KR101514539B1 - 전자부품 내장기판 - Google Patents

전자부품 내장기판 Download PDF

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Publication number
KR101514539B1
KR101514539B1 KR1020130103276A KR20130103276A KR101514539B1 KR 101514539 B1 KR101514539 B1 KR 101514539B1 KR 1020130103276 A KR1020130103276 A KR 1020130103276A KR 20130103276 A KR20130103276 A KR 20130103276A KR 101514539 B1 KR101514539 B1 KR 101514539B1
Authority
KR
South Korea
Prior art keywords
electronic component
wiring
substrate
delete delete
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020130103276A
Other languages
English (en)
Korean (ko)
Other versions
KR20150025449A (ko
Inventor
이두환
배태균
강호식
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020130103276A priority Critical patent/KR101514539B1/ko
Priority to US14/108,517 priority patent/US9516740B2/en
Priority to JP2014043573A priority patent/JP6023107B2/ja
Publication of KR20150025449A publication Critical patent/KR20150025449A/ko
Application granted granted Critical
Publication of KR101514539B1 publication Critical patent/KR101514539B1/ko
Priority to JP2016128797A priority patent/JP6325605B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H10W70/09—
    • H10W70/099—
    • H10W70/60—
    • H10W70/682—
    • H10W72/073—
    • H10W72/07307—
    • H10W72/241—
    • H10W72/874—
    • H10W72/9413—
    • H10W72/942—
    • H10W72/944—
    • H10W90/724—
    • H10W90/734—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
KR1020130103276A 2013-08-29 2013-08-29 전자부품 내장기판 Expired - Fee Related KR101514539B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020130103276A KR101514539B1 (ko) 2013-08-29 2013-08-29 전자부품 내장기판
US14/108,517 US9516740B2 (en) 2013-08-29 2013-12-17 Electronic component embedded substrate and method for manufacturing electronic component embedded substrate
JP2014043573A JP6023107B2 (ja) 2013-08-29 2014-03-06 電子部品内蔵基板及びその製造方法
JP2016128797A JP6325605B2 (ja) 2013-08-29 2016-06-29 電子部品内蔵基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130103276A KR101514539B1 (ko) 2013-08-29 2013-08-29 전자부품 내장기판

Publications (2)

Publication Number Publication Date
KR20150025449A KR20150025449A (ko) 2015-03-10
KR101514539B1 true KR101514539B1 (ko) 2015-04-22

Family

ID=52582969

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130103276A Expired - Fee Related KR101514539B1 (ko) 2013-08-29 2013-08-29 전자부품 내장기판

Country Status (3)

Country Link
US (1) US9516740B2 (OSRAM)
JP (2) JP6023107B2 (OSRAM)
KR (1) KR101514539B1 (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200020563A (ko) * 2018-08-16 2020-02-26 삼성전자주식회사 수동부품 내장기판
US10998247B2 (en) 2018-08-16 2021-05-04 Samsung Electronics Co., Ltd. Board with embedded passive component

