JP5333402B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

Info

Publication number
JP5333402B2
JP5333402B2 JP2010226608A JP2010226608A JP5333402B2 JP 5333402 B2 JP5333402 B2 JP 5333402B2 JP 2010226608 A JP2010226608 A JP 2010226608A JP 2010226608 A JP2010226608 A JP 2010226608A JP 5333402 B2 JP5333402 B2 JP 5333402B2
Authority
JP
Japan
Prior art keywords
lead frame
mold
semiconductor device
manufacturing
upper mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010226608A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012080039A (ja
JP2012080039A5 (enExample
Inventor
健 坂本
武敏 鹿野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2010226608A priority Critical patent/JP5333402B2/ja
Priority to US13/220,999 priority patent/US8334176B2/en
Priority to CN201110297639.7A priority patent/CN102446777B/zh
Priority to KR1020110100489A priority patent/KR101265043B1/ko
Priority to DE102011084058.3A priority patent/DE102011084058B4/de
Publication of JP2012080039A publication Critical patent/JP2012080039A/ja
Publication of JP2012080039A5 publication Critical patent/JP2012080039A5/ja
Application granted granted Critical
Publication of JP5333402B2 publication Critical patent/JP5333402B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14262—Clamping or tensioning means for the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2010226608A 2010-10-06 2010-10-06 半導体装置の製造方法 Active JP5333402B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010226608A JP5333402B2 (ja) 2010-10-06 2010-10-06 半導体装置の製造方法
US13/220,999 US8334176B2 (en) 2010-10-06 2011-08-30 Method of manufacturing semiconductor device
CN201110297639.7A CN102446777B (zh) 2010-10-06 2011-09-30 半导体装置的制造方法
KR1020110100489A KR101265043B1 (ko) 2010-10-06 2011-10-04 반도체장치의 제조방법
DE102011084058.3A DE102011084058B4 (de) 2010-10-06 2011-10-05 Verfahren zur Herstellung einer Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010226608A JP5333402B2 (ja) 2010-10-06 2010-10-06 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2012080039A JP2012080039A (ja) 2012-04-19
JP2012080039A5 JP2012080039A5 (enExample) 2013-02-07
JP5333402B2 true JP5333402B2 (ja) 2013-11-06

Family

ID=45872539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010226608A Active JP5333402B2 (ja) 2010-10-06 2010-10-06 半導体装置の製造方法

Country Status (5)

Country Link
US (1) US8334176B2 (enExample)
JP (1) JP5333402B2 (enExample)
KR (1) KR101265043B1 (enExample)
CN (1) CN102446777B (enExample)
DE (1) DE102011084058B4 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5975086B2 (ja) * 2014-10-28 2016-08-23 第一精工株式会社 金型および成形品の製造方法
CN110998812B (zh) * 2017-08-23 2023-08-18 三菱电机株式会社 半导体装置的制造方法
CN112536970B (zh) * 2020-11-23 2023-04-25 刘自福 全自动数据线注塑系统

