TWI317144B - - Google Patents
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- Publication number
- TWI317144B TWI317144B TW095142791A TW95142791A TWI317144B TW I317144 B TWI317144 B TW I317144B TW 095142791 A TW095142791 A TW 095142791A TW 95142791 A TW95142791 A TW 95142791A TW I317144 B TWI317144 B TW I317144B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- liquid
- processing
- posture
- developer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005377670A JP4472630B2 (ja) | 2005-12-28 | 2005-12-28 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200729291A TW200729291A (en) | 2007-08-01 |
TWI317144B true TWI317144B (ja) | 2009-11-11 |
Family
ID=38214316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095142791A TW200729291A (en) | 2005-12-28 | 2006-11-20 | Handling apparatus of substrate |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4472630B2 (ja) |
KR (1) | KR100857635B1 (ja) |
CN (1) | CN100483618C (ja) |
TW (1) | TW200729291A (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008277556A (ja) * | 2007-04-27 | 2008-11-13 | Shibaura Mechatronics Corp | 基板の処理装置 |
KR100935474B1 (ko) * | 2008-02-27 | 2010-01-06 | 주식회사 케이씨텍 | 기판 처리장치 |
KR100935473B1 (ko) * | 2008-02-27 | 2010-01-06 | 주식회사 케이씨텍 | 기판 처리장치 |
KR100934777B1 (ko) | 2008-02-27 | 2009-12-31 | 주식회사 케이씨텍 | 기판 처리장치 |
JP5270263B2 (ja) * | 2008-08-29 | 2013-08-21 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP2010240550A (ja) * | 2009-04-03 | 2010-10-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2012186188A (ja) * | 2009-07-08 | 2012-09-27 | Sharp Corp | エッチング装置および基板処理方法 |
TWI407270B (zh) * | 2009-12-30 | 2013-09-01 | Au Optronics Corp | 顯影設備 |
JP5437134B2 (ja) * | 2010-03-31 | 2014-03-12 | 大日本スクリーン製造株式会社 | 塗布装置 |
CN103801536B (zh) * | 2012-11-13 | 2016-02-17 | 沈阳芯源微电子设备有限公司 | 一种晶片清洗装置 |
CN103207543A (zh) * | 2013-04-19 | 2013-07-17 | 京东方科技集团股份有限公司 | 一种显影方法 |
CN103324038A (zh) * | 2013-06-25 | 2013-09-25 | 京东方科技集团股份有限公司 | 一种显影装置及显影方法 |
KR102134439B1 (ko) * | 2013-08-30 | 2020-07-15 | 세메스 주식회사 | 기판 처리 장치, 그리고 기판 처리 장치를 이용한 기판 처리 방법 |
CN103913959B (zh) * | 2014-03-27 | 2017-09-26 | 京东方科技集团股份有限公司 | 一种光刻胶的剥离装置及剥离方法 |
JP7060415B2 (ja) * | 2018-03-12 | 2022-04-26 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
KR102125793B1 (ko) * | 2018-04-20 | 2020-06-25 | 세메스 주식회사 | 기판 처리 장치 |
JP7370884B2 (ja) | 2020-01-31 | 2023-10-30 | 株式会社Screenホールディングス | 基板処理装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0654306B1 (en) * | 1993-05-27 | 2001-08-16 | Dai Nippon Printing Co., Ltd. | Method of and apparatus for application of liquid |
TW334359B (en) | 1995-12-04 | 1998-06-21 | Dai Nippon Scolin Seizo Kk | Apparatus and method for treating substrates |
KR100343044B1 (ko) * | 1997-08-28 | 2002-10-25 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치및처리방법 |
TWI226077B (en) * | 2001-07-05 | 2005-01-01 | Tokyo Electron Ltd | Liquid processing apparatus and liquid processing method |
-
2005
- 2005-12-28 JP JP2005377670A patent/JP4472630B2/ja not_active Expired - Fee Related
-
2006
- 2006-11-20 TW TW095142791A patent/TW200729291A/zh not_active IP Right Cessation
- 2006-12-15 CN CNB2006101646806A patent/CN100483618C/zh not_active Expired - Fee Related
- 2006-12-28 KR KR1020060136484A patent/KR100857635B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20070070118A (ko) | 2007-07-03 |
JP4472630B2 (ja) | 2010-06-02 |
JP2007180299A (ja) | 2007-07-12 |
KR100857635B1 (ko) | 2008-09-08 |
CN100483618C (zh) | 2009-04-29 |
CN1992158A (zh) | 2007-07-04 |
TW200729291A (en) | 2007-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |