JP5926322B2 - 被覆銅粒子及びその製造方法 - Google Patents
被覆銅粒子及びその製造方法 Download PDFInfo
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- JP5926322B2 JP5926322B2 JP2014112794A JP2014112794A JP5926322B2 JP 5926322 B2 JP5926322 B2 JP 5926322B2 JP 2014112794 A JP2014112794 A JP 2014112794A JP 2014112794 A JP2014112794 A JP 2014112794A JP 5926322 B2 JP5926322 B2 JP 5926322B2
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- Prior art keywords
- copper
- copper particles
- reaction
- coated copper
- particles
- Prior art date
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- 239000010949 copper Substances 0.000 title claims description 325
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 320
- 229910052802 copper Inorganic materials 0.000 title claims description 302
- 239000002245 particle Substances 0.000 title claims description 284
- 238000004519 manufacturing process Methods 0.000 title claims description 50
- 238000006243 chemical reaction Methods 0.000 claims description 119
- 239000002904 solvent Substances 0.000 claims description 71
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 54
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 claims description 48
- 150000001414 amino alcohols Chemical class 0.000 claims description 45
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 35
- 150000001875 compounds Chemical class 0.000 claims description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 16
- 229910001431 copper ion Inorganic materials 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 16
- 125000001931 aliphatic group Chemical group 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 239000012295 chemical reaction liquid Substances 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 description 73
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 55
- -1 formate ions Chemical class 0.000 description 34
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 32
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- 229910052751 metal Inorganic materials 0.000 description 28
- 239000002184 metal Substances 0.000 description 28
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 26
- 239000005639 Lauric acid Substances 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 25
- 239000000463 material Substances 0.000 description 25
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 24
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 24
- 238000002441 X-ray diffraction Methods 0.000 description 24
- 238000009835 boiling Methods 0.000 description 23
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- 229910000431 copper oxide Inorganic materials 0.000 description 21
- 239000010410 layer Substances 0.000 description 21
- 238000004458 analytical method Methods 0.000 description 20
- 230000007246 mechanism Effects 0.000 description 20
- 239000000843 powder Substances 0.000 description 20
- 239000010419 fine particle Substances 0.000 description 18
- 235000019253 formic acid Nutrition 0.000 description 17
- 239000007789 gas Substances 0.000 description 16
- 230000003647 oxidation Effects 0.000 description 16
- 238000007254 oxidation reaction Methods 0.000 description 16
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 15
- 239000012298 atmosphere Substances 0.000 description 15
- 238000009826 distribution Methods 0.000 description 15
- 239000011164 primary particle Substances 0.000 description 14
