KR101277397B1 - 기판처리장치, 스토커장치 및 기판수납용기의 반송방법 - Google Patents

기판처리장치, 스토커장치 및 기판수납용기의 반송방법 Download PDF

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KR101277397B1
KR101277397B1 KR1020110018412A KR20110018412A KR101277397B1 KR 101277397 B1 KR101277397 B1 KR 101277397B1 KR 1020110018412 A KR1020110018412 A KR 1020110018412A KR 20110018412 A KR20110018412 A KR 20110018412A KR 101277397 B1 KR101277397 B1 KR 101277397B1
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storage container
substrate
substrate storage
holding
mounting
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KR20110102177A (ko
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유키히코 이나가키
켄사쿠 오니시
준 야마모토
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가부시키가이샤 소쿠도
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0407—Storage devices mechanical using stacker cranes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020110018412A 2010-03-10 2011-03-02 기판처리장치, 스토커장치 및 기판수납용기의 반송방법 Active KR101277397B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-052900 2010-03-10
JP2010052900A JP5318005B2 (ja) 2010-03-10 2010-03-10 基板処理装置、ストッカー装置および基板収納容器の搬送方法

Publications (2)

Publication Number Publication Date
KR20110102177A KR20110102177A (ko) 2011-09-16
KR101277397B1 true KR101277397B1 (ko) 2013-06-20

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US (2) US8827621B2 (enExample)
JP (1) JP5318005B2 (enExample)
KR (1) KR101277397B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210157054A (ko) 2020-06-19 2021-12-28 세메스 주식회사 스토커

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
JP5713202B2 (ja) * 2012-01-27 2015-05-07 株式会社ダイフク 物品搬送設備
US10319621B2 (en) 2012-12-31 2019-06-11 Asm Ip Holding B.V. Semiconductor processing assembly and facility
WO2015046062A1 (ja) * 2013-09-30 2015-04-02 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および記録媒体
JP2015141915A (ja) * 2014-01-27 2015-08-03 東京エレクトロン株式会社 基板熱処理装置、基板熱処理装置の設置方法
JP6314713B2 (ja) * 2014-07-14 2018-04-25 株式会社ダイフク 階間搬送設備
US10332770B2 (en) 2014-09-24 2019-06-25 Sandisk Technologies Llc Wafer transfer system
EP3476772B1 (en) * 2016-06-27 2022-04-27 Murata Machinery, Ltd. Conveyance system
DE102016009000A1 (de) * 2016-07-21 2018-01-25 Liebherr-Verzahntechnik Gmbh Regalbediengerät für ein Palettenspeichersystem
JP6593287B2 (ja) * 2016-09-09 2019-10-23 株式会社ダイフク 物品搬送設備
US10672639B2 (en) * 2016-12-07 2020-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Method for automatic sending cassette pod
US11261024B2 (en) * 2017-04-20 2022-03-01 Daifuku America Corporation High density stocker
US10406562B2 (en) * 2017-07-21 2019-09-10 Applied Materials, Inc. Automation for rotary sorters
JP6835031B2 (ja) * 2018-04-27 2021-02-24 株式会社ダイフク 物品搬送設備
JP7115947B2 (ja) * 2018-09-21 2022-08-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7185461B2 (ja) * 2018-09-21 2022-12-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および、基板処理装置の制御方法
JP7300817B2 (ja) * 2018-09-21 2023-06-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置の制御方法
CN111331156B (zh) * 2018-12-19 2021-06-22 宝成工业股份有限公司 自动上下料装置
JP7114456B2 (ja) * 2018-12-28 2022-08-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7175191B2 (ja) 2018-12-28 2022-11-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7190900B2 (ja) 2018-12-28 2022-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、キャリア搬送方法およびキャリアバッファ装置
JP7221048B2 (ja) 2018-12-28 2023-02-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7181081B2 (ja) * 2018-12-28 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7458718B2 (ja) 2019-07-19 2024-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7387316B2 (ja) 2019-07-19 2023-11-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板搬送方法
JP2021046273A (ja) * 2019-09-17 2021-03-25 株式会社ダイフク 物品搬送装置
KR20210134869A (ko) * 2020-05-01 2021-11-11 에이에스엠 아이피 홀딩 비.브이. Foup 핸들러를 이용한 foup의 빠른 교환

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423102Y2 (enExample) * 1975-04-23 1979-08-09
JPH072309A (ja) * 1993-06-17 1995-01-06 Kokusai Electric Co Ltd ウェーハ搬送装置
KR20080055382A (ko) * 2006-12-15 2008-06-19 엘지디스플레이 주식회사 랙 마스터

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124781A (enExample) * 1973-03-28 1974-11-29
JPS5936428B2 (ja) 1975-05-19 1984-09-04 日本電気株式会社 半導体集積回路
JPH0755548B2 (ja) 1987-09-02 1995-06-14 株式会社アイジー技術研究所 耐火、断熱パネル
JPH0163137U (enExample) * 1987-10-16 1989-04-24
US5174708A (en) * 1988-12-06 1992-12-29 Yellow Freight System, Inc. Boom mounted multiple stage freight lift apparatus
JPH07101193B2 (ja) 1990-12-25 1995-11-01 株式会社コスモ計器 自己診断機能付差圧式リークテスタ
JP2969034B2 (ja) 1993-06-18 1999-11-02 東京エレクトロン株式会社 搬送方法および搬送装置
JP3324233B2 (ja) * 1993-11-04 2002-09-17 石川島播磨重工業株式会社 入出庫装置
US5849602A (en) * 1995-01-13 1998-12-15 Tokyo Electron Limited Resist processing process
KR100244041B1 (ko) * 1995-08-05 2000-02-01 엔도 마코토 기판처리장치
TW318258B (enExample) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
JPH1098087A (ja) 1996-09-25 1998-04-14 Shimadzu Corp ウエハ搬送装置
US6540466B2 (en) * 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
JP3579228B2 (ja) * 1997-01-24 2004-10-20 大日本スクリーン製造株式会社 基板処理装置
US6390754B2 (en) 1997-05-21 2002-05-21 Tokyo Electron Limited Wafer processing apparatus, method of operating the same and wafer detecting system
JP3625617B2 (ja) 1997-06-10 2005-03-02 東京エレクトロン株式会社 基板処理装置、カセット内の基板検出装置
JPH11219912A (ja) * 1998-02-02 1999-08-10 Tokyo Electron Ltd 縦型熱処理装置
JP3928902B2 (ja) 1998-02-20 2007-06-13 平田機工株式会社 基板製造ラインおよび基板製造方法
US6283692B1 (en) * 1998-12-01 2001-09-04 Applied Materials, Inc. Apparatus for storing and moving a cassette
TW412097U (en) * 1999-01-28 2000-11-11 Ind Tech Res Inst Select-type battery-charging station for managing and switching the batteries of electric vehicles
JP2000306978A (ja) 1999-02-15 2000-11-02 Kokusai Electric Co Ltd 基板処理装置、基板搬送装置、および基板処理方法
US6506009B1 (en) * 2000-03-16 2003-01-14 Applied Materials, Inc. Apparatus for storing and moving a cassette
KR100741186B1 (ko) * 2000-08-23 2007-07-19 동경 엘렉트론 주식회사 피처리체의 처리시스템
JP2003007800A (ja) * 2001-06-21 2003-01-10 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
US20030031538A1 (en) * 2001-06-30 2003-02-13 Applied Materials, Inc. Datum plate for use in installations of substrate handling systems
JP2003051527A (ja) 2001-08-02 2003-02-21 Takehide Hayashi 半導体自動搬送対応ｅｆｅｍ（密閉容器からウエハーを出し入れし、製造装置に供給、回収する装置）用ｆｏｕｐ（密閉容器）移載ロボット
JP3902027B2 (ja) 2002-03-01 2007-04-04 大日本スクリーン製造株式会社 基板処理装置
US20040081546A1 (en) * 2002-08-31 2004-04-29 Applied Materials, Inc. Method and apparatus for supplying substrates to a processing tool
US7379785B2 (en) * 2002-11-28 2008-05-27 Tokyo Electron Limited Substrate processing system, coating/developing apparatus, and substrate processing apparatus
JP3962705B2 (ja) * 2003-06-05 2007-08-22 東京エレクトロン株式会社 処理装置
JP2005150575A (ja) 2003-11-19 2005-06-09 Nachi Fujikoshi Corp ダブルアーム型ロボット
AT500229B1 (de) * 2004-03-15 2008-12-15 Tgw Mechanics Gmbh Rechnergesteuerte transportvorrichtung
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
JP4666213B2 (ja) * 2005-07-05 2011-04-06 株式会社ダイフク 物品収納設備
JP2007251088A (ja) * 2006-03-20 2007-09-27 Tokyo Electron Ltd 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法
WO2008023560A1 (en) 2006-08-21 2008-02-28 Kabushiki Kaisha Yaskawa Denki Double arm robot
JP4904995B2 (ja) * 2006-08-28 2012-03-28 シンフォニアテクノロジー株式会社 ロードポート装置
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
US8128333B2 (en) * 2006-11-27 2012-03-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and manufacturing method for semiconductor devices
JP4327206B2 (ja) * 2007-01-30 2009-09-09 東京エレクトロン株式会社 縦型熱処理装置及び縦型熱処理方法
US8757955B2 (en) 2007-09-06 2014-06-24 Murata Machinery, Ltd. Storage, transporting system and storage set
US8043039B2 (en) 2007-09-20 2011-10-25 Tokyo Electron Limited Substrate treatment apparatus
JP4828503B2 (ja) * 2007-10-16 2011-11-30 東京エレクトロン株式会社 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体
KR101015225B1 (ko) 2008-07-07 2011-02-18 세메스 주식회사 기판 처리장치 및 이의 기판 이송 방법
JP5284808B2 (ja) 2009-01-26 2013-09-11 株式会社Ｓｏｋｕｄｏ ストッカー装置及び基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423102Y2 (enExample) * 1975-04-23 1979-08-09
JPH072309A (ja) * 1993-06-17 1995-01-06 Kokusai Electric Co Ltd ウェーハ搬送装置
KR20080055382A (ko) * 2006-12-15 2008-06-19 엘지디스플레이 주식회사 랙 마스터

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210157054A (ko) 2020-06-19 2021-12-28 세메스 주식회사 스토커

Also Published As

Publication number Publication date
JP5318005B2 (ja) 2013-10-16
US20110222994A1 (en) 2011-09-15
US9728434B2 (en) 2017-08-08
KR20110102177A (ko) 2011-09-16
JP2011187796A (ja) 2011-09-22
US20140341681A1 (en) 2014-11-20
US8827621B2 (en) 2014-09-09

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