WO2008041780A1 - Microparticule de cuivre, procédé pour la produire, matériau isolant, structure de câblage, procédé de production d'une carte de connexion et dispositif électronique/électrique - Google Patents

Microparticule de cuivre, procédé pour la produire, matériau isolant, structure de câblage, procédé de production d'une carte de connexion et dispositif électronique/électrique Download PDF

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Publication number
WO2008041780A1
WO2008041780A1 PCT/JP2007/069785 JP2007069785W WO2008041780A1 WO 2008041780 A1 WO2008041780 A1 WO 2008041780A1 JP 2007069785 W JP2007069785 W JP 2007069785W WO 2008041780 A1 WO2008041780 A1 WO 2008041780A1
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WO
WIPO (PCT)
Prior art keywords
copper
copper fine
fine particles
unsaturated fatty
fatty acid
Prior art date
Application number
PCT/JP2007/069785
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English (en)
Japanese (ja)
Inventor
Takeshi Bessho
Hiroshi Yanagimoto
Masazumi Okido
Ryoichi Ichino
Original Assignee
Toyota Jidosha Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Jidosha Kabushiki Kaisha filed Critical Toyota Jidosha Kabushiki Kaisha
Publication of WO2008041780A1 publication Critical patent/WO2008041780A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques

Definitions

  • Copper fine particles, copper fine particle manufacturing method, insulating material, wiring structure, printed circuit board manufacturing method, and electronic / electric equipment technical field Copper fine particles, copper fine particle manufacturing method, insulating material, wiring structure, printed circuit board manufacturing method, and electronic / electric equipment technical field
  • the present invention relates to a method for producing high-dispersibility nano-order copper fine particles and copper fine particles that stably synthesize copper fine particles that are easily oxidized in a solvent, and to synthesize the copper fine particles synthesized by the method.
  • the present invention relates to a wiring structure having a child as a conductor.
  • Metal nanoparticles exhibit various unique properties due to their extremely small particle size, so conductive materials, coloring materials, capacitors, biosensors, 'chemical sensors, fluorescent materials, polarizing materials, magnetic memory materials, etc. It is used in various fields.
  • Metal nanoparticle synthesis methods are largely divided into break-down and build-up methods. Metals are mainly manufactured by the build-up method because they are highly malleable and ductile. In addition, the build-up method is classified into a dry method and a wet method, and many manufacturing methods have been developed.
  • metal nanoparticles by dry method a method of producing metal nanoparticles by gas evaporation method is known.
  • a method for producing metal nanoparticles by depositing metal on a polymer matrix film by vacuum deposition is known.
  • the metal nanoparticles obtained by these methods have a very high concentration and have the advantage of containing almost no impurities.
  • the particle size distribution is wide, the physical properties depend on the particle size of the metal nanoparticles ( It was unsuitable for applications using the size effect.
  • these methods are disadvantageous in production because they require special equipment for producing metal vapor.
  • the wet method of obtaining metal nanoparticles by reducing metal ions in solution does not require special equipment and has the advantage of being easy to scale up.
  • Japanese Patent Application Laid-Open No. 59-1717 3206 discloses a polyol method as a method for synthesizing metal fine particles in a highly productive dense system.
  • the polyol method is a method in which a copper oxide or salt such as copper oxide is heated and reduced in a polyol, and the polyol plays three roles: a solvent, a reducing agent, and a protective agent. As a result, it is possible to obtain submicron or micrometer metal particles even in a dense system.
  • the polyol method which is a liquid phase method suitable for mass production, is applied, and the particle size is as fine as 100 nm or less and its uniformity.
  • copper oxides, hydroxides or salts are heated and reduced in ethylene glycol, diethylene glycol or triethylene glycol solutions to obtain copper fine particles.
  • precious metal ions such as Pd and Ag for nucleation
  • polyvinylpyrrolidone as a dispersant and an amine organic compound as a reduction reaction control agent. It is disclosed that a copper fine particle dispersion is obtained by adding a copper-containing inorganic compound to obtain copper fine particles containing a trace amount of a noble metal, and substituting and concentrating the solution with a polar solvent.
