TW200729291A - Handling apparatus of substrate - Google Patents

Handling apparatus of substrate

Info

Publication number
TW200729291A
TW200729291A TW095142791A TW95142791A TW200729291A TW 200729291 A TW200729291 A TW 200729291A TW 095142791 A TW095142791 A TW 095142791A TW 95142791 A TW95142791 A TW 95142791A TW 200729291 A TW200729291 A TW 200729291A
Authority
TW
Taiwan
Prior art keywords
substrate
transporting
spray nozzle
handling
posture
Prior art date
Application number
TW095142791A
Other languages
English (en)
Other versions
TWI317144B (zh
Inventor
Mitsuaki Yoshitani
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200729291A publication Critical patent/TW200729291A/zh
Application granted granted Critical
Publication of TWI317144B publication Critical patent/TWI317144B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
TW095142791A 2005-12-28 2006-11-20 Handling apparatus of substrate TW200729291A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005377670A JP4472630B2 (ja) 2005-12-28 2005-12-28 基板処理装置

Publications (2)

Publication Number Publication Date
TW200729291A true TW200729291A (en) 2007-08-01
TWI317144B TWI317144B (zh) 2009-11-11

Family

ID=38214316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095142791A TW200729291A (en) 2005-12-28 2006-11-20 Handling apparatus of substrate

Country Status (4)

Country Link
JP (1) JP4472630B2 (zh)
KR (1) KR100857635B1 (zh)
CN (1) CN100483618C (zh)
TW (1) TW200729291A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
TWI681454B (zh) * 2018-03-12 2020-01-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277556A (ja) * 2007-04-27 2008-11-13 Shibaura Mechatronics Corp 基板の処理装置
KR100935474B1 (ko) * 2008-02-27 2010-01-06 주식회사 케이씨텍 기판 처리장치
KR100935473B1 (ko) * 2008-02-27 2010-01-06 주식회사 케이씨텍 기판 처리장치
KR100934777B1 (ko) 2008-02-27 2009-12-31 주식회사 케이씨텍 기판 처리장치
JP5270263B2 (ja) * 2008-08-29 2013-08-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2010240550A (ja) * 2009-04-03 2010-10-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2012186188A (ja) * 2009-07-08 2012-09-27 Sharp Corp エッチング装置および基板処理方法
JP5437134B2 (ja) * 2010-03-31 2014-03-12 大日本スクリーン製造株式会社 塗布装置
CN103801536B (zh) * 2012-11-13 2016-02-17 沈阳芯源微电子设备有限公司 一种晶片清洗装置
CN103207543A (zh) * 2013-04-19 2013-07-17 京东方科技集团股份有限公司 一种显影方法
CN103324038A (zh) * 2013-06-25 2013-09-25 京东方科技集团股份有限公司 一种显影装置及显影方法
KR102134439B1 (ko) * 2013-08-30 2020-07-15 세메스 주식회사 기판 처리 장치, 그리고 기판 처리 장치를 이용한 기판 처리 방법
CN103913959B (zh) * 2014-03-27 2017-09-26 京东方科技集团股份有限公司 一种光刻胶的剥离装置及剥离方法
KR102125793B1 (ko) * 2018-04-20 2020-06-25 세메스 주식회사 기판 처리 장치
JP7370884B2 (ja) 2020-01-31 2023-10-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0654306B1 (en) * 1993-05-27 2001-08-16 Dai Nippon Printing Co., Ltd. Method of and apparatus for application of liquid
TW334359B (en) 1995-12-04 1998-06-21 Dai Nippon Scolin Seizo Kk Apparatus and method for treating substrates
KR100343044B1 (ko) * 1997-08-28 2002-10-25 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치및처리방법
TWI226077B (en) * 2001-07-05 2005-01-01 Tokyo Electron Ltd Liquid processing apparatus and liquid processing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
TWI681454B (zh) * 2018-03-12 2020-01-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
KR20070070118A (ko) 2007-07-03
TWI317144B (zh) 2009-11-11
JP4472630B2 (ja) 2010-06-02
JP2007180299A (ja) 2007-07-12
KR100857635B1 (ko) 2008-09-08
CN100483618C (zh) 2009-04-29
CN1992158A (zh) 2007-07-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees