JP3180143U - Coating nozzle cleaning device - Google Patents

Abstract

Disclosed is a coating nozzle cleaning device for reducing dirt on a wiping pad and maintaining the cleaning ability of a slit nozzle.
A carriage 64 that moves in a horizontal scanning direction parallel to the longitudinal direction of the coating nozzle along the periphery of a discharge port of a long coating nozzle that applies a processing liquid to a substrate, and the scanning is installed on the carriage. In a coating nozzle cleaning device comprising wiping pads 72 and 76 for slidably contacting a discharge nozzle peripheral portion of the coating nozzle while moving in the direction and wiping and removing the processing liquid adhering to the peripheral portion of the discharge nozzle, the carriage is accommodated A wiping pad cleaning nozzle 100 is disposed on the container 44 and discharges cleaning fluid toward the wiping surfaces 72d and 76d of the wiping pad to clean the wiping surface.
[Selection] Figure 7

Description

  The present invention relates to a coating nozzle cleaning device, and more particularly to a coating nozzle cleaning device for cleaning a wiping pad for wiping off a processing liquid adhering to a discharge port peripheral portion of a long coating nozzle used for coating processing.

  In a photolithography process in a manufacturing process of a flat panel display (FPD) such as an LCD, a long slit nozzle having a slit-shaped discharge port is moved relative to a target substrate such as a glass substrate, A non-rotating coating method in which a coating solution such as a processing solution or a chemical solution such as a resist solution is applied on a substrate is often used.

  For example, the slit nozzle is moved in one horizontal direction perpendicular to the longitudinal direction of the nozzle while discharging the resist solution from the slit nozzle to the substrate fixedly placed on the stage. Then, the resist liquid overflowing on the substrate from the discharge port of the slit nozzle extends flat behind the nozzle, and a resist coating film is formed on the entire surface of the substrate (see, for example, Patent Document 1).

  In addition, as another method, a levitation conveyance method in which a substrate is conveyed in one horizontal direction (longitudinal direction of the stage) while being floated on the stage is often used. In this method, a long slit nozzle installed above the levitation stage discharges a resist solution in a strip shape toward the substrate passing directly below it, so that the substrate from the front end to the rear end in the substrate transport direction. A resist coating film is formed on the entire surface of the substrate (see, for example, Patent Document 2).

  In the slit nozzle, when the discharge operation is stopped, the resist liquid tends to adhere or remain near the discharge port. If this is left as it is and dried and solidified, the resist discharge flow may be hindered or disturbed during the next coating process, and the resist film thickness may vary. Accordingly, a slit nozzle cleaning device for cleaning the peripheral portion of the discharge port of the slit nozzle in preparation for the next coating process is provided in the nozzle standby section installed adjacent to the coating processing section. The slit nozzle cleaning device has a wiping pad that is a wiper member that wipes off the resist solution adhering to the periphery of the discharge port of the slit nozzle (see, for example, Patent Document 3).

Japanese Patent Laid-Open No. 10-156255 Japanese Patent Laid-Open No. 2005-236092 JP 2011-167607 A

  In the slit nozzle cleaning device described in Patent Document 3, the periphery of the discharge port of the slit nozzle is cleaned by the wiping pad. However, as the number of times of cleaning is increased, the resist liquid may adhere to the wiping pad, which may reduce the cleaning ability of the slit nozzle.

  The present invention solves the above-mentioned problems of the prior art, and provides a coating nozzle cleaning device for reducing the contamination of the wiping pad and maintaining the cleaning ability of the slit nozzle.

  In order to solve the above-mentioned problem, the coating nozzle cleaning device according to claim 1 is horizontally parallel to the longitudinal direction of the coating nozzle along the periphery of the discharge port of the elongated coating nozzle that coats the processing liquid onto the substrate. A carriage that moves in the scanning direction, and a wiping pad that is installed on the carriage and that slides in contact with the periphery of the discharge port of the coating nozzle while moving in the scanning direction to wipe off the processing liquid adhering to the periphery of the discharge port And a wiping pad cleaning nozzle that is disposed on an upper part of a container that houses the carriage and that discharges a cleaning fluid toward the wiping surface of the wiping pad to clean the wiping surface. It is characterized by that.

  The invention described in claim 2 is characterized in that the cleaning fluid is discharged in a spray form.

  The invention described in claim 3 is characterized in that the wiping pad cleaning nozzle is formed to be movable relative to the wiping pad.

