JP6334026B2 - スクラバー - Google Patents
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- JP6334026B2 JP6334026B2 JP2017051113A JP2017051113A JP6334026B2 JP 6334026 B2 JP6334026 B2 JP 6334026B2 JP 2017051113 A JP2017051113 A JP 2017051113A JP 2017051113 A JP2017051113 A JP 2017051113A JP 6334026 B2 JP6334026 B2 JP 6334026B2
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- cleaning
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- 230000007246 mechanism Effects 0.000 claims description 137
- 238000004140 cleaning Methods 0.000 claims description 131
- 238000004381 surface treatment Methods 0.000 claims description 22
- 238000005201 scrubbing Methods 0.000 claims description 21
- 239000006061 abrasive grain Substances 0.000 claims description 8
- 238000005498 polishing Methods 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 244
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本発明の他の態様は、上記スクラバーと、基板を保持する基板回転機構と、を有することを特徴とする基板処理装置である。
静圧支持機構90を備えた基板処理装置のより具体的な例について図3(a)および図3(b)を用いて説明する。図3(a)は静圧支持機構90を基板Wの下方に配置した基板処理装置の概念図である。静圧支持機構90には圧力流体1の流体供給路92が設けられ、圧力流体1が供給配管(図示せず)を経由して流体供給路92に供給されている。基板処理の際には、静圧支持機構90の支持ステージ91が基板Wに向かって上昇し、基板処理が終了すれば支持ステージ91は下降する。あるいは、基板Wの昇降機構を設けても良い。図3(a)に示す静圧支持機構90は、図1(a)に示す構造を有しているが、図1(b)または図1(c)に示す構造、あるいは別の構造であっても差し支えない。
図3(b)は静圧支持機構90を基板Wの上方に配置した基板処理装置の概念図である。基板処理装置の基本機能は図3(a)に示した例と同じである。
(3)実施例3
本発明の基板処理装置を用いて基板の表面処理を行う方法の実施例を説明する。基板、たとえばLSI製造途中の基板の片面を静圧支持機構90に向け、反対側の面を処理ヘッド50に向けて、本発明の基板処理装置に配置する。基板の周縁部をチャック11で保持し、デバイス面を静圧支持機構90で支持しながら、基板を回転させる。この状態で、基板の裏面(デバイスが形成されていない面)に処理ヘッド50を押し当てて裏面の傷やパーティクルなどの除去を行う。この際、チャック11での基板保持は処理中ずっと行わなくてもよい。
7 処理室
8 排気機構
9 排気ダクト
10 基板回転機構
11 チャック
12 中空モータ
14 静止部材
16 回転基台
18 ばね
20 アンギュラコンタクト玉軸受
21,22 磁気軸受
25 回転カバー
27 洗浄液供給ノズル/処理液供給ノズル
30 リフト機構
31 リングステージ
32 ロッド
33 エアシリンダ
35,36 気体軸受
39 タッチダウン軸受
40 クランプ
41 位置決め部
43,44,45 磁石
46 溝
47 突起部
50 スクラバー
51 スクラバーシャフト
53 揺動アーム
54 揺動軸
55 軸回転機構
56 スクラバー昇降機構
58 スクラバー回転機構
60 テープカートリッジ
61 洗浄テープ
62 押圧部材
63 付勢機構
64 テープ繰り出しリール
65 テープ巻き取りリール
67 テープ巻き取り軸
69,70 かさ歯車
71 エンドマーク検知センサ
72 チャック部
75A,75B リール軸
76A,76B 軸受
77 リールハウジング
78 ボールスプラインナット
79 ボールスプラインシャフト
80A,80B ブレーキ輪
81 ブレーキパッド
82 ばね
83 ピン
84A 繰り出しギヤ
84B 巻き取りギヤ
85A,85B ワンウェイクラッチ
86A,86B ラックギヤ
87 設置台
88 トルクリミッタ
90 静圧支持機構
91 支持ステージ
92 流体供給路
93 支持軸
95 ロータリジョイント
96 流体供給源
97 直動ガイド
98 ステージ昇降機構
99 ステージ回転機構
100 二流体ジェットノズル
101 回転アーム
102 揺動アーム
110 乾燥液供給ノズル
111 乾燥気体供給ノズル
120 ロードアンロード部
121 フロントロード部
123 第1の搬送ロボット
124 パーティクルカウンター
126 第2の搬送ロボット
127 基板処理装置
131,132 ウェハステーション
133 動作コントローラ
134 反転機構
Claims (8)
- 基板の表面処理を行うスクラバーであって、
前記スクラバーは、その内部に前記基板の第1の面に摺接させて前記第1の面の表面処理を行うテープ状の複数のスクラブ部材と、前記複数のスクラブ部材をそれぞれ繰り出す複数のテープ繰り出しリールと、前記複数のスクラブ部材をそれぞれ巻き取る複数のテープ巻き取りリールと、一端に前記複数のテープ巻き取りリールがそれぞれ連結された複数のテープ巻き取り軸と、前記複数のテープ巻き取り軸の他端がそれぞれ連結された複数の第1のかさ歯車と、を備え、
前記スクラバーは、該スクラバーの軸心周りに前記複数のスクラブ部材を回転させながら該複数のスクラブ部材を前記基板の第1の面に摺接させることを特徴とするスクラバー。 - 前記スクラバーは、揺動アームに連結されており、かつ該揺動アームから取り外し可能であることを特徴とする請求項1に記載のスクラバー。
- 回転する前記スクラブ部材によって形成されるスクラブ面と、前記基板を支持する基板支持面は、同心状に配置されることを特徴とする請求項1に記載のスクラバー。
- 前記複数のスクラブ部材は、前記スクラバーの半径方向に延びる基板接触面を有することを特徴とする請求項1に記載のスクラバー。
- 前記複数のスクラブ部材は、砥粒を有しない洗浄テープまたは砥粒を有する研磨テープであることを特徴とする請求項1に記載のスクラバー。
- 前記スクラバーの内部には、モータと、前記モータに連結された第2のかさ歯車が配置されており、
前記複数の第1のかさ歯車と前記第2のかさ歯車は噛み合っていることを特徴とする請求項1に記載のスクラバー。 - 前記第2のかさ歯車の中心軸と前記スクラバーの回転軸は実質的に一致していることを特徴とする請求項6に記載のスクラバー。
- 請求項1乃至7のいずれか一項に記載のスクラバーと、
基板を保持する基板回転機構と、を有することを特徴とする基板処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017051113A JP6334026B2 (ja) | 2012-02-21 | 2017-03-16 | スクラバー |
JP2017118249A JP6420415B2 (ja) | 2017-03-16 | 2017-06-16 | 基板処理装置 |
JP2018083729A JP6568975B2 (ja) | 2017-03-16 | 2018-04-25 | テープカートリッジ、スクラバー、および基板処理装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012035365A JP6113960B2 (ja) | 2012-02-21 | 2012-02-21 | 基板処理装置および基板処理方法 |
JP2017051113A JP6334026B2 (ja) | 2012-02-21 | 2017-03-16 | スクラバー |
Related Parent Applications (1)
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JP2012035365A Division JP6113960B2 (ja) | 2012-02-21 | 2012-02-21 | 基板処理装置および基板処理方法 |
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JP2017118249A Division JP6420415B2 (ja) | 2017-03-16 | 2017-06-16 | 基板処理装置 |
JP2018083729A Division JP6568975B2 (ja) | 2017-03-16 | 2018-04-25 | テープカートリッジ、スクラバー、および基板処理装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017118146A JP2017118146A (ja) | 2017-06-29 |
JP2017118146A5 JP2017118146A5 (ja) | 2017-08-10 |
JP6334026B2 true JP6334026B2 (ja) | 2018-05-30 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2012035365A Active JP6113960B2 (ja) | 2012-02-21 | 2012-02-21 | 基板処理装置および基板処理方法 |
JP2017051113A Active JP6334026B2 (ja) | 2012-02-21 | 2017-03-16 | スクラバー |
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JP2012035365A Active JP6113960B2 (ja) | 2012-02-21 | 2012-02-21 | 基板処理装置および基板処理方法 |
Country Status (4)
Country | Link |
---|---|
US (3) | US10328465B2 (ja) |
JP (2) | JP6113960B2 (ja) |
KR (2) | KR101922259B1 (ja) |
TW (3) | TWI669160B (ja) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008041250A1 (de) * | 2008-08-13 | 2010-02-25 | Ers Electronic Gmbh | Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern |
JP6113960B2 (ja) | 2012-02-21 | 2017-04-12 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
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US20190262869A1 (en) | 2019-08-29 |
TWI556881B (zh) | 2016-11-11 |
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