  • electronic devices such as personal computers, mobile phones, digital still cameras, and liquid crystal televisions are used in various fields.
  • These electronic devices include, for example, a circuit board such as a TFT array substrate having a number of TFTs (thin film transistors) and wirings.
  • Such a circuit board is generally processed when an unnecessary portion of a thin film formed by vapor deposition such as CVD (chemical vapor deposition) or sputtering is removed (etched) by photolithography or the like. Is formed by repeating a plurality of times.
  • CVD chemical vapor deposition
  • sputtering etching
  • the wiring on the circuit board is formed by a so-called ink jet method (liquid droplet discharge method) in which a liquid material containing conductive fine particles is discharged to a desired region to form a desired pattern including an object to be discharged.
  • a forming technique has been proposed.
  • a liquid material containing fine metal particles containing any one of gold, silver, copper, palladium, and nickel a particle size of 0. 0
  • a wiring is formed by an ink jet method using a paste in which silver fine particles of about 1 ⁇ m are dispersed in an organic solvent. Disclosure of the invention
  • the present invention relates to a method for producing highly dispersed nano-order copper fine particles and a copper fine particle that is synthesized by stably holding copper fine particles that are easily oxidized in a solvent, and heat conduction of the copper fine particles synthesized by the method. It is an object to provide an insulating material having a body, a wiring structure having a copper fine particle synthesized by the method as a conductor, and the like.
  • the present inventors have found that the above problem can be solved by a wet method using a plurality of specific weak reducing agents, and have reached the present invention.
  • the present invention is an invention of copper fine particles (nanoparticles), and the average particle size is 1
  • the copper fine particles of the present invention are highly dispersible without being agglomerated by being modified with a carboxyl end group of an unsaturated fatty acid, regardless of nanoparticles having an average particle size of 100 nm or less.
  • the unsaturated fatty acid one or two or more C having 8 to 20 carbon atoms is used.
  • the properties of the copper fine particles of the present invention can be adjusted from hydrophilic to hydrophobic depending on the proportion of unsaturated fatty acids modified on the surface.
  • the surface of the copper fine particle is modified with a carboxyl end group of an unsaturated fatty acid, it shows hydrophobicity.
  • the present invention is an invention of the above-described method for producing copper fine particles, comprising a primary reduction step in which an unsaturated fatty acid solution containing copper ions and an aldose (reducing monosaccharide) solution are mixed to form an emulsion.
  • oleic acid is preferably exemplified as the unsaturated fatty acid
  • glucose is preferably exemplified as the aldose (reducing monosaccharide) from the viewpoint of weak reducibility.
  • Copper is more easily oxidized than noble metals, and it has been difficult to synthesize by holding nanoparticles in a solvent in a metal state.
  • copper nanoparticles were synthesized by a process using an oleic acid solution A containing copper ions, a weak reducing agent, an aqueous glucose solution B, and an ascorbic acid aqueous solution C.
  • a nano-shaped solid is produced by primary reduction to copper monoxide with glucose, and then secondarily reduced with ascorbic acid to form copper nanoparticles.
  • the chemicals used prevent copper from being reoxidized in addition to reducing copper ions.
  • a and B are mixed and stirred, an emulsion is formed, and primary reduction occurs on the surface of the emulsion.
  • the present invention relates to the application of the above copper fine particles, wherein the polymer matrix has an average particle size of 100 nm or less, and a part or all of the surface is a carboxyl terminal of unsaturated fatty acid.
  • the polymer matrix has an average particle size of 100 nm or less, and a part or all of the surface is a carboxyl terminal of unsaturated fatty acid.
  • It is an insulating material characterized in that copper fine particles modified with a group are dispersed.
  • oleic acid is preferable as the unsaturated fatty acid. This is as described above.
