JP4961587B2 - 銅微粒子、銅微粒子製造方法、絶縁材料、配線構造、配線回路板の製造方法、及び電子・電気機器 - Google Patents
銅微粒子、銅微粒子製造方法、絶縁材料、配線構造、配線回路板の製造方法、及び電子・電気機器 Download PDFInfo
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- JP4961587B2 JP4961587B2 JP2006272120A JP2006272120A JP4961587B2 JP 4961587 B2 JP4961587 B2 JP 4961587B2 JP 2006272120 A JP2006272120 A JP 2006272120A JP 2006272120 A JP2006272120 A JP 2006272120A JP 4961587 B2 JP4961587 B2 JP 4961587B2
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- copper fine
- copper
- fine particles
- circuit board
- producing
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Images
Classifications
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- H—ELECTRICITY
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
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Description
本発明の方法で、最初に水溶液中のCu2+イオンはオレイン酸の中に抽出した。そして、抽出されたCu2+イオンはグルコースとアスコルピン酸によりそれぞれ酸化銅(I)と金属銅に還元した。オレイン酸は抽出溶媒と銅粒子の表面に吸着できる表面活性剤の両方として働く。安定な金属銅微粒子は酸素が存在している中でも得ることができる。本発明の方法は、高い安定と疎水性のナノ銅粒子を得ることを可能にする。同時に、オレイン酸のC=C結合の存在は潜在的工業プロセスアプリケーションに重要な高分子マトリクスと最終生成物を容易に反応させる。
図2に、上記実施例の反応機構の概念図を示す。
金属銅微粒子の評価は異なるテクニックにより行った。X線回折パターンは、Cu−Ka線を用い、X線回折装置(XRD;XRD−6000,島津製作所製)により得た。最終生成物の形態は、走査型電子顕微鏡(S−700)で撮影した顕微鏡写真により決定した。疎水特性の結果は、浮遊試験(50mLの蒸留水中に5gの最終生成物を投入)により評価した。上記方法で得られた銅微粒子を蒸留水に混合し、勢いよく攪拌した後、浮遊した生成物と試料の全重量の比を測定した。この比は、アクティブ比率と呼ぶ。アクティブ比率が高いと疎水特性はより良いことを意味する。
次に、合成された銅微粒子の疎水特性に及ぼす銅とオレイン酸の重量比の影響を調べるために、オレイン酸量を変化させ、他の実験条件は固定して銅微粒子を合成した。
Claims (7)
- 銅イオンを含む不飽和脂肪酸溶液とアルドース(還元性単糖類)溶液を混合してエマルジョンを形成する1次還元工程と、該エマルジョンにアスコルビン酸水溶液を加える2次還元工程と、銅微粒子分離工程とを有する銅微粒子製造方法。
- 前記不飽和脂肪酸がオレイン酸であることを特徴とする請求項1に記載の銅微粒子製造方法。
- 前記アルドース(還元性単糖類)がグルコースであることを特徴とする請求項1又は2に記載の銅微粒子製造方法。
- 銅イオンとオレイン酸の重量比が4.3wt%以下であることを特徴とする請求項2又
は3に記載の銅微粒子製造方法。 - 回路基板内の配線溝、ビアホール、コンタクトホール及び貫通孔から選ばれる凹部又は孔に、銅イオンを含む不飽和脂肪酸溶液とグルコース溶液を混合してエマルジョンを形成する1次還元工程と、該エマルジョンにアスコルビン酸水溶液を加える2次還元工程と、銅微粒子分離工程により製造された銅微粒子を充填することを特徴とする配線回路板の製造方法。
- 前記不飽和脂肪酸がオレイン酸であることを特徴とする請求項5に記載の配線回路板の製造方法。
- 回路基板内の配線溝、ビアホール、コンタクトホール及び貫通孔から選ばれる少なくとも一つの凹部又は孔への、銅微粒子の充填方法が、スクリーン印刷法、ディスペンス法、インクジェット法又はスピンコート法である請求項5又は6に記載の配線回路板の製造方法。
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PCT/JP2007/069785 WO2008041780A1 (fr) | 2006-10-03 | 2007-10-03 | Microparticule de cuivre, procédé pour la produire, matériau isolant, structure de câblage, procédé de production d'une carte de connexion et dispositif électronique/électrique |
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CN102470490B (zh) * | 2009-07-14 | 2015-08-05 | 同和电子科技有限公司 | 使用金属纳米粒子的接合材料及接合方法 |
EP2479227B1 (en) | 2009-09-16 | 2015-01-07 | Hitachi Chemical Company, Ltd. | Process for making printing ink |
JP5727766B2 (ja) * | 2009-12-10 | 2015-06-03 | 理想科学工業株式会社 | 導電性エマルジョンインク及びそれを用いた導電性薄膜の形成方法 |
JP2014224276A (ja) * | 2011-09-08 | 2014-12-04 | 学校法人 関西大学 | 分散安定性の高い銅ナノ粒子の製造方法 |
JP5088761B1 (ja) | 2011-11-14 | 2012-12-05 | 石原薬品株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
JP5088760B1 (ja) * | 2011-11-14 | 2012-12-05 | 石原薬品株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
JP5705150B2 (ja) * | 2012-02-16 | 2015-04-22 | 株式会社ノリタケカンパニーリミテド | 金属微粒子分散液およびその製造方法 |
CN103464774B (zh) * | 2012-06-07 | 2016-02-24 | 荆门市格林美新材料有限公司 | 低团聚抗氧化纳米铜粉的制备方法 |
KR101408137B1 (ko) * | 2012-11-02 | 2014-06-17 | 한국과학기술연구원 | 내산화성 구리 나노 입자의 제조방법 및 내산화성 구리 나노 입자 |
JP5926322B2 (ja) * | 2014-05-30 | 2016-05-25 | 協立化学産業株式会社 | 被覆銅粒子及びその製造方法 |
CN104014816B (zh) * | 2014-06-21 | 2015-12-30 | 吉林大学 | 一种具有抗氧化性铜纳米颗粒的制备方法 |
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