KR101835232B1 - 다이 본딩 장치 및 반도체 장치의 제조 방법 - Google Patents

다이 본딩 장치 및 반도체 장치의 제조 방법 Download PDF

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KR101835232B1
KR101835232B1 KR1020160153978A KR20160153978A KR101835232B1 KR 101835232 B1 KR101835232 B1 KR 101835232B1 KR 1020160153978 A KR1020160153978 A KR 1020160153978A KR 20160153978 A KR20160153978 A KR 20160153978A KR 101835232 B1 KR101835232 B1 KR 101835232B1
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South Korea
Prior art keywords
wafer
die
robot
substrate
handling tool
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Korean (ko)
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KR20170106175A (ko
Inventor
나오끼 오까모또
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파스포드 테크놀로지 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020160153978A 2016-03-11 2016-11-18 다이 본딩 장치 및 반도체 장치의 제조 방법 Active KR101835232B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-048988 2016-03-11
JP2016048988A JP6705668B2 (ja) 2016-03-11 2016-03-11 ダイボンディング装置および半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180022825A Division KR101990242B1 (ko) 2016-03-11 2018-02-26 다이 본딩 장치 및 반도체 장치의 제조 방법

Publications (2)

Publication Number Publication Date
KR20170106175A KR20170106175A (ko) 2017-09-20
KR101835232B1 true KR101835232B1 (ko) 2018-03-06

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KR1020180022825A Active KR101990242B1 (ko) 2016-03-11 2018-02-26 다이 본딩 장치 및 반도체 장치의 제조 방법

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Country Status (4)

Country Link
JP (1) JP6705668B2 (enrdf_load_stackoverflow)
KR (2) KR101835232B1 (enrdf_load_stackoverflow)
CN (2) CN107180772B (enrdf_load_stackoverflow)
TW (1) TWI615905B (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7018338B2 (ja) * 2018-03-19 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7102271B2 (ja) * 2018-07-17 2022-07-19 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR102113118B1 (ko) * 2018-11-21 2020-05-20 제너셈(주) 패키지 언로딩 장치
KR102687859B1 (ko) 2018-11-29 2024-07-24 삼성디스플레이 주식회사 기판 이송 시스템 및 기판 이송 방법
JP7146352B2 (ja) * 2018-12-10 2022-10-04 株式会社ディスコ 試験装置
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置
KR20200119971A (ko) 2019-04-11 2020-10-21 주식회사 지와이엘테크놀로지 반도체 본딩 장치 및 그 방법
JP6880158B1 (ja) * 2019-11-29 2021-06-02 キヤノンマシナリー株式会社 ワーク移載装置、ワーク移載方法、移載体の製造方法、半導体装置の製造方法、及びダイボンダ
JP7530793B2 (ja) * 2020-10-02 2024-08-08 ニデックインスツルメンツ株式会社 産業用ロボット
KR102434404B1 (ko) * 2022-04-05 2022-08-18 홍문복 자동차 클러스터 조립을 위한 옵티컬 본딩 공정 설비 및 이를 이용한 본딩 방법
WO2025028244A1 (ja) * 2023-07-28 2025-02-06 東京エレクトロン株式会社 接合装置、接合システム、及び接合方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093764A (ja) * 2003-09-18 2005-04-07 Matsushita Electric Ind Co Ltd 物体搬送装置および物体搬送方法
JP2007208172A (ja) * 2006-02-06 2007-08-16 Lintec Corp シート貼付装置及び貼付方法
US20130056448A1 (en) 2011-09-06 2013-03-07 Samsung Electronics Co., Ltd. Wire bonding system for semiconductor package

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3030400B2 (ja) * 1994-02-24 2000-04-10 株式会社三井ハイテック 自動ダイボンディング方法
JPH08306764A (ja) * 1995-05-02 1996-11-22 Tokyo Electron Ltd 半導体部品の実装方法およびその装置
JPH10277981A (ja) * 1997-04-07 1998-10-20 Nittetsu Semiconductor Kk ロボットハンド
JPH10335410A (ja) * 1997-05-29 1998-12-18 Sony Corp ウエハ搬送装置及びウエハアライメント方法
JP3938436B2 (ja) * 1998-06-05 2007-06-27 大日本スクリーン製造株式会社 基板移載装置およびそれを用いた基板処理装置
KR100278603B1 (ko) * 1998-09-30 2001-01-15 윤종용 미세간극 볼 그리드 어레이 패키지용 다이본딩 설비 및 다이본딩 방법
JP4234300B2 (ja) * 2000-05-09 2009-03-04 ヤマハ発動機株式会社 チップ移送装置
JP2002076094A (ja) * 2000-08-31 2002-03-15 Daikin Ind Ltd 基板搬送装置
JP5051948B2 (ja) * 2001-05-30 2012-10-17 株式会社ダイヘン カセット搬送方法及びカセット搬送システム
KR100407568B1 (ko) * 2001-06-01 2003-12-01 삼성전자주식회사 장치설치영역 내에 지지대를 갖는 반도체 제조 장치
CN1608308A (zh) * 2001-11-13 2005-04-20 Fsi国际公司 微型电子基片的自动化加工用的减少占地的工具
JP2004055697A (ja) * 2002-07-17 2004-02-19 Ace:Kk 基板の移載、搬送装置及び移載方法
TW586996B (en) * 2003-07-04 2004-05-11 Advanced Semiconductor Eng Wafer transport robot arm
JP2006073834A (ja) * 2004-09-02 2006-03-16 Dainippon Screen Mfg Co Ltd 基板搬送装置およびそれを用いた基板処理装置
JP4602750B2 (ja) * 2004-12-13 2010-12-22 東京エレクトロン株式会社 処理装置および処理方法
JP4767641B2 (ja) * 2005-09-27 2011-09-07 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
JP2006191144A (ja) * 2006-03-13 2006-07-20 Toshiba Corp ピックアップ装置及びピックアップ方法
JP4585496B2 (ja) 2006-08-25 2010-11-24 芝浦メカトロニクス株式会社 半導体チップの実装装置
US9050634B2 (en) * 2007-02-15 2015-06-09 SCREEN Holdings Co., Ltd. Substrate processing apparatus
US7923660B2 (en) * 2007-08-15 2011-04-12 Applied Materials, Inc. Pulsed laser anneal system architecture
KR20100055809A (ko) * 2008-11-18 2010-05-27 세메스 주식회사 기판 처리 장치
CN101540291A (zh) * 2009-03-23 2009-09-23 常州新区爱立德电子有限公司 半导体芯片自动分选机
KR20120123920A (ko) * 2011-05-02 2012-11-12 나노에프에이 주식회사 웨이퍼 이송 장치를 실시간 모니터링하는 비전 시스템을 구비하는 반도체 제조 설비
CN103703551A (zh) * 2011-06-03 2014-04-02 豪锐恩科技私人有限公司 用于半导体芯片的拾取和转移及结合的方法和系统
JP2013049113A (ja) * 2011-08-31 2013-03-14 Yaskawa Electric Corp ロボットのアーム構造およびロボット
JP5941701B2 (ja) * 2012-02-23 2016-06-29 ファスフォードテクノロジ株式会社 ダイボンダ
KR20140003281A (ko) * 2012-06-29 2014-01-09 한미반도체 주식회사 반도체칩 본딩 시스템
JP6111065B2 (ja) * 2012-12-28 2017-04-05 川崎重工業株式会社 自動教示システム及び教示方法
KR102232636B1 (ko) * 2013-03-28 2021-03-25 토레이 엔지니어링 컴퍼니, 리미티드 실장 방법 및 실장 장치
JP6118620B2 (ja) * 2013-04-03 2017-04-19 ヤマハ発動機株式会社 部品実装装置
JP6341641B2 (ja) * 2013-08-09 2018-06-13 ファスフォードテクノロジ株式会社 ダイボンダ
CN203491228U (zh) * 2013-10-12 2014-03-19 四川蓝彩电子科技有限公司 晶片装配系统
KR101483987B1 (ko) * 2014-06-16 2015-01-20 주식회사 로보스타 4개의 로봇 암의 가변 핸드를 구비한 반송 로봇

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093764A (ja) * 2003-09-18 2005-04-07 Matsushita Electric Ind Co Ltd 物体搬送装置および物体搬送方法
JP2007208172A (ja) * 2006-02-06 2007-08-16 Lintec Corp シート貼付装置及び貼付方法
US20130056448A1 (en) 2011-09-06 2013-03-07 Samsung Electronics Co., Ltd. Wire bonding system for semiconductor package

Also Published As

Publication number Publication date
TW201732961A (zh) 2017-09-16
JP6705668B2 (ja) 2020-06-03
KR20170106175A (ko) 2017-09-20
CN107180772B (zh) 2021-04-30
JP2017163121A (ja) 2017-09-14
CN113192867A (zh) 2021-07-30
KR101990242B1 (ko) 2019-09-24
TWI615905B (zh) 2018-02-21
CN113192867B (zh) 2024-01-23
CN107180772A (zh) 2017-09-19
KR20180028057A (ko) 2018-03-15

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