TW200403787A - Substrate treatment device - Google Patents

Substrate treatment device Download PDF

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Publication number
TW200403787A
TW200403787A TW092106948A TW92106948A TW200403787A TW 200403787 A TW200403787 A TW 200403787A TW 092106948 A TW092106948 A TW 092106948A TW 92106948 A TW92106948 A TW 92106948A TW 200403787 A TW200403787 A TW 200403787A
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TW
Taiwan
Prior art keywords
liquid
substrate
roller
processing
transfer
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Application number
TW092106948A
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Chinese (zh)
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TWI225676B (en
Inventor
Mitsuaki Yoshitani
Nobuo Yanagisawa
Koji Toyota
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Dainippon Screen Mfg
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Publication of TW200403787A publication Critical patent/TW200403787A/en
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Publication of TWI225676B publication Critical patent/TWI225676B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The present invention provides a device capable of preventing a carriage roller or the internal wall face of a treatment tank from being contaminated by a treatment solution containing solidification components at the time of treating a substrate by carrying the substrate in the treatment tank, and supplying the treatment solution to the substrate. A solution storage container 12 is disposed immediately under a carriage roller 10 brought into contact with the lower face side of a substrate 1 for supporting and carrying the substrate. A developing solution is supplied to the solution storage container. The solution storage container is constantly filled with the developing solution 14. A part of the peripheral face of the carriage roller is immersed in the developing solution filled in the solution storage container.

Description

200403787 玖、發明說明: 【發明所屬之技術領域】 本發明係關於一種一面將平面面板顯示器用玻璃基板、 半導體晶圓、印刷電路板等基板每片用並排設置的多數搬、 運滾筒支持搬運,一面對於基板施以洗滌、顯影、蝕刻、-剝膜等處理的基板處理裝置。 【先前技術】 在例如在基板上形成配線圖案的製程,使形成於基板表 面的光阻膜顯影時,使用滾筒搬運式顯影處理裝置,其係 一面將基板每片橫放用搬運滚筒搬運,一面在基板上盛顯 5V液盛液之後,特定時間經過後使顯影反應停止的方式 。圖8模式顯示此顯影處理裝置概略結構的一例。 圖8所示的顯影處理裝置具備處理槽2,其具有人口_ :3a及出口侧開口3b’在處理槽2内部並排配設多數搬運滚 筒4a 4b、4e。而且,基板1係通過人口側開卩以搬入處理 槽2内,為搬運滾筒4a〜4e所支持而向水平方向搬運,從處理 槽2内通過出口側開口3b搬出,送到其次的水洗處理槽(未 圖示)。在處理槽2内部的人口侧開口配設顯影液吐 出噴嘴5。此外’在處理槽2内部的出口侧開口扑附近如在 搬運滾筒4c正上面和搬運滾筒钓對向般地配設除液滚筒6 ,其接觸為搬運滾筒4e所支持而搬運的基板丨上面側。 對於這種結構的顯影處理裝置,在表面形成曝光完的光 阻胰的基板m過配設於處理槽2的入口側開口h附近的顯 影液吐出嘴嘴5正下面位置之際’將由顯影液吐出喷嘴^ 83883.doc 200403787 端面的狹縫狀吐出口吐出的顯影液7盛在表面上。被盛液的 基板1在為搬運滾筒4a、4b所搬運的期間,光阻膜的顯影反 應進行。基板1搬運到處理槽2的出口側開口%附近來,就 用除液滾筒6從基板!上除去顯影液7,其後由處理槽2内搬. 出;二後基板1送到其次的水洗處理槽,使光阻膜的顯影-反應完全停止。 【發明所欲解決之問題】 在如上述的顯影處理裝置,顯影液7,特別是含有光阻的 〜、〜液7彳< 基板1表面上灑落,其顯影液就會附著在搬運滾 筒4a〜4c周面或處理槽2内壁面等。此外,除液滾筒6周面成 為含有光阻的顯影液7經常附著的狀態。附著於這些構件的 顯影液乾燥,光阻成分就凝固而污染構件。因此,會產生 以下問4 ·產i粒子(particle)而污染基板以成為引起感測 器等機件錯誤動作的原因。另一方面,為了防止產生這些 問題’需㈣繁進行處理槽2内部的清掃作業,但會引起處 理效率降低或作業繁雜。 此又’採取和上述方式不同的方式,即在處理槽内設置噴 角(P ay nozzle),;f疋噴〃角使顯影液等如擴散到處理槽内部 全體般地霧狀噴出的顯影方式時,搬運滾筒或處理槽内壁 面感"4态等表面因顯影液等而經常成為沾濕的狀態,所 以難以產生凝固光阻的污染’上述問題難以產生。然而, 在顯影液等的霧難以周到的地方設置搬運滾筒等時,還是 會因含有光阻的顯影液而產生搬運滾筒等的污染。此外, 此方式基本上在需要抑制霧產生的製程不能採用。 83883.doc 200403787 本發明係鑑於如以上的情況所完成的,其目的在於提供 一種在處理槽内一面搬運基板,一面對於基板供應處理液 而進行基板處理時,可防止因含有凝固成分的處理液而污 染搬運滾筒或處理槽内壁面等,可防止基板污染或機器錯 誤動作等的基板處理裝置。 【發明内容】 關於申請專利範圍第1項之發明,係在處理槽内一面搬運 基板’一面以處理液處理基板的基板處理裝置,其特徵在 於:在接觸基板下面側支持基板而搬運的搬運滾筒正下面 配設集液容器’具備液供應機構,其供應濕潤用液到集液 容器内而經常以濕潤用液裝滿集液容器内,預先使前述搬 運滾筒周面一部分浸潰於裝滿於前述集液容器内的濕潤用 液中者。 關於申請專利範圍第2項之發明,係在處理槽内一面搬運 基板’一面以處理液處理基板的基板處理裝置,其特徵在 於·接近接觸基板下面側支持基板而搬運的搬運滾筒且比 為搬運滾筒所支持的基板高度位置在下方如吐出口和搬運 滾筒對向般地配設液吐出機構,具備液供應機構,其供應 濕潤用液到其液吐出機構者。 關於申請專利範圍第3項之發明,係在處理槽内一面搬運 基板,一面以處理液處理基板的基板處理裝置,其特徵在 於·接觸基板下面侧支持基板而搬運的搬運滾筒附近且比 為搬運滾筒所支持的基板高度位置在下方,如配設成在前 述搬運滾筒正上面和搬運滾筒對向、接觸支持於搬運滾筒 Λ 83883.doc 200403787 而被搬運的基板上面侧的上部滾筒和吐出口對向般地配設 液吐出機構,具備液供應機構,其供應濕潤用液到其液吐 出機構者。 關於申請專利範圍第4項之發明,係在申請專利範圍第/ 項之基板處理裝置,其特徵在於:在上方位置和下方位置-之間可移動地支持前述搬運滾筒及前述上部滾筒,前述液 吐出機構配設成搬運滾筒及上部滾筒位於上方時,比為搬 運滾靖所支持的基板咼度位置位於下方,搬運滾筒及上部 浪同位於下方時,前述搬運滾筒位於和比其配設於基板搬 運方向的上游側的別的搬運滾筒相同的高度,同時控制成 基板不接觸搬運滾筒及上部滾筒者。 關於申請專利範圍第5項之發明,係在申請專利範圍第4 項之基板處理裝置,其特徵在於··前述搬運滾筒及前述上 述滾筒支持成以搬運滾筒的軸心線的延長線上的一點為中 ^而在垂直面内搖動,使其在成為傾斜姿勢的上方位置和 成為水平姿勢的下方位置之間移動者。 關於申請專利範圍第6項之發明,係在申請專利範圍第4 或5項之基板處理裝置,其特徵在於:前述搬運滾筒和前述 上4滾筒為除液滾筒,在其除液滾筒和前述別的搬運滾筒 之間配设多數搬運滾筒,其支持成和除液滾筒一體在上方 位置和下方位置之間移動,接觸基板下面側支持基板而搬 運者。 關於申請專利範圍第7項之發明,係在申請專利範圍第2 土 6員中任一項之基板處理裝置,其特徵在於:前述液供應 83883.doc 200403787 機構以攸其吐出口向前述搬 ^, j、孤運來琦吐出的濕潤用液不因液 灰起而飛散的程度的低壓供岸 -s伢L濕,閏用硬到前述液吐出機構 f 〇 關於申請專利範園第8項之發明,係在申請專利範圍第2 土員中任-項之基板處理裝置,其特徵在於:在搬運基板 基板的期間中,前述搬運滾筒未和基板下面側接觸 :攸則述液吐出機構的吐出口吐出濕潤職,搬運滾筒和 基板下面側接觸時不從液吐出機構的吐出口吐出濕潤用液 瓜地從可述液供應機構間歇地供應濕潤用液到液吐出機構 者0 關於申請專利範圍第9項之發明,係在申請專利範圍第2 至8項中任-項之基板處理裝置,其特徵在於:在未搬運基 板的期間中’從前述液供應機構每一定時間間歇地供應濕 潤用液到前述液吐出機構者。 關於中請專利範圍第_之發明,係在處理槽内一面搬 運基板 面以處理液處理基板的基板處理裝置,其特徵 在於:將吐出濕潤用液到前述處理槽傾斜的内底面上的液 吐出機構配設於内底面的傾斜方向上部,具備液供應機構 ,其供應濕潤用液到其液吐出機構者。 在關於申請專利範圍第1項之發明之基板處理裝置方面 ,k液供應機構供應濕潤用液到集液容器内,經常以濕潤 用液裝滿集液容器内,使搬運滾筒周面一部分浸潰於裝滿 於其集液容器内的濕潤用液中。藉此,搬運滚筒周面因濕 潤用液而經常成為沾濕的狀態。因此,即使處理液,例如 83883.doc -10- 200403787 含有光阻的顯影液從基板表面上灑落而附著於搬運滾筒周 面,顯影液也不會乾燥’所以光阻成分不會凝固。因此, 可避免因凝固的光阻而污染搬運滾筒。此外,由於只是使 搬運滾筒浸潰於裝滿於集液容器内的濕潤用液中,所以不 擔心產生㈣起。因此’即使—面使例如含有光阻的顯影 液循環…面再利用作為濕潤用液之類的情況,也不會因 液濺起而含有光阻的顯影液附著於基板,污染基板,或者 含有光阻的顯影液附著於感測器等機件,引起錯誤動作。 在關於申請專利範圍第2項之發明之基板處理裝置方面 ,藉由液吐出機構的吐出口向搬運滾筒吐出濕潤用液,搬 運浓筒因濕潤用液而經常成為沾濕的狀態。因此,即使處 液例如έ有光阻的顯影液從基板表面上灑落而附著於 搬運滾筒,顯影液也不會乾燥,所以光阻成分不會凝固。 因此,可避免因凝固的光阻而污染搬運滾筒。此外,液吐 出機構接近搬運滾筒配設,所以難以產生液濺起,濕潤用 液不會飛散到廣大範圍。因.此,即使一面使例如含有光阻 的顯影液循環,-面再利用作為濕濁用液之類的情況,也 不會因液濺起而含有光阻的顯影液附著於基板,污染基板 ,或者含有光阻的顯影液附著於感測器等機件,引起錯誤 動作。此外,液吐出機構比基板高度位置配設於下方,所 、Ρ使έ有光阻的顯影液從液吐出機構的吐出口滴落,顯 影液也不會附著於基板上。 在關於申凊專利範圍第3項之發明之基板處理裝置方面 ,藉由從液吐出機構的吐出口向配設於搬運滾筒正上面的 83883.doc -11- 200403787 上部滾筒吐出濕潤用液,上部滾 沾濕的狀態,同時藉由濕潤用液順著:= 面’搬運滾筒也因濕潤用液而經常成為沾濕的 接:二使處理液’例如含有光阻的顯影液附著於 :二板上面侧的上部滚筒,或者即使顯影液從基板表面 雇洛而附著於搬運滾筒,顯影液也不會乾燥,所以光阻 ^分不會凝m’可避免因凝固的光阻而冷染上部滾 同及搬運滚筒。此外’液吐出機構配設於搬運滾筒附近, 所以難以產生濺起’濕潤用液不會飛散到廣大範圍。因此 ,即使-面使例如含有光阻的顯影液循環,一面再利用作 旦為濕潤用液之類的情況’也不會因液濺起而含有光阻的顯 以附者於基板,污染基板’或者含有光阻的顯影液附著 於感測器等機件,引起錯誤動作。此外’液吐出機構比基 板向度位置配設於下方’所以即使含有光阻的顯影液從液 吐出機構的吐出口滴落,顯影液也不會附著於基板上。 在關於申請專利範圍第4項之發明之基板處理裝置方面 搬運浪筒及上邵滾筒位於上方時,液吐出機構比基板高 度位置位於下方,所以即使處理液,例如含有光阻的顯影 液從液吐出機構的吐出口滴落,顯影液也不會附著於基板 上另一方面,搬運滾筒及上部滚筒位於下方時,基板不 接觸搬運滾筒及上部滾筒,所以即使含有光阻的顯影液從液 吐出機構的吐出口滴落,也不擔心顯影液附著於基板上。 在關於申請專利範圍第5項之發明之基板處理裝置方面 ,搬運滚筒及上部滾筒藉由以搬運滾筒的軸心線的延長線 83883.doc • 12 - 200403787 上的一點為中心而在垂直面内搖動,在上方位置和下方位 置<間移動。而且,在上方位置,搬運滾筒及上部滾筒成 為傾斜妥勢,所以為搬運滾筒所支持的基板也傾斜,因此 處理液從基板表面上流下來。 · 在關於申明專利範圍第6項之發明之基板處理裝置方面· ,利用除液滾筒從為搬運滾筒所支持搬運而來的基板除去 j理液,例如含有光阻的顯影液,當時即使含有光阻的顯 心液附著於除液滾筒周面,除液滾筒也因濕潤用液而經常 成為沾濕的狀態,所以顯影液不會乾燥,因此在除液滾筒 周面,光阻成分不會凝固。 在關於申請專利範圍第7項之發明之基板處理裝置方面 ,從液供應機構到液吐出機構以從液吐出機構的吐出口向 搬運滾筒吐出的濕潤用液不因液濺起而飛散的程度的低壓 供應濕潤用液,所以更難產生液濺起,濕潤用液不會飛散 到廣大範圍。 在關於申請專利範圍第8項之發明之基板處理裝置方面 ,在搬運基板而處理基板的期間中,搬運滾筒未和基板下 面侧接觸時從液吐出機構的吐出口吐出濕潤用液,搬運滾 同和基板下面侧接觸時不從液吐出機構的吐出口吐出濕潤 用液’所以一面使例如含有光阻的顯影液循環,一面再利 用作為濕潤用液之類的情況,不擔心由液吐出機構的吐出 口吐出的含有光阻的顯影液附著於基板而污染基板。 在關於申請專利範圍第9項之發明之基板處理裝置方面, 在未搬運基板的期間中,從液供應機構到液吐出機構每一定 83883.doc -13- 200403787 時間間歇地供應濕潤用液,所以搬運滚筒或上部滾筒及搬 運滾筒以濕潤用液保持在沾濕的狀態,同時可減低濕潤用 液的使用量。 在關於申請專利範圍第10項之發明之基板處理裝置方面 ,從液吐出機構到處理槽的内底面的傾斜方向上部吐出濕 潤用液,其所吐出的濕潤用液沿著内底面的傾斜在内底面 上流下,所以内底面全體因濕潤用液而經常成為沾濕的狀 態。因此,即使處理液,例如含有光阻的顯影液從基板表 面上灑落到内底面上,顯影液也不會乾燥,所以光阻成分 不會凝固。因此,可避免因凝固的光阻而污染處理槽的内 底面。 【實施方式】 以下,就本發明的較佳實施形態一面參考圖丨至圖7,一 面加以說明。 圖1顯示第一發明實施形態的一例,係以一部分截面顯示 為基板處理裝置,例如顯影處理裝置的構成單元之一的搬 運滾筒的一個的側面圖。關於顯影處理裝置的全體結構, 已根據圖8上述,所以省略其說明,圖1所示的搬運滾筒1 〇 係圖8所示的顯影處理裝置的多數搬運滾筒4卜軋中與配置 於處理槽2中間左右的搬運滾筒扑對應者。 搬運滾筒10形成其周面遍及基板i下面側的寬度方向全 體接觸的圓柱狀。此搬運滾筒1〇具有以下功能:支持基板1 而搬運,同時藉由一面遍及基板丨下面侧的寬度方向全體接 觸,一面旋轉,洗滌基板下面側。在搬運滾筒1〇的正下面 83883.doc -14- 200403787 配"又集液槽12。在集液槽12内收容從液供應源為送給泵15 所供應的濕潤用液,例如從基板丨表面上流下到處理槽底部 而回數到回收槽(未圖示從回收槽為送給系15所送液的 顯影液14。連續供應顯影液到集液槽12内,集液槽以内為. 經常以顯影液14裝滿的狀態,從集液槽12上部溢出的顯影· 液被回收後,被循環使用。而且,使搬運滾筒1〇周面一部 分浸潰於裝滿於集液槽12内的顯影液丨4中。 具備圖1所示的結構的裝置使搬運滾筒1〇周面一部分浸 /貝於裝滿於集液槽12内的顯影液14中,所以搬運滾筒1〇周 面因顯影液14而經常成為沾濕的狀態。因此,即使含有光 阻的顯影液從基板1表面上灑落而附著於搬運滾筒周面,也 不會顯景> 液在搬運滾筒1 〇周面乾燥而光阻成分凝固。因此 ’不擔心因凝固的光阻而污染搬運滚筒10。此外,只是使 板運滾筒10浸潰於裝滿於集液槽12内的顯影液14中,所以 無產生液濺起之虞。因此,不產生因液濺起而含有光阻的 頭影液附著於基板1,污染基板1,或者含有光阻的顯影液 附奢於感測器等機件,引起錯誤動作。 其次,圖2顯示第二發明實施形態的一例,係顯示為顯影 處理裝置的構成單元之一的搬運滾筒的一個的側面圖。此 圖2所示的搬運滾筒16係圖8所示的顯影處理裝置的多數搬 運滾筒4a〜4c中與除了分別配置於處理槽2中間左右及出口 側開口 3b附近的搬運滾筒4b、4c之外的大部分的搬運滚筒 4a對應者。 搬運滾甸16為圓板形’ 一對固定於旋轉支軸1 $的兩端部 83883.doc -15- 200403787 ’或者多數個,例如在旋轉支軸18的兩端部及中央部三個 固定於旋轉支軸18。而且,接近此搬運滾筒16的位置且比 以板運滾同16支持的基板1南度位置在下方的位置如吐出 口 22和搬運滾筒16對向般地配設液吐出噴嘴2〇。和圖i同樣 ,例如從基板1表面上流下到處理槽底部而回收到回收槽的 顯影液從回收槽為送給泵所供應給液吐出喷嘴2〇。此時,供 應顯影液到液吐出喷嘴20的壓力設定在從吐出口 22向搬運 滾筒16吐出的顯影液14不因液濺起而飛散的程度的低壓。 從液吐出噴嘴20的吐出口 22向搬運滾筒16的顯影液14的 吐出係在一般搬運基板1,一面處理的期間中,搬運滾筒工6 未和基板1下面側接觸且基板丨也不存在於其搬運滾筒16附 近時進行,搬運滾筒16和基板1下面側接觸時或基板1存在 於附近時不從液吐出噴嘴2〇的吐出口22吐出顯影液。藉由 如此間歇地進行顯影液的吐出,在一面使含有光阻的顯影 液循% ’一面再利用之類的情況,可消除從液吐出噴嘴2〇 的吐出口 22吐出含有光阻的顯影液或其飛沫附著於基板1 而污k基板1之虞。另一方面,在未搬運基板1的期間中, 從液吐出噴嘴20的吐出口 22向搬運滾筒16的顯影液14的吐 出係每一定時間間歇地進行。藉由如此每一定時間間歇地 進行顯影液的吐出,未進行基板1處理的期間也將搬運滚筒 16保持在沾濕的狀態而可防止光阻成分的凝固,同時可減 低顯影液的使用量。 具備圖2所示的結構的裝置藉由液吐出噴嘴20的吐出口 22向搬運滾筒16吐出顯影液14,搬運滾筒16因顯影液“而 83883.doc 200403787 經#成為沾濕的狀態。因此,即使例如含有光阻的顯影液 從基板1表面上灑落而附著於搬運滾筒16,顯影液也不會乾 燥,所以光阻成分不凝固。因此,可防止因凝固的光阻而 污染搬運滾筒16。此外,從液吐出噴嘴2〇的吐出口 22以低· 壓吐出顯影液14且從搬運滾筒16的接近位置向搬運滾筒16 · 吐出顯影液14,所以難以產生液濺起,顯影液14不會飛散 到廣大範圍。因此,即使一面使含有光阻的顯影液循環, 一面再利用之類的情況,也不會含有光阻的顯影液因液濺 起而污染基板1,或者附著於感測器等機件而引起錯誤動作 。此外,液吐出噴嘴20比基板1高度位置配設於下方,所以 即使含有光阻的顯影液從吐出口 22滴落,也不擔心其顯影 液附著於基板1上。 此外’圖3為顯示弟一發明別的實施形態的搬運滾筒的侧 面圖。此圖3所示的實施形態係斜向下地設置液吐出噴嘴2〇 的吐出口22。如圖2所示的實施形態,吐出口22成為向上般 地配置液吐出噴嘴20,則使來自吐出口22的液吐出口停出 時,不擔心液從吐出口 22滴落,對此在圖3所示的實施形態 ’有液從吐出口 22滴落的可能性。但是,液吐出嗜嘴2〇比 以二點鏈線L所示的基板1高度位置配於下方,所以不擔心 從吐出口 22滴落的含有光阻的顯影液附著於基板i上。 其次,圖4顯示第三發明實施形態的一例,係顯示為顯影 處理裝置的構成單元之一的搬運滾筒及除液滾筒的側面圖 。此圖4所示的板運滾商24係圖8所示的顯影處理裝置的多 數搬運滾筒4a〜4c中與配置於處理槽2的出口側開口讣附近 83883.doc •17- 200403787 的搬運滾筒4c對應者。 如在搬運滾筒24正上面和搬運滾筒24對向般地所配設的 除液滾筒26形成其周面遍及基板1上面側的寬度方向全體 接觸的圓柱狀,具有下述功能:藉由一面遍及為搬運滾筒 24所支持搬運的基板1上面側的寬度方向全體接觸,一面旋 轉,從基板1上除去盛在基板1上的使用完的顯影液。而且 ,搬運滾筒24附近且比為搬運滾筒24所支持搬運的基板1高 度位置(圖4中以二點鏈線L所示)在下方如除液滾筒26和吐 出口 30對向般地配設液吐出噴嘴28。和圖2所示的液吐出噴 嘴20同樣,例如從基板1表面上流下到處理槽底部而回收到 回收槽的顯影液從回收槽為送給泵所供應給此液吐出噴嘴 28。此時,供應顯影液到液吐出噴嘴28的壓力設定在從吐 出口 30向除液滾筒26吐出的顯影液14不因液濺起而飛散的 程度的低壓。 從液吐出噴嘴28的吐出口 30向搬運滾筒16的顯影液14的 吐出和圖2所示的液吐出噴嘴2〇同樣,係在一面搬運基板j ,一面處理的期間中,搬運滾筒24及除液滾筒26未和基板1 接觸且基板1也不存在於其搬運滾筒24除近時進行,搬運滾 筒2 4及除液滚筒2 6和基板丨接觸時或基板丨存在於附近時不 從液吐出噴嘴28的吐出口 30吐出顯影液。此外,在未搬運 基板1的期間中,從液吐出噴嘴28的吐出口3G向除液滾筒26 的顯影液14的吐出係每一定時間間歇地進行。 具備圖4所示的結構的裝置藉由從液吐出噴嘴以的吐出 口 向除液滾筒26吐出顯影液14,較滾筒%因顯影液而 83883.doc -18- 200403787 經常成為沾濕的狀態。此外,吐出到除液滾筒26周面上的 顯影液14順著除液滾筒26周面流下到下方的搬運滾筒24周 面’藉此搬運滾筒24也因顯影液而經常成為沾濕的狀態。 因此,即使例如含有光阻的顯影液除著於接觸基板1上面侧- 的除液滾筒26或從基板1表面上灑落的含有光阻的顯影液- 除著於搬運滾筒24,顯影液也不會乾燥,所以光阻成分不 會凝固。因此,可防止因凝固的光阻而污染除液滾筒26及 搬運滾筒24。此外,從液吐出噴嘴28的吐出口 3〇以低壓吐 出顯影液14且從搬運滾筒24的附近位置向除液滾筒26吐出 顯影液14,所以難以產生液濺起,顯影液14不會飛散到廣 大範圍。因此,即使一面使含有光阻的顯影液循環,一面 再利用之類的情況,也不會含有光阻的顯影液因液濺起而 污术基板1,或者除著於感測器等機件而引起錯誤動作。此 外,液吐出噴嘴28比基板1高度位置配設於下方,所以即使 含有光阻的顯影液從吐出口 3〇滴落,也不擔心其顯影液附 著於基板1上。 圖5及圖6顯示第三發明的變形例,圖5為顯示為顯影處理 裝置的構成單元之一的搬運滾筒1除液滾筒的側面截面圖 ,圖6為同正面圖。此圖5及圖6所示的搬運滾筒⑼及除液滾 冋52、54顯不配置於圖8所示的顯影處理裝置的處理槽2的 出口側開口补附近的搬運滾筒4c和其附近者。 过關於此變形例的顯影處理裝置係在處理槽2内的大部分 區域以水平姿勢搬運基板1,在處理槽2的下游侧附近以基 板1為傾斜姿勢而搬出到下―製程。因此,在除了處理槽2 83883.doc -19- 200403787 的下游側附近(即靠近出口側開口3b的位置)之外的區域,基 板1為固定於處理槽2内的搬運滚筒62以水平姿勢所搬運。 此外,在其以外的區域,即靠近出口侧開口 3b的區域,基 板1為搬運滾筒60及除液滾筒52、54所搬運。除液滾筒52、 54為了基板!可通過其間而設置成形成微小的間隙。搬運滾 筒60及除液滾筒52、54安裝於滾筒安裝構件64、%。滾筒 安裝構件64、66如圖6所示,係通過除液滾筒52的旋轉軸68 的延長線上的點〇且以和基板搬運方向平行的直線(在圖6 中通過點Ο且與總面垂直的直線)為中心,利用未圖示的驅 動源驅動在上下方向只可旋轉特定角度(一點鏈線八和A,形 成的角度)所設。 在滾筒安裝構件64、66在於最下位置的狀態,如以圖5(a) 及圖6中的實線所示,搬運滾筒60及除液滾筒52、54成為水 平位置。而且,在此水平位置的除滾滾筒52和鄰接的搬運 滾筒60之間設有檢測裝置70的振動子72,其檢測出基板^皮 搬到搬運滾筒60上來。在振動子72下游侧設有液吐出噴嘴 74 ’其對於在水平位置的除液滾筒54吐出顯影液。液吐出 噴嘴74在圖5的紙面進深方向列設多數於噴嘴管75,其設置 成和水平位置的除液滾筒54略平行。和圖2所示的液吐出噴 ^角20同樣,例如從基板1表面上流下到處理槽底部而回收到 回收槽的顯影液從回收槽為送給泵所供應給此噴嘴管75。 檢測裝置70及噴嘴管75固定設於處理槽2。此外,安裝於滾 筒安裝構件64、66的搬運滾筒60中最上游侧者和搬運滾筒 62之間設有檢測基板1的檢測裝置%。 83883.doc -20- 200403787 在滾筒安裝構件64、66在於最上位置的狀態,如以圖5(b) 及圖6中的二點鏈線所示,搬運滾筒6〇及除液滾筒52、“傾 斜成點Ο側成為最%,並且這些搬運滾筒6〇及除液滾筒 、54其最低位置成為噴嘴管75高的位置。又,在圖$⑻,進 深方向的滾筒的傾斜未考慮描繪。 此顯影處理裝置的動作如下。在顯影處理裝置,基板i 從處理槽2的人口側開口(圖5未圖示)以水平姿勢搬入,由顯 影液吐出噴嘴5吐出的顯影液盛在基板1上,在該狀態一面 進行顯影處理,一面用搬運滾筒62保持水平姿勢向下游側 搬運此時,滾琦安裝構件64、66在於最下位置,搬運滾 筒60及除液滾筒52、54成為水平位置。而且,此時從液吐 出賣嘴74吐出顯影液,所吐出的顯影液落到除液滾筒“上 ,除液滾筒54因顯影液而保持在沾濕的狀態。此外,在於 除液滾筒54下侧的除液滾筒52也因從除液滾筒科流下的顯 w液而保持在沾濕的狀態。因此,不會除液滾筒52、54乾 燥而光阻成分凝固。 然後’基板1被搬運來而開動檢測裝置76的振動子78,來 自液吐出噴嘴74的顯影液的吐出就被停止。這是因為基板i 接近液吐出噴嘴74,所以若繼續來自液吐出噴嘴74的顯影 液的吐出,則有所吐出的顯影液的飛沫落到基板丨上而使處 理不均勻等不妥當產生的可能性。然後,基板1再被搬運而 開動檢測裝置70的振動子72,就停止搬運滚筒60的旋轉驅 動,基板1停止在搬運滾筒6〇上。然後,其後驅動前述驅動 源,滾筒安裝構件64、66上升而搬運滾筒6〇傾斜點〇侧變低200403787 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method in which a glass substrate for a flat panel display, a semiconductor wafer, a printed circuit board, and the like are each moved side by side by a plurality of substrates. One side is a substrate processing apparatus that performs processing such as washing, developing, etching, and peeling the substrate. [Prior Art] For example, in the process of forming a wiring pattern on a substrate to develop a photoresist film formed on the surface of the substrate, a roller-conveying type development processing device is used, which transports each piece of the substrate horizontally with a conveying roller, while A method of stopping the development reaction after a specific time has elapsed after the 5V liquid is displayed on the substrate. FIG. 8 schematically shows an example of a schematic configuration of the developing processing apparatus. The developing processing apparatus shown in FIG. 8 includes a processing tank 2 having a population _: 3a and an outlet-side opening 3b '. A plurality of transporting rollers 4a, 4b, 4e are arranged inside the processing tank 2 side by side. Furthermore, the substrate 1 is carried into the processing tank 2 through the opening on the population side, and is transported horizontally to be supported by the transfer drums 4a to 4e. It is carried out from the processing tank 2 through the outlet-side opening 3b and sent to the next washing processing tank. (Not shown). A developer discharge nozzle 5 is disposed in a population-side opening inside the processing tank 2. In addition, the liquid removal drum 6 is disposed near the exit opening on the inside of the processing tank 2 such as directly above the transfer drum 4c and opposed to the transfer drum, and contacts the substrate transported by the transfer drum 4e. . In the development processing device of this structure, when the exposed substrate on the surface of the photoresist pancreas is formed on the substrate m near the entrance side opening h of the processing tank 2 and the developing solution is discharged directly below the nozzle 5, the developing solution will be replaced by the developing solution. Discharge nozzle ^ 83883.doc 200403787 The developing solution 7 discharged from the slit-shaped discharge port on the end face is held on the surface. While the substrate 1 containing the liquid is being transported by the transport rollers 4a, 4b, the development of the photoresist film proceeds. The substrate 1 is transported to the vicinity of the exit-side opening% of the processing tank 2 and is removed from the substrate by the liquid removing roller 6! The developing solution 7 is removed from the upper part, and then carried out from the processing tank 2; the second substrate 1 is sent to the second water-washing processing tank to completely stop the development-reaction of the photoresist film. [Problems to be Solved by the Invention] In the developing processing device described above, the developing solution 7, especially the photoresist containing ~, ~ solution 7 液, is sprayed on the surface of the substrate 1, and the developing solution will adhere to the conveying roller 4a. ~ 4c peripheral surface or inner wall surface of processing tank 2 etc. In addition, the peripheral surface of the liquid removing roller 6 is in a state where the developing solution 7 containing a photoresist is always adhered. The developing solution adhered to these members is dried, and the photoresist component is solidified to contaminate the members. Therefore, the following problems may occur: • I particles are generated and the substrate is contaminated, which may cause a malfunction of a device such as a sensor. On the other hand, in order to prevent these problems', the cleaning operation inside the processing tank 2 needs to be complicated. However, the processing efficiency is reduced or the operation is complicated. Here again, a method different from the above is adopted, that is, a spray nozzle (P ay nozzle) is provided in the processing tank; the f 疋 spraying angle makes the developing solution and the like spray out to the inside of the processing tank in a misty manner as a whole. In this case, the surface feeling of the inner wall of the conveying roller or the processing tank is in a wet state due to the developer and the like. Therefore, it is difficult to cause contamination of the solidifying photoresist. The above problem is difficult to occur. However, when a transfer roller or the like is installed in a place where mist of the developer or the like is difficult to be considered, the developer containing the photoresist may cause contamination of the transfer roller or the like. In addition, this method cannot be used basically in a process that needs to suppress fog generation. 83883.doc 200403787 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a processing liquid for carrying a substrate in a processing tank while supplying a processing liquid to the substrate to prevent the processing liquid from containing a solidified component. A substrate processing device that contaminates the conveying roller or the inner wall surface of the processing tank can prevent substrate contamination or machine malfunction. [Summary of the Invention] Regarding the invention of claim 1 in the scope of patent application, a substrate processing apparatus for processing a substrate with a processing liquid while conveying the substrate in a processing tank is characterized in that it is a transfer roller that supports and transports a substrate while contacting a lower surface of the substrate. A liquid collecting container is provided immediately below. The liquid collecting mechanism supplies liquid to the liquid collecting container, and often fills the liquid collecting container with the liquid for wetting. The wet liquid in the liquid collection container. Regarding the second invention of the patent application scope, the substrate processing apparatus for processing substrates with a processing liquid while conveying the substrates in the processing tank is characterized in that the transfer rollers which are transported close to the substrates in contact with the substrates on the lower side of the substrates are compared with the transports. A liquid ejecting mechanism is disposed below the height position of the substrate supported by the roller, such as opposed to the ejection outlet and the conveying roller. The liquid ejecting mechanism is provided to supply the wetting liquid to the liquid ejecting mechanism. Regarding the invention of claim 3 in the scope of patent application, the substrate processing apparatus for processing substrates in a processing tank while processing the substrates with a processing liquid is characterized in that it is near a transfer roller that carries a substrate while supporting the substrate while contacting the lower side of the substrate, and the ratio The height of the substrate supported by the roller is below. If it is arranged to face the transportation roller directly above the transportation roller and contact the transportation roller Λ 83883.doc 200403787, the upper roller and the ejection outlet of the substrate to be transported A liquid discharge mechanism is generally provided, and a liquid supply mechanism is provided to supply a liquid for moistening to the liquid discharge mechanism. Regarding the invention in the fourth scope of the patent application, the invention relates to the substrate processing apparatus in the first scope of the patent application, which is characterized in that: the upper and lower