  • the contained copper fine particles have excellent thermal conductivity and become an insulating material by a polymer matrix. As a result, the insulating material is excellent in heat dissipation and thermal conductivity.
  • the present invention relates to another application of the above-mentioned copper fine particles, and the average particle size is 10 0 in a recess or a hole selected from a wiring groove, a via hole, a contact hole and a through hole in a circuit board.
  • the wiring structure is characterized in that a part or all of the surface is filled with fine copper particles modified with unsaturated fatty acid force lpoxyl end groups.
  • oleic acid is preferable as the unsaturated fatty acid.
  • the present invention is a method for manufacturing a printed circuit board having the above-described wiring structure, and includes copper ions in a recess or a hole selected from a wiring groove, a via hole, a contact hole, and a through hole in a circuit board.
  • oleic acid is preferable as the unsaturated fatty acid.
  • a method for filling copper fine particles into at least one recess or hole selected from wiring grooves, via holes, contact holes and through holes in a circuit board a screen printing method, a dispense method, an ink jet method, or a spin coating method can be used. Preferably exemplified.
  • the present invention is an electronic device having an insulating material containing the above copper fine particles.
  • the present invention is an electronic device having a wiring structure having an insulating material containing the above copper fine particles.
  • the copper fine particles of the present invention exhibit high dispersibility regardless of nano-order.
  • the method for producing copper fine particles of the present invention is excellent in productivity and operability from the laboratory scale to the factory scale, and can synthesize copper fine particles that are easily oxidized in a stable manner.
  • the insulating material having the copper fine particles of the present invention as a heat conductor is expensive.
  • the wiring structure which is a useful insulating material having thermal conductivity and has the copper fine particles of the present invention as a conductor realizes a fine pitch wiring circuit.
  • Figure 1 shows the experimental procedure used in this example.
  • FIG. 2 shows a conceptual diagram of the reaction mechanism of this example.
  • Figure 3 shows an XRD pattern (Figure 3a), particle size distribution (Figure 3b), SEM of a representative sample obtained by reducing copper sulfate in a solution extracted using the process of the present invention. A photograph is shown (Fig. 3c, d).
  • Figure 4 shows the change in the hydrophobic properties of copper particles when synthesized with varying weight ratios of copper and oleic acid.
  • the unsaturated fatty acid used for producing the copper fine particles of the present invention those having 1 or 2 or more C double bonds having 8 to 20 carbon atoms can be used.
  • mono-unsaturated fatty acids having one unsaturated bond myristoleic acid (9_monounsaturated fatty acid having 14 carbon atoms), palmitoleic acid (cis 9 mono-carbon having 16 carbon atoms) Unsaturated fatty acid), oleic acid (cis mono-unsaturated fatty acid with 1-7 carbon atoms), elaidic acid (1-7 carbon atoms.
  • Trans 9-monounsaturated fatty acid, trans isomer of oleic acid), Paxenoic acid (1 1-monounsaturated fatty acid with 1 to 7 carbon atoms), gadoleic acid (cis-9 mono-unsaturated fatty acid), diunsaturated fatty acid with two unsaturated bonds, linoleic acid (1 carbon number) 7 -cis-9-cis- 1 2-diunsaturated fatty acid), a tri-unsaturated fatty acid with three unsaturated bonds, ⁇ -linolenic acid (9, 1 2, 1 5-carbon with 1 7 carbons) Unsaturated fatty acids), eleostearic acid (9,11,13-triunsaturated fatty acids having 1 to 7 carbon atoms), etc. That. Of these, oleic acid is preferably exemplified.
  • the aldose (reducing monosaccharide) used in producing the copper fine particles of the present invention is a monosaccharide having one aldehyde group at the end of the chain, and there exist D-form and L-form.
  • aldtriose darrisel aldehyde, aldetrose, erythro Sucrose, throse, anoled pentose, ribose, lyxose, xylose, arabinose, anoledo hexose, sucrose, talose, growth, gnolecose, ano-reose, mannose, galactose, idose, funo lectose.
  • glucose is preferably exemplified.
  • a part of glucose and the like has a chain structure in an aqueous solution, and an aldehyde group is present at the end of this structure, so that an aqueous solution of glucose and the like shows reducibility.
  • Ascorbic acid used in producing the copper fine particles of the present invention is converted into dehydroascorbic acid by releasing two hydrogen atoms.
