TW200711749A - Coating method and coating apparatus - Google Patents

Coating method and coating apparatus

Info

Publication number
TW200711749A
TW200711749A TW095119113A TW95119113A TW200711749A TW 200711749 A TW200711749 A TW 200711749A TW 095119113 A TW095119113 A TW 095119113A TW 95119113 A TW95119113 A TW 95119113A TW 200711749 A TW200711749 A TW 200711749A
Authority
TW
Taiwan
Prior art keywords
coating film
field
resist
coating
substrate
Prior art date
Application number
TW095119113A
Other languages
Chinese (zh)
Other versions
TWI422436B (en
Inventor
Naoki Fujita
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200711749A publication Critical patent/TW200711749A/en
Application granted granted Critical
Publication of TWI422436B publication Critical patent/TWI422436B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

For the field-like coating unit (ACT) 40, when substrate G is mounted on a stage 80, and resist liquid supply mechanism 86 and nozzle movement mechanism 88 are operated, the field-like coating film 100 of the resist liquid is formed from the end of the substrate G toward other end by the coating scanning of length scale nozzle 82. In that case, it contacts or unites with the line-like resist coating film 76 in process in which the field-like resist coating film 100 spreads toward the outside of the substrate G, and film thickness is also controlled at the same time a marginal position is prescribed by the line-like resist coating film 76 outside the field-like resist coating film 100.
TW095119113A 2005-05-30 2006-05-30 Coating method and coating apparatus TWI422436B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005156895 2005-05-30
JP2006121556A JP4980644B2 (en) 2005-05-30 2006-04-26 Coating method and coating apparatus

Publications (2)

Publication Number Publication Date
TW200711749A true TW200711749A (en) 2007-04-01
TWI422436B TWI422436B (en) 2014-01-11

Family

ID=37729284

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095119113A TWI422436B (en) 2005-05-30 2006-05-30 Coating method and coating apparatus
TW098107118A TWI405617B (en) 2005-05-30 2006-05-30 Coating method and coating apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW098107118A TWI405617B (en) 2005-05-30 2006-05-30 Coating method and coating apparatus

Country Status (4)

Country Link
JP (1) JP4980644B2 (en)
KR (1) KR101195735B1 (en)
CN (1) CN101685257B (en)
TW (2) TWI422436B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636301B (en) * 2013-08-30 2018-09-21 日商武藏工業股份有限公司 Method and device for manufacturing plate-shaped laminated body

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4927158B2 (en) * 2009-12-25 2012-05-09 東京エレクトロン株式会社 Substrate processing method, recording medium storing program for executing substrate processing method, and substrate processing apparatus
JP5314726B2 (en) * 2011-03-18 2013-10-16 東京エレクトロン株式会社 Coating film forming apparatus and coating film forming method
JP5578377B2 (en) * 2011-07-29 2014-08-27 セメス株式会社 Substrate processing apparatus and method
CN103796819B (en) 2011-09-09 2018-05-29 Lg伊诺特有限公司 For manufacturing the method for the film of substrate and film, the back light unit and liquid crystal display using back light unit
KR101827364B1 (en) * 2011-10-13 2018-03-22 세메스 주식회사 Apparatus and method for treating substrate
CN103034061B (en) * 2012-12-13 2016-04-27 京东方科技集团股份有限公司 A kind of method for making of substrate
JP6231956B2 (en) * 2014-08-11 2017-11-15 東京エレクトロン株式会社 Substrate processing equipment
US10948825B2 (en) * 2015-12-23 2021-03-16 Asml Netherlands B.V. Method for removing photosensitive material on a substrate
JP6713910B2 (en) * 2016-11-11 2020-06-24 株式会社Ｓｃｒｅｅｎホールディングス Developing apparatus, substrate processing apparatus, developing method and substrate processing method
JP6925746B2 (en) * 2017-12-15 2021-08-25 住友重機械工業株式会社 Membrane forming device and film forming method
JP6506446B2 (en) * 2018-05-10 2019-04-24 Ａｉメカテック株式会社 Thin film forming apparatus and thin film forming method
JP6775907B1 (en) * 2019-08-08 2020-10-28 中外炉工業株式会社 Coating device and coating method
CN111187008B (en) * 2020-03-12 2022-04-26 Tcl华星光电技术有限公司 Glass substrate coating method and glass substrate coating device
CN113600440B (en) * 2021-08-03 2022-07-29 武汉华星光电技术有限公司 Dispensing method of display panel and dispensing device of display panel

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0992134A (en) * 1995-09-22 1997-04-04 Dainippon Printing Co Ltd Nozzle application method and device
JP3245813B2 (en) * 1996-11-27 2002-01-15 東京エレクトロン株式会社 Coating film forming equipment
JP4192456B2 (en) * 2001-10-22 2008-12-10 セイコーエプソン株式会社 Thin film forming method, thin film structure manufacturing apparatus, semiconductor device manufacturing method, and electro-optical device manufacturing method using the same
JP3966306B2 (en) * 2002-04-16 2007-08-29 セイコーエプソン株式会社 Pattern forming method, pattern forming apparatus, conductive film wiring, device manufacturing method, electro-optical device, and electronic apparatus
KR100923022B1 (en) * 2002-06-14 2009-10-22 삼성전자주식회사 Method and apparatus for coating sensitive material
JP2004098012A (en) * 2002-09-12 2004-04-02 Seiko Epson Corp Thin film formation method, thin film formation device, optical device, organic electroluminescent device, semiconductor device, and electronic apparatus
JP4245329B2 (en) * 2002-10-31 2009-03-25 大日本印刷株式会社 Method for producing functional element
JP4071183B2 (en) * 2003-09-12 2008-04-02 東京エレクトロン株式会社 Coating method and coating apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636301B (en) * 2013-08-30 2018-09-21 日商武藏工業股份有限公司 Method and device for manufacturing plate-shaped laminated body

Also Published As

Publication number Publication date
TWI422436B (en) 2014-01-11
JP4980644B2 (en) 2012-07-18
CN101685257B (en) 2012-04-25
KR20060124583A (en) 2006-12-05
KR101195735B1 (en) 2012-10-29
CN101685257A (en) 2010-03-31
JP2007007639A (en) 2007-01-18
TWI405617B (en) 2013-08-21
TW200930468A (en) 2009-07-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees