KR101709458B1 - 피복 구리 입자 및 그 제조 방법 - Google Patents
피복 구리 입자 및 그 제조 방법 Download PDFInfo
- Publication number
- KR101709458B1 KR101709458B1 KR1020167027210A KR20167027210A KR101709458B1 KR 101709458 B1 KR101709458 B1 KR 101709458B1 KR 1020167027210 A KR1020167027210 A KR 1020167027210A KR 20167027210 A KR20167027210 A KR 20167027210A KR 101709458 B1 KR101709458 B1 KR 101709458B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- copper particles
- coated copper
- particles
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- B22F1/02—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
- B22F9/305—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis of metal carbonyls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014112794A JP5926322B2 (ja) | 2014-05-30 | 2014-05-30 | 被覆銅粒子及びその製造方法 |
| JPJP-P-2014-112794 | 2014-05-30 | ||
| PCT/JP2015/063880 WO2015182395A1 (ja) | 2014-05-30 | 2015-05-14 | 被覆銅粒子及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167034561A Division KR101743897B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160120786A KR20160120786A (ko) | 2016-10-18 |
| KR101709458B1 true KR101709458B1 (ko) | 2017-02-22 |
Family
ID=54698732
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167027210A Active KR101709458B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
| KR1020167034561A Active KR101743897B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167034561A Active KR101743897B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9744595B2 (enExample) |
| EP (1) | EP3150306B1 (enExample) |
| JP (1) | JP5926322B2 (enExample) |
| KR (2) | KR101709458B1 (enExample) |
| CN (2) | CN108161027B (enExample) |
| TW (1) | TWI638769B (enExample) |
| WO (1) | WO2015182395A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3117596B2 (ja) | 1993-12-29 | 2000-12-18 | オルガノ株式会社 | 3分子以上の単糖類分子がグリコシド結合してなる糖類の製造方法 |
| JP6715450B2 (ja) * | 2016-01-13 | 2020-07-01 | 小林 博 | 金属ないしは金属酸化物からなる個々のナノ粒子が、液体の有機化合物に囲まれて該有機化合物中に分散した懸濁体を製造する製造方法 |
| JP6979150B2 (ja) * | 2016-03-28 | 2021-12-08 | 協立化学産業株式会社 | 被覆銀粒子とその製造方法、導電性組成物、および導電体 |
| JP7251470B2 (ja) * | 2017-03-15 | 2023-04-04 | 株式会社レゾナック | 接合用金属ペースト、接合体及びその製造方法、並びに半導体装置及びその製造方法 |
| EP3597330A4 (en) * | 2017-03-15 | 2020-11-25 | Hitachi Chemical Company, Ltd. | METAL PASTE FOR BONDING, BONDED BODY AS WELL AS A METHOD FOR MANUFACTURING THE SAME, AND A SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING THE SAME |
| JP6976597B2 (ja) | 2017-04-14 | 2021-12-08 | 学校法人 関西大学 | 銅粒子混合物及びその製造方法、銅粒子混合物分散液、銅粒子混合物含有インク、銅粒子混合物の保存方法及び銅粒子混合物の焼結方法 |
| JP7222904B2 (ja) * | 2017-11-13 | 2023-02-15 | 京セラ株式会社 | ペースト組成物、半導体装置及び電気・電子部品 |
| US11590569B2 (en) * | 2017-11-29 | 2023-02-28 | National University Corporation Hokkaido University | Low-temperature sinterable copper particle and method for producing sintered body by using the same |
