JP4722446B2 - 研磨パッド - Google Patents
研磨パッド Download PDFInfo
- Publication number
- JP4722446B2 JP4722446B2 JP2004295816A JP2004295816A JP4722446B2 JP 4722446 B2 JP4722446 B2 JP 4722446B2 JP 2004295816 A JP2004295816 A JP 2004295816A JP 2004295816 A JP2004295816 A JP 2004295816A JP 4722446 B2 JP4722446 B2 JP 4722446B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing pad
- rad
- sec
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
- B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/22—Rubbers synthetic or natural
- B24D3/26—Rubbers synthetic or natural for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Description
表4は、40℃及び10rad/secで計測された弾性率及びエネルギー損失を、i)銅シートウェーハ及びパターニングされたCu/Ta/TEOSウェーハの欠陥率ならびにii)計測したパターニングされたCu/Ta/TEOSウェーハのディッシング及びエロージョンで対比したものである。
表5Aは、40℃及び1rad/secで計測された弾性率及びエネルギー損失を、i)銅シートウェーハ及びパターニングされたCu/Ta/TEOSウェーハの欠陥率ならびにii)パターニングされたCu/Ta/TEOSウェーハのディッシング及びエロージョンで対比したものである。
この例は、研磨パッド2と比較研磨パッドDとでTEOS(テトラエチルオルトシリケート前駆体から析出した二酸化ケイ素)及びタングステン研磨特性を比較した。研磨パッドDは、IC1000(商標)ポリウレタン研磨パッドと等価である。この比較は、200mmのTEOSウェーハ及び200mmのタングステンウェーハに対して、IPEC472研磨機を5psi(34.5kPa)、65rpmプラテン速度、50rpmキャリヤ速度で使用し、MSW1500アルミナ砥粒含有スラリー(Rodel社)を150ml/minで導入した。
Claims (3)
- 半導体基材を平坦化するのに有用な研磨パッドであって、少なくとも0.1容量%の気孔率、40℃及び1rad/secで405〜600 l/PaのKELエネルギー損失係数、40℃及び1rad/secで140〜300MPaの弾性率E′ならびに20〜60のショアD硬さを有するポリマー材料を含む研磨パッド。
- 半導体基材を平坦化するのに有用な研磨パッドであって、少なくとも0.1容量%の気孔率を有するポリウレタンポリマー材料を含み、前記ポリウレタンポリマー材料が、トルエンジイソシアネートとポリテトラメチレンエーテルグリコールとのプレポリマー反応生成物と、4,4′−メチレン−ビス−o−クロロアニリンとから形成され、前記プレポリマー反応生成物が、5.5〜8.6重量%のイソシアナト基(NCO)を有し、4,4′−メチレン−ビス−o−クロロアニリンのアミノ基(NH 2 )とNCOの化学量論比(NH 2 /NCO)が80〜110%を有するものである、請求項1記載の研磨パッド。
- 半導体基材を研磨する方法であって、少なくとも0.1容量%の気孔率、40℃及び1rad/secで405〜600 l/PaのKELエネルギー損失係数、40℃及び1rad/secで140〜300MPaの弾性率E′ならびに20〜60のショアD硬さを有するポリマー材料を含む、半導体基材を平坦化するのに有用な研磨パッドを用いて半導体基材を研磨する工程を含む方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68215803A | 2003-10-09 | 2003-10-09 | |
US10/682,158 | 2003-10-09 | ||
US10/937,914 US7074115B2 (en) | 2003-10-09 | 2004-09-10 | Polishing pad |
US10/937,914 | 2004-09-10 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005136400A JP2005136400A (ja) | 2005-05-26 |
JP2005136400A5 JP2005136400A5 (ja) | 2011-03-31 |
JP4722446B2 true JP4722446B2 (ja) | 2011-07-13 |
Family
ID=34316904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004295816A Active JP4722446B2 (ja) | 2003-10-09 | 2004-10-08 | 研磨パッド |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1522385B1 (ja) |
JP (1) | JP4722446B2 (ja) |
KR (1) | KR101092944B1 (ja) |
CN (1) | CN100353502C (ja) |
DE (1) | DE602004010871T2 (ja) |
SG (1) | SG111222A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7074115B2 (en) | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
US20050171224A1 (en) | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
KR20070057157A (ko) * | 2004-08-25 | 2007-06-04 | 제이.에이치.로데스 컴퍼니, 인코퍼레이티드 | 연마 패드 및 패드 제거 속도와 평탄화의 개선 방법 |
JP4757562B2 (ja) * | 2005-08-04 | 2011-08-24 | 東洋ゴム工業株式会社 | Cu膜研磨用研磨パッド |
US7445847B2 (en) * | 2006-05-25 | 2008-11-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US7169030B1 (en) * | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US7569268B2 (en) * | 2007-01-29 | 2009-08-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US8303375B2 (en) * | 2009-01-12 | 2012-11-06 | Novaplanar Technology, Inc. | Polishing pads for chemical mechanical planarization and/or other polishing methods |
WO2010138724A1 (en) * | 2009-05-27 | 2010-12-02 | Rogers Corporation | Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer |
US20150059254A1 (en) * | 2013-09-04 | 2015-03-05 | Dow Global Technologies Llc | Polyurethane polishing pad |
US9731398B2 (en) * | 2014-08-22 | 2017-08-15 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Polyurethane polishing pad |
US10688621B2 (en) * | 2016-08-04 | 2020-06-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-defect-porous polishing pad |
US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
JP6968651B2 (ja) | 2017-10-12 | 2021-11-17 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
CN108047420B (zh) * | 2017-11-28 | 2021-01-12 | 湖北鼎龙控股股份有限公司 | 一种聚氨酯抛光层及其制备方法 |
JP7141230B2 (ja) | 2018-03-30 | 2022-09-22 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
TWI828771B (zh) | 2018-09-28 | 2024-01-11 | 日商富士紡控股股份有限公司 | 研磨墊及研磨加工物的製造方法 |
KR102423956B1 (ko) * | 2020-09-07 | 2022-07-21 | 에스케이씨솔믹스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
