KR20060124583A - Coating method and coating apparatus - Google Patents

Abstract

A coating method and a coating apparatus are provided to uniformly form the thickness of a coating layer of a periphery by controlling the thickness of the coating layer in a coating process without spinning. A line-shaped coating layer(76) is formed by coating a processing solution on a part or an entire part of a periphery of a coating region defined on a substrate as a processing target. A surface-shaped coating layer(100) is formed by coating the processing solution on the coating region of the substrate. In the process for forming the surface-shaped coating layer, a profile of the line-shaped coating layer is selected in order to suppress a spreading effect of the processing solution by the line-shaped coating layer.

Description

Coating method and coating device {COATING METHOD AND COATING APPARATUS}

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the structure of the application | coating development process system applicable of this invention.

2 is a flowchart showing a procedure of a process in the coating and developing processing system of the embodiment.

3 is a perspective view showing the configuration of main parts in a line-shaped coating unit included in the coating and developing processing system of the embodiment.

4 is a plan view schematically showing a planar pattern of a line-shaped resist coating film formed on a substrate in an embodiment.

FIG. 5: is sectional drawing which shows typically the application position and cross-sectional shape of the line-shaped resist coating film formed on a board | substrate in embodiment.

FIG. 6 is a perspective view showing the configuration of main parts in the planar coating unit included in the coating and developing processing system of the embodiment. FIG.

7 is a perspective view showing the operation in the planar coating unit of the embodiment;

FIG. 8: is a top view which shows typically the planar view pattern of the planar resist coating film formed on a board | substrate in embodiment.

9 is a partial cross-sectional view schematically showing one operation of the line-shaped resist coating film in the embodiment.

10 is a partial cross-sectional view schematically showing one operation of the line-shaped resist coating film in the embodiment.

11 is a partial cross-sectional view schematically showing one operation of the line-shaped resist coating film in the embodiment.

12 is a partial cross-sectional view schematically showing one operation of the line-shaped resist coating film in the embodiment.

It is a partial sectional drawing which shows typically one effect | action of the line-shaped resist coating film in embodiment.

It is a perspective view which shows the structure of one modification which assembles a line-shaped coating processing apparatus in the surface-shaped coating processing apparatus in embodiment.

It is a top view which shows typically the effect | action of the coating process by the structural example of FIG.

FIG. 16 is a schematic side view showing a structural example of assembling the heat-drying apparatus in the structural example of FIG. 14.

It is a top view which shows an example of the pattern of the prior resist coating film in embodiment.

It is a top view which shows the effect | action of the preceding coating film in embodiment.

19 is a plan view illustrating another pattern example of the preceding coating film in the embodiment.

20 is a plan view illustrating another pattern example of the preceding coating film in the embodiment.

21 is a plan view illustrating another pattern example of the preceding coating film in the embodiment.

It is a top view which shows typically the planar view pattern of the resist coating film calculated | required on the board | substrate by the conventional spinless coating process.

It is a front view which shows typically the action of the spinless coating process of a prior art.

24 is a partial cross-sectional view that schematically illustrates a problem in the prior art.

It is a partial sectional drawing which shows typically the problem in the prior art.

It is a front view which shows typically the problem in the prior art.

27 is a perspective view schematically showing a problem in the prior art.

** Description of reference numerals indicating major parts **

40 face coating unit (ACT)

44 Line Shape Coating Unit (LCT)

62 stages

64 Inkjet Resist Nozzles (Inkjet Nozzles)

68 Y guide rail

70 X guide rail

72 Y direction drive

74 carriage

76 line shape resist coating film

80 stages

82 Long Resist Nozzle

84 Coating treatment unit

86 Resist Liquid Supply Mechanism

88 nozzle moving mechanism

100 planar resist coating film

102 warm air heater

110 Leading Resist Coating Film

112 planar resist coating film

114 synthetic resist coating film

G glass substrate (to-be-processed substrate)

RE coating area

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a technique for applying a liquid onto a substrate to be treated, and in particular, to a coating method and a coating apparatus for forming a coating film on a substrate in a spinless manner.

Recently, in the lithography process in the manufacturing process of a flat panel display (FPD), a long resist nozzle is used as a resist coating method for increasing the size of a substrate (for example, a glass substrate) to be treated with a resist liquid at its slit-shaped discharge port. A spinless method (see Patent Document 1, for example), which is applied to a resist film to a desired film thickness on a substrate without requiring rotational movement by discharging in a shape and moving or scanning relative to the substrate, is popular. have.

In the resist process employing the spinless method (also referred to as slit type), cleaning treatment and adhesion treatment are also performed as the pretreatment, and the cleaning treatment removes particles such as particles and organic matter on the substrate surface. In the adhesion treatment, in order to improve the adhesion between the substrate and the resist film, vapor-shaped HMDS is applied onto the substrate. And the resist coating process is performed on the plain board | substrate after an adhesion process.

[Patent Document 1] Japanese Patent Laid-Open No. 10-156255

However, the conventional spinless method leaves room for improvement in the film thickness control of the resist coating film formed on the substrate, and in particular, the improvement of in-plane uniformity has been a problem. Specifically, there is a problem that the film thickness of the coating film is decreased at the coating start portion, while the film thickness of the coating film becomes uncontrollable at both left and right ends at the coating intermediate portion, and the coating film is frequently acid-shaped at the coating termination portion.

More specifically, according to the conventional spinless method, the coating film 200 of the resist liquid is formed on the substrate G in a planar pattern as shown in FIG. Here, in the application start part A, as shown in FIG. 23A, the long type resist nozzle 202 narrows the gap D _A with the board | substrate G, and displaces or liquids the resist liquid beforehand. Although the resist liquid from the slit-shaped discharge port 202a of the resist nozzle 202 easily spreads to the outer side (especially the nozzle longitudinal direction outer side) on the board | substrate G. As a result, as shown in Fig. 24, the coating start portion A (particularly, the left and right corners thereof) sags so that the film thickness of the resist coating film 200 is directed outward.