| CN111565870B (zh) * | 2018-01-26 | 2023-04-04 | 日清工程株式会社 | 铜微粒子 |
| US20210069782A1 (en) * | 2018-01-26 | 2021-03-11 | Nisshin Engineering Inc. | Fine particle production method and fine particles |
| JP7139258B2 (ja) * | 2019-01-22 | 2022-09-20 | 大陽日酸株式会社 | 銅微粒子、導電性材料、銅微粒子の製造方法 |
| CN109655521A (zh) * | 2019-01-28 | 2019-04-19 | 中国地质科学院水文地质环境地质研究所 | 基于加速器质谱技术的14c的快速测量方法 |
| JP7269565B2 (ja) * | 2019-03-29 | 2023-05-09 | 学校法人 関西大学 | 導電性インキ組成物及び導電性積層体 |
| US12070801B2 (en) * | 2019-03-29 | 2024-08-27 | Mitsui Mining & Smelting Co., Ltd. | Bonding material and bonded structure |
| JP7244919B2 (ja) * | 2019-08-27 | 2023-03-23 | 協立化学産業株式会社 | 被覆銅ナノ粒子含有組成物、及び物品 |
| EP4205882A4 (en) * | 2020-08-28 | 2024-01-24 | National University Corporation Hokkaido University | FINE OXIDE-CONTAINING COPPER PARTICLES, METHOD FOR MANUFACTURING THEM AND METHOD FOR MANUFACTURING A SINTERED TABLET FROM FINE OXIDE-CONTAINING COPPER PARTICLES |
| CN116329539B (zh) * | 2023-03-03 | 2024-05-28 | 嘉庚创新实验室 | 铜复合材料及其制备方法、铜导电浆料和铜膜 |
| CN118136337B (zh) * | 2024-04-01 | 2025-06-20 | 合肥工业大学 | 一种高收缩率铜导电薄膜的制备方法及其材料 |
| CN119747963A (zh) * | 2024-11-20 | 2025-04-04 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种基于热分解铜盐的自还原铜膏及其制备方法和应用 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011032558A (ja) * | 2009-08-04 | 2011-02-17 | Harima Chemicals Inc | 金属銅微粒子の製造方法 |
| JP2011032509A (ja) | 2009-07-30 | 2011-02-17 | Dowa Electronics Materials Co Ltd | 金属ナノ粒子分散液 |
| JP2013047365A (ja) | 2011-08-29 | 2013-03-07 | Hitachi Cable Ltd | 銅微粒子分散液およびその製造方法、銅微粒子およびその製造方法、銅微粒子を含む銅ペースト、並びに銅被膜およびその製造方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2702796B2 (ja) * | 1990-02-23 | 1998-01-26 | 旭化成工業株式会社 | 銀合金導電性ペースト |
| JPH08143916A (ja) | 1994-11-24 | 1996-06-04 | Nok Corp | 鉄微粒子の製造方法 |
| US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
| JP3900414B2 (ja) | 2002-02-18 | 2007-04-04 | 富士フイルム株式会社 | ナノ粒子およびナノ粒子の製造方法、並びに、磁気記録媒体 |
| JP4449484B2 (ja) * | 2003-02-18 | 2010-04-14 | 東レ株式会社 | 導電性ペーストおよびそれを用いたプラズマディスプレイパネル用部材の製造方法 |
| JP4431085B2 (ja) | 2004-06-24 | 2010-03-10 | シャープ株式会社 | 導電性インキ組成物、反射部材、回路基板、電子装置 |
| JP5205717B2 (ja) * | 2006-07-04 | 2013-06-05 | セイコーエプソン株式会社 | ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法 |
| JP2008019461A (ja) * | 2006-07-11 | 2008-01-31 | Fujifilm Corp | 金属ナノ粒子の製造方法、金属ナノ粒子及び金属ナノ粒子分散物 |
| JP5045015B2 (ja) | 2006-07-28 | 2012-10-10 | セイコーエプソン株式会社 | ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法 |
| JP4961587B2 (ja) * | 2006-10-03 | 2012-06-27 | トヨタ自動車株式会社 | 銅微粒子、銅微粒子製造方法、絶縁材料、配線構造、配線回路板の製造方法、及び電子・電気機器 |
| JP2008205430A (ja) * | 2007-01-26 | 2008-09-04 | Konica Minolta Holdings Inc | 金属パターン形成方法及び金属塩混合物 |
| JP2009082828A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 逆ミセル液、無機ナノ粒子及び無機ナノ粒子の製造方法 |
| JP2009158441A (ja) | 2007-12-28 | 2009-07-16 | Namics Corp | 導電性ペースト及びそれを用いた銅膜の形成方法 |