rollers are movably supported between the upper position and the lower position. When the ejection mechanism is arranged such that the conveying roller and the upper roller are above, the position of the substrate roller supported by the conveying roller is lower than the position of the substrate, and when the conveying roller and the upper wave are both below, the aforementioned conveying roller is located at a position higher than that of the substrate. The other conveyance rollers on the upstream side in the conveyance direction have the same height and are controlled so that the substrates do not contact the conveyance roller and the upper roller. Regarding the invention in the scope of the patent application No. 5, the substrate processing apparatus in the scope of the patent application No. 4 is characterized in that the transfer roller and the roller are supported by a point on the extension line of the axis line of the transfer roller as Middle ^ and shake in the vertical plane to move the person between the upper position in the inclined posture and the lower position in the horizontal posture. Regarding the invention in the sixth scope of the patent application, the invention is a substrate processing device in the fourth or fifth scope of the patent scope, which is characterized in that the transfer roller and the upper 4 rollers are liquid removal rollers, and the liquid removal rollers and the other Most of the transporting rollers are arranged between the transporting rollers, and are supported to move integrally with the liquid removing roller between the upper position and the lower position, and contact the supporting substrate on the lower side of the substrate to carry the carrier. Regarding the invention in item 7 of the scope of patent application, which is a substrate processing device in any one of the second to sixth members of the scope of patent application, it is characterized in that the aforementioned liquid supply 83883.doc 200403787 moves to the aforementioned place by its outlet. , j. Low-pressure supply shore to the extent that the wet liquid discharged by Guyun Laiqi does not scatter due to the rise of liquid ash-s 伢 L is wet, and it is hard to use the liquid discharge mechanism f mentioned above. The invention is a substrate processing apparatus in any one of the second civil servants in the scope of patent application, characterized in that during the transportation of the substrate and the substrate, the transfer roller is not in contact with the lower surface of the substrate: Wet discharge from the outlet, when the transfer roller and the bottom surface of the substrate are in contact, the wet liquid is not discharged from the discharge outlet of the liquid discharge mechanism. Wet liquid is intermittently supplied from the liquid supply mechanism to the liquid discharge mechanism. The invention of 9 items is a substrate processing apparatus in any one of the items 2 to 8 of the scope of patent application, and is characterized in that the substrate is not intermittently transported from the aforementioned liquid supply mechanism during a certain period of time while the substrate is not being transported. A person who supplies a moisturizing liquid to the aforementioned liquid discharge mechanism is provided. The invention of claim No. _ is a substrate processing apparatus that handles a substrate while carrying a substrate surface in a processing tank, and is characterized in that the liquid that discharges the wetting liquid onto the inclined inner bottom surface of the processing tank is discharged. The mechanism is arranged at the upper part in the oblique direction of the inner bottom surface, and is provided with a liquid supply mechanism that supplies a moisturizing liquid to the liquid discharge mechanism. With regard to the substrate processing device of the invention claimed in item 1 of the patent application, the k-liquid supply mechanism supplies the wetting liquid to the liquid collecting container, and the liquid collecting container is often filled with the wetting liquid to immerse a part of the peripheral surface of the transfer drum In the wetting liquid filled in the liquid collecting container. Thereby, the peripheral surface of the conveyance roller is always wet with the wetting liquid. Therefore, even if a processing solution, such as 83883.doc -10- 200403787, containing a developer containing photoresist is sprayed from the substrate surface and adheres to the peripheral surface of the conveying roller, the developer solution will not dry 'so the photoresist component will not solidify. Therefore, it is possible to avoid contamination of the conveyance roller by the solidified photoresist. In addition, since the conveying roller is only immersed in the wetting liquid filled in the liquid collecting container, there is no fear of curling. Therefore, even if the developer containing a photoresist is circulated on the surface, the developer containing the photoresist will not adhere to the substrate due to splashing, contaminate the substrate, or contain The photoresist developer is attached to the sensor and other parts, causing malfunction. Regarding the substrate processing apparatus of the invention in the second scope of the patent application, the wet liquid is discharged to the transfer drum through the discharge port of the liquid discharge mechanism, and the transported thick cylinder is often wet due to the wet liquid. Therefore, even if a developer such as a photoresist developer is dropped from the surface of the substrate and adheres to the conveyance roller, the developer solution does not dry, so the photoresist component does not solidify. Therefore, it is possible to avoid contamination of the conveyance roller by the solidified photoresist. In addition, since the liquid ejection mechanism is arranged close to the conveying roller, it is difficult to cause liquid splashing, and the wet liquid does not spread to a wide range. Therefore, even when the developer containing a photoresist is circulated on one side and reused as a wet turbidity solution, the developer containing the photoresist is not adhered to the substrate due to the splashing of the liquid and the substrate is contaminated. , Or a developer containing a photoresist is attached to a sensor or the like, causing malfunction. In addition, the liquid ejection mechanism is disposed below the substrate at a height position, so that the photoresist developing solution drips from the ejection opening of the liquid ejection mechanism, and the developing solution does not adhere to the substrate. Regarding the substrate processing device of the invention in claim 3 of the patent scope, the wetting liquid is discharged from the upper roller disposed on the upper roller 83838.doc -11- 200403787, which is disposed directly above the conveying roller from the discharge port of the liquid discharge mechanism. When the roller is in a wet state, it is run along with the wetting solution: = surface. The conveying roller is also often wet because of the wetting solution: Second, the processing solution such as a photoresist-containing developer is attached to the second plate. The upper roller on the upper side, or even if the developer is attached to the conveying roller from the substrate surface, the developer will not dry, so the photoresist will not condense. It can avoid the cold dyeing of the upper roller due to the solidified photoresist. Same as handling rollers. In addition, the 'liquid ejection mechanism is arranged near the conveyance roller, so it is difficult to cause splashing.' The wet liquid does not spread to a wide range. Therefore, even if a developer containing a photoresist is circulated on the side and reused as a wetting liquid, the photoresist containing the photoresist will not be attached to the substrate due to liquid splashing, and the substrate will be contaminated. 'Or a developer containing a photoresist adheres to a device such as a sensor, causing malfunction. In addition, the 'liquid ejection mechanism is disposed below the substrate in a direction-oriented position', so that even if a developing solution containing a photoresist drips from the ejection opening of the liquid ejection mechanism, the developer solution does not adhere to the substrate. Regarding the substrate processing device of the invention in the fourth scope of the patent application, when the conveyer and the upper roller are positioned above, the liquid discharge mechanism is positioned lower than the height of the substrate, so even if the processing liquid, such as a photoresist-containing developer, is removed from the liquid, When the ejection port of the ejection mechanism is dripped, the developer solution does not adhere to the substrate. On the other hand, when the conveyance roller and the upper roller are located below, the substrate does not contact the conveyance roller and the upper roller, so even the developer containing photoresist is ejected from the liquid. The discharge port of the mechanism drips, and there is no fear that the developing solution adheres to the substrate. Regarding the substrate processing apparatus of the invention claimed in claim 5 of the patent application scope, the transfer roller and the upper roller are centered on a point on the extension of the axis of the transfer roller 83883.doc • 12-200403787 in the vertical plane. Shake to move between the upper and lower positions. Furthermore, in the upper position, the transfer roller and the upper roller are tilted properly, so the substrate supported by the transfer roller is also tilted, so that the processing liquid flows down from the surface of the substrate. In regard to the substrate processing device of the invention claimed in claim 6 of the patent scope, the liquid removing roller is used to remove the physical liquid from the substrate supported by the conveying roller, such as a developer containing a photoresist. Obstructive heart solution adheres to the peripheral surface of the liquid removal roller, and the liquid removal roller also becomes wet due to the wet liquid, so the developing solution does not dry, so the photoresist component does not solidify on the peripheral surface of the liquid removal roller. . Regarding the substrate processing apparatus of the invention claimed in claim 7 of the scope of the patent application, the liquid for wetting from the liquid supply mechanism to the liquid discharge mechanism to the transfer roller from the discharge port of the liquid discharge mechanism is not scattered by the liquid splash. Wetting liquid is supplied at low pressure, so it is more difficult for the liquid to splash, and the wet liquid will not spread to a wide range. Regarding the substrate processing apparatus concerning the invention in the eighth aspect of the patent application, while the substrate is being transported and the substrate is being processed, the wetting liquid is discharged from the discharge port of the liquid discharge mechanism when the transfer roller is not in contact with the lower surface of the substrate, When the lower side of the substrate is in contact, the wetting liquid is not discharged from the discharge port of the liquid discharge mechanism. Therefore, while the developer solution containing a photoresist is circulated and reused as a wetting liquid, there is no worry about the discharge from the liquid discharge mechanism. The developer containing the photoresist discharged from the outlet adheres to the substrate and contaminates the substrate. Regarding the substrate processing apparatus of the invention in the ninth aspect of the application for a patent, during the period when the substrate is not being transported, the wetting liquid is intermittently supplied from the liquid supply mechanism to the liquid discharge mechanism at a fixed 83883.doc -13- 200403787 time, so The transfer drum or the upper drum and the transfer drum are kept wet with the moistening liquid, and at the same time, the amount of the moisturizing liquid can be reduced. With regard to the substrate processing apparatus of the invention claimed in claim 10, the wetting liquid is discharged from the liquid discharge mechanism to the upper portion of the inner bottom surface of the processing tank in an oblique direction, and the wetting liquid is discharged along the inclination of the inner bottom surface. Since the bottom surface flows down, the entire inner bottom surface is often wetted by the wetting liquid. Therefore, even if a processing solution, such as a developing solution containing a photoresist, is sprayed from the substrate surface to the inner bottom surface, the developing solution is not dried, so the photoresist component is not solidified. Therefore, it is possible to avoid contamination of the inner bottom surface of the processing tank due to the solidified photoresist. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described with reference to FIGS. 