During application scanning, as shown in Fig. 23B, the resist nozzle 202 makes the gap D _B of the substrate G larger than that at the start of the application, and forms the meniscus at the lower end behind the substrate G. Since the resist liquid immediately after moving above and discharged onto the substrate G is attracted to the nozzle 202, as shown in FIG. 25, the resist liquid is biased inward at both left and right ends of the intermediate portion B of the coating. It is easy to form the mountain shape 204. This peak shape 204 tends to grow as indicated by the dotted line 204 'by increasing the scanning speed or by increasing the gap D _B.

When the resist nozzle 202 finishes discharging the resist liquid, the liquid is separated from the both ends of the slit-shaped ejection opening 202a to start by moving upward and retracting, so that the application end portion C (particularly left and right) In the square corner portion), the bias toward the inner side of the resist liquid becomes stronger, and it is easy to form a larger mountain shape.

Such variation in thickness or unevenness of the resist coating film can be solved to some extent by optimizing the discharge structure of the resist nozzle 202 in accordance with the specifications and conditions of the resist process. However, this technique is not universal and requires a hardware replacement of the resist nozzle every time the specification (e.g. film thickness) or the conditions (e.g. type of resist) is changed, and the practical disadvantages in terms of cost and operation are large. .

In addition, in the conventional spinless method, as shown in FIG. 26, the gap between the resist nozzle 202 and the substrate G is completely filled with the resist liquid in the pre-discharge at the coating start position (A). There existed a lot of space | intervals (liquid defect point 206) without doing so. When the coating scan is started in the state where the liquid failure point 206 is present, the normal line (wet line) of the meniscus formed below the resist nozzle 202 as shown in FIG. 27 is the liquid failure point 206. In the scanning direction at the position on the resist coating film 200 corresponding to the position of phi, it is easy to produce the coating unevenness 208 of the stripe shape.

SUMMARY OF THE INVENTION The present invention has been made in view of the related problems in the related art, and an object thereof is to provide a spinless coating method and a coating apparatus that can easily control film thickness of a coating film, in particular, uniform film thickness of a peripheral portion.

It is another object of the present invention to provide a spinless coating method and a coating apparatus in which a gap between a nozzle and a substrate to be treated is reliably filled in a gap between a nozzle and a substrate to be coated to prevent coating stains.

In order to achieve the above object, the coating method of the present invention includes a line-like coating step of applying a treatment liquid to a portion or all of its periphery with respect to a coating area set on a substrate and forming a line-shaped coating film on the substrate. It has a surface coating process of apply | coating a process liquid to the said application area | region, and forming a surface coating film.

Moreover, the coating apparatus of this invention apply | coats a process liquid to the part or all of the peripheral part with respect to the application | coating area | region set on the to-be-processed board | substrate, and forms a line-shaped coating process part and a process liquid in the said coating area on the said board | substrate. It has a surface coating process part which apply | coats and forms a surface coating film.

According to the present invention, a process liquid is applied to a part or all of the periphery of the application region by a line-shaped coating process prior to the surface coating process for applying the treatment liquid to one surface of the application region on the substrate to form a linear coating film. . In the surface coating process, the processing liquid applied to the surface shape on the substrate is controlled by the film thickness according to the profile of the line coating film by contacting or integrating the line coating film with the peripheral portion of the coating area.

According to one embodiment which is very suitable in the present invention, the profile of the linear coating film is selected so that the expansion of the processing liquid applied on the substrate is prevented by the linear coating film in the planar coating step. According to another very suitable embodiment, the profile of the linear coating film is selected so that the treatment liquid applied on the substrate in the planar coating step is extended to the periphery side of the coating area by the tensile force by the adhesion of the linear coating film. . In the coating method of this invention, it is preferable to heat and dry a linear coating film before a surface coating process. Therefore, also in the coating apparatus of this invention, it is preferable to provide the drying means which heats and dries a linear coating film before a surface coating process.

Moreover, according to one highly suitable embodiment, the line-shaped coating processing line is lined with a first nozzle for discharging the processing liquid linearly from above toward the substrate in a substantially horizontal state and a processing liquid discharged onto the substrate from the first nozzle. It has a 1st coating scanning part which moves a 1st nozzle relatively with respect to a board | substrate so that a shape coating film may be formed. This first nozzle can suitably use an inkjet nozzle that pressurizes the processing liquid in the nozzle and ejects it as a droplet according to an electric drive signal.

According to one particularly suitable embodiment, the planar coating processing section includes a second nozzle for discharging the processing liquid from the top toward the substrate in a substantially horizontal state and a processing liquid discharged onto the substrate from the second nozzle. It has a 2nd application | coating scan part which moves a 2nd nozzle relative to a board | substrate so that an application | coating area | region may be apply | coated to one surface. This second nozzle can be suitably used an elongated nozzle having a slit-shaped discharge port that covers from one end to the other end of the application region in one direction. In the planar application step, the elongate nozzle may be relatively moved in parallel with the substrate and in a direction substantially perpendicular to the nozzle long direction.

According to one very suitable embodiment, the profile of the line coating film is selected so that the processing liquid applied on the substrate at the second nozzle adheres with the line coating film at the start of the planar coating process to close the gap. do.

In the present invention, the line-like coating treatment and the surface-shaped coating treatment may be performed at separate substrate supporting portions (in other places) or may be performed at the same substrate supporting portion (same place).

The coating method according to another aspect of the present invention moves the nozzle in a relatively horizontal direction while discharging the processing liquid from the nozzle with respect to the substrate, with the discharge port of the substrate to be processed and the nozzle being discharged almost horizontally with a small gap. A coating method of forming a planar coating film of the treatment liquid on the substrate by applying a coating scan to make a desired coating film made of the treatment liquid in the coating scan near the position where the coating scan on the substrate is finished. The preceding coating film is joined to the end of the planar coating film formed in the pattern and formed on the substrate by the coating scan so that the preceding coating film becomes an extended portion of the surface coating film.

In addition, the coating apparatus according to another aspect of the present invention has the discharge port of the substrate to be processed and the elongated nozzle facing substantially horizontally with a small gap so as to discharge the processing liquid from the nozzle with respect to the substrate in a relatively horizontal direction. In the coating scan of the planar coating processing part which performs the coating scan which moves, and forms the surface coating film of the said processing liquid on the said board | substrate, and the position which the said coating scan on the said board | substrate completes, the said The preceding coating film is joined to the end of the planar coating film formed on the substrate by a coating scan of the planar coating processing section having a preceding coating film forming section for forming the preceding coating film made of the processing liquid into a desired pattern, thereby forming the preceding coating film. It becomes an extension part of the said planar coating film.

In one very suitable aspect of the present invention, the substrate is rectangular and the preceding coating film is formed in the rectangular corner portion on the side where the coating scan on the substrate is completed.

According to the above-described method, the planar coating film is combined (integrated) with the preceding coating film in the vicinity of the end position of the coating scan during the planar coating process, and the preceding coating film becomes an extended portion of the surface coating film. The outline of the coating film can be arbitrarily adjusted.

Hereinafter, a very preferred embodiment of the present invention will be described with reference to FIGS.

1 shows a coating and developing treatment system as an example of the applicable configuration of the coating method and the coating apparatus of the present invention. This coating and developing treatment system is installed in a clean room, for example, using a glass substrate for LCD as a substrate to be processed, and performing cleaning, resist coating, prebaking, and post-baking in a photolithography process in an LCD manufacturing process. It is. Exposure processing is performed by an external exposure apparatus (not shown) provided adjacent to this system.

This coating and developing treatment system is roughly divided into a cassette station (C / S, 10), a process station (P / S, 12), and an interface unit (I / F, 14).

The cassette station C / S 10 provided at one end of the system includes a cassette stage 16 and a cassette stage 16 capable of arranging a predetermined number of cassettes C, which accommodate a plurality of substrates G, for example, up to four. Entry and exit of the substrate G with respect to the conveying path 17 provided on the side on the 16 and parallel to the arrangement direction of the cassette C and the cassette C on the stage 16 freely moveable on the conveying path 17. The conveyance mechanism 20 which implements is provided. This conveyance mechanism 20 has a means which can hold | maintain the board | substrate G, for example, conveyance arm, and X; It is operable by four axes of Y; Z; θ, and the transfer device 38 and the substrate G on the process station P / S · 12 side described later can be carried out.

The process station (P / S, 12) is a substrate relay unit (23) with a cleaning process unit (22), an application process unit (24) and a developing process unit (26) in order from the cassette station (C / S, 10) side. ) They are installed in a horizontal line via the chemical liquid supply unit 25 and the space 27.

The cleaning process unit 22 includes two scrubber cleaning units (SCR, 28), two upper and lower ultraviolet irradiation / cooling units (UV / COL, 30), heating units (HP, 32), and cooling units (COL, 34). It includes.

The coating process section 24 includes a spinless type planar coating unit (ACT, 40), a vacuum drying unit (VD, 42), a line-shaped coating unit (LCT, 44), and a two-stage upper and lower type adhesion / cooling unit (AD). / COL, 46), upper and lower two-stage heating / cooling unit (HP / COL, 48) and heating unit (HP, 50).

The developing process unit 26 includes three developing units DEV 52 and two upper and lower two-stage heating / cooling units HP / COL 53 and heating units HP 55.

The conveyance paths 36, 47, 58 are provided in the longitudinal direction in the center part of each process part 22, 24, 26, and the conveying apparatus 38, 54, 60 follows the conveyance paths 36, 47, 58, respectively. It moves, accesses each unit in each process part, and carries in / out of a board | substrate G, or conveys. In this system, the liquid treatment units (SCR, CT, DEV, etc.) are arranged on one side of the conveyance paths 36, 47, 58 in each of the process units 22, 24, and 26, and the heat treatment system on one side thereof. Units (HP, COL, etc.) are deployed.

The interface portion (I / F) 14 provided at the other end of the system is provided with an extension (substrate 56) and a buffer stage 57 on the side adjacent to the process station 12 and adjacent to the exposure apparatus. The conveyance mechanism 59 is provided in this. The conveyance mechanism 59 is free to move on the conveyance path 19 extending in the Y-direction, allows the substrate G to enter and exit the buffer stage 57, and extends (substrate receiving portion 56) or an exposure apparatus near the same. And the substrate G are carried out.

2 shows a procedure of the treatment in this coating and developing treatment system. First, in the cassette station C / S, 10, the conveyance mechanism 20 takes out one board | substrate G from the predetermined | prescribed cassette C on the cassette stage 16, and wash | cleans the process station P / S, 12. It is passed to the conveyance apparatus 38 of the process part 22 (step S1).

In the cleaning process section 22, the substrate G is first brought into the ultraviolet irradiation / cooling unit (UV / COL) 30 in turn, and the first ultraviolet irradiation unit (UV) is subjected to dry cleaning by ultraviolet irradiation, and then The cooling unit COL cools down to a predetermined temperature (step S2). In this ultraviolet cleaning, the organic substance of the surface of a board | substrate is mainly removed.

Subsequently, the substrate G is subjected to a scrubbing cleaning process with one of the scrubber cleaning units SCR 28 to remove particulate dirt from the substrate surface (step S3). After the scrubbing cleaning, the substrate G is subjected to a dehydration bake treatment by heating in the heating unit HP 32 (step S4) and then cooled to a constant substrate temperature in the cooling unit COL 34 (step S5). The pretreatment in the washing | cleaning process part 22 is complete | finished by this, and the board | substrate G is conveyed to the application | coating process part 24 via the board | substrate receiving part 23 by the conveying apparatus 38. As shown in FIG.

