KR101743897B1 - 피복 구리 입자 및 그 제조 방법 - Google Patents
피복 구리 입자 및 그 제조 방법 Download PDFInfo
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- KR101743897B1 KR101743897B1 KR1020167034561A KR20167034561A KR101743897B1 KR 101743897 B1 KR101743897 B1 KR 101743897B1 KR 1020167034561 A KR1020167034561 A KR 1020167034561A KR 20167034561 A KR20167034561 A KR 20167034561A KR 101743897 B1 KR101743897 B1 KR 101743897B1
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- Prior art keywords
- copper
- copper particles
- coated copper
- particles
- reaction
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 345
- 239000010949 copper Substances 0.000 title claims abstract description 338
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 329
- 239000002245 particle Substances 0.000 title claims abstract description 275
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title description 37
- 238000006243 chemical reaction Methods 0.000 claims abstract description 102
- 239000002904 solvent Substances 0.000 claims abstract description 73
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 claims abstract description 59
- 150000001414 amino alcohols Chemical class 0.000 claims abstract description 46
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 claims abstract description 38
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims description 97
- 238000002441 X-ray diffraction Methods 0.000 claims description 24
- 238000009826 distribution Methods 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 21
- 239000011164 primary particle Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 12
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 12
- 238000007641 inkjet printing Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 238000000197 pyrolysis Methods 0.000 abstract description 30
- 229910052751 metal Inorganic materials 0.000 abstract description 25
- 239000002184 metal Substances 0.000 abstract description 25
- 230000008569 process Effects 0.000 abstract description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052799 carbon Inorganic materials 0.000 abstract description 3
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 57
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 46
- -1 copper complex formate Chemical class 0.000 description 31
- 230000002829 reductive effect Effects 0.000 description 29
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 28
- 239000005639 Lauric acid Substances 0.000 description 28
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 27
- 239000005751 Copper oxide Substances 0.000 description 27
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 27
- 229910000431 copper oxide Inorganic materials 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 26
- 239000000243 solution Substances 0.000 description 26
- 238000004458 analytical method Methods 0.000 description 25
- 239000011248 coating agent Substances 0.000 description 25
- 238000000576 coating method Methods 0.000 description 25
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 235000019253 formic acid Nutrition 0.000 description 23
- 238000012360 testing method Methods 0.000 description 22
- 238000009835 boiling Methods 0.000 description 21
- 238000005259 measurement Methods 0.000 description 21
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 20
- 239000000463 material Substances 0.000 description 20
- 239000007789 gas Substances 0.000 description 18
- 238000005245 sintering Methods 0.000 description 18
- 230000007246 mechanism Effects 0.000 description 17
- 238000006722 reduction reaction Methods 0.000 description 16
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 15
- 239000012298 atmosphere Substances 0.000 description 15
- 229910001431 copper ion Inorganic materials 0.000 description 15
- 239000010419 fine particle Substances 0.000 description 15
- 230000003647 oxidation Effects 0.000 description 15
- 238000007254 oxidation reaction Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 14
- 239000001569 carbon dioxide Substances 0.000 description 12
- 229910002092 carbon dioxide Inorganic materials 0.000 description 12
- 239000012295 chemical reaction liquid Substances 0.000 description 12
- 239000012299 nitrogen atmosphere Substances 0.000 description 12
- 230000001603 reducing effect Effects 0.000 description 12
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 11
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 11
- 239000002244 precipitate Substances 0.000 description 11
- 239000006185 dispersion Substances 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 8
- 239000007810 chemical reaction solvent Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 238000010304 firing Methods 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(i) oxide Chemical compound [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000006228 supernatant Substances 0.000 description 6
- 229910001111 Fine metal Inorganic materials 0.000 description 5
- 230000002776 aggregation Effects 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 239000005749 Copper compound Substances 0.000 description 4
- 238000005054 agglomeration Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000008139 complexing agent Substances 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 150000001880 copper compounds Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical group 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- 239000000693 micelle Substances 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000003223 protective agent Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000005476 size effect Effects 0.000 description 4
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000005456 alcohol based solvent Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 229940116318 copper carbonate Drugs 0.000 description 3
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 239000004584 polyacrylic acid Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000005211 surface analysis Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 239000007762 w/o emulsion Substances 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- LQGKDMHENBFVRC-UHFFFAOYSA-N 5-aminopentan-1-ol Chemical compound NCCCCCO LQGKDMHENBFVRC-UHFFFAOYSA-N 0.000 description 2
- GGZZISOUXJHYOY-UHFFFAOYSA-N 8-amino-4-hydroxynaphthalene-2-sulfonic acid Chemical compound C1=C(S(O)(=O)=O)C=C2C(N)=CC=CC2=C1O GGZZISOUXJHYOY-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 235000002597 Solanum melongena Nutrition 0.000 description 2
- HQIUDYOGBLMEOR-UHFFFAOYSA-J [Cu++].[Cu++].[O-]C=O.[O-]C=O.[O-]C=O.[O-]C=O Chemical compound [Cu++].[Cu++].[O-]C=O.[O-]C=O.[O-]C=O.[O-]C=O HQIUDYOGBLMEOR-UHFFFAOYSA-J 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N caprylic alcohol Natural products CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000004453 electron probe microanalysis Methods 0.000 description 2
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- 229940013085 2-diethylaminoethanol Drugs 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- MEMLGWASIRZEFV-UHFFFAOYSA-L C(=O)[O-].C(=O)ON.[Cu+2].C(=O)[O-] Chemical compound C(=O)[O-].C(=O)ON.[Cu+2].C(=O)[O-] MEMLGWASIRZEFV-UHFFFAOYSA-L 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- GPOHEWYMQUEFAZ-UHFFFAOYSA-N [Cu].NO Chemical compound [Cu].NO GPOHEWYMQUEFAZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- HULQNLHTVRATRE-UHFFFAOYSA-N amino formate copper Chemical compound [Cu].NOC=O HULQNLHTVRATRE-UHFFFAOYSA-N 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 238000010533 azeotropic distillation Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000009918 complex formation Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000004699 copper complex Chemical class 0.000 description 1
- FSQAIQPPCOCRAX-UHFFFAOYSA-L copper;2-oxopropanoate Chemical compound [Cu+2].CC(=O)C([O-])=O.CC(=O)C([O-])=O FSQAIQPPCOCRAX-UHFFFAOYSA-L 0.000 description 1
- LBJNMUFDOHXDFG-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu].[Cu] LBJNMUFDOHXDFG-UHFFFAOYSA-N 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- VUVZASHBYYMLRC-UHFFFAOYSA-N heptane-2,3-diol Chemical compound CCCCC(O)C(C)O VUVZASHBYYMLRC-UHFFFAOYSA-N 0.000 description 1
- QCIYAEYRVFUFAP-UHFFFAOYSA-N hexane-2,3-diol Chemical compound CCCC(O)C(C)O QCIYAEYRVFUFAP-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229960004232 linoleic acid Drugs 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Images
Classifications
-
- B22F1/02—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
- B22F9/305—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis of metal carbonyls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014112794A JP5926322B2 (ja) | 2014-05-30 | 2014-05-30 | 被覆銅粒子及びその製造方法 |
| JPJP-P-2014-112794 | 2014-05-30 | ||
| PCT/JP2015/063880 WO2015182395A1 (ja) | 2014-05-30 | 2015-05-14 | 被覆銅粒子及びその製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167027210A Division KR101709458B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160145207A KR20160145207A (ko) | 2016-12-19 |
| KR101743897B1 true KR101743897B1 (ko) | 2017-06-05 |
Family
ID=54698732
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167034561A Active KR101743897B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
| KR1020167027210A Active KR101709458B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167027210A Active KR101709458B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9744595B2 (enExample) |
| EP (1) | EP3150306B1 (enExample) |
| JP (1) | JP5926322B2 (enExample) |
| KR (2) | KR101743897B1 (enExample) |
| CN (2) | CN108161027B (enExample) |
| TW (1) | TWI638769B (enExample) |
| WO (1) | WO2015182395A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3117596B2 (ja) | 1993-12-29 | 2000-12-18 | オルガノ株式会社 | 3分子以上の単糖類分子がグリコシド結合してなる糖類の製造方法 |
| JP6715450B2 (ja) * | 2016-01-13 | 2020-07-01 | 小林 博 | 金属ないしは金属酸化物からなる個々のナノ粒子が、液体の有機化合物に囲まれて該有機化合物中に分散した懸濁体を製造する製造方法 |
| JP6979150B2 (ja) * | 2016-03-28 | 2021-12-08 | 協立化学産業株式会社 | 被覆銀粒子とその製造方法、導電性組成物、および導電体 |
| CN110430951B (zh) * | 2017-03-15 | 2021-11-16 | 昭和电工材料株式会社 | 接合用金属糊料、接合体及其制造方法以及半导体装置及其制造方法 |
| EP3597330A4 (en) * | 2017-03-15 | 2020-11-25 | Hitachi Chemical Company, Ltd. | METAL PASTE FOR BONDING, BONDED BODY AS WELL AS A METHOD FOR MANUFACTURING THE SAME, AND A SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING THE SAME |
| US11767443B2 (en) | 2017-04-14 | 2023-09-26 | The School Corporation Kansai University | Copper particle mixture and method for manufacturing same, copper particle mixture dispersion, ink containing copper particle mixture, method for storing copper particle mixture, and method for sintering copper particle mixture |
| JP7222904B2 (ja) * | 2017-11-13 | 2023-02-15 | 京セラ株式会社 | ペースト組成物、半導体装置及び電気・電子部品 |
| WO2019106739A1 (ja) * | 2017-11-29 | 2019-06-06 | 国立大学法人北海道大学 | 低温焼結性銅粒子とそれを用いた焼結体の製造方法 |
| JP7282691B2 (ja) * | 2018-01-26 | 2023-05-29 | 日清エンジニアリング株式会社 | 微粒子の製造方法 |
| US11798707B2 (en) | 2018-01-26 | 2023-10-24 | Nisshin Engineering Inc. | Copper microparticles |
| JP7139258B2 (ja) * | 2019-01-22 | 2022-09-20 | 大陽日酸株式会社 | 銅微粒子、導電性材料、銅微粒子の製造方法 |
| CN109655521A (zh) * | 2019-01-28 | 2019-04-19 | 中国地质科学院水文地质环境地质研究所 | 基于加速器质谱技术的14c的快速测量方法 |
| JP7269565B2 (ja) * | 2019-03-29 | 2023-05-09 | 学校法人 関西大学 | 導電性インキ組成物及び導電性積層体 |
| EP3950175B1 (en) * | 2019-03-29 | 2025-06-04 | Mitsui Mining & Smelting Co., Ltd. | Bonding material and uses therof |
| JP7244919B2 (ja) * | 2019-08-27 | 2023-03-23 | 協立化学産業株式会社 | 被覆銅ナノ粒子含有組成物、及び物品 |
| CN119259994A (zh) * | 2020-08-28 | 2025-01-07 | 国立大学法人北海道大学 | 含氧化物的铜微粒及其制造方法、以及铜微粒烧结体的制造方法 |
| CN116329539B (zh) * | 2023-03-03 | 2024-05-28 | 嘉庚创新实验室 | 铜复合材料及其制备方法、铜导电浆料和铜膜 |
