JP6000019B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
JP6000019B2
JP6000019B2 JP2012182964A JP2012182964A JP6000019B2 JP 6000019 B2 JP6000019 B2 JP 6000019B2 JP 2012182964 A JP2012182964 A JP 2012182964A JP 2012182964 A JP2012182964 A JP 2012182964A JP 6000019 B2 JP6000019 B2 JP 6000019B2
Authority
JP
Japan
Prior art keywords
substrate
detection
swing
swing member
initial position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012182964A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014041897A (ja
JP2014041897A5 (zh
Inventor
末吉　秀樹
秀樹 末吉
久顕 宮迫
久顕 宮迫
潔 荻原
潔 荻原
崇広 濱田
崇広 濱田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2012182964A priority Critical patent/JP6000019B2/ja
Priority to KR1020130093094A priority patent/KR101473107B1/ko
Priority to TW102129802A priority patent/TWI494260B/zh
Priority to CN201310364328.7A priority patent/CN103633000B/zh
Publication of JP2014041897A publication Critical patent/JP2014041897A/ja
Publication of JP2014041897A5 publication Critical patent/JP2014041897A5/ja
Application granted granted Critical
Publication of JP6000019B2 publication Critical patent/JP6000019B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2012182964A 2012-08-22 2012-08-22 基板処理装置 Active JP6000019B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012182964A JP6000019B2 (ja) 2012-08-22 2012-08-22 基板処理装置
KR1020130093094A KR101473107B1 (ko) 2012-08-22 2013-08-06 기판 처리 장치
TW102129802A TWI494260B (zh) 2012-08-22 2013-08-20 Substrate processing device
CN201310364328.7A CN103633000B (zh) 2012-08-22 2013-08-20 基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012182964A JP6000019B2 (ja) 2012-08-22 2012-08-22 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014184103A Division JP6008917B2 (ja) 2014-09-10 2014-09-10 基板検出装置および基板処理装置

Publications (3)

Publication Number Publication Date
JP2014041897A JP2014041897A (ja) 2014-03-06
JP2014041897A5 JP2014041897A5 (zh) 2015-10-01
JP6000019B2 true JP6000019B2 (ja) 2016-09-28

Family

ID=50213886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012182964A Active JP6000019B2 (ja) 2012-08-22 2012-08-22 基板処理装置

Country Status (4)

Country Link
JP (1) JP6000019B2 (zh)
KR (1) KR101473107B1 (zh)
CN (1) CN103633000B (zh)
TW (1) TWI494260B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD800083S1 (en) 2015-02-23 2017-10-17 Samsung Electronics Co., Ltd. Electronic device
CN105107776B (zh) * 2015-08-24 2017-06-27 京东方科技集团股份有限公司 检测装置及工件清洗设备
CN105865495B (zh) * 2016-06-20 2017-12-01 武汉华星光电技术有限公司 位置检知装置
JP7148289B2 (ja) * 2018-06-20 2022-10-05 芝浦メカトロニクス株式会社 基板検出装置及び基板処理装置
CN109142388B (zh) * 2018-08-01 2021-04-13 京东方科技集团股份有限公司 基板检测器、驱动装置以及基板清洁设备
JP6857682B2 (ja) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 基板処理装置
USD959424S1 (en) 2020-02-26 2022-08-02 Samsung Electronics Co., Ltd. Mobile telephone

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737285B2 (ja) * 1993-02-22 1995-04-26 吉田車輌機器株式会社 荷検出装置
JPH10265026A (ja) * 1997-03-25 1998-10-06 Hitachi Electron Eng Co Ltd ワーク通過検出装置
JPH1111640A (ja) * 1997-06-30 1999-01-19 Okamura Corp ローラコンベヤにおける搬送物検出装置
JP2001057355A (ja) * 1999-08-19 2001-02-27 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
JP2002110004A (ja) * 2000-09-29 2002-04-12 Nippon Kentetsu Co Ltd 通過検出スイッチ
JP2003128244A (ja) * 2001-10-30 2003-05-08 Sumitomo Precision Prod Co Ltd 基板検出装置及び基板処理設備
TW200420480A (en) * 2003-04-04 2004-10-16 Mosel Vitelic Inc Wafer transmission system with sensor
TWM259245U (en) * 2004-05-28 2005-03-11 Jing Bo Technology Co Ltd Magnetically swinging counting controller and resetting structure
JP2007066985A (ja) * 2005-08-29 2007-03-15 Shibaura Mechatronics Corp 基板の検出装置及び処理装置
KR20070048483A (ko) * 2005-11-04 2007-05-09 세메스 주식회사 기판을 처리하는 장치 및 기판을 처리하는 방법
KR101071174B1 (ko) * 2008-11-26 2011-10-10 에프엔에스테크 주식회사 기판 감지장치
JP2010133884A (ja) * 2008-12-08 2010-06-17 Sharp Corp 振り子センサ
CN102253505B (zh) * 2010-05-20 2013-04-03 北京京东方光电科技有限公司 基板位置检测方法及装置

Also Published As

Publication number Publication date
KR101473107B1 (ko) 2014-12-16
TWI494260B (zh) 2015-08-01
CN103633000B (zh) 2016-05-04
CN103633000A (zh) 2014-03-12
TW201414653A (zh) 2014-04-16
KR20140026256A (ko) 2014-03-05
JP2014041897A (ja) 2014-03-06

Similar Documents

Publication Publication Date Title
JP6000019B2 (ja) 基板処理装置
JP6008917B2 (ja) 基板検出装置および基板処理装置
US20070234582A1 (en) Sheet thickness detection device, sheet conveying device, image forming apparatus
JP2002329761A (ja) 搬送装置、洗浄装置及び現像装置
JP2012228753A (ja) 回転機構、産業用ロボットおよび回転体の原点位置復帰方法
JP2014041897A5 (zh)
JP2001068537A (ja) 基板載置台
JP2006303149A (ja) ウェーハ洗浄装置及びウェーハ洗浄方法
KR20100044448A (ko) 노광장비의 레티클 이송용 로봇 그리퍼
JP2007281095A (ja) ワーク搬送装置
JPH10146557A (ja) 基板保持機構
JP7148289B2 (ja) 基板検出装置及び基板処理装置
JP2008060278A (ja) 位置決め装置、ステージおよび検査または処理の装置
JP2007066985A (ja) 基板の検出装置及び処理装置
JP2011022395A5 (zh)
KR101071174B1 (ko) 기판 감지장치
TW201306165A (zh) 校準裝置及校準方法
JP2014225711A5 (zh)
JP5480159B2 (ja) 基板処理装置および基板処理方法
JP2010129668A (ja) 被搬送部材の検出装置及び処理装置
TWI681493B (zh) 基板搬送裝置
JP2009170567A (ja) 搬送装置
JP2004191226A (ja) 複数の構造物の間の相対的位置ずれの検出システムおよび複数の構造物の間の被処理物の搬送システム
JP2001217303A (ja) ガラス基板の基板端検出装置
JP2007242949A (ja) 板状部材の位置決め装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140905

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20150601

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150818

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150818

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160606

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160614

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160810

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160830

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160830

R150 Certificate of patent or registration of utility model

Ref document number: 6000019

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150