CN106457407B - 被覆铜颗粒的制造方法 - Google Patents

被覆铜颗粒的制造方法 Download PDF

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Publication number
CN106457407B
CN106457407B CN201580028643.XA CN201580028643A CN106457407B CN 106457407 B CN106457407 B CN 106457407B CN 201580028643 A CN201580028643 A CN 201580028643A CN 106457407 B CN106457407 B CN 106457407B
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Prior art keywords
copper
coated copper
copper particles
reaction
solvent
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CN201580028643.XA
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Chinese (zh)
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CN106457407A (zh
Inventor
福本邦宏
小山优
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Kyoritsu Chemical and Co Ltd
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Kyoritsu Chemical and Co Ltd
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Priority to CN201711328045.1A priority Critical patent/CN108161027B/zh
Publication of CN106457407A publication Critical patent/CN106457407A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • B22F9/305—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis of metal carbonyls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/32—Hydrogen storage

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
CN201580028643.XA 2014-05-30 2015-05-14 被覆铜颗粒的制造方法 Active CN106457407B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711328045.1A CN108161027B (zh) 2014-05-30 2015-05-14 被覆铜颗粒

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014112794A JP5926322B2 (ja) 2014-05-30 2014-05-30 被覆銅粒子及びその製造方法
JP2014-112794 2014-05-30
PCT/JP2015/063880 WO2015182395A1 (ja) 2014-05-30 2015-05-14 被覆銅粒子及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201711328045.1A Division CN108161027B (zh) 2014-05-30 2015-05-14 被覆铜颗粒

Publications (2)

Publication Number Publication Date
CN106457407A CN106457407A (zh) 2017-02-22
CN106457407B true CN106457407B (zh) 2017-12-05

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CN201580028643.XA Active CN106457407B (zh) 2014-05-30 2015-05-14 被覆铜颗粒的制造方法
CN201711328045.1A Active CN108161027B (zh) 2014-05-30 2015-05-14 被覆铜颗粒

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US (2) US9744595B2 (enExample)
EP (1) EP3150306B1 (enExample)
JP (1) JP5926322B2 (enExample)
KR (2) KR101743897B1 (enExample)
CN (2) CN106457407B (enExample)
TW (1) TWI638769B (enExample)
WO (1) WO2015182395A1 (enExample)

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JP6715450B2 (ja) * 2016-01-13 2020-07-01 小林　博 金属ないしは金属酸化物からなる個々のナノ粒子が、液体の有機化合物に囲まれて該有機化合物中に分散した懸濁体を製造する製造方法
JP6979150B2 (ja) * 2016-03-28 2021-12-08 協立化学産業株式会社 被覆銀粒子とその製造方法、導電性組成物、および導電体
US11370066B2 (en) * 2017-03-15 2022-06-28 Showa Denko Materials Co., Ltd. Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
SG11201906718UA (en) * 2017-03-15 2019-10-30 Hitachi Chemical Co Ltd Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
JP6976597B2 (ja) * 2017-04-14 2021-12-08 学校法人 関西大学 銅粒子混合物及びその製造方法、銅粒子混合物分散液、銅粒子混合物含有インク、銅粒子混合物の保存方法及び銅粒子混合物の焼結方法
EP3712904B1 (en) * 2017-11-13 2025-06-25 Kyocera Corporation Paste composition, semiconductor device, and electrical/electronic component
EP3718661A4 (en) * 2017-11-29 2021-06-09 National University Corporation Hokkaido University COPPER PARTS SINTERABLE AT LOW TEMPERATURE AND A PROCESS FOR MANUFACTURING A SINTER BODY THEREOF
WO2019146414A1 (ja) * 2018-01-26 2019-08-01 日清エンジニアリング株式会社 銅微粒子
CN111819018B (zh) * 2018-01-26 2023-07-28 日清工程株式会社 微粒子的制造方法及微粒子
JP7139258B2 (ja) * 2019-01-22 2022-09-20 大陽日酸株式会社 銅微粒子、導電性材料、銅微粒子の製造方法
CN109655521A (zh) * 2019-01-28 2019-04-19 中国地质科学院水文地质环境地质研究所 基于加速器质谱技术的14c的快速测量方法
JP7269565B2 (ja) * 2019-03-29 2023-05-09 学校法人 関西大学 導電性インキ組成物及び導電性積層体
CN113631301B (zh) * 2019-03-29 2024-04-30 三井金属矿业株式会社 接合材料及接合结构
JP7244919B2 (ja) * 2019-08-27 2023-03-23 協立化学産業株式会社 被覆銅ナノ粒子含有組成物、及び物品
CN115461173A (zh) * 2020-08-28 2022-12-09 国立大学法人北海道大学 含氧化物的铜微粒及其制造方法、以及使用该含氧化物的铜微粒的烧结体的制造方法
CN116329539B (zh) * 2023-03-03 2024-05-28 嘉庚创新实验室 铜复合材料及其制备方法、铜导电浆料和铜膜
CN118136337B (zh) * 2024-04-01 2025-06-20 合肥工业大学 一种高收缩率铜导电薄膜的制备方法及其材料
CN119747963A (zh) * 2024-11-20 2025-04-04 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) 一种基于热分解铜盐的自还原铜膏及其制备方法和应用

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Also Published As

Publication number Publication date
US20180036805A1 (en) 2018-02-08
TW201601993A (zh) 2016-01-16
KR101743897B1 (ko) 2017-06-05
KR20160120786A (ko) 2016-10-18
US9744595B2 (en) 2017-08-29
WO2015182395A1 (ja) 2015-12-03
EP3150306A1 (en) 2017-04-05
US20170043404A1 (en) 2017-02-16
KR20160145207A (ko) 2016-12-19
JP2015227476A (ja) 2015-12-17
CN108161027A (zh) 2018-06-15
EP3150306B1 (en) 2019-01-30
CN108161027B (zh) 2019-01-08
JP5926322B2 (ja) 2016-05-25
CN106457407A (zh) 2017-02-22
KR101709458B1 (ko) 2017-02-22
TWI638769B (zh) 2018-10-21
EP3150306A4 (en) 2018-01-17

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