KR101368057B1 - 스퍼터 타깃 및 회전 축 단조에 의해 이를 성형하는 방법 - Google Patents
스퍼터 타깃 및 회전 축 단조에 의해 이를 성형하는 방법 Download PDFInfo
- Publication number
- KR101368057B1 KR101368057B1 KR1020127023065A KR20127023065A KR101368057B1 KR 101368057 B1 KR101368057 B1 KR 101368057B1 KR 1020127023065 A KR1020127023065 A KR 1020127023065A KR 20127023065 A KR20127023065 A KR 20127023065A KR 101368057 B1 KR101368057 B1 KR 101368057B1
- Authority
- KR
- South Korea
- Prior art keywords
- metal plate
- tissue
- target
- thickness
- forging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C14/00—Alloys based on titanium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C16/00—Alloys based on zirconium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/07—Alloys based on nickel or cobalt based on cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/02—Alloys based on vanadium, niobium, or tantalum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
- C22F1/18—High-melting or refractory metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Forging (AREA)
- Heat Treatment Of Articles (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US56859204P | 2004-05-06 | 2004-05-06 | |
| US60/568,592 | 2004-05-06 | ||
| PCT/US2005/015839 WO2005108639A1 (en) | 2004-05-06 | 2005-05-06 | Sputter targets and methods of forming same by rotary axial forging |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067025570A Division KR101196528B1 (ko) | 2004-05-06 | 2005-05-06 | 스퍼터 타깃 및 회전 축 단조에 의해 이를 성형하는 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120107019A KR20120107019A (ko) | 2012-09-27 |
| KR101368057B1 true KR101368057B1 (ko) | 2014-02-26 |
Family
ID=34971580
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127023065A Expired - Fee Related KR101368057B1 (ko) | 2004-05-06 | 2005-05-06 | 스퍼터 타깃 및 회전 축 단조에 의해 이를 성형하는 방법 |
| KR1020067025570A Expired - Fee Related KR101196528B1 (ko) | 2004-05-06 | 2005-05-06 | 스퍼터 타깃 및 회전 축 단조에 의해 이를 성형하는 방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067025570A Expired - Fee Related KR101196528B1 (ko) | 2004-05-06 | 2005-05-06 | 스퍼터 타깃 및 회전 축 단조에 의해 이를 성형하는 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8252126B2 (enExample) |
| EP (1) | EP1751324B1 (enExample) |
| JP (3) | JP2007536431A (enExample) |
| KR (2) | KR101368057B1 (enExample) |
| CN (2) | CN103255381B (enExample) |
| TW (1) | TWI484054B (enExample) |
| WO (1) | WO2005108639A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180027623A (ko) * | 2015-08-03 | 2018-03-14 | 허니웰 인터내셔널 인코포레이티드 | 개선된 특성을 갖는 무마찰 단조 알루미늄 합금 스퍼터링 타겟 |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4970034B2 (ja) * | 2003-08-11 | 2012-07-04 | ハネウェル・インターナショナル・インコーポレーテッド | ターゲット/バッキングプレート構造物、及びターゲット/バッキングプレート構造物の形成法 |
| EP1876258A4 (en) * | 2005-04-28 | 2008-08-13 | Nippon Mining Co | sputtering Target |
| US7837929B2 (en) | 2005-10-20 | 2010-11-23 | H.C. Starck Inc. | Methods of making molybdenum titanium sputtering plates and targets |
| US8250895B2 (en) * | 2007-08-06 | 2012-08-28 | H.C. Starck Inc. | Methods and apparatus for controlling texture of plates and sheets by tilt rolling |
| KR101201577B1 (ko) | 2007-08-06 | 2012-11-14 | 에이치. 씨. 스타아크 아이앤씨 | 향상된 조직 균일성을 가진 내화 금속판 |
| KR101626286B1 (ko) * | 2008-11-03 | 2016-06-01 | 토소우 에스엠디, 인크 | 스퍼터 타겟 제조 방법 및 이에 의해 제조된 스퍼터 타겟 |
| CN102091733B (zh) * | 2009-12-09 | 2013-02-13 | 宁波江丰电子材料有限公司 | 高纯度铜靶材的制作方法 |
| JP5718896B2 (ja) * | 2010-03-11 | 2015-05-13 | 株式会社東芝 | スパッタリングターゲットとその製造方法、および半導体素子の製造方法 |
| US8449817B2 (en) | 2010-06-30 | 2013-05-28 | H.C. Stark, Inc. | Molybdenum-containing targets comprising three metal elements |
