CN108161027B - 被覆铜颗粒 - Google Patents
被覆铜颗粒 Download PDFInfo
- Publication number
- CN108161027B CN108161027B CN201711328045.1A CN201711328045A CN108161027B CN 108161027 B CN108161027 B CN 108161027B CN 201711328045 A CN201711328045 A CN 201711328045A CN 108161027 B CN108161027 B CN 108161027B
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- Prior art keywords
- copper
- particle
- copper particle
- coating
- value
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 350
- 239000010949 copper Substances 0.000 title claims abstract description 344
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 331
- 239000002245 particle Substances 0.000 title claims abstract description 258
- 239000011248 coating agent Substances 0.000 title claims abstract description 196
- 238000000576 coating method Methods 0.000 title claims abstract description 196
- 238000006243 chemical reaction Methods 0.000 claims abstract description 119
- 239000002904 solvent Substances 0.000 claims abstract description 81
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 claims abstract description 51
- 150000001414 amino alcohols Chemical class 0.000 claims abstract description 48
- -1 aliphatic group aliphatic carboxylic acid Chemical class 0.000 claims abstract description 47
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 claims abstract description 40
- 150000001875 compounds Chemical class 0.000 claims abstract description 37
- 238000005979 thermal decomposition reaction Methods 0.000 claims abstract description 35
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 18
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract 5
- 239000000203 mixture Substances 0.000 claims description 90
- 238000009826 distribution Methods 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 24
- 238000002441 X-ray diffraction Methods 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 17
- 230000015572 biosynthetic process Effects 0.000 claims description 16
- 239000011164 primary particle Substances 0.000 claims description 16
- 238000010521 absorption reaction Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 125000001931 aliphatic group Chemical group 0.000 claims description 12
- 238000002425 crystallisation Methods 0.000 claims description 11
- 230000008025 crystallization Effects 0.000 claims description 11
- 238000007650 screen-printing Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000007641 inkjet printing Methods 0.000 claims description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 2
- CVSVTCORWBXHQV-UHFFFAOYSA-N creatine Chemical compound NC(=[NH2+])N(C)CC([O-])=O CVSVTCORWBXHQV-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 70
- 230000008569 process Effects 0.000 abstract description 38
- 238000004519 manufacturing process Methods 0.000 description 85
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 48
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 44
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 35
- 239000000243 solution Substances 0.000 description 33
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 28
- 238000004458 analytical method Methods 0.000 description 28
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 27
- 238000009835 boiling Methods 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 25
- 235000019253 formic acid Nutrition 0.000 description 25
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 24
- 238000005259 measurement Methods 0.000 description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 23
- 239000005639 Lauric acid Substances 0.000 description 23
- 230000036961 partial effect Effects 0.000 description 22
- 238000006722 reduction reaction Methods 0.000 description 21
- 238000012360 testing method Methods 0.000 description 21
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000000463 material Substances 0.000 description 18
- 230000007246 mechanism Effects 0.000 description 18
- 239000002184 metal Substances 0.000 description 17
- 239000000126 substance Substances 0.000 description 17
- 239000005751 Copper oxide Substances 0.000 description 16
- 239000012298 atmosphere Substances 0.000 description 16
- 229910002092 carbon dioxide Inorganic materials 0.000 description 16
- 229910000431 copper oxide Inorganic materials 0.000 description 16
- 229910052757 nitrogen Inorganic materials 0.000 description 16
- 238000005245 sintering Methods 0.000 description 16
- 229910001431 copper ion Inorganic materials 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 238000010304 firing Methods 0.000 description 13
- 239000002002 slurry Substances 0.000 description 13
- 230000004075 alteration Effects 0.000 description 12
- 239000001569 carbon dioxide Substances 0.000 description 12
- BDERNNFJNOPAEC-UHFFFAOYSA-N n-propyl alcohol Natural products CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 12
- 230000003647 oxidation Effects 0.000 description 12
- 238000007254 oxidation reaction Methods 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 11
- 239000006185 dispersion Substances 0.000 description 11
- 230000012010 growth Effects 0.000 description 11
- 239000007788 liquid Substances 0.000 description 11
- 230000002829 reductive effect Effects 0.000 description 11
- 150000001721 carbon Chemical group 0.000 description 10
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 10
- 239000013049 sediment Substances 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 230000004523 agglutinating effect Effects 0.000 description 9
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 9
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 239000012299 nitrogen atmosphere Substances 0.000 description 9
- 230000001590 oxidative effect Effects 0.000 description 9
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 9
- 230000009467 reduction Effects 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- 229940112669 cuprous oxide Drugs 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 230000003321 amplification Effects 0.000 description 7
- 150000004699 copper complex Chemical class 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 7
- 235000019197 fats Nutrition 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000004615 ingredient Substances 0.000 description 7
- VMGAPWLDMVPYIA-HIDZBRGKSA-N n'-amino-n-iminomethanimidamide Chemical compound N\N=C\N=N VMGAPWLDMVPYIA-HIDZBRGKSA-N 0.000 description 7
- 238000003199 nucleic acid amplification method Methods 0.000 description 7
- BOLDJAUMGUJJKM-LSDHHAIUSA-N renifolin D Natural products CC(=C)[C@@H]1Cc2c(O)c(O)ccc2[C@H]1CC(=O)c3ccc(O)cc3O BOLDJAUMGUJJKM-LSDHHAIUSA-N 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000008187 granular material Substances 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 239000002923 metal particle Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000001476 alcoholic effect Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 239000003446 ligand Substances 0.000 description 5
- 239000000693 micelle Substances 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000006228 supernatant Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000005749 Copper compound Substances 0.000 description 4
- 206010021143 Hypoxia Diseases 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 238000007792 addition Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000008139 complexing agent Substances 0.000 description 4
- 150000001880 copper compounds Chemical class 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 238000000197 pyrolysis Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000004580 weight loss Effects 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 3
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- 235000021355 Stearic acid Nutrition 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
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- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
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- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- WURBVZBTWMNKQT-UHFFFAOYSA-N 1-(4-chlorophenoxy)-3,3-dimethyl-1-(1,2,4-triazol-1-yl)butan-2-one Chemical compound C1=NC=NN1C(C(=O)C(C)(C)C)OC1=CC=C(Cl)C=C1 WURBVZBTWMNKQT-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 2
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- 244000055346 Paulownia Species 0.000 description 2
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- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 2
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- QCIYAEYRVFUFAP-UHFFFAOYSA-N hexane-2,3-diol Chemical compound CCCC(O)C(C)O QCIYAEYRVFUFAP-UHFFFAOYSA-N 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
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- 230000008520 organization Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
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- 238000012216 screening Methods 0.000 description 1
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- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
- B22F9/305—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis of metal carbonyls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014112794A JP5926322B2 (ja) | 2014-05-30 | 2014-05-30 | 被覆銅粒子及びその製造方法 |
| JP2014-112794 | 2014-05-30 | ||
| CN201580028643.XA CN106457407B (zh) | 2014-05-30 | 2015-05-14 | 被覆铜颗粒的制造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580028643.XA Division CN106457407B (zh) | 2014-05-30 | 2015-05-14 | 被覆铜颗粒的制造方法 |
Publications (2)
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| CN108161027A CN108161027A (zh) | 2018-06-15 |
| CN108161027B true CN108161027B (zh) | 2019-01-08 |
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| CN201580028643.XA Active CN106457407B (zh) | 2014-05-30 | 2015-05-14 | 被覆铜颗粒的制造方法 |
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| CN201580028643.XA Active CN106457407B (zh) | 2014-05-30 | 2015-05-14 | 被覆铜颗粒的制造方法 |
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| EP (1) | EP3150306B1 (enExample) |
| JP (1) | JP5926322B2 (enExample) |
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| CN (2) | CN108161027B (enExample) |
| TW (1) | TWI638769B (enExample) |
| WO (1) | WO2015182395A1 (enExample) |
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| JP3117596B2 (ja) | 1993-12-29 | 2000-12-18 | オルガノ株式会社 | ３分子以上の単糖類分子がグリコシド結合してなる糖類の製造方法 |
| JP6715450B2 (ja) * | 2016-01-13 | 2020-07-01 | 小林 博 | 金属ないしは金属酸化物からなる個々のナノ粒子が、液体の有機化合物に囲まれて該有機化合物中に分散した懸濁体を製造する製造方法 |
| JP6979150B2 (ja) * | 2016-03-28 | 2021-12-08 | 協立化学産業株式会社 | 被覆銀粒子とその製造方法、導電性組成物、および導電体 |
| CN110430951B (zh) * | 2017-03-15 | 2021-11-16 | 昭和电工材料株式会社 | 接合用金属糊料、接合体及其制造方法以及半导体装置及其制造方法 |
| EP3597330A4 (en) * | 2017-03-15 | 2020-11-25 | Hitachi Chemical Company, Ltd. | METAL PASTE FOR BONDING, BONDED BODY AS WELL AS A METHOD FOR MANUFACTURING THE SAME, AND A SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING THE SAME |
| US11767443B2 (en) | 2017-04-14 | 2023-09-26 | The School Corporation Kansai University | Copper particle mixture and method for manufacturing same, copper particle mixture dispersion, ink containing copper particle mixture, method for storing copper particle mixture, and method for sintering copper particle mixture |
| JP7222904B2 (ja) * | 2017-11-13 | 2023-02-15 | 京セラ株式会社 | ペースト組成物、半導体装置及び電気・電子部品 |
| WO2019106739A1 (ja) * | 2017-11-29 | 2019-06-06 | 国立大学法人北海道大学 | 低温焼結性銅粒子とそれを用いた焼結体の製造方法 |
| JP7282691B2 (ja) * | 2018-01-26 | 2023-05-29 | 日清エンジニアリング株式会社 | 微粒子の製造方法 |
| US11798707B2 (en) | 2018-01-26 | 2023-10-24 | Nisshin Engineering Inc. | Copper microparticles |
| JP7139258B2 (ja) * | 2019-01-22 | 2022-09-20 | 大陽日酸株式会社 | 銅微粒子、導電性材料、銅微粒子の製造方法 |
| CN109655521A (zh) * | 2019-01-28 | 2019-04-19 | 中国地质科学院水文地质环境地质研究所 | 基于加速器质谱技术的14c的快速测量方法 |
| JP7269565B2 (ja) * | 2019-03-29 | 2023-05-09 | 学校法人 関西大学 | 導電性インキ組成物及び導電性積層体 |
| EP3950175B1 (en) * | 2019-03-29 | 2025-06-04 | Mitsui Mining & Smelting Co., Ltd. | Bonding material and uses therof |
| JP7244919B2 (ja) * | 2019-08-27 | 2023-03-23 | 協立化学産業株式会社 | 被覆銅ナノ粒子含有組成物、及び物品 |
| CN119259994A (zh) * | 2020-08-28 | 2025-01-07 | 国立大学法人北海道大学 | 含氧化物的铜微粒及其制造方法、以及铜微粒烧结体的制造方法 |
| CN116329539B (zh) * | 2023-03-03 | 2024-05-28 | 嘉庚创新实验室 | 铜复合材料及其制备方法、铜导电浆料和铜膜 |
| CN118136337B (zh) * | 2024-04-01 | 2025-06-20 | 合肥工业大学 | 一种高收缩率铜导电薄膜的制备方法及其材料 |
| CN119747963A (zh) * | 2024-11-20 | 2025-04-04 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种基于热分解铜盐的自还原铜膏及其制备方法和应用 |
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| JP2012226841A (ja) * | 2011-04-15 | 2012-11-15 | Fukuda Metal Foil & Powder Co Ltd | 銅超微粒子分散ペーストおよび導電膜の形成方法 |
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| JPH08143916A (ja) | 1994-11-24 | 1996-06-04 | Nok Corp | 鉄微粒子の製造方法 |
| US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
| JP3900414B2 (ja) | 2002-02-18 | 2007-04-04 | 富士フイルム株式会社 | ナノ粒子およびナノ粒子の製造方法、並びに、磁気記録媒体 |
| JP4449484B2 (ja) * | 2003-02-18 | 2010-04-14 | 東レ株式会社 | 導電性ペーストおよびそれを用いたプラズマディスプレイパネル用部材の製造方法 |
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| JP2008019461A (ja) * | 2006-07-11 | 2008-01-31 | Fujifilm Corp | 金属ナノ粒子の製造方法、金属ナノ粒子及び金属ナノ粒子分散物 |
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| JP4961587B2 (ja) * | 2006-10-03 | 2012-06-27 | トヨタ自動車株式会社 | 銅微粒子、銅微粒子製造方法、絶縁材料、配線構造、配線回路板の製造方法、及び電子・電気機器 |
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-
2014
- 2014-05-30 JP JP2014112794A patent/JP5926322B2/ja active Active
-
2015
- 2015-05-14 KR KR1020167034561A patent/KR101743897B1/ko active Active
- 2015-05-14 CN CN201711328045.1A patent/CN108161027B/zh active Active
- 2015-05-14 KR KR1020167027210A patent/KR101709458B1/ko active Active
- 2015-05-14 US US15/307,227 patent/US9744595B2/en active Active
- 2015-05-14 WO PCT/JP2015/063880 patent/WO2015182395A1/ja not_active Ceased
- 2015-05-14 EP EP15799589.5A patent/EP3150306B1/en active Active
- 2015-05-14 CN CN201580028643.XA patent/CN106457407B/zh active Active
- 2015-05-22 TW TW104116484A patent/TWI638769B/zh active
-
2017
- 2017-08-24 US US15/685,729 patent/US20180036805A1/en not_active Abandoned
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| CN1065280A (zh) * | 1990-02-23 | 1992-10-14 | 旭化成工业株式会社 | 铜合金系组合物 |
| JP2010144208A (ja) * | 2008-12-18 | 2010-07-01 | Sumitomo Metal Mining Co Ltd | 酸化物被覆銅微粒子の製造方法 |
| JP2011032558A (ja) * | 2009-08-04 | 2011-02-17 | Harima Chemicals Inc | 金属銅微粒子の製造方法 |
| JP2012041592A (ja) * | 2010-08-17 | 2012-03-01 | Mitsui Mining & Smelting Co Ltd | 扁平銅粒子 |
| JP2012226841A (ja) * | 2011-04-15 | 2012-11-15 | Fukuda Metal Foil & Powder Co Ltd | 銅超微粒子分散ペーストおよび導電膜の形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101743897B1 (ko) | 2017-06-05 |
| EP3150306A1 (en) | 2017-04-05 |
| EP3150306A4 (en) | 2018-01-17 |
| US20180036805A1 (en) | 2018-02-08 |
| US20170043404A1 (en) | 2017-02-16 |
| JP2015227476A (ja) | 2015-12-17 |
| JP5926322B2 (ja) | 2016-05-25 |
| CN106457407B (zh) | 2017-12-05 |
| WO2015182395A1 (ja) | 2015-12-03 |
| EP3150306B1 (en) | 2019-01-30 |
| KR101709458B1 (ko) | 2017-02-22 |
| KR20160120786A (ko) | 2016-10-18 |
| CN106457407A (zh) | 2017-02-22 |
| US9744595B2 (en) | 2017-08-29 |
| TWI638769B (zh) | 2018-10-21 |
| CN108161027A (zh) | 2018-06-15 |
| KR20160145207A (ko) | 2016-12-19 |
| TW201601993A (zh) | 2016-01-16 |
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