In the coating process part 24, the board | substrate G is first carried in line-shaped coating unit LCT 44, and a resist liquid is lined in the periphery or periphery of the application | coating area | region set on the board | substrate G as mentioned later here. It is apply | coated in a shape (step S6). In this way, the line-shaped resist coating film formed on the board | substrate G is immediately dried by heat processing in the heating unit HP (50) (step S7). Subsequently, the substrate G is carried in the adhigen / cooling unit (AD / COL) 46 in turn, and is subjected to hydrophobic treatment (HMDS) in the first adhigen unit AD (step S8). The next cooling unit (COL) To a constant substrate temperature (step S9). In addition, a cooling treatment (COL) may be added between the heat drying process (HP) and the hydrophobization process (HMDS).

Subsequently, the substrate G is coated with the resist liquid on one surface of the coating area by the spinless method with the surface coating unit ACT, 40 and then subjected to the drying treatment under reduced pressure with the vacuum drying unit VD 42. (Step SI0).

Subsequently, the substrate G is brought into the heating / cooling unit HP / COL 48 in turn, and after the first heating unit HP is applied after baking (prebaking) (step S11), the cooling unit COL is next. To a constant substrate temperature (step S12). It is also possible to use a heating unit (HP, 50) for baking after this application.

The substrate G after the coating treatment is conveyed to the interface unit I / F, 14 by the conveying device 54 of the coating process part 24 and the conveying device 60 of the developing process part 26, and therefrom. It is passed to an exposure apparatus (step S13). In the exposure apparatus, a predetermined circuit pattern is exposed to the resist on the substrate G. And the board | substrate G which finished pattern exposure is returned to the interface part I / F, 14 from an exposure apparatus. The conveyance mechanism 59 of the interface unit I / F, 14 passes the substrate G received from the exposure apparatus to the developing process unit 26 of the process station P / S, 12 via the extension 56. (Step S13).

In the developing process part 26, the board | substrate G is subjected to the developing process by either one of the developing units DEV, 52 (step S14), and then to one of the heating / cooling units (HP / COL, 53). It is carried in one by one and post-baked in the first heating unit HP (step S15), and then cooled to a constant substrate temperature by the cooling unit COL (step S16). The heating unit (HP, 55) can also be used for this postbaking.

The board | substrate G which processed a series of things to the image development process part 26 is returned to the cassette station C / S, 10 by the conveying apparatus 60, 54, 38 of the process station P / S, 12, Thereby, it is accommodated in one cassette C by either of the conveyance mechanisms 20 (step S1).

In this coating and developing treatment system, the present invention can be applied to the coating process section 24, in particular, the line coating unit (LCT) 44 and the surface coating unit (ACT, 40). 3-14, the structure and effect | action of the line-shaped application unit LCT 44 and the surface application unit ACT 40 in one embodiment of this invention are demonstrated in detail.

3 shows a configuration of main parts in the line-shaped coating unit LCT 44 in this embodiment. The line coating unit LCT 44 discharges the resist liquid in a dot shape or a solid shape to the stage 62 for holding and holding the substrate G horizontally and the substrate G on the stage 62. And a nozzle scanning mechanism 66 for moving the inkjet resist nozzle (hereinafter referred to as an "inkjet nozzle" 64) in the XY direction and a controller (not shown) for controlling the respective portions.

In the nozzle scanning mechanism 66, a pair of Y guide rails 68, 68 extending in the Y direction are disposed on both the left and right sides of the stage 62 and extends in the X direction across the stage 62. The X guide rail 70 is movable in the Y direction on the Y guide rails 68 and 68 by the Y direction drive part 72 which has an electric motor, for example. In addition, the X guide rail 70 is equipped with a carriage (carrier) 74 which can move in the X direction, for example, self-propelled or externally driven, and the ink jet nozzle 64 is mounted on the carriage 74. The combination of the movement in the Y direction by the Y-direction drive unit 72 and the movement in the X direction by the carriage 74 causes the inkjet nozzles 64 to be disposed between any two points on the XY plane above the stage 62 or at any time. You can move it on a straight or curved route.

The inkjet nozzle 64 has a piezo element, for example, as a jet means at the core of the discharge port, and contracts the piezo element with an electric drive signal from the controller to pressurize the resist liquid in the nozzle by the contraction pressure. It is configured to jet-jet at the discharge port as the droplets. In addition, a resist liquid supply unit (not shown) is connected to the inkjet nozzle 64 directly as a tank or via a pipe (not shown).

In this linear coating unit (LCT) 44, a treatment liquid can be applied to a part or all of the periphery of the predetermined coating region on the substrate G by the above-described configuration to form a linear resist coating film. . For example, as shown in FIG. 4, the inkjet nozzle 64 is routed along the four sides of the board | substrate G by the nozzle scanning mechanism 66 to the route of (1)-(2)-(3)-(4). By moving and dropping the resist liquid of a desired amount rather than the inkjet nozzle 64 to each point on this route, the rectangular line-shaped resist coating film 76 can be formed in the periphery of the application | coating area | region RE. Here, the application area RE is an area on the substrate G to which the resist liquid is applied onto the surface by the spinless method in the surface application unit ACT 40 described later. Usually, the outer periphery position of application area | region RE is set inwardly (for example, 10 mm) from the end of board | substrate G.

