SG111222A1 - Polishing pad - Google Patents

Polishing pad

Info

Publication number
SG111222A1
SG111222A1 SG200405774A SG200405774A SG111222A1 SG 111222 A1 SG111222 A1 SG 111222A1 SG 200405774 A SG200405774 A SG 200405774A SG 200405774 A SG200405774 A SG 200405774A SG 111222 A1 SG111222 A1 SG 111222A1
Authority
SG
Singapore
Prior art keywords
polishing pad
polishing
pad
Prior art date
Application number
SG200405774A
Other languages
English (en)
Inventor
B James David
Jo Kulp Mary
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34316904&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG111222(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US10/937,914 external-priority patent/US7074115B2/en
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of SG111222A1 publication Critical patent/SG111222A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
SG200405774A 2003-10-09 2004-10-04 Polishing pad SG111222A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68215803A 2003-10-09 2003-10-09
US10/937,914 US7074115B2 (en) 2003-10-09 2004-09-10 Polishing pad

Publications (1)

Publication Number Publication Date
SG111222A1 true SG111222A1 (en) 2005-05-30

Family

ID=34316904

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200405774A SG111222A1 (en) 2003-10-09 2004-10-04 Polishing pad

Country Status (6)

Country Link
EP (1) EP1522385B1 (ja)
JP (1) JP4722446B2 (ja)
KR (1) KR101092944B1 (ja)
CN (1) CN100353502C (ja)
DE (1) DE602004010871T2 (ja)
SG (1) SG111222A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US20050171224A1 (en) 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
KR20070057157A (ko) * 2004-08-25 2007-06-04 제이.에이치.로데스 컴퍼니, 인코퍼레이티드 연마 패드 및 패드 제거 속도와 평탄화의 개선 방법
JP4757562B2 (ja) * 2005-08-04 2011-08-24 東洋ゴム工業株式会社 Ｃｕ膜研磨用研磨パッド
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7169030B1 (en) * 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7569268B2 (en) * 2007-01-29 2009-08-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US8303375B2 (en) * 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
CN102448669B (zh) * 2009-05-27 2014-12-10 罗杰斯公司 抛光垫、其聚氨酯层及抛光硅晶片的方法
US20150059254A1 (en) * 2013-09-04 2015-03-05 Dow Global Technologies Llc Polyurethane polishing pad
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
US10688621B2 (en) * 2016-08-04 2020-06-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-defect-porous polishing pad
US20180345449A1 (en) * 2017-06-06 2018-12-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
JP6968651B2 (ja) 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CN108047420B (zh) * 2017-11-28 2021-01-12 湖北鼎龙控股股份有限公司 一种聚氨酯抛光层及其制备方法
JP7141230B2 (ja) 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
EP3858547A4 (en) 2018-09-28 2022-06-22 Fujibo Holdings, Inc. POLISHING PAD AND METHOD OF MAKING POLISHED ARTICLE
KR102423956B1 (ko) * 2020-09-07 2022-07-21 에스케이씨솔믹스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
WO2022071205A1 (ja) * 2020-09-30 2022-04-07 富士紡ホールディングス株式会社 研磨パッド、及び研磨加工物の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000344902A (ja) * 1999-06-04 2000-12-12 Fuji Spinning Co Ltd 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物
TWI228522B (en) * 1999-06-04 2005-03-01 Fuji Spinning Co Ltd Urethane molded products for polishing pad and method for making same
US6454634B1 (en) * 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
KR100770852B1 (ko) * 2000-05-27 2007-10-26 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 화학 기계적 평탄화용 그루브형 연마 패드
JP2002124491A (ja) 2000-08-10 2002-04-26 Toray Ind Inc 研磨パッド
JP4409758B2 (ja) * 2000-12-26 2010-02-03 東洋ゴム工業株式会社 研磨シートの製造方法
JP2002192457A (ja) * 2000-12-26 2002-07-10 Toyo Tire & Rubber Co Ltd 研磨材組成物及び研磨シート
US7378454B2 (en) * 2001-04-09 2008-05-27 Toyo Tire & Rubber Co., Ltd. Polyurethane composition and polishing pad
JP3359629B1 (ja) * 2001-04-09 2002-12-24 東洋紡績株式会社 ポリウレタン組成物からなる研磨パッド
JP2004083722A (ja) * 2002-08-26 2004-03-18 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド

Also Published As

Publication number Publication date
DE602004010871T2 (de) 2008-12-11
KR101092944B1 (ko) 2011-12-12
DE602004010871D1 (de) 2008-02-07
EP1522385B1 (en) 2007-12-26
JP2005136400A (ja) 2005-05-26
EP1522385A3 (en) 2006-03-15
CN100353502C (zh) 2007-12-05
EP1522385A2 (en) 2005-04-13
KR20050034554A (ko) 2005-04-14
JP4722446B2 (ja) 2011-07-13
CN1638056A (zh) 2005-07-13

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