JP2022058234A (ja) * | 2020-09-30 | 2022-04-11 | 富士紡ホールディングス株式会社 | 研磨パッド、及び研磨加工物の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001091971A1 (en) * | 2000-05-27 | 2001-12-06 | Rodel Holdings, Inc. | Polishing pads for chemical mechanical planarization |
JP2002124491A (ja) * | 2000-08-10 | 2002-04-26 | Toray Ind Inc | 研磨パッド |
JP2002192457A (ja) * | 2000-12-26 | 2002-07-10 | Toyo Tire & Rubber Co Ltd | 研磨材組成物及び研磨シート |
JP2002194333A (ja) * | 2000-12-26 | 2002-07-10 | Toyo Tire & Rubber Co Ltd | 研磨材組成物及び研磨シート |
WO2002083757A1 (fr) * | 2001-04-09 | 2002-10-24 | Toyo Boseki Kabushiki Kaisha | Composition de polyurethanne et tampon a polir |
JP2002371121A (ja) * | 2001-04-09 | 2002-12-26 | Toyobo Co Ltd | ポリウレタン組成物からなる研磨パッド |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI228522B (en) * | 1999-06-04 | 2005-03-01 | Fuji Spinning Co Ltd | Urethane molded products for polishing pad and method for making same |
JP2000344902A (ja) * | 1999-06-04 | 2000-12-12 | Fuji Spinning Co Ltd | 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物 |
US6454634B1 (en) * | 2000-05-27 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads for chemical mechanical planarization |
JP2004083722A (ja) * | 2002-08-26 | 2004-03-18 | Jsr Corp | 研磨パッド用組成物及びこれを用いた研磨パッド |
-
2004
- 2004-10-04 SG SG200405774A patent/SG111222A1/en unknown
- 2004-10-06 DE DE602004010871T patent/DE602004010871T2/de active Active
- 2004-10-06 EP EP04256170A patent/EP1522385B1/en active Active
- 2004-10-07 KR KR1020040080039A patent/KR101092944B1/ko active IP Right Grant
- 2004-10-08 CN CNB200410010483XA patent/CN100353502C/zh not_active Ceased
- 2004-10-08 JP JP2004295816A patent/JP4722446B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001091971A1 (en) * | 2000-05-27 | 2001-12-06 | Rodel Holdings, Inc. | Polishing pads for chemical mechanical planarization |
WO2001091972A1 (en) * | 2000-05-27 | 2001-12-06 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
JP2002124491A (ja) * | 2000-08-10 | 2002-04-26 | Toray Ind Inc | 研磨パッド |
JP2002192457A (ja) * | 2000-12-26 | 2002-07-10 | Toyo Tire & Rubber Co Ltd | 研磨材組成物及び研磨シート |
JP2002194333A (ja) * | 2000-12-26 | 2002-07-10 | Toyo Tire & Rubber Co Ltd | 研磨材組成物及び研磨シート |
WO2002083757A1 (fr) * | 2001-04-09 | 2002-10-24 | Toyo Boseki Kabushiki Kaisha | Composition de polyurethanne et tampon a polir |
JP2002371121A (ja) * | 2001-04-09 | 2002-12-26 | Toyobo Co Ltd | ポリウレタン組成物からなる研磨パッド |
Also Published As
Publication number | Publication date |
---|---|
EP1522385A2 (en) | 2005-04-13 |
KR101092944B1 (ko) | 2011-12-12 |
DE602004010871D1 (de) | 2008-02-07 |
EP1522385A3 (en) | 2006-03-15 |
KR20050034554A (ko) | 2005-04-14 |
CN1638056A (zh) | 2005-07-13 |
JP2005136400A (ja) | 2005-05-26 |
CN100353502C (zh) | 2007-12-05 |
SG111222A1 (en) | 2005-05-30 |
DE602004010871T2 (de) | 2008-12-11 |
EP1522385B1 (en) | 2007-12-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7074115B2 (en) | Polishing pad | |
JP5593337B2 (ja) | ポリウレタン研磨パッド | |
JP5346445B2 (ja) | ケミカルメカニカル研磨パッド | |
JP4722446B2 (ja) | 研磨パッド | |
TWI480123B (zh) | 多功能研磨墊 | |
EP2151299B1 (en) | Chemical mechanical polishing pad | |
JP7197330B2 (ja) | アミン開始ポリオール含有硬化剤からの高除去速度ケミカルメカニカルポリッシングパッド | |
KR102502964B1 (ko) | 조절된-팽창 cmp 패드캐스팅방법 | |
TW201122033A (en) | Polyurethane composition for CMP pads and method of manufacturing same | |
US9452507B2 (en) | Controlled-viscosity CMP casting method | |
JP6423205B2 (ja) | ポリウレタン研磨パッド | |
JP6730025B2 (ja) | 高安定性ポリウレタン研磨パッド |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070829 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070829 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100810 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20101109 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20101112 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20101210 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20101215 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110106 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110112 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110210 |
|
A524 | Written submission of copy of amendment under section 19 (pct) |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20110210 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110329 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110406 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140415 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4722446 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |