KR101141880B1 - 폴리우레탄 연마 패드 - Google Patents

폴리우레탄 연마 패드 Download PDF

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Publication number
KR101141880B1
KR101141880B1 KR1020067015630A KR20067015630A KR101141880B1 KR 101141880 B1 KR101141880 B1 KR 101141880B1 KR 1020067015630 A KR1020067015630 A KR 1020067015630A KR 20067015630 A KR20067015630 A KR 20067015630A KR 101141880 B1 KR101141880 B1 KR 101141880B1
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KR
South Korea
Prior art keywords
isocyanate
expandable hollow
hollow polymer
polishing pad
reaction product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020067015630A
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English (en)
Korean (ko)
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KR20060124686A (ko
Inventor
마리 조 컬프
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34808579&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR101141880(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20060124686A publication Critical patent/KR20060124686A/ko
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Publication of KR101141880B1 publication Critical patent/KR101141880B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
KR1020067015630A 2004-02-03 2005-01-13 폴리우레탄 연마 패드 Expired - Lifetime KR101141880B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/772,054 US20050171224A1 (en) 2004-02-03 2004-02-03 Polyurethane polishing pad
US10/772,054 2004-02-03
PCT/US2005/001192 WO2005077999A1 (en) 2004-02-03 2005-01-13 Polyurethane polishing pad

Publications (2)

Publication Number Publication Date
KR20060124686A KR20060124686A (ko) 2006-12-05
KR101141880B1 true KR101141880B1 (ko) 2012-05-03

Family

ID=34808579

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067015630A Expired - Lifetime KR101141880B1 (ko) 2004-02-03 2005-01-13 폴리우레탄 연마 패드

Country Status (7)

Country Link
US (3) US20050171224A1 (https=)
EP (1) EP1716193A1 (https=)
JP (2) JP4954716B2 (https=)
KR (1) KR101141880B1 (https=)
CN (1) CN1914241B (https=)
TW (1) TWI378994B (https=)
WO (1) WO2005077999A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140056116A (ko) * 2012-11-01 2014-05-09 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 연질 및 컨디셔닝 가능한 화학기계 연마 패드

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WO2005077999A1 (en) 2005-08-25
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US20050171225A1 (en) 2005-08-04
CN1914241A (zh) 2007-02-14
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US20080242755A1 (en) 2008-10-02
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