KR101558570B1 - 연마 장치 및 연마 방법 - Google Patents

연마 장치 및 연마 방법 Download PDF

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Publication number
KR101558570B1
KR101558570B1 KR1020080120933A KR20080120933A KR101558570B1 KR 101558570 B1 KR101558570 B1 KR 101558570B1 KR 1020080120933 A KR1020080120933 A KR 1020080120933A KR 20080120933 A KR20080120933 A KR 20080120933A KR 101558570 B1 KR101558570 B1 KR 101558570B1
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South Korea
Prior art keywords
polishing
substrate
polishing head
tape
wafer
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Korean (ko)
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KR20090057920A (ko
Inventor
다마미 다까하시
마사야 세끼
히로아끼 구사
겐지 야마구찌
마사유끼 나까니시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/008—Machines comprising two or more tools or having several working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/20—Accessories for controlling or adjusting the tracking or the tension of the grinding belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777—Edge feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
KR1020080120933A 2007-12-03 2008-12-02 연마 장치 및 연마 방법 Active KR101558570B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007312724 2007-12-03
JPJP-P-2007-312724 2007-12-03
JP2008292193A JP5274993B2 (ja) 2007-12-03 2008-11-14 研磨装置
JPJP-P-2008-292193 2008-11-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020150097064A Division KR101624465B1 (ko) 2007-12-03 2015-07-08 연마 장치 및 연마 방법

Publications (2)

Publication Number Publication Date
KR20090057920A KR20090057920A (ko) 2009-06-08
KR101558570B1 true KR101558570B1 (ko) 2015-10-07

Family

ID=40342578

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Application Number Title Priority Date Filing Date
KR1020080120933A Active KR101558570B1 (ko) 2007-12-03 2008-12-02 연마 장치 및 연마 방법
KR1020150097064A Active KR101624465B1 (ko) 2007-12-03 2015-07-08 연마 장치 및 연마 방법
KR1020160032542A Ceased KR20160036028A (ko) 2007-12-03 2016-03-18 연마 장치 및 연마 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020150097064A Active KR101624465B1 (ko) 2007-12-03 2015-07-08 연마 장치 및 연마 방법
KR1020160032542A Ceased KR20160036028A (ko) 2007-12-03 2016-03-18 연마 장치 및 연마 방법

Country Status (6)

Country Link
US (4) US8187055B2 (enExample)
EP (3) EP2711128B1 (enExample)
JP (2) JP5274993B2 (enExample)
KR (3) KR101558570B1 (enExample)
CN (4) CN101450457B (enExample)
TW (5) TWI574790B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11456191B2 (en) 2019-07-18 2022-09-27 Semes Co., Ltd. Substrate treating apparatus and rotating assembly

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Publication number Priority date Publication date Assignee Title
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JP5031087B2 (ja) * 2010-12-29 2012-09-19 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法
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US9457447B2 (en) 2011-03-28 2016-10-04 Ebara Corporation Polishing apparatus and polishing method
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US9718164B2 (en) 2012-12-06 2017-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing system and polishing method
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US20140242883A1 (en) * 2013-02-27 2014-08-28 Applied Materials, Inc. Determination of wafer angular position for in-sequence metrology
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075933A (ja) 2000-08-23 2002-03-15 Toyobo Co Ltd 研磨パッド
JP2006303112A (ja) * 2005-04-19 2006-11-02 Ebara Corp 半導体ウエハ周縁研磨装置及び方法
US20070131654A1 (en) * 2005-12-09 2007-06-14 Applied Materials, Inc. Methods and apparatus for processing a substrate
JP2007524231A (ja) * 2004-02-25 2007-08-23 株式会社荏原製作所 研磨装置及び基板処理装置

