JP2016192568A - 電子部品内蔵基板 - Google Patents
電子部品内蔵基板 Download PDFInfo
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- JP2016192568A JP2016192568A JP2016128797A JP2016128797A JP2016192568A JP 2016192568 A JP2016192568 A JP 2016192568A JP 2016128797 A JP2016128797 A JP 2016128797A JP 2016128797 A JP2016128797 A JP 2016128797A JP 2016192568 A JP2016192568 A JP 2016192568A
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- H—ELECTRICITY
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- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
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- H05K1/00—Printed circuits
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- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Abstract
【解決手段】電子部品内蔵基板100は、第1の外部端子11が設けられる第1の面、及び第1の面の反対側の面であって絶縁物質からなる第2の面を備える電子部品10と、第1の面上に設けられ、第1の外部端子11と電気的に接続される第1の配線及び第1の絶縁部を備える第1の配線層L1と、第2の面上に設けられ、第2の配線及び第2の絶縁部を備える第2の配線層L2とを含む。第1の配線層L1の層数及び配線密度のうちの少なくともいずれか一つは第2の配線層L2の層数及び配線密度のうちの少なくともいずれか一つより大きく、第1の絶縁部は第2の絶縁部より熱膨脹係数が低い物質からなる。
【選択図】図1
Description
第1の配線層L1は、電子部品10を基準に第1の外部端子11の各々から遠くなる方向に設けられ、第1の配線及び第1の絶縁部を有する。第1の配線層L1は、第1の外部端子11を基板の内部、または外部の他のデバイスと電気的に接続される。
10 電子部品
11 第1の外部端子
12 第2の外部端子
20、21、22 チップ部品
110 絶縁基板
111 接着部材
112 第1の金属パターン
120 第1の絶縁層
122 キャビティ
125 第5の絶縁層
132 第2の絶縁層
133 第3の絶縁層
134 第4の絶縁層
WP1 第1の配線パターン
WP2 第2の配線パターン
WP3 第3の配線パターン
WP4 第4の配線パターン
CP1 第1の接触パッド
CP2 第2の接触パッド
SR1 第1のソルダレジスト
SR2 第2のソルダレジスト
SB1 第1のソルダボール
SB2 第2のソルダボール
SB3 第3のソルダボール
O1 第1の開口部
O2 第2の開口部
L1 第1の配線層
L2 第2の配線層
VT スルービア
DC ディタッチコア
TSV スルーシリコーンビア
Claims (25)
- 第1の外部端子が複数設けられる第1の面、及び該第1の面の反対側の面であって絶縁物質からなる第2の面を備える電子部品と、
前記第1の面上に設けられ、前記第1の外部端子と電気的に接続される第1の配線及び第1の絶縁部を備える第1の配線層と、
前記第2の面上に設けられ、第2の配線及び第2の絶縁部を備える第2の配線層とを含み、
前記第1の配線層の層数は、前記第2の配線層の層数より大きく、
前記第1の配線層の配線密度は、前記第2の配線層の配線密度より高く、
前記第1の絶縁部は、前記第2の絶縁部より熱膨脹係数が低い物質からなることを特徴とする電子部品内蔵基板。 - 前記電子部品の少なくとも一部が挿入されるキャビティを含み、絶縁材料からなる第1の絶縁層をさらに含むことを特徴とする請求項1に記載の電子部品内蔵基板。
- 前記第1の絶縁層は、コア基板であることを特徴とする請求項2に記載の電子部品内蔵基板。
- 前記第1の絶縁層を貫いて前記第1の配線層及び前記第2の配線層を電気的に接続するスルービアを、さらに含むことを特徴とする請求項3に記載の電子部品内蔵基板。
- 前記第1の配線層の外面には、前記第1の配線と電気的に接続される第1の接触パッドがさらに設けられることを特徴とする請求項1に記載の電子部品内蔵基板。
- 前記第1の配線層の外面には、前記第1の接触パッドを外部に露出させる第1のソルダレジストが、さらに設けられることを特徴とする請求項5に記載の電子部品内蔵基板。
- 前記電子部品の第2の面に接触する接着部材を、さらに含むことを特徴とする請求項1に記載の電子部品内蔵基板。
- 前記接着部材の外面に設けられる複数の第1の金属パターンを、さらに含むことを特徴とする請求項7に記載の電子部品内蔵基板。
- 前記第2の配線層上に設けられ、前記第2の配線層と電気的に接続されるチップ部品を、さらに含むことを特徴とする請求項1に記載の電子部品内蔵基板。
- 前記チップ部品はメモリーチップであり、前記電子部品は集積回路であることを特徴とする請求項9に記載の電子部品内蔵基板。
- 前記第2の配線層の外面には、前記第2の配線と電気的に接続される第2の接触パッドが、さらに設けられることを特徴とする請求項9に記載の電子部品内蔵基板。
- 前記第2の接触パッドと前記チップ部品とを電気的に接続するソルダボールを、さらに含むことを特徴とする請求項11に記載の電子部品内蔵基板。
- 前記ソルダボールは、前記電子部品の垂直上方または垂直下方の領域に設けられることを特徴とする請求項12に記載の電子部品内蔵基板。
- 前記第2の配線層の外面には、前記第2の接触パッドを外部に露出させる第2のソルダレジストが、さらに設けられることを特徴とする請求項11に記載の電子部品内蔵基板。
- 第1の外部端子が複数設けられる第1の面、及び該第1の面の反対側の面であって第2の外部端子が少なくとも一つ設けられる第2の面を備える電子部品と、
前記第1の面上に設けられ、前記第1の外部端子と電気的に接続される第1の配線及び第1の絶縁部を備える第1の配線層と、
前記第2の面上に設けられ、前記第2の外部端子と電気的に接続される第2の配線及び第2の絶縁部を備える第2の配線層とを含み、
前記第2の外部端子の数は、前記第1の外部端子の数より少なく、
前記第1の配線層の層数は、前記第2の配線層の層数より大きく、
前記第1の配線層の配線密度は、前記第2の配線層の配線密度より高く、
前記第1の絶縁部は、前記第2の絶縁部より熱膨脹係数が低い物質からなることを特徴とする電子部品内蔵基板。 - 前記第2の配線層上に設けられ、前記第2の配線層と電気的に接続されるチップ部品を、さらに含むことを特徴とする請求項15に記載の電子部品内蔵基板。
- 前記チップ部品はメモリーチップであり、前記電子部品は集積回路であることを特徴とする請求項16に記載の電子部品内蔵基板。
- 前記第2の配線層の外面には、前記第2の配線と電気的に接続される第2の接触パッドが、さらに設けられることを特徴とする請求項16に記載の電子部品内蔵基板。
- 前記第2の接触パッドと前記チップ部品とを電気的に接続するソルダボールを、さらに含むことを特徴とする請求項18に記載の電子部品内蔵基板。
- 前記ソルダボールは、前記電子部品の垂直上方または垂直下方の領域に設けられることを特徴とする請求項19に記載の電子部品内蔵基板。
- 前記第2の配線層の外面に設けられ、前記第2の接触パッドを外部に露出させる第2のソルダレジストを、さらに含むことを特徴とする請求項18に記載の電子部品内蔵基板。
- 前記第1の外部端子と前記第2の外部端子とは前記電子部品を貫くスルーシリコーンビアによって電気的に接続されることを特徴とする請求項15に記載の電子部品内蔵基板。
- 前記第2の配線層は、前記第2の外部端子に一面が接触されるビアを含むことを特徴とする請求項22に記載の電子部品内蔵基板。
- 前記第2の配線層の外面には前記ビアの他面に接触される第2の接触パッドと、
ソルダボールによって前記第2の接触パッドに電気的に接続されるチップ部品と、をさらに含むことを特徴とする請求項23に記載の電子部品内蔵基板。 - 前記電子部品の第2の面に接触する接着部材と、
前記接着部材の外面に設けられる複数の第1の金属パターンと、
前記第1の金属パターン各々に一面が接触される少なくとも一つのビアと、
前記ビアの他面に接触される第2の接触パッドと、
ソルダボールによって前記第2の接触パッドに電気的に接続されるチップ部品と、をさらに含み、
前記複数の第1の金属パターン及び前記第2の外部端子は、第2のソルダボールによって電気的に接続されることを特徴とする請求項22に記載の電子部品内蔵基板。
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