KR101345245B1 - 에폭시 수지, 에폭시 수지 조성물, 감광성 수지 조성물 및그의 경화물 - Google Patents

에폭시 수지, 에폭시 수지 조성물, 감광성 수지 조성물 및그의 경화물 Download PDF

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Publication number
KR101345245B1
KR101345245B1 KR1020087011613A KR20087011613A KR101345245B1 KR 101345245 B1 KR101345245 B1 KR 101345245B1 KR 1020087011613 A KR1020087011613 A KR 1020087011613A KR 20087011613 A KR20087011613 A KR 20087011613A KR 101345245 B1 KR101345245 B1 KR 101345245B1
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
area
epoxy
compound
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KR1020087011613A
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English (en)
Korean (ko)
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KR20080063843A (ko
Inventor
마사타카 나카니시
카츠히코 오시미
류타로 타나카
토루 쿠리하시
Original Assignee
니폰 가야꾸 가부시끼가이샤
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Publication of KR20080063843A publication Critical patent/KR20080063843A/ko
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Publication of KR101345245B1 publication Critical patent/KR101345245B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
KR1020087011613A 2005-10-18 2008-05-15 에폭시 수지, 에폭시 수지 조성물, 감광성 수지 조성물 및그의 경화물 KR101345245B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005302619 2005-10-18
JPJP-P-2005-00302619 2005-10-18
PCT/JP2006/320184 WO2007046262A1 (ja) 2005-10-18 2006-10-10 エポキシ樹脂、エポキシ樹脂組成物、感光性樹脂組成物およびその硬化物

Publications (2)

Publication Number Publication Date
KR20080063843A KR20080063843A (ko) 2008-07-07
KR101345245B1 true KR101345245B1 (ko) 2013-12-27

Family

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Family Applications (1)

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KR1020087011613A KR101345245B1 (ko) 2005-10-18 2008-05-15 에폭시 수지, 에폭시 수지 조성물, 감광성 수지 조성물 및그의 경화물

Country Status (7)

Country Link
US (1) US7884172B2 (ja)
EP (1) EP1939233A1 (ja)
JP (3) JPWO2007046262A1 (ja)
KR (1) KR101345245B1 (ja)
CN (1) CN101291971B (ja)
TW (1) TWI400261B (ja)
WO (1) WO2007046262A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102549481B (zh) * 2009-09-25 2015-07-22 旭硝子株式会社 显示装置的制造方法及显示装置
CN102574981A (zh) * 2009-10-07 2012-07-11 陶氏环球技术有限责任公司 减少固体环氧树脂中的杂质
CN101973966B (zh) * 2010-09-03 2012-07-04 北京化工大学 一种1，1，2，2-四（对羟基苯基）乙烷四缩水甘油醚的制备方法
WO2013008680A1 (ja) * 2011-07-13 2013-01-17 株式会社ダイセル 硬化性エポキシ樹脂組成物
CN105073939B (zh) * 2013-04-02 2018-11-09 昭和电工株式会社 导电性粘合剂、各向异性导电膜以及使用它们的电子设备
KR101442412B1 (ko) * 2013-05-03 2014-09-17 주식회사 엘지화학 고무 강화 그라프트 공중합체용 고무질 중합체 및 그 제조방법
KR101987310B1 (ko) * 2013-12-16 2019-06-10 삼성전기주식회사 인쇄회로기판용 절연 수지조성물 및 이를 이용한 제품
CN106046318B (zh) * 2016-07-04 2018-07-10 南京远淑医药科技有限公司 一种降低环氧树脂总氯的方法
JP7094264B2 (ja) 2019-12-25 2022-07-01 株式会社神戸製鋼所 溶鋼の製造方法
WO2024137596A2 (en) * 2022-12-19 2024-06-27 Advanced Polymer Coatings, Inc. Hybrid coating utilizing epoxy resin and monomers capable of undergoing ring opening metathesis polymerization that incorporates tricyclopentadiene

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005076079A1 (ja) * 2004-02-09 2005-08-18 Nippon Kayaku Kabushiki Kaisha 感光性樹脂組成物並びにその硬化物
JP2005220300A (ja) * 2004-02-09 2005-08-18 Nippon Kayaku Co Ltd エポキシ樹脂の製造法

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JPS5738814A (en) 1980-08-20 1982-03-03 Mitsubishi Petrochem Co Ltd Production of polyepoxy compound
JPS58134112A (ja) * 1982-02-04 1983-08-10 Mitsubishi Petrochem Co Ltd ポリグリシジルエ−テルの可鹸化塩素含量の低減方法
US4785062A (en) * 1984-07-31 1988-11-15 W. R. Grace & Co.-Conn. Reaction product of O-epoxyalkylated tetrakis(hydroxyphenyl)ethane resin and phenol with product having no remaining epoxy groups
US4668807A (en) * 1984-12-21 1987-05-26 Ciba-Geigy Corporation Process for reducing the content of hydrolyzable chlorine in glycidyl compounds
JP2897850B2 (ja) * 1991-04-26 1999-05-31 旭有機材工業株式会社 高純度テトラキスフェノールエタンの製造方法
JP3044412B2 (ja) * 1991-07-08 2000-05-22 東都化成株式会社 高純度エポキシ樹脂の製造方法
JP3573530B2 (ja) 1995-06-22 2004-10-06 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物
JPH0912677A (ja) 1995-06-27 1997-01-14 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物
JP3381819B2 (ja) * 1996-09-13 2003-03-04 旭有機材工業株式会社 テトラキスフェノールエタンの製造方法
JP2003021898A (ja) * 2001-07-10 2003-01-24 Nippon Kayaku Co Ltd 感光性樹脂組成物並びにその硬化物
JP4023594B2 (ja) 2002-07-09 2007-12-19 日本化薬株式会社 エポキシ樹脂組成物、及びその硬化物
JP4033455B2 (ja) 2002-11-07 2008-01-16 日本化薬株式会社 感光性樹脂組成物及びその硬化物
JP2004307545A (ja) * 2003-04-02 2004-11-04 Kyocera Chemical Corp エポキシ樹脂組成物および半導体封止装置
JP4383180B2 (ja) 2004-01-15 2009-12-16 日本化薬株式会社 結晶性エポキシ化合物の製造方法
EP1731545A4 (en) * 2004-03-31 2008-11-12 Asahi Kasei Chemicals Corp HARDENER FOR EPOXY RESIN AND COMPOSITION OF THE EPOXY RESIN

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005076079A1 (ja) * 2004-02-09 2005-08-18 Nippon Kayaku Kabushiki Kaisha 感光性樹脂組成物並びにその硬化物
JP2005220300A (ja) * 2004-02-09 2005-08-18 Nippon Kayaku Co Ltd エポキシ樹脂の製造法

Also Published As

Publication number Publication date
JP2013253260A (ja) 2013-12-19
JP6212227B2 (ja) 2017-10-11
JP6117062B2 (ja) 2017-04-19
KR20080063843A (ko) 2008-07-07
CN101291971A (zh) 2008-10-22
JP2017082241A (ja) 2017-05-18
TWI400261B (zh) 2013-07-01
WO2007046262A1 (ja) 2007-04-26
US20090131607A1 (en) 2009-05-21
US7884172B2 (en) 2011-02-08
TW200720312A (en) 2007-06-01
EP1939233A1 (en) 2008-07-02
CN101291971B (zh) 2012-07-18
JPWO2007046262A1 (ja) 2009-04-23

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