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081915B2 (ja) * 1985-06-18 1996-01-10 松下電器産業株式会社 封止金型装置
JP2581113B2 (ja) * 1987-11-25 1997-02-12 三菱電機株式会社 半導体装置のモールド方法および装置
JP3262823B2 (ja) 1992-01-08 2002-03-04 アピックヤマダ株式会社 リードフレームの樹脂モールド金型
JPH0621127A (ja) * 1992-07-03 1994-01-28 Nec Kyushu Ltd 樹脂モールドｉｃ用封入金型
JPH06244228A (ja) * 1993-02-18 1994-09-02 Oki Electric Ind Co Ltd リードフレーム及びその樹脂封止用成形型
JPH07130780A (ja) 1993-10-29 1995-05-19 Apic Yamada Kk リードフレームのモールド方法
KR100272178B1 (ko) 1993-11-09 2000-12-01 윤종용 반도체패키지의 몰드장치
JP3151346B2 (ja) * 1993-12-10 2001-04-03 株式会社日立製作所 半導体集積回路装置およびその製造方法ならびにその製造に用いるモールド金型
JPH08156009A (ja) 1994-12-12 1996-06-18 Nec Kansai Ltd 樹脂モールド装置
JPH08323798A (ja) 1995-05-30 1996-12-10 Nec Kansai Ltd 樹脂モールド装置
KR100242664B1 (ko) 1997-05-30 2000-02-01 김영환 시-비엘피 패키지용 몰드체이스
JP3727446B2 (ja) * 1997-08-19 2005-12-14 沖電気工業株式会社 半導体装置の樹脂封止成形金型
JP3055669B2 (ja) 1997-10-16 2000-06-26 日本電気株式会社 樹脂封止型ｂｇａおよびｂｇａ用樹脂封止金型
US6319625B1 (en) * 1999-10-29 2001-11-20 George J. Gemberling Graphite plate assembly and method of manufacture
JP4173346B2 (ja) * 2001-12-14 2008-10-29 株式会社ルネサステクノロジ 半導体装置
US6955941B2 (en) * 2002-03-07 2005-10-18 Micron Technology, Inc. Methods and apparatus for packaging semiconductor devices
JP3866127B2 (ja) * 2002-03-20 2007-01-10 株式会社ルネサステクノロジ 半導体装置
JP4426880B2 (ja) * 2004-03-12 2010-03-03 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP4481705B2 (ja) * 2004-03-31 2010-06-16 ルネサスエレクトロニクス株式会社 半導体素子封止装置および半導体素子封止方法
TWI270190B (en) * 2005-09-29 2007-01-01 Siliconware Precision Industries Co Ltd Lead frame structure and package for integrating the same
JP2008166395A (ja) 2006-12-27 2008-07-17 Renesas Technology Corp 半導体装置の製造方法
KR101561934B1 (ko) * 2007-11-16 2015-10-21 페어차일드코리아반도체 주식회사 반도체 패키지 및 그의 제조방법
JP5341556B2 (ja) * 2008-09-30 2013-11-13 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置の製造方法
JP5378781B2 (ja) * 2008-12-26 2013-12-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
US8586419B2 (en) * 2010-01-19 2013-11-19 Vishay-Siliconix Semiconductor packages including die and L-shaped lead and method of manufacture

Also Published As

Publication number Publication date
CN102446777B (zh) 2014-12-24
KR101265043B1 (ko) 2013-05-16
US20120088337A1 (en) 2012-04-12
JP2012080039A (ja) 2012-04-19
DE102011084058B4 (de) 2016-04-07
KR20120035866A (ko) 2012-04-16
DE102011084058A1 (de) 2012-04-12
CN102446777A (zh) 2012-05-09
US8334176B2 (en) 2012-12-18

Similar Documents

Publication Publication Date Title
CN104039522B (zh) 车辆用树脂制窗户面板的注射成型模具
JP5580116B2 (ja) 射出成形による樹脂成形品の製造方法
JP5333402B2 (ja) 半導体装置の製造方法
JP5076198B2 (ja) 樹脂成形部品とその製造方法
JP4153862B2 (ja) 半導体樹脂封止用金型
JP6288120B2 (ja) 樹脂封止金型および電子部品の樹脂成形部を製造する方法
JP6373508B2 (ja) 半導体装置の製造方法
JP6400401B2 (ja) 成形用金型、及び成形方法
JP5825037B2 (ja) ヒートシンク付き半導体装置の製造方法
JP6407041B2 (ja) 樹脂漏れ防止パッキン
JP5401703B2 (ja) モールド金型
CN108604577B (zh) 电子装置以及电子装置的制造方法
JP5903785B2 (ja) 半導体装置製造方法
JPH06216178A (ja) 樹脂封止半導体装置用モールド金型
JP2630429B2 (ja) 樹脂封止成形用金型装置
JP2020100113A (ja) 射出成型方法
JP2000058733A (ja) 樹脂封止型半導体装置およびそのリードフレーム
JPH05337991A (ja) 樹脂成形金型
JPH04284213A (ja) ガス注入成形方法
JPH052931U (ja) 樹脂モールド装置
JPH0679756A (ja) 射出成形方法
JP2009040011A (ja) 成形型装置及び高分子成形方法
JP2016072512A (ja) 半導体装置
JPH06304958A (ja) 樹脂モールド装置
JPH03242945A (ja) 半導体部品のモールド部成形装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121213

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121213

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130620

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130702

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130715

R150 Certificate of patent or registration of utility model

Ref document number: 5333402

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250