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01316160A (ja) * 1988-06-13 1989-12-21 Hitachi Electron Eng Co Ltd ディスクの研摩加工方式
KR920008432B1 (ko) * 1988-11-05 1992-09-28 가부시끼가이샤 히다찌세이사꾸쇼 자기헤드 래핑방법과 이것에 사용하는 자기헤드 래핑장치 및 이것을 사용해서 얻어진 자기헤드
JP2832142B2 (ja) * 1993-10-29 1998-12-02 信越半導体株式会社 ウェーハのノッチ部研磨装置
JP2837342B2 (ja) * 1993-12-13 1998-12-16 日本ミクロコーティング株式会社 研磨装置
US5798164A (en) * 1995-06-23 1998-08-25 Stormedia, Inc. Zone textured magnetic recording media
US5713784A (en) 1996-05-17 1998-02-03 Mark A. Miller Apparatus for grinding edges of a glass sheet
JP4049900B2 (ja) * 1998-08-20 2008-02-20 株式会社スーパーシリコン研究所 ワイヤソー切断装置
JP2000158309A (ja) * 1998-11-27 2000-06-13 Speedfam-Ipec Co Ltd 端面研磨装置における周面研磨部の搬送部材配列
US6290573B1 (en) * 1999-08-23 2001-09-18 Komag, Incorporated Tape burnish with monitoring device
JP2001205549A (ja) * 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
US6306016B1 (en) 2000-08-03 2001-10-23 Tsk America, Inc. Wafer notch polishing machine and method of polishing an orientation notch in a wafer
TW483801B (en) * 2001-08-24 2002-04-21 Taiwan Semiconductor Mfg Chemical mechanical polishing device
JP3949941B2 (ja) * 2001-11-26 2007-07-25 株式会社東芝 半導体装置の製造方法および研磨装置
US7364495B2 (en) * 2002-03-28 2008-04-29 Etsu Handotai Co., Ltd. Wafer double-side polishing apparatus and double-side polishing method
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP4338355B2 (ja) * 2002-05-10 2009-10-07 東京エレクトロン株式会社 プラズマ処理装置
JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
US6641464B1 (en) * 2003-02-21 2003-11-04 Accretech Usa, Inc. Method and apparatus for polishing the edge of a bonded wafer
CN101383271A (zh) * 2003-08-07 2009-03-11 株式会社荏原制作所 基片处理装置、基片处理方法和基片固定装置
JP2005305586A (ja) * 2004-04-20 2005-11-04 Nihon Micro Coating Co Ltd 研磨装置
JP4488799B2 (ja) * 2004-06-03 2010-06-23 株式会社ディスコ ウェーハの清浄化装置及びウェーハの清浄化方法
US7744445B2 (en) 2004-10-15 2010-06-29 Kabushiki Kaisha Toshiba Polishing apparatus and polishing method
JP4077439B2 (ja) * 2004-10-15 2008-04-16 株式会社東芝 基板処理方法及び基板処理装置
JP4756884B2 (ja) * 2005-03-14 2011-08-24 信越半導体株式会社 半導体ウエーハ用の研磨ヘッド及び研磨装置並びに研磨方法
CN101137464A (zh) * 2005-04-12 2008-03-05 日本精密电子株式会社 Cmp装置用挡圈及其制造方法、以及cmp装置
WO2006112532A1 (en) 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
US9287158B2 (en) * 2005-04-19 2016-03-15 Ebara Corporation Substrate processing apparatus
CN2853279Y (zh) * 2005-09-22 2007-01-03 徐培镜 多磨头自动平面砂带机
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
KR101236855B1 (ko) * 2005-12-09 2013-02-26 어플라이드 머티어리얼스, 인코포레이티드 기판 처리 방법 및 장치
JP4639405B2 (ja) * 2005-12-28 2011-02-23 株式会社東京精密 ウェーハ面取り装置及びウェーハ面取り方法
JP4937807B2 (ja) * 2006-03-31 2012-05-23 株式会社荏原製作所 基板保持回転機構、基板処理装置
US7503831B2 (en) * 2006-04-26 2009-03-17 Siemens Medical Solutions Usa, Inc. System and method for cutting soluble scintillator material
JP2008288599A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨パッドを使用して基板のノッチを研磨する方法及び装置
JP2009004579A (ja) * 2007-06-21 2009-01-08 Nihon Micro Coating Co Ltd 半導体ウェーハノッチ端面の研磨装置及びこれに使用する研磨ヘッド
US20100105299A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing an edge and/or notch of a substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075933A (ja) 2000-08-23 2002-03-15 Toyobo Co Ltd 研磨パッド
JP2007524231A (ja) * 2004-02-25 2007-08-23 株式会社荏原製作所 研磨装置及び基板処理装置
JP2006303112A (ja) * 2005-04-19 2006-11-02 Ebara Corp 半導体ウエハ周縁研磨装置及び方法
US20070131654A1 (en) * 2005-12-09 2007-06-14 Applied Materials, Inc. Methods and apparatus for processing a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11456191B2 (en) 2019-07-18 2022-09-27 Semes Co., Ltd. Substrate treating apparatus and rotating assembly

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