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KR20150074785A (ko) * 2013-12-24 2015-07-02 삼성전기주식회사 빌드업 절연필름, 그를 이용한 전자부품 내장형 인쇄회로기판 및 그 제조방법
KR102186149B1 (ko) * 2015-03-11 2020-12-03 삼성전기주식회사 인쇄회로기판 및 그의 제조 방법
KR102426528B1 (ko) * 2015-04-14 2022-07-29 엘지이노텍 주식회사 임베디드 인쇄회로기판
US9984979B2 (en) 2015-05-11 2018-05-29 Samsung Electro-Mechanics Co., Ltd. Fan-out semiconductor package and method of manufacturing the same
KR20160132751A (ko) * 2015-05-11 2016-11-21 삼성전기주식회사 전자부품 패키지 및 그 제조방법
US10199337B2 (en) 2015-05-11 2019-02-05 Samsung Electro-Mechanics Co., Ltd. Electronic component package and method of manufacturing the same
KR102595276B1 (ko) * 2016-01-14 2023-10-31 삼성전자주식회사 반도체 패키지
KR102656394B1 (ko) * 2016-08-18 2024-04-11 삼성전기주식회사 반도체 패키지 및 이를 이용한 전자소자 모듈
JP2018078274A (ja) * 2016-11-10 2018-05-17 サムソン エレクトロ−メカニックス カンパニーリミテッド． イメージセンサー装置及びそれを含むイメージセンサーモジュール
CN110024116A (zh) * 2016-12-27 2019-07-16 英特尔公司 堆叠管芯腔封装
KR102426202B1 (ko) * 2017-01-09 2022-07-29 삼성전기주식회사 인쇄회로기판
JP7383866B2 (ja) * 2017-01-09 2023-11-21 サムソン エレクトロ－メカニックス カンパニーリミテッド． プリント回路基板
JP6862886B2 (ja) * 2017-02-13 2021-04-21 Tdk株式会社 電子部品内蔵基板
EP3373714B1 (en) * 2017-03-08 2023-08-23 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Hybrid component carrier and method for manufacturing the same
CN111149199A (zh) * 2017-10-11 2020-05-12 索尼半导体解决方案公司 半导体装置及其制造方法
TWI736780B (zh) 2017-10-31 2021-08-21 台灣積體電路製造股份有限公司 晶片封裝及其形成方法
KR101939046B1 (ko) * 2017-10-31 2019-01-16 삼성전기 주식회사 팬-아웃 반도체 패키지
US11322449B2 (en) * 2017-10-31 2022-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Package with fan-out structures
EP3483921B1 (en) 2017-11-11 2026-01-07 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure
JP7046639B2 (ja) * 2018-02-21 2022-04-04 新光電気工業株式会社 配線基板及びその製造方法
US10797017B2 (en) * 2018-03-20 2020-10-06 Unimicron Technology Corp. Embedded chip package, manufacturing method thereof, and package-on-package structure
CN109300882A (zh) * 2018-09-20 2019-02-01 蔡亲佳 堆叠嵌入式封装结构及其制作方法
US10790162B2 (en) * 2018-09-27 2020-09-29 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
DE102019117844A1 (de) 2018-09-27 2020-04-02 Taiwan Semiconductor Manufacturing Co., Ltd. Integrierte-schaltung-package und verfahren
KR102540829B1 (ko) * 2018-10-05 2023-06-08 삼성전자주식회사 반도체 패키지, 반도체 패키지 제조방법 및 재배선 구조체 제조방법
KR102595864B1 (ko) * 2018-12-07 2023-10-30 삼성전자주식회사 반도체 패키지
KR102170904B1 (ko) * 2018-12-21 2020-10-29 주식회사 심텍 수동 소자를 구비하는 인쇄회로기판 및 그 제조 방법
KR102730504B1 (ko) 2019-03-05 2024-11-14 에스케이하이닉스 주식회사 테스트방법 및 이를 이용한 반도체칩
CN112770495B (zh) * 2019-10-21 2022-05-27 宏启胜精密电子(秦皇岛)有限公司 全向内埋模组及制作方法、封装结构及制作方法
KR102776264B1 (ko) * 2019-12-19 2025-03-07 삼성전기주식회사 전자부품 내장기판
KR102776276B1 (ko) * 2019-12-19 2025-03-07 삼성전기주식회사 전자부품 내장기판
JP7496251B2 (ja) * 2020-06-19 2024-06-06 イビデン株式会社 部品内蔵配線基板及び部品内蔵配線基板の製造方法
US11348874B2 (en) * 2020-07-08 2022-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packages and forming methods thereof
KR102854180B1 (ko) * 2020-07-27 2025-09-03 삼성전기주식회사 전자부품 내장기판
KR102576178B1 (ko) * 2021-07-14 2023-09-07 주식회사 티에스이 테스트 소켓, 그 테스트 소켓을 포함하는 테스트 장치, 및 그 테스트 소켓 제조방법
US12100645B2 (en) * 2021-09-23 2024-09-24 Qualcomm Incorporated Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods
US12362269B2 (en) 2021-10-18 2025-07-15 Qualcomm Incorporated Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods
CN116033645A (zh) 2021-10-26 2023-04-28 奥特斯奥地利科技与系统技术有限公司 无芯部件承载件及用于制造无芯部件承载件的方法
CN116994964A (zh) * 2022-04-25 2023-11-03 宏启胜精密电子(秦皇岛)有限公司 封装结构及其制备方法

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Publication number Priority date Publication date Assignee Title
KR20200020563A (ko) * 2018-08-16 2020-02-26 삼성전자주식회사 수동부품 내장기판
KR102164793B1 (ko) * 2018-08-16 2020-10-14 삼성전자주식회사 수동부품 내장기판
US10998247B2 (en) 2018-08-16 2021-05-04 Samsung Electronics Co., Ltd. Board with embedded passive component

Also Published As

Publication number Publication date
US20150062848A1 (en) 2015-03-05
JP6023107B2 (ja) 2016-11-09
JP2015050457A (ja) 2015-03-16
JP2016192568A (ja) 2016-11-10
JP6325605B2 (ja) 2018-05-16
KR20150025449A (ko) 2015-03-10
US9516740B2 (en) 2016-12-06

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