  In the present invention, a cleaning liquid can be used as the cleaning fluid (Claim 4), or a gas can be used (Claim 5).

  Further, the invention according to claim 6 is the coating nozzle cleaning device according to any one of claims 1 to 5, wherein the device is disposed above the wiping pad cleaning nozzle and cooperates with the container to wipe the wiping pad and the wiping pad. A nozzle cover that forms a closed space around the cleaning nozzle is provided.

  The device according to claim 7 is the coating nozzle cleaning device according to claim 6, further comprising an exhaust port for exhausting the inside of the closed space.

  The invention according to claim 8 is the coating nozzle cleaning device according to claim 6 or 7, wherein the nozzle cover includes an opening through which the coating nozzle enters and leaves the closed space, and the opening is formed in the closed space. An air curtain nozzle for shutting off from the outside.

  According to the coating nozzle cleaning device of the present invention, the wiping pad can be cleaned when the wiping pad becomes dirty. Since the wiping pad can be kept clean, it is possible to prevent the cleaning ability of the slit nozzle from being reduced. In addition, according to the coating nozzle cleaning device of the present invention, it is possible to prevent the mist of the cleaning fluid discharged from the cleaning nozzle from adhering to the coating processing surface of the substrate, and thus it is possible to prevent the product yield from being lowered.

It is a top view which shows one structural example of the resist coating device which can apply the washing nozzle and nozzle cover in this invention. It is sectional drawing which shows the slit nozzle structure in the said resist coating device. It is a front view which shows a mode that the resist coating liquid is formed on the external appearance structure of a slit nozzle in the said resist coating device, and a board | substrate. It is sectional drawing which shows the structure of the nozzle refresh part with which the said resist coating apparatus is equipped. It is a perspective view which shows the structure of the slit nozzle washing | cleaning part integrated in the said nozzle refresh part. It is a perspective view which shows the structure of the said slit nozzle washing | cleaning part. It is sectional drawing which shows the structure of the washing nozzle and nozzle cover in this invention incorporated in the said nozzle refresh part.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  As shown in FIG. 1, the resist coating apparatus includes a floating stage 10 that floats a substrate to be processed, such as a glass substrate G for FPD, in the air by gas pressure, and a substrate G that floats in the air on the floating stage 10. A substrate transport mechanism 20 for transporting in the longitudinal direction (X direction) of the levitation stage; a slit nozzle 32 that is a coating nozzle elongated in the Y direction for supplying a resist solution to the upper surface of the substrate G transported on the levitation stage 10; The nozzle refreshing unit 42 refreshes the slit nozzle 32 between the coating processes.

  A large number of gas injection holes 12 for injecting a predetermined gas (for example, air) upward are provided on the upper surface of the levitation stage 10, and the substrate G is placed on the upper surface of the stage by the pressure of the gas injected from the gas injection holes 12. It is configured to rise to a certain height.

  The substrate transport mechanism 20 includes a pair of guide rails 22A and 22B extending in the X direction across the levitation stage 10, a pair of sliders 24 that can reciprocate along the guide rails 22A and 22B, and the levitation stage 10. A substrate holding member (not shown) such as a suction pad provided on the slider 24 so as to detachably hold both side ends of the substrate G is provided. The slider 24 is moved by a linear movement mechanism (not shown). By moving in the transport direction (X direction), the substrate G is floated and transported on the floating stage 10.

  The slit nozzle 32 crosses the top of the levitation stage 10 in the horizontal direction (Y direction) perpendicular to the transport direction (X direction), and is slit-shaped with respect to the upper surface (surface to be processed) of the substrate G passing immediately below it. The resist solution R is discharged in a strip shape from the discharge port. The slit nozzle 32 is configured to be movable up and down so as to be movable in the vertical direction (Z direction) integrally with a nozzle support member 28 that supports the nozzle by a nozzle lifting mechanism 26 including, for example, a ball screw mechanism and a guide member. ing.

  As shown in FIG. 2, the slit nozzle 32 includes a front lip 33F and a rear lip 33R extending in parallel with the nozzle longitudinal direction (Y direction), and a pair of lips 33F and 33R are abutted against each other to form a bolt (not shown). And have a slit-like discharge port 32a. The nozzle side surfaces 32f and 32r on both sides extending in parallel with the discharge port 32a of the slit nozzle 32 are formed in a tapered shape that gradually narrows from the top to the bottom toward the discharge port 32a. The slit nozzle 32 is connected via a resist supply pipe 30 to a resist supply unit (not shown) including a resist solution container and a liquid feed pump.

  A nozzle refresh unit 42 is provided above the levitation stage 10 adjacent to the slit nozzle 32. Details of the nozzle refresh unit 42 will be described later with reference to FIGS.

  Next, a resist coating operation in this resist coating apparatus will be described. First, a substrate G is carried into a carry-in area set on the front end side of the floating stage 10 via a substrate carry-in mechanism (not shown) from a previous unit, for example, a thermal processing unit (not shown), and is waiting there. The slider 24 holds and receives the substrate G. On the levitation stage 10, the substrate G receives the pressure of gas (for example, high-pressure air) ejected from the gas ejection holes 12 and keeps the levitation state in a substantially horizontal posture.

  In this way, the substrate G moves in a horizontal posture at a constant speed in the transport direction (X direction), and at the same time, the slit nozzle 32 discharges the resist solution toward the substrate G directly below at a predetermined pressure or flow rate, As shown in FIGS. 2 and 3, a coating film RM of a resist solution having a uniform film thickness is formed from the front end side to the rear end side of the substrate G.

  When the rear end of the substrate G passes under the slit nozzle 32, a resist coating film RM is formed on the entire surface of the substrate. Subsequently, the substrate G is then levitated and conveyed on the levitation stage 10 by the slider 24, and a subsequent unit (not illustrated) from the unloading area set at the rear end of the levitation stage 10 via a substrate unloading mechanism (not illustrated). Z)).

  FIG. 4 shows a configuration in the nozzle refresh unit 42. The nozzle refresh unit 42 has a nozzle bath 50 for keeping the discharge port of the slit nozzle 32 in an atmosphere of solvent vapor for the purpose of preventing drying, and the peripheral portion of the discharge port of the slit nozzle 32 (discharge port 32a, nozzle side surfaces 32f and 32r). A slit nozzle cleaning unit 52 is also provided. The nozzle bath 50 and the slit nozzle cleaning unit 52 are accommodated in the container 44.

  At the time of resist coating, not only the discharge port 32a but also the lower ends of the nozzle side surfaces 32f and 32r on both sides are wet with the resist solution R, and the resist solution is applied to the discharge port 32a and the lower ends of the nozzle side surfaces 32f and 32r after the resist coating process is completed. R dirt remains. Therefore, the slit nozzle 32 that has finished the coating process is first subjected to a cleaning process by the slit nozzle cleaning unit 52 and then waits in the nozzle bath 50.

  In order to place the slit nozzle 32 on each part (50, 52) in the nozzle refreshing part 42, the X-direction movement comprising a driving part driven by the control part (not shown), for example, a ball screw mechanism having a motor M, etc. The part 54 moves the entire nozzle refresh unit 42, that is, the container 44 in the substrate transport direction (X direction), and moves the slit nozzle 32 in the vertical direction (Z direction) by the nozzle lifting mechanism 26 (see FIG. 1).

  As shown in FIG. 5, the slit nozzle cleaning unit 52 is coupled to the Y-direction moving unit 60 via a joint member 62, and is parallel to the longitudinal direction of the slit nozzle 32 along the periphery of the discharge port of the slit nozzle 32. It has a carriage 64 that moves in the proper cleaning scanning direction (Y direction). The Y-direction moving unit 60 includes a rail 66 extending in the Y direction and a movable unit 68 that moves on the rail 66. The carriage 64 moves in the cleaning scanning direction (Y direction) after being aligned with the peripheral portion of the discharge port of the slit nozzle 32.

  The slit nozzle cleaning unit 52 includes a first wiping pad 72, a second cleaning unit 74, a second wiping pad 76, and a drying unit 78 in this order on the carriage 64, starting with the first cleaning unit 70 in the cleaning scanning direction. They are placed in a line. Each of the first and second cleaning units 70 and 74, the first and second wiping pads 72 and 76, and the drying unit 78 is detachably attached to the carriage 64 in a cassette manner.

  FIG. 6 shows a configuration of a main part of the slit nozzle cleaning unit 52 as viewed obliquely from the front of the cleaning scan.

  The first and second cleaning units 70 and 74 include block-like nozzle holding portions 70a and 74a each having a concave groove on the upper surface, and a plurality of pairs protruding from inner walls on both sides of the nozzle holding portions 70a and 74a (or A pair of cleaning nozzles 70b and 74b, and connection portions 70c and 74c connected to the cleaning nozzles 70b and 74b through flow paths in the nozzle holding portions 70a and 74a, respectively. The connection parts 70c and 74c are connected to a cleaning liquid supply pipe (not shown) from a cleaning liquid supply part (not shown), respectively.

  The drying unit 78 includes a block-shaped nozzle holding portion 78a having a concave groove on the upper surface, a plurality of pairs (or a pair) of drying nozzles 78b protruding from inner walls on both sides of the nozzle holding portion 78a, and a nozzle holding portion. And a connecting portion 78c connected to the drying nozzle 78b through a flow path in 78a. The connection part 78c is connected to a gas supply pipe (not shown) from a dry gas supply part (not shown).

  The first and second wiping pads 72 and 76 have V-shaped groove-like wiping surfaces 72d and 76d on the upper surfaces, respectively.

  To put the slit nozzle 32 on the slit nozzle cleaning unit 52, as described above, the entire nozzle refresh unit 42 is moved in the substrate transport direction (X direction) by the X direction moving unit 54 (see FIG. 4). The slit nozzle 32 is moved in the vertical direction (Z direction) by the nozzle lifting mechanism 26 (see FIG. 1). Then, both the nozzle side surfaces 32f and 32r of the slit nozzle 32 and the discharge port 32a are in contact with the V-shaped groove-shaped wiping surfaces 72d and 76d of the first and second wiping pads 72 and 76, respectively, with an appropriate and uniform pressure. The alignment between the slit nozzle 32 and the slit nozzle cleaning unit 52 is automatically performed.

  Next, the operation in the slit nozzle cleaning unit 52 will be described.

  In the slit nozzle cleaning unit 52, when the alignment with the slit nozzle 32 is completed, the Y-direction moving unit 60 (see FIG. 4) is maintained under the control of a control unit (not shown) while maintaining the alignment state. The carriage 64 moves at a constant speed in the cleaning scanning direction (Y direction). Here, the slit nozzle 32 has just finished the resist coating process, and the periphery of the discharge port (discharge port 32a, nozzle side surfaces 32f and 32r) is contaminated with the resist solution R.

  Almost simultaneously with the start of the scanning movement of the carriage 64, all the units placed on the carriage 64, that is, the first and second cleaning units 70 and 74, the first and second wiping pads 72 and 76, and the drying unit 78 are displayed. Starts each operation. More specifically, the first cleaning unit 70 discharges a cleaning liquid such as a thinner liquid from the cleaning nozzle 70b at the head position on the carriage 64, and discharge nozzle peripheral portions (discharge ports 32a, nozzle side surfaces 32f and 32r). ) In the cleaning scanning direction (Y direction).

  The first wiping pad 72 is cleaned immediately after the first cleaning unit 70 by sliding the V-shaped groove 72d in the periphery of the discharge port of the slit nozzle 32 (discharge port 32a, nozzle side surfaces 32f, 32r). Move in the scanning direction (Y direction).

  The second cleaning unit 74 immediately follows the first wiping pad 72 and discharges a cleaning liquid, for example, a thinner liquid from the cleaning nozzle 74b, to the discharge port peripheral portion (discharge port 32a, nozzle side surfaces 32f, 32r) of the slit nozzle 32. It moves in the cleaning scanning direction (Y direction) while spraying the thinner.

  The second wiping pad 76 is cleaned immediately after the second cleaning unit 74 by bringing the V-shaped groove 76d into sliding contact with the discharge port peripheral portion (discharge port 32a, nozzle side surfaces 32f, 32r) of the slit nozzle 32. Move in the scanning direction (Y direction).

  Immediately following the second wiping pad 76, the drying unit 78 discharges a drying gas such as N2 gas from the drying nozzle 78b, and discharges it to the periphery of the discharge port of the slit nozzle 32 (discharge port 32a, nozzle side surfaces 32f and 32r). It moves in the cleaning scanning direction (Y direction) while spraying N2 gas.

  A series of processes (first cleaning → first cleaning) at the discharge port peripheral portion of each position in the cleaning scanning direction (Y direction) of the slit nozzle 32 over the entire length from one end to the other end of the slit nozzle 32. Wiping → second cleaning → second wiping → drying).

  In this way, the resist contamination around the discharge port (discharge port 32a and nozzle side surfaces 32f and 32r) is completely removed at each position over the entire length of the slit nozzle 32 by one (one-way) cleaning scan. Therefore, when the carriage 64 arrives at the end point set near the other end of the slit nozzle 32, the nozzle cleaning process ends there. Immediately after that, under the control of a control unit (not shown), the nozzle lifting mechanism 38 (see FIG. 1) and the X-direction moving unit 54 (see FIG. 4) are operated, and the slit nozzle 32 is next to the slit nozzle cleaning unit 52. To the nozzle bath 50.

  Next, the cleaning nozzle and nozzle cover in the coating nozzle cleaning apparatus according to the present invention will be described.

  As shown in FIG. 7, the nozzle refresh unit 42 includes a wiping pad cleaning nozzle 100 for cleaning the first wiping pad 72 and the second wiping pad 76. The wiping pad cleaning nozzle 100 is disposed above the first wiping pad 72 and the second wiping pad 76, and is a cleaning fluid such as a cleaning liquid, specifically a solvent, toward the V-shaped groove-shaped wiping surfaces 72d and 76d. Discharge the thinner. The wiping pad cleaning nozzle 100 can discharge the cleaning liquid in a spray form.

  A nozzle cover 101 is disposed above the wiping pad cleaning nozzle 100. Further, the nozzle cover 101 is located at the upper part of the container 44. The nozzle cover 101 and the container 44 cooperate to keep the nozzle refreshing section 42 in a closed space (closed space) 102. Further, in order to exhaust the atmosphere of the closed space 102, the nozzle cover 101 is provided with an exhaust port 103. An exhaust means (not shown) is connected to the exhaust port 103 so that the atmosphere of the closed space 102 can be exhausted from the exhaust port 103.

  The nozzle cover 101 has an opening 104 through which the slit nozzle 32 enters and exits the space 102. An air curtain nozzle 105 is disposed around the opening 104, for example, at the top. The air curtain nozzle 105 can form an air curtain by discharging air or a gas such as N 2 gas. The opening 104 is covered and blocked by an air curtain formed by the air curtain nozzle 105. Therefore, it is possible to prevent the atmosphere in the space 102 from leaking outside the space 102 through the opening.

  Both end portions in the longitudinal direction of the nozzle cover 101 are closed by end walls (not shown), but slits (not shown) communicating with the openings 104 are provided on the end walls. The slit nozzle 32 can be moved through.

  Next, the operation of the wiping pad cleaning nozzle 100 according to the present invention will be described. When the number of cleaning operations of the slit nozzle 32 is repeated, the resist solution gradually begins to adhere and accumulate on the first wiping pad 72 and the second wiping pad 76. Therefore, when the cleaning operation (wiping operation) of the slit nozzle 32 reaches a predetermined number of times, the cleaning liquid is discharged from the wiping pad cleaning nozzle 100 and the first wiping pad 72 and the second wiping pad 76 are cleaned. The wiping pad cleaning nozzle 100 discharges the cleaning liquid toward the V-shaped groove-shaped wiping surfaces 72d and 76d.

  When the cleaning liquid is discharged from the wiping pad cleaning nozzle 100, the Y-direction moving unit 60 is also operated. Then, the first wiping pad 72 and the second wiping pad 76 are moved from the wiping pad cleaning nozzle 100 while the first wiping pad 72 and the second wiping pad 76 are moved relative to the wiping pad cleaning nozzle 100 to discharge the cleaning liquid. The wiping pad 76 is cleaned.

  However, when the cleaning liquid is discharged from the wiping pad cleaning nozzle 100, mist of the cleaning liquid is generated. When the generated mist adheres to the coating surface of the substrate G, it causes a coating failure.

  Therefore, in the present invention, the nozzle refresh unit 42 is kept in the closed space 102 by the nozzle cover 101 and the container 44. In addition, the atmosphere of the closed space 102 can be exhausted. Therefore, since the generated mist can be prevented from adhering to the coating surface of the substrate G, the yield of products such as FPD can be prevented from being lowered.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications or changes can be made within the scope of the technical idea.

  In the present embodiment, the cleaning liquid is used as the cleaning fluid, but the present invention is not limited to the cleaning liquid. As the cleaning fluid, a fluid such as a gas such as air or nitrogen gas may be used.

  In addition, a plurality of wiping pad cleaning nozzles 100 are disposed on the first wiping pad 72 and the second wiping pad 76, respectively, and the first wiping pad 72 and the second wiping pad 76 are operated without operating the Y-direction moving unit 60. Washing may be performed.

  The cleaning nozzle 100 discharges the cleaning liquid in a spray form, but may be configured to discharge, for example, in a curtain form, a shower form, a columnar form, or the like.

  In addition, although the first wiping pad 72 and the second wiping pad 76 are provided, only the first wiping pad 72 may be provided without providing the second wiping pad 76. Alternatively, in addition to the first wiping pad 72 and the second wiping pad 76, more wiping pads may be provided.

  Further, the opening 104 may not be provided, and instead, an elevating mechanism for elevating and lowering the wiping pad cleaning nozzle 100 and the nozzle cover 101 is provided. The slit nozzle 32 is moved into the space 102 with the wiping pad cleaning nozzle 100 and the nozzle cover 101 raised. Thereafter, the space 102 may be closed by lowering the nozzle cover 101.

  Further, the closed space 102 may be exhausted at all times, or may be exhausted only at a predetermined timing in order to reduce the exhaust force.

  Instead of the slit nozzle 32, another long nozzle having a plurality of fine holes arranged in the Y direction may be used.

  Further, a wiping pad drying nozzle (not shown) may be provided on the side of the wiping pad cleaning nozzle 100. A drying fluid such as air or nitrogen gas is supplied from a wiping pad drying nozzle (not shown) toward the first wiping pad 72 and the second wiping pad 76. The wiping pad cleaning nozzle 100 may also serve as the wiping pad drying nozzle described above, or the cleaning fluid and the drying fluid may be switched and discharged from the wiping pad cleaning nozzle 100.

  In the above embodiment, the substrate floating type slit coater has been described as an example. However, the present invention is not limited to this type of slit coater. For example, a nozzle coater type slit coater that moves the slit nozzle in one horizontal direction perpendicular to the longitudinal direction of the nozzle while discharging the resist solution from the slit nozzle to the substrate fixed on the stage. But you can. Also, a stage moving type slit coater that moves the stage in one horizontal direction perpendicular to the longitudinal direction of the nozzle while discharging the resist solution from the slit nozzle to the substrate fixedly placed on the stage. Is also applicable.

  As the coating solution in the present invention, in addition to the resist solution, for example, a coating solution such as an interlayer insulating material, a dielectric material, and a wiring material can be used, and various chemical solutions, developing solutions, rinse solutions, and the like are also possible. The substrate to be processed in the present invention is not limited to an LCD substrate, and other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates and the like are also possible.

G Substrate 32 Slit nozzle 42 Nozzle refresh unit 44 Container 52 Slit nozzle cleaning unit 64 Carriage 72 First wiping pad 72d Wiping surface 76 Second wiping pad 76d Wiping surface 100 Wiping pad cleaning nozzle 101 Nozzle cover 102 Closed space 103 Exhaust port 104 Opening 105 Air curtain nozzle

Claims (8)

A carriage that moves in a horizontal scanning direction parallel to the longitudinal direction of the coating nozzle along the periphery of the discharge port of the elongated coating nozzle that applies the processing liquid to the substrate;
A coating nozzle cleaning device comprising: a wiping pad installed on the carriage and slidably contacting the discharge nozzle peripheral portion of the coating nozzle while moving in the scanning direction to wipe off the processing liquid adhering to the discharge port peripheral portion In
A coating nozzle cleaning device, comprising: a wiping pad cleaning nozzle that is disposed on an upper part of a container that houses the carriage and that discharges a cleaning fluid toward a wiping surface of the wiping pad to clean the wiping surface.   The coating nozzle cleaning apparatus according to claim 1, wherein the cleaning fluid is discharged in a spray form.   The coating nozzle cleaning device according to claim 1 or 2, wherein the wiping pad cleaning nozzle is formed to be movable relative to the wiping pad.   The coating nozzle cleaning apparatus according to claim 1, wherein a cleaning liquid is used as the cleaning fluid.   The coating nozzle cleaning apparatus according to claim 1, wherein a gas is used as the cleaning fluid.   6. A nozzle cover that is disposed above the wiping pad cleaning nozzle and that forms a closed space around the wiping pad and the wiping pad cleaning nozzle in cooperation with the container. A coating nozzle cleaning device according to claim 1.   The coating nozzle cleaning apparatus according to claim 6, further comprising an exhaust port for exhausting the inside of the closed space.   The nozzle cover includes an opening for the application nozzle to enter and leave the closed space, and an air curtain nozzle for blocking the opening from the outside of the closed space. Or the coating nozzle cleaning device according to 7.

Images