| CN118136337B (zh) * | 2024-04-01 | 2025-06-20 | 合肥工业大学 | 一种高收缩率铜导电薄膜的制备方法及其材料 |
| CN119747963A (zh) * | 2024-11-20 | 2025-04-04 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种基于热分解铜盐的自还原铜膏及其制备方法和应用 |
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| JP2011032558A (ja) * | 2009-08-04 | 2011-02-17 | Harima Chemicals Inc | 金属銅微粒子の製造方法 |
| WO2013128449A2 (en) | 2012-02-29 | 2013-09-06 | Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd | Inks containing metal precursors nanoparticles |
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| JPH08143916A (ja) | 1994-11-24 | 1996-06-04 | Nok Corp | 鉄微粒子の製造方法 |
| US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
| JP3900414B2 (ja) | 2002-02-18 | 2007-04-04 | 富士フイルム株式会社 | ナノ粒子およびナノ粒子の製造方法、並びに、磁気記録媒体 |
| JP4449484B2 (ja) * | 2003-02-18 | 2010-04-14 | 東レ株式会社 | 導電性ペーストおよびそれを用いたプラズマディスプレイパネル用部材の製造方法 |
| JP4431085B2 (ja) | 2004-06-24 | 2010-03-10 | シャープ株式会社 | 導電性インキ組成物、反射部材、回路基板、電子装置 |
| JP5205717B2 (ja) * | 2006-07-04 | 2013-06-05 | セイコーエプソン株式会社 | ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法 |
| JP2008019461A (ja) * | 2006-07-11 | 2008-01-31 | Fujifilm Corp | 金属ナノ粒子の製造方法、金属ナノ粒子及び金属ナノ粒子分散物 |
| JP5045015B2 (ja) | 2006-07-28 | 2012-10-10 | セイコーエプソン株式会社 | ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法 |
| JP4961587B2 (ja) * | 2006-10-03 | 2012-06-27 | トヨタ自動車株式会社 | 銅微粒子、銅微粒子製造方法、絶縁材料、配線構造、配線回路板の製造方法、及び電子・電気機器 |
| JP2008205430A (ja) * | 2007-01-26 | 2008-09-04 | Konica Minolta Holdings Inc | 金属パターン形成方法及び金属塩混合物 |
| JP2009082828A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 逆ミセル液、無機ナノ粒子及び無機ナノ粒子の製造方法 |
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| WO2012053456A1 (ja) * | 2010-10-21 | 2012-04-26 | 旭硝子株式会社 | 水素化銅微粒子分散液の製造方法、導電インクおよび導体付き基材の製造方法 |
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| JP5848552B2 (ja) * | 2011-08-29 | 2016-01-27 | 日立金属株式会社 | 銅微粒子分散液の製造方法、銅微粒子の製造方法、銅微粒子分散液および銅微粒子 |
| JP2014001443A (ja) * | 2012-06-21 | 2014-01-09 | Kyoritsu Kagaku Sangyo Kk | 酸化物被覆銅微粒子及びその製造方法 |
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-
2014
- 2014-05-30 JP JP2014112794A patent/JP5926322B2/ja active Active
-
2015
- 2015-05-14 KR KR1020167034561A patent/KR101743897B1/ko active Active
- 2015-05-14 CN CN201711328045.1A patent/CN108161027B/zh active Active
- 2015-05-14 KR KR1020167027210A patent/KR101709458B1/ko active Active
- 2015-05-14 US US15/307,227 patent/US9744595B2/en active Active
- 2015-05-14 WO PCT/JP2015/063880 patent/WO2015182395A1/ja not_active Ceased
- 2015-05-14 EP EP15799589.5A patent/EP3150306B1/en active Active
- 2015-05-14 CN CN201580028643.XA patent/CN106457407B/zh active Active
- 2015-05-22 TW TW104116484A patent/TWI638769B/zh active
-
2017
- 2017-08-24 US US15/685,729 patent/US20180036805A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009158441A (ja) | 2007-12-28 | 2009-07-16 | Namics Corp | 導電性ペースト及びそれを用いた銅膜の形成方法 |
| JP2011032558A (ja) * | 2009-08-04 | 2011-02-17 | Harima Chemicals Inc | 金属銅微粒子の製造方法 |
| WO2013128449A2 (en) | 2012-02-29 | 2013-09-06 | Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd | Inks containing metal precursors nanoparticles |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3150306A1 (en) | 2017-04-05 |
| EP3150306A4 (en) | 2018-01-17 |
| US20180036805A1 (en) | 2018-02-08 |
| CN108161027B (zh) | 2019-01-08 |
| US20170043404A1 (en) | 2017-02-16 |
| JP2015227476A (ja) | 2015-12-17 |
| JP5926322B2 (ja) | 2016-05-25 |
| CN106457407B (zh) | 2017-12-05 |
| WO2015182395A1 (ja) | 2015-12-03 |
| EP3150306B1 (en) | 2019-01-30 |
| KR101709458B1 (ko) | 2017-02-22 |
| KR20160120786A (ko) | 2016-10-18 |
| CN106457407A (zh) | 2017-02-22 |
| US9744595B2 (en) | 2017-08-29 |
| TWI638769B (zh) | 2018-10-21 |
| CN108161027A (zh) | 2018-06-15 |
| KR20160145207A (ko) | 2016-12-19 |
| TW201601993A (zh) | 2016-01-16 |
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