MY178751A - Silver paste having excellent low-temperature sinterability and method for manufacturing same silver paste - Google Patents

Silver paste having excellent low-temperature sinterability and method for manufacturing same silver paste

Info

Publication number
MY178751A
MY178751A MYPI2016702566A MYPI2016702566A MY178751A MY 178751 A MY178751 A MY 178751A MY PI2016702566 A MYPI2016702566 A MY PI2016702566A MY PI2016702566 A MYPI2016702566 A MY PI2016702566A MY 178751 A MY178751 A MY 178751A
Authority
MY
Malaysia
Prior art keywords
silver paste
silver particles
solid
metal paste
excellent low
Prior art date
Application number
MYPI2016702566A
Inventor
Yuichi Makita
Yuusuke Ohshima
Junichi Taniuchi
Hitoshi Kubo
Original Assignee
Tanaka Precious Metal Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54008883&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY178751(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tanaka Precious Metal Ind filed Critical Tanaka Precious Metal Ind
Publication of MY178751A publication Critical patent/MY178751A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

The present invention is a metal paste formed by kneading a solid including silver particles and a solvent, wherein the solid includes silver particles containing silver particles having a particle size of from 100 to 200 nm at 30% or more based on the number of particles, and the silver particles constituting the solid are bound with an amine compound having from 4 to 8 carbon atoms in total as a protective agent. In the metal paste, an average particle size of the entire silver particles constituting the solid is preferably from 60 to 800 nm. The metal paste according to the present invention can form a sintered body having a low resistance by sintering silver particles even in a low temperature region of 150?C or lower.
MYPI2016702566A 2014-02-25 2015-02-20 Silver paste having excellent low-temperature sinterability and method for manufacturing same silver paste MY178751A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014034554A JP5795096B2 (en) 2014-02-25 2014-02-25 Silver paste excellent in low-temperature sinterability and method for producing the silver paste

Publications (1)

Publication Number Publication Date
MY178751A true MY178751A (en) 2020-10-20

Family

ID=54008883

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016702566A MY178751A (en) 2014-02-25 2015-02-20 Silver paste having excellent low-temperature sinterability and method for manufacturing same silver paste

Country Status (7)

Country Link
JP (1) JP5795096B2 (en)
KR (2) KR20180036799A (en)
CN (1) CN106062886B (en)
DE (1) DE112015000957B4 (en)
MY (1) MY178751A (en)
TW (1) TWI542711B (en)
WO (1) WO2015129562A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102056972B1 (en) * 2014-11-25 2019-12-17 반도 카가쿠 가부시키가이샤 Conductive ink
JP2017066501A (en) * 2015-10-02 2017-04-06 アルプス電気株式会社 Method for producing coated silver particles, liquid composition, coated silver particles, composition containing coated silver particles, conductive member, method for producing conductive member, electric / electronic component and electric / electronic device
US12163034B2 (en) 2018-08-30 2024-12-10 Tanaka Kikinzoku Kogyo K.K. Silver ink for low-temperature calcination
EP3848134A4 (en) 2018-09-03 2022-02-09 Osaka Soda Co., Ltd. SILVER NANOPARTICLES
EP4026630A4 (en) 2019-09-02 2023-08-23 Osaka Soda Co., Ltd. SILVER PARTICLES
TWI774439B (en) 2020-07-03 2022-08-11 日商田中貴金屬工業股份有限公司 Metal wiring and conductive sheet with excellent bending resistance and metal paste for forming the metal wiring
CN116348562A (en) 2020-08-31 2023-06-27 株式会社大阪曹達 conductive adhesive
CN115989105A (en) 2020-09-30 2023-04-18 株式会社大阪曹達 conductive adhesive
WO2022176809A1 (en) 2021-02-18 2022-08-25 学校法人 関西大学 Electrically conductive adhesive, sintered body of electrically conductive adhesive, method for producing sintered body, electronic component, and method for producing electronic component
CN113770370A (en) * 2021-08-18 2021-12-10 清华大学 Silver powder and preparation method thereof, silver paste and photovoltaic cell
EP4596144A1 (en) 2022-09-30 2025-08-06 Osaka Soda Co., Ltd. Silver particles
CN119923300A (en) 2022-09-30 2025-05-02 株式会社大阪曹达 Silver particles
WO2024154463A1 (en) * 2023-01-17 2024-07-25 富士フイルム株式会社 Composition, conductive joining material, device and production method of conductive joining material
KR20240148569A (en) * 2023-04-04 2024-10-11 대주전자재료 주식회사 Bonding composition for low temperature sintering
CN121646516A (en) 2023-09-07 2026-03-10 株式会社大阪曹达 Silver particles

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100081563A1 (en) * 2008-09-26 2010-04-01 Andrew Edgar-Beltran Adhesion and coating integrity of washcoats and overcoats
JP5574761B2 (en) 2009-04-17 2014-08-20 国立大学法人山形大学 Coated silver ultrafine particles and method for producing the same
CN101710497B (en) * 2009-12-08 2011-04-20 华中科技大学 Nano-silver conductive slurry
JP5761483B2 (en) * 2010-05-07 2015-08-12 戸田工業株式会社 Silver fine particles and production method thereof, and conductive paste, conductive film and electronic device containing the silver fine particles
WO2011148520A1 (en) * 2010-05-26 2011-12-01 第一工業製薬株式会社 Dispersant and dispersion composition
WO2011155055A1 (en) 2010-06-11 2011-12-15 Ｄｏｗａエレクトロニクス株式会社 Low-temperature-sintering bonding material and bonding method using the bonding material
JP2012031478A (en) * 2010-07-30 2012-02-16 Toda Kogyo Corp Silver fine particle and method of manufacturing the same, conductive paste containing the silver fine particle, conductive film, and electronic device
JP6241908B2 (en) * 2011-02-04 2017-12-06 国立大学法人山形大学 Coated fine metal particles and production method thereof
EP2881198B1 (en) 2012-08-02 2020-03-25 National University Corporation Yamagata University Process for producing coated fine silver particles and paste comprising said coated fine silver particles

Also Published As

Publication number Publication date
DE112015000957B4 (en) 2023-01-05
KR20160113266A (en) 2016-09-28
TW201538753A (en) 2015-10-16
KR101866111B1 (en) 2018-06-08
CN106062886A (en) 2016-10-26
WO2015129562A1 (en) 2015-09-03
JP2015159096A (en) 2015-09-03
TWI542711B (en) 2016-07-21
JP5795096B2 (en) 2015-10-14
CN106062886B (en) 2018-12-07
DE112015000957T5 (en) 2016-11-03
KR20180036799A (en) 2018-04-09

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