丨 to 7. Fig. 1 shows an example of an embodiment of the first invention, and is a side view showing one of the transporting rollers, which is one of the constituent units of a substrate processing apparatus such as a development processing apparatus, in a partial cross section. The overall structure of the development processing apparatus has been described above with reference to FIG. 8, and therefore its description is omitted. The transporting roller 10 shown in FIG. 1 is a plurality of transporting rollers 4 of the developing processing apparatus shown in FIG. 8 and is disposed in the processing tank. 2 right and left carrying roller flapping counterparts. The transfer drum 10 is formed in a cylindrical shape whose peripheral surface is in full contact with the width direction of the lower surface side of the substrate i. This transfer drum 10 has the following functions: it supports the substrate 1 and carries it, and at the same time contacts the entire width direction of the lower surface of the substrate and rotates it while washing the lower surface of the substrate. Directly below the transfer roller 10, 83883.doc -14-200403787 is equipped with a "tank 12". The wetting liquid supplied from the liquid supply source to the pump 15 is stored in the liquid collecting tank 12, for example, it flows down from the substrate 丨 surface to the bottom of the processing tank and returns to the recovery tank (not shown from the recovery tank for feeding) The developer solution 14 sent by the system 15. The developer solution is continuously supplied to the liquid collecting tank 12, and the inside of the liquid collecting tank is. The developing solution 14 is often filled in the state where the developer liquid 14 is full, and the developing solution that has overflowed from the upper part of the liquid collecting tank 12 is recovered. Then, it is recycled. A part of the peripheral surface of the conveying roller 10 is immersed in the developer solution 4 filled in the liquid collecting tank 12. The device having the structure shown in FIG. 1 makes the peripheral surface of the conveying roller 10 A part is immersed / developed in the developer solution 14 filled in the liquid collecting tank 12, so the peripheral surface of the conveying roller 10 is often wetted by the developer solution 14. Therefore, even a developer solution containing a photoresist is removed from the substrate 1. Spattered on the surface and adhere to the peripheral surface of the conveying roller, there is no visual effect> The liquid is dried on the peripheral surface of the conveying roller 10 and the photoresist component is solidified. Therefore, 'the worry is not caused by the solidified photoresist to contaminate the conveying roller 10. In addition, Only the board transport roller 10 is immersed in the display filled in the liquid collecting tank 12 In the shadow liquid 14, there is no risk of liquid splashing. Therefore, a head shadow liquid containing a photoresist due to the liquid splash is not attached to the substrate 1, the substrate 1 is contaminated, or a developing solution containing a photoresist is extravagant. A mechanism such as a measuring device may cause an erroneous operation. Next, FIG. 2 shows an example of a second embodiment of the invention, which is a side view showing one of the conveyance rollers which is one of the constituent units of the developing processing apparatus. The conveyance shown in FIG. 2 The roller 16 is a majority of the transfer rollers 4a to 4c of the developing processing apparatus shown in FIG. 8 and most of the transfer rollers 4a except for the transfer rollers 4b and 4c which are respectively arranged in the middle and left of the processing tank 2 and near the exit-side opening 3b. Correspondence: The carrying roller 16 has a circular plate shape. One pair is fixed to the two ends of the rotary support shaft 1 $ 83883.doc -15-200403787 'or a plurality of, for example, the two ends and the central portion of the rotary support shaft 18 Three are fixed to the rotating support shaft 18. Further, the position near the position of the conveying roller 16 and lower than the south position of the substrate 1 supported by the plate conveying roller 16 is arranged as if the discharge port 22 and the conveying roller 16 face each other. Set the liquid discharge nozzle 20. and Similarly, for example, the developer solution flowing down from the surface of the substrate 1 to the bottom of the processing tank and recovered in the recovery tank is supplied from the recovery tank to the liquid discharge nozzle 20 supplied to the pump. At this time, the developer solution is supplied to the liquid discharge nozzle 20 The pressure is set to a low pressure such that the developing solution 14 discharged from the discharge port 22 to the transfer drum 16 does not scatter due to splashing of liquid. The discharge of the developing solution 14 from the discharge port 22 of the liquid discharge nozzle 20 to the transfer drum 16 is generally performed. The substrate 1 is conveyed during the one-side processing, when the conveying roller 6 is not in contact with the lower surface of the substrate 1 and the substrate does not exist near the conveying roller 16. The conveying roller 16 is in contact with the lower surface of the substrate 1 or the substrate 1 is present. When it is near, the developer is not discharged from the discharge port 22 of the liquid discharge nozzle 20. By intermittently discharging the developer in this way, it is possible to reuse the developer containing the photoresist while recycling the developer, and it is possible to eliminate the developer containing the photoresist from the discharge port 22 of the liquid ejection nozzle 20. Or the droplets may adhere to the substrate 1 and stain the substrate 1. On the other hand, during the period when the substrate 1 is not conveyed, the developing solution 14 is discharged intermittently from a discharge port 22 of the liquid discharge nozzle 20 to a developing roller 14 of the transfer roller 16. By intermittently discharging the developer in this manner, the transfer roller 16 is kept in a wet state while the substrate 1 is not being processed, thereby preventing the photoresist components from solidifying and reducing the amount of developer used. The device having the structure shown in FIG. 2 discharges the developer solution 14 to the transfer roller 16 through the discharge port 22 of the liquid discharge nozzle 20, and the transfer roller 16 becomes wet because of the developer solution 83838.doc 200403787 #. Therefore, Even if, for example, a developing