The shape of the planar pattern of the line-shaped resist coating film 76 is based on the shape (square) matched to the substrate G as a standard, but is arbitrarily matched to the requirements and processing conditions in the planar resist coating (ACT) of subsequent steps. Can bring about change. For example, in order to more effectively reduce the film thickness fluctuation or nonuniformity of the edge portion of the resist coating film 200 in the prior art as described with reference to FIGS. 22 to 27, the planar resist coating ACT of the subsequent step (ACT) The pattern which rounds the inner part 76A of the line-shaped resist coating film 76 at the one end side of the board | substrate of X direction which becomes the application | coating start position (A) as shown in the circle partial enlarged view LA in FIG. Or 76C of the line-shaped resist coating film 76 on the outside end side of the substrate in the X direction, which becomes the coating termination position C, is sharpened at an acute angle as shown in the circle partial enlarged view LC in FIG. 8. Patterns widening on the outside are very suitable.

5, the cross-sectional shape and size (especially width W, height H, etc.) of the line-shaped resist coating film 76 can also be arbitrarily selected within a predetermined limit. The dotted line J in the middle represents the boundary between the product region and the non-product region on the substrate G. FIG. Usually, since the outer periphery position of application area | region RE is set to the outer side of boundary J, the line-shaped resist coating film 76 may also be formed in the outer side of boundary J. FIG.

The linear resist coating film 76 formed on the substrate G by the linear coating units LCT 44 as described above is immediately dried by heat treatment in the heating units HP and 50 (step S7). . This heat drying is performed in order to evaporate the solvent remaining in the linear resist coating film 76 to increase the adhesiveness of the substrate G, but it does not have to be as dry as prebaking (step S11), and may be semi-dried.

6 shows the configuration of main parts in the planar application unit ACT 40. This planar application unit ACT, 40 has a stage 80 for horizontally placing and holding the substrate G and an upper surface of the substrate G placed on the stage 80 (exactly, the application area RE). ), A coating treatment portion 84 for applying a resist liquid in a planar shape by spinless method using an elongated resist nozzle (hereinafter referred to as "long nozzle" 82).

The coating processing section 84 includes a resist liquid supply mechanism 86 including the long nozzle 82 and a nozzle moving mechanism 88 for horizontally moving the long nozzle 82 in the X direction from above the stage 80 during the coating processing. Have In the resist liquid supply mechanism 86, the long nozzle 82 has a slit-shaped discharge port extending in the Y direction at a length that can cover the substrate G on the stage 80 from one end to the other end, and the resist liquid supply source It is connected to the resist liquid supply pipe 90 from (not shown). The nozzle moving mechanism 88 includes an inverted U-shaped or door-shaped nozzle support 92 for horizontally supporting the long nozzle 82 and a straight drive portion 94 for moving the nozzle support 92 straight in both directions in the X direction. Have This linear drive part 94 may be comprised, for example with a linear motor mechanism with a guide, or a ball screw mechanism. Moreover, the lifting mechanism 96 with a guide for changing or adjusting the height position of the long nozzle 82 is provided in the joint part 98 which connects the nozzle support body 92 and the long nozzle 82, for example. . The lifting mechanism 96 adjusts or varies the height position of the long nozzle 82 so that the distance between the lower end or discharge port of the long nozzle 82 and the upper surface (the surface to be processed) of the substrate G on the stage 80 is increased. That is, the size of the gap can be arbitrarily adjusted or varied.

The long nozzle 82 is made of, for example, a metal that is excellent in rustproof and workability, such as stainless steel, and has a tapered surface of a thin tip toward a slit-shaped discharge port at the bottom. The total length of the slit-shaped discharge port of the long nozzle 82 corresponds to the width size of the board | substrate G or the width (distance spacing) between the opposing line-shaped resist coating films mentioned later. As a result, both ends of the discharge port of the long nozzle 82 move almost immediately above both the left and right ends of the coating area RE on the substrate G in the X direction.

In this planar application unit ACT, 40, the substrate G is placed on the stage 80, and under the control of a controller (not shown), a resist liquid supply mechanism 86, a nozzle moving mechanism 88, and the like. As shown in FIG. 8, the planar resist coating film (in the region enclosed by the rectangular frame or bank of the line-shaped resist coating film 76) is shown in FIG. 100) can be formed to a desired film thickness.

More specifically, as shown in FIG. 6, the resist liquid is supplied while the long nozzle 82 is moved at a constant speed by the nozzle moving mechanism 88 so as to terminate or scan the upper portion of the stage 80 in the X direction at a predetermined height. In the mechanism 86, the resist liquid is supplied to the application region RE of the substrate G on the stage 80 by a band-like discharge flow that spreads in the Y direction from the slit-shaped discharge port of the long nozzle 82. As shown in FIG. 7 by the application | coating scan of the said long nozzle 82, the long nozzle 82 is traced on the board | substrate G, and the surface-form coating film 100 of the resist liquid is formed toward the other end from the board | substrate. Going. At that time, in the process of spreading the planar resist coating film 100 toward the outside (especially left and right outside) of the substrate G, the planar resist coating film 100 is brought into contact with and integrated with the line-shaped resist coating film 76. The position of the outer periphery of the planar resist coating film 100 is defined and the film thickness is also controlled.

That is, in the application start position A, the resist liquid from the slit-shaped ejection opening of the long nozzle 82 is used for the long nozzle 82 to narrow the gap with the substrate G, and to perform pre-discharge or liquid deposition of the resist liquid. It is easy to spread excessively on the outer side (especially the nozzle long direction outer side) on G). However, in this embodiment, the linear resist coating film 76 is formed before the outer periphery of the application region RE. As a result, as shown in FIG. 9, since the outer periphery of the planar resist coating film 100 is regulated by the embankment of the line-shaped resist coating film 76, the outer periphery of the planar resist coating film 100 does not spread to the outside thereof (bank effect). The thin tip (cut) of the film thickness as indicated by the line 100 'is blocked. Especially in the pattern which rounds the corner | corner (corner part) of the line-shaped resist coating film 76 at the application | coating start position (A) side, as shown to the circle partial enlarged view LA of FIG. The effect of the thickness digging prevention can be further enhanced.

On the other hand, during the coating scan, as shown in FIG. 7, immediately after the long nozzle 82 is discharged onto the substrate G by moving the upper portion of the substrate G in the X direction with the meniscus formed at the lower end thereof. Since the resist liquid of is attracted to the long nozzle 82, the resist liquid is biased inwardly at both left and right ends of the application intermediate portion B. As shown in FIG. However, in this embodiment, since the linear resist coating film 76 is formed before the outer peripheral portion of the coating area RE, as shown in FIG. 10, the outer peripheral portion of the planar resist coating film 100 is coated with the linear resist. Since it stays at a predetermined outer periphery position due to attraction due to adhesion to the film 76 (leakage), the peak shape of the film thickness as shown by the imaginary line 100 'is suppressed without being biased inward.

In the coating end portion C, the resist liquid immediately after being discharged onto the substrate G receives an inward force larger than that of the coating intermediate portion B from the long nozzle 82 side, but is also a linear resist coating film 76. The film shape of the film thickness is prevented without staying at a predetermined outer periphery position and biasing inward by the attraction force due to attachment (leak) with In particular, as shown in the circle-part enlarged view LC in FIG. 8, in the pattern in which each part 76C of the line-shaped resist coating film 76 is acutely angled and extended outward on the coating end position C side, immediately before the end of the coating. The excess amount of the resist liquid discharged from the long nozzle 82 can be led to the area expansion portion and held securely by the adhesion force leaked on the line-shaped resist coating film 76, thereby preventing the film thickness acid shape as described above. Can further enhance the effect.

Moreover, in this embodiment, it is possible to achieve good reproducibility with good reproducibility to prevent the gap between the long nozzle 82 and the substrate G with the resist liquid at the application start position (A) immediately before or at the start of the application scan. have. That is, as shown in FIG. 12, since the line-shaped resist coating film 76 is formed in advance of the application start position A or the X-direction outer side vicinity, the liquid is discharged from the slit-shaped discharge port 82a of the long nozzle 82. The resist liquid R is attached or integrated so as to overlap the line-shaped resist coating film 76 from above, and spreads in the nozzle long direction (Y direction) so that the resist liquid R can be completely prevented by filling the gap without gaps. .

Thus, by starting the coating scan with the gap between the long nozzle 82 and the substrate G completely filled with the resist liquid, as shown in FIG. 7, the top of the meniscus formed in the lower part of the back of the long nozzle 82 is shown. The line (wet line, WL) is stabilized in a horizontal straight line to form a resist coating film 100 having a flat surface without coating unevenness on the substrate G.

In this embodiment, the profile (coating position height H; width W) of the line-shaped resist coating film 76 without requiring any hardware change or replacement of the long nozzle 82 for various specifications and conditions of the resist process. By appropriately selecting, etc., the above-described uniform film thickness control can be easily realized.

For example, if the film thickness setting value of the planar resist coating film 100 is changed from Ta to about Tb, for example, without changing the coating conditions such as the scanning speed and the resist characteristics, in the application scanning intermediate section (B), The quantitative force of the resist liquid, which tries to spread outward from the substrate, is stronger than the force biased inward by the long nozzle 82, and the film thickness at the left and right ends thereof easily forms a mountain shape or falls outwardly.

In this case, as shown in FIG. 11, the application position of the linear resist coating film 76 is biased toward the inside of the substrate (product region side). It is possible to have a function of a bank effect that prevents the expansion of the outer periphery. This makes it possible to achieve uniform film thickness without sagging or digging of the film thickness in the planar resist coating film 100 as indicated by an imaginary line (single-dotted line, 100 ').

As described above, according to this embodiment, the spinless resist coating is formed by forming the line-shaped resist coating film 76 prior to the outer circumference of the coating region RE set on the substrate G in the spinless resist coating. In the coating treatment, the film thickness control of the planar resist coating film 100, in particular, the film thickness uniformity control of the peripheral portion can be easily performed. In addition, it is possible to reliably close the gap between the long nozzle 82 and the substrate G with a resist liquid at the time of the start of coating or immediately before the application of the liquid, thereby preventing the occurrence of streaks of coating streaks by coating scanning. A flat resist film of good quality can be obtained.

In said embodiment, the process which forms the linear resist coating film 76 on the board | substrate G is comprised by the exclusive line-shaped coating unit (LCT) 44. As shown in FIG. However, it is also possible to add or assemble an apparatus for performing a line-shaped coating process in the surface-shaped coating units ACT 40.

For example, as shown in FIG. 14, in the planar application unit ACT, 40, the liner coating processing apparatus in the line application unit LCT 41 is connected to the nozzle support 92 of the nozzle movement mechanism 88. It is also possible to mount the inkjet nozzle 64 via the X guide rail 70 carriage 74 as shown in FIG. 3). In this case, the inkjet nozzle 64 is located in the front position of the long nozzle 82 in the coating scan in which the long nozzle 82 is moved in the predetermined direction (X direction) above the stage 80 by the nozzle moving mechanism 88. The upper side of the stage 80 can be moved, and the line-shaped coating scan by the inkjet nozzle 64 can be executed prior to the planar coating scanning by the long nozzle 82.

In this way, in the case where the line-shaped coating processing apparatus is provided in the planar coating unit ACT, 40, the means for drying the line-shaped resist coating film 76 formed immediately on the substrate G also includes the unit (ACT, 40). It is preferable to install inside. For example, as shown in FIG. 16, the structure which scans the warm air heater 102 behind the inkjet nozzle 64 is also possible. This warm air heater 102 has a heat generating part 104 made of resistance heating means, for example, and draws air or nitrogen gas through a gas pipe 106 to draw a line-shaped resist on the substrate G from the warm air heater 102. The warm air for drying is blown toward the coating film 76. Alternatively, the effect of the linear resist coating film 76 may be reduced to some extent, but after the linear coating treatment, it is also possible to perform the surface coating treatment without performing a special drying treatment.