- 238000006722 reduction reaction Methods 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- 239000001569 carbon dioxide Substances 0.000 description 12
- 229910002092 carbon dioxide Inorganic materials 0.000 description 12
- 239000012299 nitrogen atmosphere Substances 0.000 description 12
- 238000005245 sintering Methods 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 239000013078 crystal Substances 0.000 description 10
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- 239000001301 oxygen Substances 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000002244 precipitate Substances 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 239000007810 chemical reaction solvent Substances 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 238000001179 sorption measurement Methods 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 230000002776 aggregation Effects 0.000 description 6
- 238000004220 aggregation Methods 0.000 description 6
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 6
- 230000001186 cumulative effect Effects 0.000 description 6
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 6
- 229940112669 cuprous oxide Drugs 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 239000006228 supernatant Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 238000007641 inkjet printing Methods 0.000 description 5
- 150000002500 ions Chemical group 0.000 description 5
- 239000000693 micelle Substances 0.000 description 5
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000005749 Copper compound Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 230000005587 bubbling Effects 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
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- 230000008859 change Effects 0.000 description 4
- 239000008139 complexing agent Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 150000001880 copper compounds Chemical class 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 4
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- 238000005406 washing Methods 0.000 description 4
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 description 3
- LQGKDMHENBFVRC-UHFFFAOYSA-N 5-aminopentan-1-ol Chemical compound NCCCCCO LQGKDMHENBFVRC-UHFFFAOYSA-N 0.000 description 3
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 3
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- 230000001276 controlling effect Effects 0.000 description 3
- 229940116318 copper carbonate Drugs 0.000 description 3
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 3
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- 239000007791 liquid phase Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
- B22F9/305—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis of metal carbonyls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
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- Chemical & Material Sciences (AREA)
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- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
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| US15/307,227 US9744595B2 (en) | 2014-05-30 | 2015-05-14 | Coated copper particles and method for producing the same |
| CN201711328045.1A CN108161027B (zh) | 2014-05-30 | 2015-05-14 | 被覆铜颗粒 |
| EP15799589.5A EP3150306B1 (en) | 2014-05-30 | 2015-05-14 | Coated copper particles and method for manufacturing same |
| KR1020167034561A KR101743897B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
| PCT/JP2015/063880 WO2015182395A1 (ja) | 2014-05-30 | 2015-05-14 | 被覆銅粒子及びその製造方法 |
| CN201580028643.XA CN106457407B (zh) | 2014-05-30 | 2015-05-14 | 被覆铜颗粒的制造方法 |
| KR1020167027210A KR101709458B1 (ko) | 2014-05-30 | 2015-05-14 | 피복 구리 입자 및 그 제조 방법 |
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| US15/685,729 US20180036805A1 (en) | 2014-05-30 | 2017-08-24 | Coated copper particles and method for producing the same |
Applications Claiming Priority (1)
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| JP2014112794A JP5926322B2 (ja) | 2014-05-30 | 2014-05-30 | 被覆銅粒子及びその製造方法 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3117596B2 (ja) | 1993-12-29 | 2000-12-18 | オルガノ株式会社 | ３分子以上の単糖類分子がグリコシド結合してなる糖類の製造方法 |
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| JP6715450B2 (ja) * | 2016-01-13 | 2020-07-01 | 小林 博 | 金属ないしは金属酸化物からなる個々のナノ粒子が、液体の有機化合物に囲まれて該有機化合物中に分散した懸濁体を製造する製造方法 |
| JP6979150B2 (ja) * | 2016-03-28 | 2021-12-08 | 協立化学産業株式会社 | 被覆銀粒子とその製造方法、導電性組成物、および導電体 |
| CN110430951B (zh) * | 2017-03-15 | 2021-11-16 | 昭和电工材料株式会社 | 接合用金属糊料、接合体及其制造方法以及半导体装置及其制造方法 |
| EP3597330A4 (en) * | 2017-03-15 | 2020-11-25 | Hitachi Chemical Company, Ltd. | METAL PASTE FOR BONDING, BONDED BODY AS WELL AS A METHOD FOR MANUFACTURING THE SAME, AND A SEMICONDUCTOR DEVICE AS WELL AS A METHOD FOR MANUFACTURING THE SAME |
| US11767443B2 (en) | 2017-04-14 | 2023-09-26 | The School Corporation Kansai University | Copper particle mixture and method for manufacturing same, copper particle mixture dispersion, ink containing copper particle mixture, method for storing copper particle mixture, and method for sintering copper particle mixture |
| JP7222904B2 (ja) * | 2017-11-13 | 2023-02-15 | 京セラ株式会社 | ペースト組成物、半導体装置及び電気・電子部品 |
| WO2019106739A1 (ja) * | 2017-11-29 | 2019-06-06 | 国立大学法人北海道大学 | 低温焼結性銅粒子とそれを用いた焼結体の製造方法 |
| JP7282691B2 (ja) * | 2018-01-26 | 2023-05-29 | 日清エンジニアリング株式会社 | 微粒子の製造方法 |
| US11798707B2 (en) | 2018-01-26 | 2023-10-24 | Nisshin Engineering Inc. | Copper microparticles |
| JP7139258B2 (ja) * | 2019-01-22 | 2022-09-20 | 大陽日酸株式会社 | 銅微粒子、導電性材料、銅微粒子の製造方法 |
| CN109655521A (zh) * | 2019-01-28 | 2019-04-19 | 中国地质科学院水文地质环境地质研究所 | 基于加速器质谱技术的14c的快速测量方法 |
| JP7269565B2 (ja) * | 2019-03-29 | 2023-05-09 | 学校法人 関西大学 | 導電性インキ組成物及び導電性積層体 |
| EP3950175B1 (en) * | 2019-03-29 | 2025-06-04 | Mitsui Mining & Smelting Co., Ltd. | Bonding material and uses therof |
| JP7244919B2 (ja) * | 2019-08-27 | 2023-03-23 | 協立化学産業株式会社 | 被覆銅ナノ粒子含有組成物、及び物品 |
| CN119259994A (zh) * | 2020-08-28 | 2025-01-07 | 国立大学法人北海道大学 | 含氧化物的铜微粒及其制造方法、以及铜微粒烧结体的制造方法 |
| CN116329539B (zh) * | 2023-03-03 | 2024-05-28 | 嘉庚创新实验室 | 铜复合材料及其制备方法、铜导电浆料和铜膜 |
| CN118136337B (zh) * | 2024-04-01 | 2025-06-20 | 合肥工业大学 | 一种高收缩率铜导电薄膜的制备方法及其材料 |
| CN119747963A (zh) * | 2024-11-20 | 2025-04-04 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种基于热分解铜盐的自还原铜膏及其制备方法和应用 |
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| JP2702796B2 (ja) * | 1990-02-23 | 1998-01-26 | 旭化成工業株式会社 | 銀合金導電性ペースト |
| JPH08143916A (ja) | 1994-11-24 | 1996-06-04 | Nok Corp | 鉄微粒子の製造方法 |
| US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
| JP3900414B2 (ja) | 2002-02-18 | 2007-04-04 | 富士フイルム株式会社 | ナノ粒子およびナノ粒子の製造方法、並びに、磁気記録媒体 |
| JP4449484B2 (ja) * | 2003-02-18 | 2010-04-14 | 東レ株式会社 | 導電性ペーストおよびそれを用いたプラズマディスプレイパネル用部材の製造方法 |
| JP4431085B2 (ja) | 2004-06-24 | 2010-03-10 | シャープ株式会社 | 導電性インキ組成物、反射部材、回路基板、電子装置 |
| JP5205717B2 (ja) * | 2006-07-04 | 2013-06-05 | セイコーエプソン株式会社 | ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法 |
| JP2008019461A (ja) * | 2006-07-11 | 2008-01-31 | Fujifilm Corp | 金属ナノ粒子の製造方法、金属ナノ粒子及び金属ナノ粒子分散物 |
| JP5045015B2 (ja) | 2006-07-28 | 2012-10-10 | セイコーエプソン株式会社 | ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法 |
| JP4961587B2 (ja) * | 2006-10-03 | 2012-06-27 | トヨタ自動車株式会社 | 銅微粒子、銅微粒子製造方法、絶縁材料、配線構造、配線回路板の製造方法、及び電子・電気機器 |
| JP2008205430A (ja) * | 2007-01-26 | 2008-09-04 | Konica Minolta Holdings Inc | 金属パターン形成方法及び金属塩混合物 |
| JP2009082828A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 逆ミセル液、無機ナノ粒子及び無機ナノ粒子の製造方法 |
| JP2009158441A (ja) | 2007-12-28 | 2009-07-16 | Namics Corp | 導電性ペースト及びそれを用いた銅膜の形成方法 |
| JP5003668B2 (ja) * | 2008-12-18 | 2012-08-15 | 住友金属鉱山株式会社 | 酸化物被覆銅微粒子の製造方法 |
| JP5441550B2 (ja) * | 2009-07-30 | 2014-03-12 | Ｄｏｗａエレクトロニクス株式会社 | 金属ナノ粒子分散液 |
| JP5426270B2 (ja) * | 2009-08-04 | 2014-02-26 | ハリマ化成株式会社 | 金属銅微粒子の製造方法 |
| JP5759688B2 (ja) | 2010-08-17 | 2015-08-05 | 三井金属鉱業株式会社 | 扁平銅粒子 |
| WO2012053456A1 (ja) * | 2010-10-21 | 2012-04-26 | 旭硝子株式会社 | 水素化銅微粒子分散液の製造方法、導電インクおよび導体付き基材の製造方法 |
| JP5342597B2 (ja) * | 2011-04-15 | 2013-11-13 | 福田金属箔粉工業株式会社 | 銅超微粒子分散ペーストおよび導電膜の形成方法 |
| CN102220046A (zh) * | 2011-06-01 | 2011-10-19 | 上海大学 | 纳米锡包铜导电墨水的制备方法 |
| JP5848552B2 (ja) * | 2011-08-29 | 2016-01-27 | 日立金属株式会社 | 銅微粒子分散液の製造方法、銅微粒子の製造方法、銅微粒子分散液および銅微粒子 |
| US10590295B2 (en) * | 2012-02-29 | 2020-03-17 | Singapore Asahi Chemical & Solder Ind. Pte. Ltd | Inks containing metal precursors nanoparticles |
| JP2014001443A (ja) * | 2012-06-21 | 2014-01-09 | Kyoritsu Kagaku Sangyo Kk | 酸化物被覆銅微粒子及びその製造方法 |
| JP2014201618A (ja) * | 2013-04-02 | 2014-10-27 | 旭硝子株式会社 | 金属微粒子分散液からなる導電インク、導体付き基材 |
| KR101886263B1 (ko) * | 2014-02-27 | 2018-08-07 | 더 스쿨 코포레이션 칸사이 유니버시티 | 구리 나노 입자 및 그 제조 방법, 구리 나노 입자 분산액, 구리 나노 잉크, 구리 나노 입자의 저장 방법 및 구리 나노 입자의 소결 방법 |
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2014
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- 2015-05-14 KR KR1020167027210A patent/KR101709458B1/ko active Active
- 2015-05-14 US US15/307,227 patent/US9744595B2/en active Active
- 2015-05-14 WO PCT/JP2015/063880 patent/WO2015182395A1/ja not_active Ceased
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- 2015-05-14 CN CN201580028643.XA patent/CN106457407B/zh active Active
- 2015-05-22 TW TW104116484A patent/TWI638769B/zh active
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3117596B2 (ja) | 1993-12-29 | 2000-12-18 | オルガノ株式会社 | ３分子以上の単糖類分子がグリコシド結合してなる糖類の製造方法 |
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| KR101743897B1 (ko) | 2017-06-05 |
| EP3150306A1 (en) | 2017-04-05 |
| EP3150306A4 (en) | 2018-01-17 |
| US20180036805A1 (en) | 2018-02-08 |
| CN108161027B (zh) | 2019-01-08 |
| US20170043404A1 (en) | 2017-02-16 |
| JP2015227476A (ja) | 2015-12-17 |
| CN106457407B (zh) | 2017-12-05 |
| WO2015182395A1 (ja) | 2015-12-03 |
| EP3150306B1 (en) | 2019-01-30 |
| KR101709458B1 (ko) | 2017-02-22 |
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| CN106457407A (zh) | 2017-02-22 |
| US9744595B2 (en) | 2017-08-29 |
| TWI638769B (zh) | 2018-10-21 |
| CN108161027A (zh) | 2018-06-15 |
| KR20160145207A (ko) | 2016-12-19 |
| TW201601993A (zh) | 2016-01-16 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |