、
前記駆動ローラーが固定された駆動軸と、
前記駆動軸を回転可能に支持するオービタルテーブルと、
前記オービタルテーブルから離れて配置されたベースプレートと、
前記ベースプレートに固定された第1モータと、
前記第1モータと前記駆動軸とを連結する第1トルク伝達機構と、
前記オービタルテーブルを並進回転運動させる並進回転運動機構とを備えたことを特徴とする基板保持装置。 - 前記基板の周縁部に接触可能なクランプローラーと、
前記クランプローラーを回転可能に支持する偏心軸と、
前記ベースプレートに固定されたロータリーアクチュエータと、
前記ロータリーアクチュエータと前記偏心軸を連結する第2トルク伝達機構とをさらに備え、
前記偏心軸は、前記オービタルテーブルに回転可能に支持されていることを特徴とする請求項3に記載の基板保持装置。 - 前記偏心軸に固定されたカウンターウェイトをさらに備え、
前記偏心軸は、前記第2トルク伝達機構に連結された第1軸部と、前記第1軸部から偏心した第2軸部を有しており、
前記クランプローラーは前記第2軸部に回転可能に連結されており、
前記カウンターウェイトと前記クランプローラーは、前記第1軸部に関して対称に配置されていることを特徴とする請求項4に記載の基板保持装置。 - 前記基板保持装置は動作制御部をさらに備えており、
前記並進回転運動機構は、前記オービタルテーブルに回転可能に連結された偏心主軸と、前記偏心主軸に連結された第2モータと、前記オービタルテーブルと前記ベースプレートとを連結する複数の偏心継手を備えており、
前記第2モータは前記ベースプレートに固定されており、
前記動作制御部は、前記第1モータおよび前記第2モータの回転速度を独立に制御可能に構成されていることを特徴とする請求項3乃至5のいずれか一項に記載の基板保持装置。 - 前記並進回転運動機構は、前記偏心継手に固定されたカウンターウェイトを有しており、
前記偏心継手は、前記ベースプレートに回転可能に連結された第1継手軸部と、前記オービタルテーブルに回転可能に連結された第2継手軸部とを備え、
前記第2継手軸部は前記第1継手軸部から偏心しており、
前記偏心継手に固定された前記カウンターウェイトと、前記第2継手軸部は、前記第1継手軸部に関して対称に配置されており、
前記偏心主軸は、前記第2モータに連結された第1主軸部と、前記オービタルテーブルに回転可能に連結された第2主軸部とを備え、
前記第2主軸部は前記第1主軸部から偏心していることを特徴とする請求項6に記載の基板保持装置。 - 前記第1トルク伝達機構は、ユニバーサルジョイントまたはマグネットギヤであることを特徴とする請求項3乃至7のいずれか一項に記載の基板保持装置。
- 前記第2トルク伝達機構は、ユニバーサルジョイントまたはマグネットギヤであることを特徴とする請求項4または5に記載の基板保持装置。
- 請求項1乃至9のいずれか一項に記載の基板保持装置と、
処理具を基板の第1の面に接触させて該第1の面を処理する処理ヘッドとを備えたことを特徴とする基板処理装置。 - 複数のローラーを基板の周縁部に接触させ、
前記複数のローラーをそれぞれの軸心を中心に回転させ、かつ前記複数のローラーおよび複数のカウンターウェイトを円運動させることで、前記複数のローラーに発生する遠心力を、前記複数のカウンターウェイトに発生する遠心力でキャンセルしながら、前記基板をその軸心を中心に回転させ、かつ前記基板を円運動させ、
処理具を、前記回転および円運動する基板に接触させて該基板を処理することを特徴とする基板処理方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017208327A JP6974116B2 (ja) | 2017-10-27 | 2017-10-27 | 基板保持装置並びに基板保持装置を備えた基板処理装置および基板処理方法 |
TW107136859A TWI795450B (zh) | 2017-10-27 | 2018-10-19 | 基板保持裝置、具備基板保持裝置的基板處理裝置、及基板處理方法 |
US16/168,301 US20190131166A1 (en) | 2017-10-27 | 2018-10-23 | Substrate holding apparatus, substrate processing apparatus having substrate holding apparatus, and substrate processing method |
KR1020180126510A KR102530553B1 (ko) | 2017-10-27 | 2018-10-23 | 기판 보유 지지 장치 및 기판 보유 지지 장치를 구비한 기판 처리 장치 및 기판 처리 방법 |
EP18202401.8A EP3477393A1 (en) | 2017-10-27 | 2018-10-24 | Substrate holding apparatus, substrate processing apparatus and substrate processing method |
CN201811250661.4A CN109719103B (zh) | 2017-10-27 | 2018-10-25 | 基板保持装置、具有基板保持装置的基板处理装置以及基板处理方法 |
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US20210016400A1 (en) * | 2018-03-15 | 2021-01-21 | Dalmac Enterprises Pty Ltd | Work supporting and rotating apparatus |
JP2021002639A (ja) | 2019-06-18 | 2021-01-07 | 株式会社荏原製作所 | 基板保持装置および基板処理装置 |
US11335588B2 (en) | 2019-06-18 | 2022-05-17 | Ebara Corporation | Substrate holding apparatus and substrate processing apparatus |
CN113838788A (zh) * | 2020-06-24 | 2021-12-24 | 拓荆科技股份有限公司 | 晶圆自动承载系统及采用该系统传送晶圆的方法 |
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JPH0774133A (ja) * | 1993-03-18 | 1995-03-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH08125004A (ja) * | 1994-10-27 | 1996-05-17 | Sony Corp | ウエハホルダ及びこれを使用したウエハ目視検査装置 |
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JP2000077379A (ja) * | 1998-09-03 | 2000-03-14 | Toshiba Mach Co Ltd | ブラシ洗浄装置 |
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JP3494119B2 (ja) * | 2000-04-24 | 2004-02-03 | 三菱住友シリコン株式会社 | 両面研磨装置を用いた半導体ウェーハの研磨方法 |
KR100737879B1 (ko) * | 2000-04-24 | 2007-07-10 | 주식회사 사무코 | 반도체 웨이퍼의 제조방법 |
JP4532014B2 (ja) * | 2001-04-27 | 2010-08-25 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
JP2004342939A (ja) * | 2003-05-16 | 2004-12-02 | Shimada Phys & Chem Ind Co Ltd | 基板処理装置 |
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JP4937807B2 (ja) * | 2006-03-31 | 2012-05-23 | 株式会社荏原製作所 | 基板保持回転機構、基板処理装置 |
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JP6734666B2 (ja) * | 2015-03-30 | 2020-08-05 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
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JP6660202B2 (ja) * | 2016-02-19 | 2020-03-11 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
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