JPS506081B1 - - Google Patents
Info
- Publication number
- JPS506081B1 JPS506081B1 JP10844070A JP10844070A JPS506081B1 JP S506081 B1 JPS506081 B1 JP S506081B1 JP 10844070 A JP10844070 A JP 10844070A JP 10844070 A JP10844070 A JP 10844070A JP S506081 B1 JPS506081 B1 JP S506081B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Earth Drilling (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10844070A JPS506081B1 (en) | 1970-12-09 | 1970-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10844070A JPS506081B1 (en) | 1970-12-09 | 1970-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS506081B1 true JPS506081B1 (en) | 1975-03-11 |
Family
ID=14484812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10844070A Pending JPS506081B1 (en) | 1970-12-09 | 1970-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS506081B1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180050712A (en) | 2015-09-07 | 2018-05-15 | 히타치가세이가부시끼가이샤 | Copper paste for bonding, method of manufacturing a bonded body, and method of manufacturing a semiconductor device |
| KR20180050714A (en) | 2015-09-07 | 2018-05-15 | 히타치가세이가부시끼가이샤 | Copper paste for bonding, method of manufacturing a bonded body, and method of manufacturing a semiconductor device |
| KR20180050713A (en) | 2015-09-07 | 2018-05-15 | 히타치가세이가부시끼가이샤 | Junction body and semiconductor device |
| WO2018168187A1 (en) | 2017-03-15 | 2018-09-20 | 日立化成株式会社 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device |
| WO2018168186A1 (en) | 2017-03-15 | 2018-09-20 | 日立化成株式会社 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device |
| WO2021064826A1 (en) | 2019-09-30 | 2021-04-08 | 昭和電工マテリアルズ株式会社 | Copper paste for joining, method for manufacturing joined body, and joined body |
| KR20210096147A (en) | 2018-11-29 | 2021-08-04 | 쇼와덴코머티리얼즈가부시끼가이샤 | Method for manufacturing a bonded body and semiconductor device, and copper paste for bonding |
| KR20240031329A (en) | 2021-07-06 | 2024-03-07 | 가부시끼가이샤 레조낙 | Metal paste for joining, joined body, and method of manufacturing the same |
| KR20240032878A (en) | 2021-07-06 | 2024-03-12 | 가부시끼가이샤 레조낙 | Metal paste for joining, joined body, and method of manufacturing the same |
-
1970
- 1970-12-09 JP JP10844070A patent/JPS506081B1/ja active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3689511A1 (en) | 2015-09-07 | 2020-08-05 | Hitachi Chemical Company, Ltd. | Joined body and semiconductor device |
| KR20180050714A (en) | 2015-09-07 | 2018-05-15 | 히타치가세이가부시끼가이샤 | Copper paste for bonding, method of manufacturing a bonded body, and method of manufacturing a semiconductor device |
| KR20180050713A (en) | 2015-09-07 | 2018-05-15 | 히타치가세이가부시끼가이샤 | Junction body and semiconductor device |
| EP3702072A1 (en) | 2015-09-07 | 2020-09-02 | Hitachi Chemical Company, Ltd. | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device |
| KR20180050712A (en) | 2015-09-07 | 2018-05-15 | 히타치가세이가부시끼가이샤 | Copper paste for bonding, method of manufacturing a bonded body, and method of manufacturing a semiconductor device |
| EP3702071A1 (en) | 2015-09-07 | 2020-09-02 | Hitachi Chemical Company, Ltd. | Copper paste for joining, method for producing joined body, and method for producing semiconductor device |
| WO2018168186A1 (en) | 2017-03-15 | 2018-09-20 | 日立化成株式会社 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device |
| KR20190126299A (en) | 2017-03-15 | 2019-11-11 | 히타치가세이가부시끼가이샤 | Metal paste for joining, a joined body and a manufacturing method thereof, and a semiconductor device and a manufacturing method thereof |
| KR20190126297A (en) | 2017-03-15 | 2019-11-11 | 히타치가세이가부시끼가이샤 | Metal paste for joining, a joined body and a method for manufacturing the same, and a semiconductor device and a method for manufacturing the same |
| WO2018168187A1 (en) | 2017-03-15 | 2018-09-20 | 日立化成株式会社 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device |
| KR20210096147A (en) | 2018-11-29 | 2021-08-04 | 쇼와덴코머티리얼즈가부시끼가이샤 | Method for manufacturing a bonded body and semiconductor device, and copper paste for bonding |
| US11890681B2 (en) | 2018-11-29 | 2024-02-06 | Resonac Corporation | Method for producing bonded object and semiconductor device and copper bonding paste |
| WO2021064826A1 (en) | 2019-09-30 | 2021-04-08 | 昭和電工マテリアルズ株式会社 | Copper paste for joining, method for manufacturing joined body, and joined body |
| KR20220073763A (en) | 2019-09-30 | 2022-06-03 | 쇼와덴코머티리얼즈가부시끼가이샤 | Copper paste for bonding, method for manufacturing a bonded body, and a bonded body |
| KR20240031329A (en) | 2021-07-06 | 2024-03-07 | 가부시끼가이샤 레조낙 | Metal paste for joining, joined body, and method of manufacturing the same |
| KR20240032878A (en) | 2021-07-06 | 2024-03-12 | 가부시끼가이샤 레조낙 | Metal paste for joining, joined body, and method of manufacturing the same |