solution containing a photoresist is dropped from the surface of the substrate 1 and adheres to the conveying roller 16, the developing solution does not dry, so the photoresist component does not solidify. Therefore, the conveying roller 16 can be prevented from being contaminated by the solidified photoresist. In addition, the discharge port 22 from the liquid discharge nozzle 20 discharges the developer solution 14 at a low pressure and the developer solution 14 is ejected toward the transfer roller 16 from the approaching position of the transfer roller 16. Therefore, it is difficult for the liquid to splash, and the developer solution 14 does not It spreads over a wide range. Therefore, even when the developer containing the photoresist is circulated and reused, the developer containing the photoresist will not contaminate the substrate 1 due to splashing of the liquid or attach to the sensor. Incorrect operation caused by other parts. In addition, the liquid ejection nozzle 20 is arranged at a lower position than the substrate 1, so that even if the developer containing the photoresist drops from the ejection port 22, there is no worry about the developer. It is attached to the substrate 1. In addition, FIG. 3 is a side view showing a conveying roller according to another embodiment of the first invention. This embodiment shown in FIG. 3 is provided with a discharge port 22 for the liquid discharge nozzle 20 obliquely downward. In the embodiment shown in FIG. 2, when the liquid discharge nozzle 20 is arranged upward as the discharge port 22, when the liquid discharge port from the discharge port 22 is stopped, there is no fear that the liquid will drip from the discharge port 22. In the illustrated embodiment, there is a possibility that the liquid may drip from the discharge port 22. However, the liquid discharge nozzle 20 is arranged below the height of the substrate 1 indicated by the two-dot chain line L, so there is no worry about the liquid from the discharge port. 22 drops of a developer containing a photoresist adhered to the substrate i. Next, FIG. 4 shows an example of the third embodiment of the invention, and is a side view of a conveyance roller and a liquid-removing roller, which are one of the constituent units of the development processing apparatus. The board transporter 24 shown in FIG. 4 is a transporter of most of the transfer rollers 4a to 4c of the developing processing apparatus shown in FIG. 8 and the vicinity of the opening 讣 disposed on the exit side of the processing tank 2. 83883.doc • 17- 200403787 Corresponding to the roller 4c. The liquid removal roller 26 disposed on the upper surface and the conveyance roller 24 is formed in a cylindrical shape whose peripheral surface is in contact with the entire width direction of the upper surface side of the substrate 1, and has a function of supporting the conveyance roller 24 on one side. The entire width direction of the upper surface of the substrate 1 to be conveyed contacts and rotates to remove the used developer solution held on the substrate 1 from the substrate 1. The substrate 1 near the conveyance roller 24 is larger than the substrate 1 supported by the conveyance roller 24. At the height position (shown by the two-point chain line L in FIG. 4), a liquid discharge nozzle 28 is arranged below the liquid removal drum 26 and the discharge port 30 so as to face each other. The liquid discharge nozzle 20 is the same as the liquid discharge nozzle 20 shown in FIG. 2. The developer liquid flowing down from the surface of the substrate 1 to the bottom of the processing tank and recovered in the recovery tank is supplied to the liquid discharge nozzle 28 from the recovery tank to the pump. At this time, the pressure at which the developer is supplied to the liquid discharge nozzle 28 is set to a low pressure such that the developer 14 discharged from the discharge port 30 to the liquid removing roller 26 does not scatter due to splashing of the liquid. The discharge of the developer solution 14 from the discharge port 30 of the liquid discharge nozzle 28 to the transfer drum 16 is the same as that of the liquid discharge nozzle 20 shown in FIG. 2, and the substrate j is transported on one side. The liquid roller 26 is not in contact with the substrate 1 and the substrate 1 does not exist when the conveying roller 24 is removed. The conveying roller 24 and the liquid removing roller 26 are not in contact with the substrate 丨 or the substrate 丨 is nearby. The discharge port 30 of the nozzle 28 discharges the developer. In addition, while the substrate 1 is not being conveyed, the discharging of the developer solution 14 from the discharge port 3G of the liquid discharge nozzle 28 to the liquid-removing roller 26 is performed intermittently at a constant time. The device having the structure shown in FIG. 4 discharges the developer solution 14 to the liquid-removing roller 26 through the discharge port of the liquid ejection nozzle. The developer solution is often wet because of the developer solution. 83883.doc -18- 200403787. In addition, the developer 14 discharged onto the peripheral surface of the liquid-removing roller 26 flows down the peripheral surface of the liquid-receiving roller 26 to the lower peripheral surface of the conveying roller 24 ', whereby the conveying roller 24 is constantly wet with the developer. Therefore, even if, for example, the developer containing photoresist is removed on the liquid-removing roller 26 contacting the upper side of the substrate 1 or the developer containing photoresist is spilled from the surface of the substrate 1-except on the transfer roller 24, the developer is not It will dry, so the photoresist component will not solidify. Therefore, it is possible to prevent the liquid removing drum 26 and the conveying drum 24 from being contaminated by the solidified photoresist. In addition, since the developer solution 14 is discharged from the discharge port 30 of the liquid discharge nozzle 28 at a low pressure and the developer solution 14 is discharged from the position near the conveyance roller 24 to the liquid removal roller 26, it is difficult to cause liquid splashing and the developer solution 14 does not scatter. Wide range. Therefore, even if the developer containing the photoresist is circulated and reused, the developer containing the photoresist will not stain the substrate 1 due to the splash of the liquid, or be removed from the sensor and other components. And cause wrong action. In addition, since the liquid ejection nozzle 