| US8449818B2 (en) | 2010-06-30 | 2013-05-28 | H. C. Starck, Inc. | Molybdenum containing targets |
| US8968537B2 (en) * | 2011-02-09 | 2015-03-03 | Applied Materials, Inc. | PVD sputtering target with a protected backing plate |
| KR20170016024A (ko) | 2011-05-10 | 2017-02-10 | 에이치. 씨. 스타아크 아이앤씨 | 멀티-블록 스퍼터링 타겟 및 이에 관한 제조방법 및 물품 |
| CN103827348B (zh) * | 2011-11-30 | 2015-11-25 | 吉坤日矿日石金属株式会社 | 钽溅射靶及其制造方法 |
| CN102513789B (zh) * | 2011-12-21 | 2014-04-09 | 宁波江丰电子材料有限公司 | 钨靶材的制作方法 |
| US9890452B2 (en) * | 2012-03-21 | 2018-02-13 | Jx Nippon Mining & Metals Corporation | Tantalum sputtering target, method for manufacturing same, and barrier film for semiconductor wiring formed by using target |
| US9334565B2 (en) | 2012-05-09 | 2016-05-10 | H.C. Starck Inc. | Multi-block sputtering target with interface portions and associated methods and articles |
| CN103028898A (zh) | 2012-08-16 | 2013-04-10 | 宁夏东方钽业股份有限公司 | 一种高性能钽靶材的制备方法 |
| CN103692151B (zh) * | 2012-09-28 | 2016-02-24 | 宁波江丰电子材料股份有限公司 | 钛聚焦环的制造方法 |
| CN102989856B (zh) * | 2012-12-03 | 2014-12-10 | 西安超晶新能源材料有限公司 | 一种大型变壁厚纯钼坩埚的成型方法 |
| US9994951B2 (en) * | 2013-03-15 | 2018-06-12 | The United States Of America, As Represented By The Secretary Of The Navy | Photovoltaic sputtering targets fabricated from reclaimed materials |
| SG11201503724RA (en) | 2013-03-22 | 2015-06-29 | Jx Nippon Mining & Metals Corp | Tungsten sintered compact sputtering target and method for producing same |
| AT14157U1 (de) * | 2013-12-20 | 2015-05-15 | Plansee Se | W-Ni-Sputtertarget |
| CN103738099B (zh) * | 2013-12-26 | 2016-04-06 | 乌鲁木齐哈玛铜制工艺品有限公司 | 一种铜质工艺品的制作方法 |
| WO2015146516A1 (ja) * | 2014-03-27 | 2015-10-01 | Jx日鉱日石金属株式会社 | タンタルスパッタリングターゲット及びその製造方法 |
| CN103898459B (zh) * | 2014-04-16 | 2016-05-04 | 昆山海普电子材料有限公司 | 一种高纯钴靶材的制备方法 |
| CA2952404C (en) * | 2014-06-16 | 2019-09-24 | Shinohara Press Service Co., Ltd. | Method of manufacturing pure niobium plate end-group components for superconducting high-frequency accelerator cavity |
| KR20170134365A (ko) | 2015-04-10 | 2017-12-06 | 토소우 에스엠디, 인크 | 탄탈 스퍼터 타겟의 제조 방법 및 그에 의해 제조된 스퍼터 타겟 |
| EP3211118B1 (en) * | 2015-05-22 | 2020-09-09 | JX Nippon Mining & Metals Corporation | Tantalum sputtering target, and production method therefor |
| JP6293928B2 (ja) | 2015-05-22 | 2018-03-14 | Jx金属株式会社 | タンタルスパッタリングターゲット及びその製造方法 |
| KR20190015346A (ko) | 2016-06-02 | 2019-02-13 | 다나카 기킨조쿠 고교 가부시키가이샤 | 금 스퍼터링 타깃 |
| US10900102B2 (en) | 2016-09-30 | 2021-01-26 | Honeywell International Inc. | High strength aluminum alloy backing plate and methods of making |
| CN106893990B (zh) * | 2017-02-17 | 2019-02-01 | 南京东锐铂业有限公司 | 银溅射靶材组件的生产工艺 |
| JP6553813B2 (ja) | 2017-03-30 | 2019-07-31 | Jx金属株式会社 | タンタルスパッタリングターゲット |
| US10760156B2 (en) | 2017-10-13 | 2020-09-01 | Honeywell International Inc. | Copper manganese sputtering target |
| WO2019111945A1 (ja) * | 2017-12-06 | 2019-06-13 | 田中貴金属工業株式会社 | 金スパッタリングターゲットの製造方法及び金膜の製造方法 |
| US11035036B2 (en) | 2018-02-01 | 2021-06-15 | Honeywell International Inc. | Method of forming copper alloy sputtering targets with refined shape and microstructure |
| WO2019186946A1 (ja) * | 2018-03-29 | 2019-10-03 | 本田技研工業株式会社 | 鞍乗型電動車両 |
| JP6745415B2 (ja) * | 2018-05-21 | 2020-08-26 | 株式会社アルバック | スパッタリングターゲット及びその製造方法 |
| CN110814246B (zh) * | 2019-11-22 | 2021-06-25 | 西安庄信新材料科技有限公司 | 一种钛板坯的锻造工艺 |
| CN110886001B (zh) * | 2019-12-06 | 2020-10-27 | 重庆文理学院 | 一种有效提高钛合金耐应力腐蚀性能的方法 |
| CN111471940B (zh) * | 2020-04-29 | 2021-09-10 | 钢铁研究总院 | 一种高强度不锈钢转子及其制备方法 |
| JPWO2023224084A1 (enExample) * | 2022-05-19 | 2023-11-23 | ||
| CN117620599B (zh) * | 2023-10-27 | 2024-05-14 | 光微半导体材料(宁波)有限公司 | 一种铜溅射靶材加工装置及加工方法 |
| TW202540463A (zh) * | 2023-12-05 | 2025-10-16 | 美商塔沙Smd公司 | 具有改善的性能及可預測性之鉭濺射靶及其製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20010071476A (ko) * | 1998-06-17 | 2001-07-28 | 레슬리 웨이스 | 미세균일 구조 및 조직을 갖는 금속재 및 그 제조방법 |
| KR20010080585A (ko) * | 1998-11-25 | 2001-08-22 | 마싸 앤 피네간 | 고순도 탄탈 및 그를 포함하는 스퍼터링 타겟과 같은 생성물 |
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| JP2000276116A (ja) * | 1999-03-26 | 2000-10-06 | Sanyo Electric Co Ltd | 表示装置 |
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| AU2001296213A1 (en) | 2000-05-22 | 2001-12-24 | Cabot Corporation | High purity niobium and products containing the same, and methods of making the same |
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| US6462339B1 (en) * | 2000-09-20 | 2002-10-08 | Cabot Corporation | Method for quantifying the texture homogeneity of a polycrystalline material |
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| US20050155677A1 (en) * | 2004-01-08 | 2005-07-21 | Wickersham Charles E.Jr. | Tantalum and other metals with (110) orientation |
| EP1876258A4 (en) * | 2005-04-28 | 2008-08-13 | Nippon Mining Co | sputtering Target |
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2005
- 2005-05-04 US US11/121,440 patent/US8252126B2/en active Active
- 2005-05-06 WO PCT/US2005/015839 patent/WO2005108639A1/en not_active Ceased
- 2005-05-06 EP EP05755181.4A patent/EP1751324B1/en not_active Expired - Lifetime
- 2005-05-06 CN CN201310169232.5A patent/CN103255381B/zh not_active Expired - Fee Related
- 2005-05-06 TW TW094114620A patent/TWI484054B/zh not_active IP Right Cessation
- 2005-05-06 KR KR1020127023065A patent/KR101368057B1/ko not_active Expired - Fee Related
- 2005-05-06 CN CN2005800229541A patent/CN1981067B/zh not_active Expired - Fee Related
- 2005-05-06 KR KR1020067025570A patent/KR101196528B1/ko not_active Expired - Fee Related
- 2005-05-06 JP JP2007511634A patent/JP2007536431A/ja active Pending
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2012
- 2012-06-15 JP JP2012135436A patent/JP2012180599A/ja active Pending
- 2012-07-18 US US13/551,697 patent/US8500928B2/en not_active Expired - Fee Related
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- 2013-02-14 JP JP2013026829A patent/JP6023605B2/ja not_active Expired - Fee Related
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| KR20010071476A (ko) * | 1998-06-17 | 2001-07-28 | 레슬리 웨이스 | 미세균일 구조 및 조직을 갖는 금속재 및 그 제조방법 |
| KR20010080585A (ko) * | 1998-11-25 | 2001-08-22 | 마싸 앤 피네간 | 고순도 탄탈 및 그를 포함하는 스퍼터링 타겟과 같은 생성물 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180027623A (ko) * | 2015-08-03 | 2018-03-14 | 허니웰 인터내셔널 인코포레이티드 | 개선된 특성을 갖는 무마찰 단조 알루미늄 합금 스퍼터링 타겟 |
| KR102622052B1 (ko) | 2015-08-03 | 2024-01-08 | 허니웰 인터내셔널 인코포레이티드 | 개선된 특성을 갖는 무마찰 단조 알루미늄 합금 스퍼터링 타겟 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103255381B (zh) | 2016-08-10 |
| KR20070011568A (ko) | 2007-01-24 |
| US8252126B2 (en) | 2012-08-28 |
| TW200607873A (en) | 2006-03-01 |
| JP2007536431A (ja) | 2007-12-13 |
| JP2013151751A (ja) | 2013-08-08 |
| US8500928B2 (en) | 2013-08-06 |
| EP1751324A1 (en) | 2007-02-14 |
| KR101196528B1 (ko) | 2012-11-01 |
| WO2005108639A1 (en) | 2005-11-17 |
| JP2012180599A (ja) | 2012-09-20 |
| US20050247386A1 (en) | 2005-11-10 |
| TWI484054B (zh) | 2015-05-11 |
| US20120297855A1 (en) | 2012-11-29 |
| CN1981067B (zh) | 2013-05-08 |
| KR20120107019A (ko) | 2012-09-27 |
| JP6023605B2 (ja) | 2016-11-09 |
| CN103255381A (zh) | 2013-08-21 |
| CN1981067A (zh) | 2007-06-13 |
| EP1751324B1 (en) | 2015-09-23 |
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