In the said embodiment, the linear resist coating film 76 was formed in the whole periphery of the coating area RE so that the board | substrate G may be rounded. However, it is also possible to form a local line-shaped resist coating film 76 only on a part of the outer circumference of the coating area RE, for example, only in the vicinity of the coating start position or only in the coating scanning intermediate portion, or only in the coating termination portion or in each portion. Moreover, as one modification of the application | coating pattern shown to the enlarged view LC of FIG. 8, you may form at intervals without combining the line-shaped resist film 76 of each part (corner part), and the structure is the same as the above. It is possible to get the effect.

The application | coating scan in the said embodiment was a system which fixes the board | substrate G on the stage 80, and moves the inkjet nozzle 64 or the long nozzle 82 to a predetermined direction or a root above it. However, a method of fixing the nozzles 64 and 82 and moving the substrate G in a predetermined direction or a method of simultaneously moving both the nozzles 64 and 82 and the substrate G may be possible. The floating conveyance type which floats and moves the board | substrate G to the air during application | coating scan is also possible.

In the above embodiment, a small amount of the resist liquid is discharged into the narrow gap with the substrate G than the long nozzle 82 with respect to the liquid at the start of coating, but the liquid by the priming treatment method can be used as another method. According to the priming treatment method, the primer solution is placed near the discharge port of the long nozzle 82 in the priming treatment unit provided near the stage 80, and then the long nozzle 82 is moved above the stage 80 to move the substrate G and the substrate G. The liquid film of the resist liquid attached to the lower end of the board | substrate G is dropped to the height which forms a predetermined narrow gap, and is attached to the application starting position of the board | substrate G. According to the present invention, since the line-shaped resist coating film is formed in the vicinity of the coating start position, the liquid by the priming treatment method is also reproducible and satisfactory.

Further, it is preferable to stop or move the long nozzle 82 until the resist liquid discharged from the long nozzle 82 comes into contact with the line-shaped resist coating film 76 for the first time. Once the resist is in contact with the line-shaped resist coating film 76, after the long nozzle 82 is moved, it is suction-biased by the line-type resist coating film 76 and is spaced apart from the line-shaped resist coating film 76. The resist can be supplied without. The time until the long nozzle 82 which discharges a resist starts a movement may be calculated | required previously by experiment etc.

In addition, in the initial stage, the ejecting resist that ejects the resist more than a predetermined amount is contacted with the line-shaped resist coating film 76 so that the resist is ejected from the long nozzle 82 to be brought into contact with the line-type resist film 76 quickly. An excess amount of resist may be sucked into the long nozzle 82. The time from the discharge of the resist to the start of suction may also be determined in advance by experiment or the like.

In addition, although not shown, in the linear coating unit (LCT) 44, a plurality of nozzles 64 (for example, four) corresponding to each side of the substrate are provided, and the linear resist coating film (at the same time along each side of the substrate) A device configuration for forming 76 may also be used. In this case, a desired line-shaped resist coating film 76 can be formed on the substrate in a shorter time.

Various modifications are possible also in the structure of the nozzle for application | coating a linear resist film used for this invention, and the nozzle for application | coating a planar resist film. For example, a solenoid valve on / off nozzle having a discharge hole of fine holes may be used instead of the inkjet nozzle 64. In addition, the ejection openings of the long nozzle 82 can be arranged not only in the slit type but also in a plurality of fine hole ejection openings in a row.

It is also possible to modify the shape of the linear resist coating film 76 in any pattern other than the line in the linear coating step. Particularly, in the surfaceless coating of the spinless method, the resist liquid film is largely biased to the inside (substrate center side in the direction orthogonal to the coating scanning direction) from the coating end portion (especially the left and right square corner portions) on the substrate G as described above. easy. According to the present invention, the outline of the planar resist coating film (e.g., in the preceding coating process such as the line-shaped coating process) in advance of the vicinity of the end of the planar resist coating film on the substrate G (especially in the left and right corners) is particularly A preceding resist coating film for extending the outline of the left and right rectangular corner portions can be formed in a desired pattern.

For example, as shown in FIG. 17, you may form the preceding resist coating film 110 by the pattern of the "shape or form" of substantially right angle in the left-right square corner part of the back-end | surface side of the planar application on the board | substrate G. As shown in FIG. In this case, in the planar coating step, even if the planar resist coating film 112 formed on the substrate G is biased inward from the coating scan end portion, as shown in FIG. As shown), the planar resist coating film 112 is partially overlapped (integrated) with the left and right corner corners on the substrate G so that the preceding resist coating film 110 is coated with the planar resist. As the expanded portion of the film 112, a synthetic resist coating film 114 which defines the shape (square shape) of each portion can be obtained.

In addition, in the present invention, the pattern or layout of the preceding resist coating film 110 can be arbitrarily modified. For example, a circular pattern as shown in FIG. 19 and a long rectangular or square pattern extending in the planar coating scanning direction as shown in FIG. 20 extending in a direction orthogonal to the planar coating scanning direction as shown in FIG. Long rectangular or square patterns are possible. Also in these cases, the planar resist coating film 112 joins (integrates) the preceding resist coating film 110 at the end of the planar coating scan so that the preceding resist coating film 110 becomes the planar resist coating film 112. The synthetic resist coating film 114 which defines the shape of each part as an extension part of can be obtained.

Moreover, it is also possible to form the preceding coating film in this invention in the above-mentioned pattern or layout using a solvent, for example, a thinner instead of a resist liquid. In this case, although not shown, in the case of the planar coating process, when the planar resist coating film is combined with the preceding thinner coating film, the resist liquid of the planar resist coating film leaks out onto the preceding thinner coating film, and as a result, the outline of the planar resist coating film is diffused. It extends or extends to the outline of the preceding thin film. Thereby, even if a planar resist coating film is biased inward from an application | coating scanning terminal part, the coating film outline of each left and right part can be made into a desired shape (for example, a rectangular shape).

Although the above embodiment relates to a resist coating apparatus in a coating and developing processing system of LCD manufacture, the present invention can be applied to any processing apparatus or application for supplying a processing liquid onto a substrate to be processed. Therefore, as the processing liquid in the present invention, for example, a coating liquid such as an interlayer insulating material dielectric material wiring material can be used as well as a resist liquid, and a developing solution, a rinse liquid, and the like can also be used. The to-be-processed substrate in this invention is not limited to an LCD substrate, Another flat panel display substrate; Semiconductor wafers; CD substrates; glass substrates; photomasks; A printed board etc. are also possible.

According to the coating method or coating apparatus of the present invention, the film thickness control of the coating film, in particular, the uniformity of the film thickness of the peripheral portion can be easily performed in the spinless coating treatment by the above-described configuration and operation. In addition, the coating liquid can be reliably filled in the gap between the nozzle and the treated substrate at the application start position without any gap to prevent application staining.

Claims (20)

A line-like coating step of forming a line-like coating film by applying a treatment liquid to a part or all of the peripheral portion of the coating area set on the substrate to be processed, and And a surface coating step of applying a treatment liquid to the coating area on the substrate to form a surface coating film. The method according to claim 1, The profile of the linear coating film is selected in the linear coating step so that the spreading of the processing liquid applied on the substrate in the planar coating step is prevented by the linear coating film. Application method. The method according to claim 1, In the line-like coating step, the processing liquid applied on the substrate is spread to the peripheral side of the coating area by attraction force by adhesion with the line-shaped coating film in the planar coating step. A coating method wherein the profile of the coating film is selected. The method according to any one of claims 1 to 3, And the linear coating step includes a step of moving the first nozzle for discharging the processing liquid linearly relative to the substrate. The method according to any one of claims 1 to 3, And said planar coating step includes a step of moving a second nozzle for discharging a processing liquid in a band shape relative to said substrate. The method according to claim 5, The second nozzle is an elongated nozzle having a slit discharge port, And said elongated nozzle is moved relative to said substrate in parallel with said substrate and in a direction substantially perpendicular to said nozzle longitudinal direction in said planar coating process. The method according to claim 6, The profile of the linear coating film is selected so that the processing liquid applied on the substrate at the second nozzle adheres to the linear coating film at the start of the planar coating process to close the gap. Application method to make. The method according to claim 2 or 3, The profile of the said linear coating film contains the film thickness line width of the coating film and at least 1 in the position on a board | substrate. The coating method characterized by the above-mentioned. The method according to any one of claims 1 to 3, The coating method formed by the said linear coating process is heated and dried before the said surface coating process. A line-shaped coating processing unit for applying a processing liquid to a portion or all of the peripheral portion of the coating area set on the substrate to be formed, to form a linear coating film; And a planar coating treatment section for applying a treatment liquid to the coating region on the substrate to form a planar coating film. The method according to claim 10, The line-shaped coating processing unit, A first nozzle for discharging the processing liquid linearly from above toward the substrate in a substantially horizontal state; And a first coating scanning unit for moving the first nozzle relative to the substrate so that the line-shaped coating film is formed from the first nozzle from the first nozzle onto the substrate. The method according to claim 11, And the first nozzle comprises a jet nozzle for pressurizing the processing liquid in the nozzle and spraying the liquid as a droplet according to an electric drive signal. The method according to any one of claims 10 to 12, The surface coating treatment unit, A second nozzle for discharging the processing liquid from the top toward the substrate in a substantially horizontal state in a band shape,  And a second coating scanning portion for moving the second nozzle relative to the substrate so that the coating area is coated on one surface with the processing liquid discharged from the second nozzle onto the substrate. . The method according to claim 13, And the second nozzle is formed of an elongated nozzle having a slit-shaped discharge port covering a length from one end to the other end of the application region in one direction. The method according to claim 13, And the line-shaped coating processing section and the planar coating processing section each have independent support portions for supporting the substrate in a horizontal state. The method according to claim 13, And the line-shaped coating processing section and the planar coating processing section have a common support section for supporting the substrate in a horizontal state. The method according to any one of claims 10 to 12, And a drying means for heating and drying the linear coating film formed on the substrate by the linear coating processing unit. On the substrate, a coating scan is performed in which the ejection openings of the substrate to be processed and the nozzle are moved almost horizontally with a slight gap to move the nozzle in a relatively horizontal direction while discharging the processing liquid from the nozzle. As a coating method of forming the surface coating film of the said processing liquid, In the coating scan, a preceding coating film made of the processing liquid is formed in a desired pattern near the position where the coating scan on the substrate ends. And the preceding coating film is joined to an end of the surface coating film formed on the substrate by the coating scan so that the preceding coating film becomes an extended portion of the surface coating film. The method according to claim 18, And said substrate is a rectangle, and said preceding coating film is formed in a rectangular corner portion at the side where the coating scan on said substrate ends. On the substrate, a coating scan is performed in which the ejection openings of the substrate to be processed and the nozzle are moved almost horizontally with a slight gap to move the nozzle in a relatively horizontal direction while discharging the processing liquid from the nozzle. A planar coating processing unit for forming a planar coating film of the processing liquid; In the application | coating scan of the said planar coating process part, in the vicinity of the position which the said application | coating scan on the said board | substrate has, the prior coating film formation part which forms the preceding coating film which consists of the said processing liquid in a desired pattern, And the preceding coating film is joined to an end of the surface coating film formed on the substrate by the coating scanning of the surface coating processing unit so that the preceding coating film becomes an extended portion of the surface coating film.

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