DE602004010871D1 - Polierscheibe - Google Patents

Polierscheibe

Info

Publication number
DE602004010871D1
DE602004010871D1 DE602004010871T DE602004010871T DE602004010871D1 DE 602004010871 D1 DE602004010871 D1 DE 602004010871D1 DE 602004010871 T DE602004010871 T DE 602004010871T DE 602004010871 T DE602004010871 T DE 602004010871T DE 602004010871 D1 DE602004010871 D1 DE 602004010871D1
Authority
DE
Germany
Prior art keywords
buff
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004010871T
Other languages
English (en)
Other versions
DE602004010871T2 (de
Inventor
David B James
Mary Jo Kulp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34316904&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE602004010871(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US10/937,914 external-priority patent/US7074115B2/en
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE602004010871D1 publication Critical patent/DE602004010871D1/de
Application granted granted Critical
Publication of DE602004010871T2 publication Critical patent/DE602004010871T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
DE602004010871T 2003-10-09 2004-10-06 Polierscheibe Active DE602004010871T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US68215803A 2003-10-09 2003-10-09
US682158 2003-10-09
US10/937,914 US7074115B2 (en) 2003-10-09 2004-09-10 Polishing pad
US937914 2004-09-10

Publications (2)

Publication Number Publication Date
DE602004010871D1 true DE602004010871D1 (de) 2008-02-07
DE602004010871T2 DE602004010871T2 (de) 2008-12-11

Family

ID=34316904

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004010871T Active DE602004010871T2 (de) 2003-10-09 2004-10-06 Polierscheibe

Country Status (6)

Country Link
EP (1) EP1522385B1 (de)
JP (1) JP4722446B2 (de)
KR (1) KR101092944B1 (de)
CN (1) CN100353502C (de)
DE (1) DE602004010871T2 (de)
SG (1) SG111222A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US20050171224A1 (en) 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
WO2006026343A1 (en) * 2004-08-25 2006-03-09 J.H. Rhodes, Inc. Polishing pad and methods of improving pad removal rates and planarization
JP4757562B2 (ja) * 2005-08-04 2011-08-24 東洋ゴム工業株式会社 Ｃｕ膜研磨用研磨パッド
US7169030B1 (en) * 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7569268B2 (en) * 2007-01-29 2009-08-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US8303375B2 (en) * 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
WO2010138724A1 (en) * 2009-05-27 2010-12-02 Rogers Corporation Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer
US20150059254A1 (en) * 2013-09-04 2015-03-05 Dow Global Technologies Llc Polyurethane polishing pad
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
US10688621B2 (en) * 2016-08-04 2020-06-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-defect-porous polishing pad
US20180345449A1 (en) * 2017-06-06 2018-12-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
JP6968651B2 (ja) 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CN108047420B (zh) * 2017-11-28 2021-01-12 湖北鼎龙控股股份有限公司 一种聚氨酯抛光层及其制备方法
JP7141230B2 (ja) 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
EP4177008A1 (de) 2018-09-28 2023-05-10 Fujibo Holdings, Inc. Polierkissen und verfahren zur herstellung eines polierten produkts
KR102423956B1 (ko) * 2020-09-07 2022-07-21 에스케이씨솔믹스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
KR20230073324A (ko) 2020-09-30 2023-05-25 후지보 홀딩스 가부시키가이샤 연마 패드 및 연마 가공물의 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000344902A (ja) * 1999-06-04 2000-12-12 Fuji Spinning Co Ltd 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物
TWI228522B (en) * 1999-06-04 2005-03-01 Fuji Spinning Co Ltd Urethane molded products for polishing pad and method for making same
JP4959901B2 (ja) * 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド
US6454634B1 (en) * 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
JP2002124491A (ja) 2000-08-10 2002-04-26 Toray Ind Inc 研磨パッド
JP4409758B2 (ja) * 2000-12-26 2010-02-03 東洋ゴム工業株式会社 研磨シートの製造方法
JP2002192457A (ja) * 2000-12-26 2002-07-10 Toyo Tire & Rubber Co Ltd 研磨材組成物及び研磨シート
WO2002083757A1 (fr) * 2001-04-09 2002-10-24 Toyo Boseki Kabushiki Kaisha Composition de polyurethanne et tampon a polir
JP3359629B1 (ja) * 2001-04-09 2002-12-24 東洋紡績株式会社 ポリウレタン組成物からなる研磨パッド
JP2004083722A (ja) * 2002-08-26 2004-03-18 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド

Also Published As

Publication number Publication date
JP4722446B2 (ja) 2011-07-13
KR101092944B1 (ko) 2011-12-12
SG111222A1 (en) 2005-05-30
CN100353502C (zh) 2007-12-05
JP2005136400A (ja) 2005-05-26
EP1522385A3 (de) 2006-03-15
EP1522385A2 (de) 2005-04-13
CN1638056A (zh) 2005-07-13
EP1522385B1 (de) 2007-12-26
KR20050034554A (ko) 2005-04-14
DE602004010871T2 (de) 2008-12-11

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