| JP5003668B2 (ja) * | 2008-12-18 | 2012-08-15 | 住友金属鉱山株式会社 | 酸化物被覆銅微粒子の製造方法 |
| JP5759688B2 (ja) | 2010-08-17 | 2015-08-05 | 三井金属鉱業株式会社 | 扁平銅粒子 |
| KR20130124490A (ko) | 2010-10-21 | 2013-11-14 | 아사히 가라스 가부시키가이샤 | 수소화구리 미립자 분산액의 제조 방법, 도전 잉크 및 도체가 형성된 기재의 제조 방법 |
| JP5342597B2 (ja) * | 2011-04-15 | 2013-11-13 | 福田金属箔粉工業株式会社 | 銅超微粒子分散ペーストおよび導電膜の形成方法 |
| CN102220046A (zh) * | 2011-06-01 | 2011-10-19 | 上海大学 | 纳米锡包铜导电墨水的制备方法 |
| KR20150006091A (ko) * | 2012-02-29 | 2015-01-15 | 이슘 리서치 디벨롭먼트 컴퍼니 오브 더 히브루 유니버시티 오브 예루살렘, 엘티디. | 금속 전구체 나노입자들을 함유한 잉크 |
| JP2014001443A (ja) * | 2012-06-21 | 2014-01-09 | Kyoritsu Kagaku Sangyo Kk | 酸化物被覆銅微粒子及びその製造方法 |
| JP2014201618A (ja) * | 2013-04-02 | 2014-10-27 | 旭硝子株式会社 | 金属微粒子分散液からなる導電インク、導体付き基材 |
| US10214656B2 (en) * | 2014-02-27 | 2019-02-26 | A School Corporation Kansai University | Copper nanoparticles and production method for same, copper nanoparticle fluid dispersion, copper nanoink, copper nanoparticle preservation method, and copper nanoparticle sintering method |
-
2014
- 2014-05-30 JP JP2014112794A patent/JP5926322B2/ja active Active
-
2015
- 2015-05-14 KR KR1020167027210A patent/KR101709458B1/ko active Active
- 2015-05-14 CN CN201711328045.1A patent/CN108161027B/zh active Active
- 2015-05-14 KR KR1020167034561A patent/KR101743897B1/ko active Active
- 2015-05-14 EP EP15799589.5A patent/EP3150306B1/en active Active
- 2015-05-14 US US15/307,227 patent/US9744595B2/en active Active
- 2015-05-14 CN CN201580028643.XA patent/CN106457407B/zh active Active
- 2015-05-14 WO PCT/JP2015/063880 patent/WO2015182395A1/ja not_active Ceased
- 2015-05-22 TW TW104116484A patent/TWI638769B/zh active
-
2017
- 2017-08-24 US US15/685,729 patent/US20180036805A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011032509A (ja) | 2009-07-30 | 2011-02-17 | Dowa Electronics Materials Co Ltd | 金属ナノ粒子分散液 |
| JP2011032558A (ja) * | 2009-08-04 | 2011-02-17 | Harima Chemicals Inc | 金属銅微粒子の製造方法 |
| JP2013047365A (ja) | 2011-08-29 | 2013-03-07 | Hitachi Cable Ltd | 銅微粒子分散液およびその製造方法、銅微粒子およびその製造方法、銅微粒子を含む銅ペースト、並びに銅被膜およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108161027A (zh) | 2018-06-15 |
| KR20160120786A (ko) | 2016-10-18 |
| CN106457407A (zh) | 2017-02-22 |
| US9744595B2 (en) | 2017-08-29 |
| CN108161027B (zh) | 2019-01-08 |
| TW201601993A (zh) | 2016-01-16 |
| EP3150306A4 (en) | 2018-01-17 |
| JP2015227476A (ja) | 2015-12-17 |
| JP5926322B2 (ja) | 2016-05-25 |
| EP3150306B1 (en) | 2019-01-30 |
| WO2015182395A1 (ja) | 2015-12-03 |
| CN106457407B (zh) | 2017-12-05 |
| KR20160145207A (ko) | 2016-12-19 |
| EP3150306A1 (en) | 2017-04-05 |
| TWI638769B (zh) | 2018-10-21 |
| US20180036805A1 (en) | 2018-02-08 |
| KR101743897B1 (ko) | 2017-06-05 |
| US20170043404A1 (en) | 2017-02-16 |
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