  • Cu 2 + ions in an aqueous solution were first extracted into oleic acid.
  • the extracted Cu 2+ ions were reduced to copper oxide (I) and copper metal by glucose and ascorpic acid, respectively.
  • Oleic acid acts as both an extraction solvent and a surfactant that can be adsorbed on the surface of copper particles.
  • Stable metallic copper fine particles can be obtained even in the presence of oxygen.
  • the method of the present invention makes it possible to obtain highly stable and hydrophobic nano-copper particles.
  • Figure 1 shows the experimental procedure used in this example. In a typical experiment, the two solutions were first mixed. One 0. In 2 MC u S 0 4 aqueous solution, and the other is a 0. 5 M O Rain monobasic ethanol kerosene acetone.
  • FIG. 2 shows a conceptual diagram of the reaction mechanism of the above example.
  • Metal copper fine particles were evaluated by different techniques.
  • the X-ray diffraction pattern was obtained with an X-ray diffractometer (XRD; XRD-6000, manufactured by Shimadzu Corporation) using Cu—Ka lines.
  • the form of the final product was determined by a photomicrograph taken with a scanning electron microscope (S-700).
  • the results of hydrophobic properties were evaluated by a flotation test (injecting 5 g of final product in 50 mL of distilled water).
  • the copper fine particles obtained by the above method were mixed with distilled water and stirred vigorously, and then the ratio of the suspended product to the total weight of the sample was measured. This ratio is called the active ratio. Higher active ratio means better hydrophobic properties.
  • Figure 3 shows an XRD pattern (Figure 3a), particle size distribution (Figure 3b), S of a representative sample obtained by reducing copper sulfate in a solution extracted using the process of the present invention. An EM photograph is shown (Fig. 3c, d).
  • Figure 4 shows the change in the hydrophobic properties of copper particles when the weight ratio of copper and oleic acid is varied.
  • Figure 4 shows that the synthesized copper fine particles are hydrophobic when the weight ratio of copper and oleic acid is changed from 3.25 wt% to 4.3 wt%. When this ratio changes from 3 2 to 65 wt%, the synthesized particles are hydrophilic.
  • Hydrophobic properties gradually decreased from 98.5 force to 0.1% when the weight ratio of copper to oleic acid changed from 3.25 to 65 wt%. 3. It can be concluded that with the reduction of the weight ratio to less than 25 wt%, the particle ratio of hydrophobic properties reaches nearly 100%.
  • the optimal weight ratio of copper and oleic acid is about 3.25 wt%. This is because when the weight ratio of copper and oleic acid is higher than 4.3 wt%, the hydrophobic functional group of oleic acid that reacts with the copper fine particles is not sufficient, and most of the copper fine particles cannot be covered. It is.
  • Oleic acid plays an important role throughout this process. It is first used as a phase transfer agent, and Cu 2+ ions in aqueous solution are first extracted into ethanolic oleate kerosene / acetone. The extracted metal ions are reduced to metal atoms with dalcose and ascorbic acid, respectively. Since metal atoms have high surface activity, the oleic acid extractant also acts as a surface active agent to modify the newly formed particle surface with the carboxyl end groups of oleic acid, and the hydrophobic force of oleic acid is It is arranged outside from the surface of the synthesized particles.
  • Oleic acid which protects copper particulates from oxidation, has another role in this process. It occurs between both the growth stage and the cleaning process. In the growth stage case, the steric effect resulting from the long alkyl chain of oleic acid on the surface of the copper particles may contribute to anti-oxygen. This is because the steric effect is largely determined by the oleic acid fragments covered on the surface of the copper particles. Therefore, it is necessary that there is sufficient oleic acid to adsorb on the copper particles. In the case of the cleaning process, the chemical bond between oleic acid and copper particulates may play an important role in preventing copper particulate oxidation.
  • the copper fine particles of the present invention exhibit high dispersibility regardless of nano-order.
  • the method for producing copper fine particles of the present invention is excellent in productivity and operability from the laboratory scale to the factory scale, and can synthesize copper fine particles that are easily oxidized in a stable manner. Thereby, the copper fine particles of the present invention can be effectively applied to various uses.

