SG11201906718UA - Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device - Google Patents

Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

Info

Publication number
SG11201906718UA
SG11201906718UA SG11201906718UA SG11201906718UA SG 11201906718U A SG11201906718U A SG 11201906718UA SG 11201906718U A SG11201906718U A SG 11201906718UA SG 11201906718U A SG11201906718U A SG 11201906718UA
Authority
SG
Singapore
Prior art keywords
assembly
semiconductor device
production method
joints
metal paste
Prior art date
Application number
Inventor
Yuki Kawana
Hideo Nakako
Motohiro Negishi
Dai Ishikawa
Chie Sugama
Yoshinori Ejiri
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11201906718UA publication Critical patent/SG11201906718UA/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
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    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Die Bonding (AREA)

Abstract

FP0637-00 Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper 5 particles having a volume average particle diameter of 0.12 pm to 0.8 JIM. 78
SG11201906718U 2017-03-15 2018-01-18 Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device SG11201906718UA (en)

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PCT/JP2018/001409 WO2018168186A1 (en) 2017-03-15 2018-01-18 Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

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US10930612B2 (en) * 2017-01-11 2021-02-23 Showa Denko Materials Co., Ltd. Copper paste for pressureless bonding, bonded body and semiconductor device
JP6983186B2 (en) * 2019-01-30 2021-12-17 株式会社神鋼環境ソリューション Storage method of dispersion in which alkali metal is dispersed in a dispersion solvent
TW202115744A (en) * 2019-09-30 2021-04-16 日商日立化成股份有限公司 Copper paste for joining, method for manufacturing joined body, and joined body
CN114502301A (en) * 2019-09-30 2022-05-13 昭和电工材料株式会社 Copper paste for bonding, method for producing bonded body, and bonded body
JP7391678B2 (en) * 2020-01-24 2023-12-05 大陽日酸株式会社 Bonding material
JP7380256B2 (en) * 2020-01-28 2023-11-15 三菱マテリアル株式会社 Joining sheet

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JPS4928639B1 (en) 1969-06-17 1974-07-27
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JP3736797B2 (en) 2001-11-20 2006-01-18 Ｔｄｋ株式会社 High temperature cream solder composition and inductor
JP5006081B2 (en) 2007-03-28 2012-08-22 株式会社日立製作所 Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
JP4928639B2 (en) 2010-03-15 2012-05-09 Ｄｏｗａエレクトロニクス株式会社 Bonding material and bonding method using the same
WO2011155055A1 (en) * 2010-06-11 2011-12-15 Ｄｏｗａエレクトロニクス株式会社 Low-temperature-sintering bonding material and bonding method using the bonding material
TWI601157B (en) * 2011-12-13 2017-10-01 道康寧公司 Composition and conductor formed therefrom
US9818718B2 (en) * 2012-10-30 2017-11-14 Kaken Tech Co., Ltd. Conductive paste and die bonding method
JP6199048B2 (en) * 2013-02-28 2017-09-20 国立大学法人大阪大学 Bonding material
EP2942129B1 (en) * 2014-05-05 2017-07-05 Heraeus Deutschland GmbH & Co. KG Metal paste and its use in joining components
JP5926322B2 (en) * 2014-05-30 2016-05-25 協立化学産業株式会社 Coated copper particles and method for producing the same
JP6373066B2 (en) * 2014-05-30 2018-08-15 Ｄｏｗａエレクトロニクス株式会社 Bonding material and bonding method using the same
KR102018194B1 (en) 2014-08-29 2019-09-04 미쓰이금속광업주식회사 Conductor connection structure, method for producing same, conductive composition, and electronic component module
US10625344B2 (en) * 2015-03-05 2020-04-21 Osaka University Method for producing copper particles, copper particles, and copper paste
JP6060199B2 (en) 2015-03-24 2017-01-11 ハリマ化成株式会社 Solder alloy, solder paste and electronic circuit board
JP6507826B2 (en) * 2015-04-28 2019-05-08 日立化成株式会社 Conductive joint and method of manufacturing the same

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US20200075528A1 (en) 2020-03-05
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JP7251470B2 (en) 2023-04-04
EP3597331A4 (en) 2020-11-25
US11462502B2 (en) 2022-10-04
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TWI756352B (en) 2022-03-01
CN110430951B (en) 2021-11-16
WO2018168186A1 (en) 2018-09-20
TW201840859A (en) 2018-11-16
CN110430951A (en) 2019-11-08
EP3597331A1 (en) 2020-01-22

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