KR101265043B1 - 반도체장치의 제조방법 - Google Patents

반도체장치의 제조방법 Download PDF

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Publication number
KR101265043B1
KR101265043B1 KR1020110100489A KR20110100489A KR101265043B1 KR 101265043 B1 KR101265043 B1 KR 101265043B1 KR 1020110100489 A KR1020110100489 A KR 1020110100489A KR 20110100489 A KR20110100489 A KR 20110100489A KR 101265043 B1 KR101265043 B1 KR 101265043B1
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KR
South Korea
Prior art keywords
lead frame
mold
upper mold
gate
protrusion
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KR1020110100489A
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English (en)
Korean (ko)
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KR20120035866A (ko
Inventor
켄 사카모토
타케토시 시카노
Original Assignee
미쓰비시덴키 가부시키가이샤
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Publication of KR20120035866A publication Critical patent/KR20120035866A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14262—Clamping or tensioning means for the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020110100489A 2010-10-06 2011-10-04 반도체장치의 제조방법 Active KR101265043B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-226608 2010-10-06
JP2010226608A JP5333402B2 (ja) 2010-10-06 2010-10-06 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20120035866A KR20120035866A (ko) 2012-04-16
KR101265043B1 true KR101265043B1 (ko) 2013-05-16

Family

ID=45872539

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110100489A Active KR101265043B1 (ko) 2010-10-06 2011-10-04 반도체장치의 제조방법

Country Status (5)

Country Link
US (1) US8334176B2 (enExample)
JP (1) JP5333402B2 (enExample)
KR (1) KR101265043B1 (enExample)
CN (1) CN102446777B (enExample)
DE (1) DE102011084058B4 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200029009A (ko) * 2017-08-23 2020-03-17 미쓰비시덴키 가부시키가이샤 반도체 장치의 제조 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5975086B2 (ja) * 2014-10-28 2016-08-23 第一精工株式会社 金型および成形品の製造方法
CN112536970B (zh) * 2020-11-23 2023-04-25 刘自福 全自动数据线注塑系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100242664B1 (ko) 1997-05-30 2000-02-01 김영환 시-비엘피 패키지용 몰드체이스
KR100272178B1 (ko) 1993-11-09 2000-12-01 윤종용 반도체패키지의 몰드장치

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Publication number Priority date Publication date Assignee Title
JPH081915B2 (ja) * 1985-06-18 1996-01-10 松下電器産業株式会社 封止金型装置
JP2581113B2 (ja) * 1987-11-25 1997-02-12 三菱電機株式会社 半導体装置のモールド方法および装置
JP3262823B2 (ja) 1992-01-08 2002-03-04 アピックヤマダ株式会社 リードフレームの樹脂モールド金型
JPH0621127A (ja) * 1992-07-03 1994-01-28 Nec Kyushu Ltd 樹脂モールドｉｃ用封入金型
JPH06244228A (ja) * 1993-02-18 1994-09-02 Oki Electric Ind Co Ltd リードフレーム及びその樹脂封止用成形型
JPH07130780A (ja) 1993-10-29 1995-05-19 Apic Yamada Kk リードフレームのモールド方法
JP3151346B2 (ja) * 1993-12-10 2001-04-03 株式会社日立製作所 半導体集積回路装置およびその製造方法ならびにその製造に用いるモールド金型
JPH08156009A (ja) 1994-12-12 1996-06-18 Nec Kansai Ltd 樹脂モールド装置
JPH08323798A (ja) 1995-05-30 1996-12-10 Nec Kansai Ltd 樹脂モールド装置
JP3727446B2 (ja) * 1997-08-19 2005-12-14 沖電気工業株式会社 半導体装置の樹脂封止成形金型
JP3055669B2 (ja) 1997-10-16 2000-06-26 日本電気株式会社 樹脂封止型ｂｇａおよびｂｇａ用樹脂封止金型
US6319625B1 (en) * 1999-10-29 2001-11-20 George J. Gemberling Graphite plate assembly and method of manufacture
JP4173346B2 (ja) * 2001-12-14 2008-10-29 株式会社ルネサステクノロジ 半導体装置
US6955941B2 (en) * 2002-03-07 2005-10-18 Micron Technology, Inc. Methods and apparatus for packaging semiconductor devices
JP3866127B2 (ja) * 2002-03-20 2007-01-10 株式会社ルネサステクノロジ 半導体装置
JP4426880B2 (ja) * 2004-03-12 2010-03-03 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP4481705B2 (ja) * 2004-03-31 2010-06-16 ルネサスエレクトロニクス株式会社 半導体素子封止装置および半導体素子封止方法
TWI270190B (en) * 2005-09-29 2007-01-01 Siliconware Precision Industries Co Ltd Lead frame structure and package for integrating the same
JP2008166395A (ja) 2006-12-27 2008-07-17 Renesas Technology Corp 半導体装置の製造方法
KR101561934B1 (ko) * 2007-11-16 2015-10-21 페어차일드코리아반도체 주식회사 반도체 패키지 및 그의 제조방법
JP5147758B2 (ja) * 2008-09-30 2013-02-20 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法、半導体装置およびモールド金型
JP5378781B2 (ja) * 2008-12-26 2013-12-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
US8586419B2 (en) * 2010-01-19 2013-11-19 Vishay-Siliconix Semiconductor packages including die and L-shaped lead and method of manufacture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100272178B1 (ko) 1993-11-09 2000-12-01 윤종용 반도체패키지의 몰드장치
KR100242664B1 (ko) 1997-05-30 2000-02-01 김영환 시-비엘피 패키지용 몰드체이스

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200029009A (ko) * 2017-08-23 2020-03-17 미쓰비시덴키 가부시키가이샤 반도체 장치의 제조 방법
KR102321556B1 (ko) 2017-08-23 2021-11-03 미쓰비시덴키 가부시키가이샤 반도체 장치의 제조 방법

Also Published As

Publication number Publication date
JP5333402B2 (ja) 2013-11-06
US8334176B2 (en) 2012-12-18
CN102446777B (zh) 2014-12-24
KR20120035866A (ko) 2012-04-16
JP2012080039A (ja) 2012-04-19
US20120088337A1 (en) 2012-04-12
DE102011084058B4 (de) 2016-04-07
DE102011084058A1 (de) 2012-04-12
CN102446777A (zh) 2012-05-09

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