KR101473107B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101473107B1
KR101473107B1 KR1020130093094A KR20130093094A KR101473107B1 KR 101473107 B1 KR101473107 B1 KR 101473107B1 KR 1020130093094 A KR1020130093094 A KR 1020130093094A KR 20130093094 A KR20130093094 A KR 20130093094A KR 101473107 B1 KR101473107 B1 KR 101473107B1
Authority
KR
South Korea
Prior art keywords
substrate
detection
swinging
swinging member
magnet
Prior art date
Application number
KR1020130093094A
Other languages
English (en)
Korean (ko)
Other versions
KR20140026256A (ko
Inventor
히데키 스에요시
히사아키 미야사코
기요시 오기와라
다카히로 하마다
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20140026256A publication Critical patent/KR20140026256A/ko
Application granted granted Critical
Publication of KR101473107B1 publication Critical patent/KR101473107B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020130093094A 2012-08-22 2013-08-06 기판 처리 장치 KR101473107B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-182964 2012-08-22
JP2012182964A JP6000019B2 (ja) 2012-08-22 2012-08-22 基板処理装置

Publications (2)

Publication Number Publication Date
KR20140026256A KR20140026256A (ko) 2014-03-05
KR101473107B1 true KR101473107B1 (ko) 2014-12-16

Family

ID=50213886

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130093094A KR101473107B1 (ko) 2012-08-22 2013-08-06 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP6000019B2 (zh)
KR (1) KR101473107B1 (zh)
CN (1) CN103633000B (zh)
TW (1) TWI494260B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD800083S1 (en) 2015-02-23 2017-10-17 Samsung Electronics Co., Ltd. Electronic device
CN105107776B (zh) * 2015-08-24 2017-06-27 京东方科技集团股份有限公司 检测装置及工件清洗设备
CN105865495B (zh) * 2016-06-20 2017-12-01 武汉华星光电技术有限公司 位置检知装置
JP7148289B2 (ja) * 2018-06-20 2022-10-05 芝浦メカトロニクス株式会社 基板検出装置及び基板処理装置
CN109142388B (zh) * 2018-08-01 2021-04-13 京东方科技集团股份有限公司 基板检测器、驱动装置以及基板清洁设备
JP6857682B2 (ja) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 基板処理装置
USD959424S1 (en) 2020-02-26 2022-08-02 Samsung Electronics Co., Ltd. Mobile telephone

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101071174B1 (ko) * 2008-11-26 2011-10-10 에프엔에스테크 주식회사 기판 감지장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737285B2 (ja) * 1993-02-22 1995-04-26 吉田車輌機器株式会社 荷検出装置
JPH10265026A (ja) * 1997-03-25 1998-10-06 Hitachi Electron Eng Co Ltd ワーク通過検出装置
JPH1111640A (ja) * 1997-06-30 1999-01-19 Okamura Corp ローラコンベヤにおける搬送物検出装置
JP2001057355A (ja) * 1999-08-19 2001-02-27 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
JP2002110004A (ja) * 2000-09-29 2002-04-12 Nippon Kentetsu Co Ltd 通過検出スイッチ
JP2003128244A (ja) * 2001-10-30 2003-05-08 Sumitomo Precision Prod Co Ltd 基板検出装置及び基板処理設備
TW200420480A (en) * 2003-04-04 2004-10-16 Mosel Vitelic Inc Wafer transmission system with sensor
TWM259245U (en) * 2004-05-28 2005-03-11 Jing Bo Technology Co Ltd Magnetically swinging counting controller and resetting structure
JP2007066985A (ja) * 2005-08-29 2007-03-15 Shibaura Mechatronics Corp 基板の検出装置及び処理装置
KR20070048483A (ko) * 2005-11-04 2007-05-09 세메스 주식회사 기판을 처리하는 장치 및 기판을 처리하는 방법
JP2010133884A (ja) * 2008-12-08 2010-06-17 Sharp Corp 振り子センサ
CN102253505B (zh) * 2010-05-20 2013-04-03 北京京东方光电科技有限公司 基板位置检测方法及装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101071174B1 (ko) * 2008-11-26 2011-10-10 에프엔에스테크 주식회사 기판 감지장치

Also Published As

Publication number Publication date
JP2014041897A (ja) 2014-03-06
CN103633000A (zh) 2014-03-12
TWI494260B (zh) 2015-08-01
CN103633000B (zh) 2016-05-04
KR20140026256A (ko) 2014-03-05
JP6000019B2 (ja) 2016-09-28
TW201414653A (zh) 2014-04-16

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