KR100857635B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR100857635B1
KR100857635B1 KR1020060136484A KR20060136484A KR100857635B1 KR 100857635 B1 KR100857635 B1 KR 100857635B1 KR 1020060136484 A KR1020060136484 A KR 1020060136484A KR 20060136484 A KR20060136484 A KR 20060136484A KR 100857635 B1 KR100857635 B1 KR 100857635B1
Authority
KR
South Korea
Prior art keywords
substrate
liquid
board
posture
developer
Prior art date
Application number
KR1020060136484A
Other languages
English (en)
Korean (ko)
Other versions
KR20070070118A (ko
Inventor
미츠아키 요시타니
Original Assignee
다이니폰 스크린 세이조우 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 스크린 세이조우 가부시키가이샤 filed Critical 다이니폰 스크린 세이조우 가부시키가이샤
Publication of KR20070070118A publication Critical patent/KR20070070118A/ko
Application granted granted Critical
Publication of KR100857635B1 publication Critical patent/KR100857635B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
KR1020060136484A 2005-12-28 2006-12-28 기판 처리 장치 KR100857635B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005377670A JP4472630B2 (ja) 2005-12-28 2005-12-28 基板処理装置
JPJP-P-2005-00377670 2005-12-28

Publications (2)

Publication Number Publication Date
KR20070070118A KR20070070118A (ko) 2007-07-03
KR100857635B1 true KR100857635B1 (ko) 2008-09-08

Family

ID=38214316

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060136484A KR100857635B1 (ko) 2005-12-28 2006-12-28 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP4472630B2 (ja)
KR (1) KR100857635B1 (ja)
CN (1) CN100483618C (ja)
TW (1) TW200729291A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100934777B1 (ko) 2008-02-27 2009-12-31 주식회사 케이씨텍 기판 처리장치
KR100935473B1 (ko) * 2008-02-27 2010-01-06 주식회사 케이씨텍 기판 처리장치
KR100935474B1 (ko) * 2008-02-27 2010-01-06 주식회사 케이씨텍 기판 처리장치

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277556A (ja) * 2007-04-27 2008-11-13 Shibaura Mechatronics Corp 基板の処理装置
JP5270263B2 (ja) * 2008-08-29 2013-08-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2010240550A (ja) * 2009-04-03 2010-10-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2012186188A (ja) * 2009-07-08 2012-09-27 Sharp Corp エッチング装置および基板処理方法
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
JP5437134B2 (ja) * 2010-03-31 2014-03-12 大日本スクリーン製造株式会社 塗布装置
CN103801536B (zh) * 2012-11-13 2016-02-17 沈阳芯源微电子设备有限公司 一种晶片清洗装置
CN103207543A (zh) * 2013-04-19 2013-07-17 京东方科技集团股份有限公司 一种显影方法
CN103324038A (zh) * 2013-06-25 2013-09-25 京东方科技集团股份有限公司 一种显影装置及显影方法
KR102134439B1 (ko) * 2013-08-30 2020-07-15 세메스 주식회사 기판 처리 장치, 그리고 기판 처리 장치를 이용한 기판 처리 방법
CN103913959B (zh) * 2014-03-27 2017-09-26 京东方科技集团股份有限公司 一种光刻胶的剥离装置及剥离方法
JP7060415B2 (ja) * 2018-03-12 2022-04-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102125793B1 (ko) * 2018-04-20 2020-06-25 세메스 주식회사 기판 처리 장치
JP7370884B2 (ja) 2020-01-31 2023-10-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960700103A (ko) * 1993-05-27 1996-01-19 기타지마 요시토시 액도포 방법 및 도포장치(method of and appartus for application of liquid)
KR19990023551A (ko) * 1997-08-28 1999-03-25 이시다 아키라 기판처리장치
KR100286470B1 (ko) 1995-12-04 2001-04-16 이시다 아키라 기판처리장치 및 기판처리방법
KR20030005029A (ko) * 2001-07-05 2003-01-15 동경 엘렉트론 주식회사 액처리장치 및 액처리방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960700103A (ko) * 1993-05-27 1996-01-19 기타지마 요시토시 액도포 방법 및 도포장치(method of and appartus for application of liquid)
KR100286470B1 (ko) 1995-12-04 2001-04-16 이시다 아키라 기판처리장치 및 기판처리방법
KR19990023551A (ko) * 1997-08-28 1999-03-25 이시다 아키라 기판처리장치
KR20030005029A (ko) * 2001-07-05 2003-01-15 동경 엘렉트론 주식회사 액처리장치 및 액처리방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100934777B1 (ko) 2008-02-27 2009-12-31 주식회사 케이씨텍 기판 처리장치
KR100935473B1 (ko) * 2008-02-27 2010-01-06 주식회사 케이씨텍 기판 처리장치
KR100935474B1 (ko) * 2008-02-27 2010-01-06 주식회사 케이씨텍 기판 처리장치

Also Published As

Publication number Publication date
KR20070070118A (ko) 2007-07-03
TWI317144B (ja) 2009-11-11
JP4472630B2 (ja) 2010-06-02
JP2007180299A (ja) 2007-07-12
CN100483618C (zh) 2009-04-29
CN1992158A (zh) 2007-07-04
TW200729291A (en) 2007-08-01

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