Abstract

L'invention concerne un procédé de production de microparticules de cuivre comprenant : une première étape de réduction destinée à mélanger une solution d'acide gras insaturé contenant un ion cuivre avec une solution d'aldose (un monosaccharide réducteur), afin de former une émulsion ; une seconde étape de réduction destinée à ajouter une solution aqueuse d'acide ascorbique à l'émulsion ; et une étape de séparation des microparticules de cuivre. Le procédé permet de produire des microparticules de cuivre ayant un diamètre moyen de particule inférieur ou égal à 100 nm et dont la surface est partiellement ou entièrement modifiée par un groupe terminal carboxyle dérivé dudit acide gras insaturé. Les microparticules de cuivre produites par le procédé de l'invention font preuve d'une dispersibilité élevée malgré leur taille nanométrique.
PCT/JP2007/069785 2006-10-03 2007-10-03 Microparticule de cuivre, procédé pour la produire, matériau isolant, structure de câblage, procédé de production d'une carte de connexion et dispositif électronique/électrique WO2008041780A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006272120A JP4961587B2 (ja) 2006-10-03 2006-10-03 銅微粒子、銅微粒子製造方法、絶縁材料、配線構造、配線回路板の製造方法、及び電子・電気機器
JP2006-272120 2006-10-03

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Cited By (3)

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CN103464774A (zh) * 2012-06-07 2013-12-25 荆门市格林美新材料有限公司 低团聚抗氧化纳米铜粉的制备方法
CN104014816A (zh) * 2014-06-21 2014-09-03 吉林大学 一种具有抗氧化性铜纳米颗粒的制备方法
WO2020204118A1 (fr) * 2019-04-03 2020-10-08 東洋製罐グループホールディングス株式会社 Poudre de particules fines de cuivre métallique et son procédé de fabrication

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KR101623449B1 (ko) * 2009-07-14 2016-05-23 도와 일렉트로닉스 가부시키가이샤 금속 나노 입자를 이용한 접합재 및 접합 방법
MY159795A (en) 2009-09-16 2017-01-31 Hitachi Chemical Co Ltd Process for making printing ink
JP5727766B2 (ja) * 2009-12-10 2015-06-03 理想科学工業株式会社 導電性エマルジョンインク及びそれを用いた導電性薄膜の形成方法
JP2014224276A (ja) * 2011-09-08 2014-12-04 学校法人 関西大学 分散安定性の高い銅ナノ粒子の製造方法
JP5088760B1 (ja) * 2011-11-14 2012-12-05 石原薬品株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
JP5088761B1 (ja) 2011-11-14 2012-12-05 石原薬品株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
JP5705150B2 (ja) * 2012-02-16 2015-04-22 株式会社ノリタケカンパニーリミテド 金属微粒子分散液およびその製造方法
WO2014069698A1 (fr) * 2012-11-02 2014-05-08 한국과학기술연구원 Nanoparticules de cuivre résistant à l'oxydation et leur procédé de fabrication
JP5926322B2 (ja) * 2014-05-30 2016-05-25 協立化学産業株式会社 被覆銅粒子及びその製造方法

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JP2004225122A (ja) * 2003-01-23 2004-08-12 Mitsui Mining & Smelting Co Ltd 銅ペースト用の銅粉及びその銅粉の製造方法
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Publication number Priority date Publication date Assignee Title
CN103464774A (zh) * 2012-06-07 2013-12-25 荆门市格林美新材料有限公司 低团聚抗氧化纳米铜粉的制备方法
CN104014816A (zh) * 2014-06-21 2014-09-03 吉林大学 一种具有抗氧化性铜纳米颗粒的制备方法
CN104014816B (zh) * 2014-06-21 2015-12-30 吉林大学 一种具有抗氧化性铜纳米颗粒的制备方法
WO2020204118A1 (fr) * 2019-04-03 2020-10-08 東洋製罐グループホールディングス株式会社 Poudre de particules fines de cuivre métallique et son procédé de fabrication

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