28 is arranged at a lower position than the substrate 1, even if the developer containing the photoresist drops from the ejection port 30, there is no fear that the developer will adhere to the substrate 1. Figs. 5 and 6 show a modification of the third invention. Fig. 5 is a side cross-sectional view of the liquid-removing roller of the conveyance roller 1 as one of the constituent units of the developing device, and Fig. 6 is the same front view. The conveyance rollers ⑼ and the liquid removal rollers 52 and 54 shown in FIGS. 5 and 6 are not disposed near the conveyance roller 4c near the exit side of the processing tank 2 of the developing processing apparatus shown in FIG. 8 and the vicinity thereof. . In the development processing apparatus of this modification example, the substrate 1 is transported in a horizontal posture in most areas in the processing tank 2, and is carried out to the lower-process by the substrate 1 in an inclined posture near the downstream side of the processing tank 2. Therefore, in a region other than the vicinity of the downstream side of the processing tank 2 83883.doc -19- 200403787 (that is, the position near the outlet-side opening 3b), the substrate 1 is moved by the transfer drum 62 fixed in the processing tank 2 in a horizontal posture. Moving. In addition, in other regions, that is, the region near the outlet-side opening 3b, the substrate 1 is transported by the transporting drum 60 and the liquid removing drums 52 and 54. The liquid removal rollers 52 and 54 are substrates! It may be provided to form a minute gap therebetween. The conveyance roller 60 and the liquid removing rollers 52 and 54 are attached to the roller attachment member 64 and the rollers. As shown in FIG. 6, the roller mounting members 64 and 66 pass through a point on the extension line of the rotation shaft 68 of the liquid removing roller 52 and are parallel to the substrate conveying direction (in FIG. 6, they pass through the point 0 and are perpendicular to the general plane). A straight line) is set as the center, and a driving source (not shown) can be used to rotate in a vertical direction only by a specific angle (the angle formed by the one-point chain line eight and A). In the state where the drum mounting members 64 and 66 are at the lowermost position, as shown by the solid lines in Fig. 5 (a) and Fig. 6, the transfer drum 60 and the liquid removing drums 52 and 54 are in the horizontal position. Furthermore, a vibrator 72 of a detection device 70 is provided between the de-roller roller 52 and the adjacent transfer roller 60 in this horizontal position, and it detects that the substrate is transferred to the transfer roller 60. A liquid discharge nozzle 74 'is provided on the downstream side of the vibrator 72, and it discharges the developer solution to the liquid removing roller 54 in the horizontal position. The liquid ejection nozzles 74 are mostly arranged in the nozzle tube 75 in the depth direction of the paper surface shown in Fig. 5, and are arranged slightly parallel to the liquid removing drum 54 at the horizontal position. Similar to the liquid discharge nozzle 20 shown in FIG. 2, for example, the developer solution flowing down from the surface of the substrate 1 to the bottom of the processing tank and recovered in the recovery tank is supplied from the recovery tank to the nozzle tube 75 for the pump. The detection device 70 and the nozzle tube 75 are fixed in the processing tank 2. In addition, a detection device% for detecting the substrate 1 is provided between the most upstream side of the transfer rollers 60 mounted on the roller mounting members 64 and 66 and the transfer roller 62. 83883.doc -20- 200403787 In the state where the roller mounting members 64 and 66 are at the uppermost position, as shown by the two-dot chain line in Fig. 5 (b) and Fig. 6, the transport roller 60 and the drain roller 52, " Inclined to the point O side becomes the most%, and the lowest position of these conveyance rollers 60 and the liquid removal rollers 54 is the position where the nozzle tube 75 is high. In the figure, the inclination of the roller in the depth direction is not considered for drawing. The operation of the developing processing device is as follows. In the developing processing device, the substrate i is carried in from a population-side opening (not shown in FIG. 5) of the processing tank 2 in a horizontal posture, and the developing solution discharged from the developing solution discharge nozzle 5 is stored on the substrate 1. In this state, while carrying out the development process, the conveyance roller 62 is held horizontally and conveyed to the downstream side. At this time, the roll mounting members 64 and 66 are at the lowermost position, and the conveyance roller 60 and the liquid removal rollers 52 and 54 are in the horizontal position. At this time, the developing solution is discharged from the liquid discharging selling nozzle 74, and the discharged developing solution falls on the liquid removing roller ", and the liquid removing roller 54 is kept in a wet state by the developing liquid. In addition, the liquid removing drum 52 located on the lower side of the liquid removing drum 54 is also kept in a wet state by the liquid flowing from the liquid removing drum section. Therefore, the liquid removing rollers 52 and 54 are not dried and the photoresist component is not solidified. Then, the substrate 1 is carried and the vibrator 78 of the detection device 76 is activated, and the discharge of the developer from the liquid discharge nozzle 74 is stopped. This is because the substrate i is close to the liquid ejection nozzle 74, so if the developer is continuously ejected from the liquid ejection nozzle 74, droplets of the ejected developer will fall on the substrate, which may cause improper processing and other improper production. Sex. Then, the substrate 1 is transported again and the vibrator 72 of the detection device 70 is started, the rotation driving of the transport roller 60 is stopped, and the substrate 1 is stopped on the transport roller 60. Then, the drive source is driven thereafter, and the roller mounting members 64 and 66 are raised, and the side of the conveyance roller 60 tilting point 0 becomes lower.

B3883.doc -21- 200403787 ’放在其上的基板1也成為傾斜姿勢。藉此,盛在基板1上 的顯影液的大半流下到下侧被粗略除液。然後,液的大部 分流下’就再旋轉驅動搬運滾筒60及除液滾筒52、54,基 板1保持傾斜姿勢向下游側搬運,由配合此傾斜姿勢位置所-形成的出口侧開口 3b搬出,搬運到下一製程。此時,由於· 滾筒安裝構件64、66上升,所以液吐出噴嘴74或檢測裝置 70的振動子72就比搬運滾筒60位於下方,不會成為基板1搬 運的障礙,而且即使液從液吐出噴嘴74不慎漏出來,也不 會除著於基板1。基板1由出口側開口 3b搬出,滾筒安裝構 件64、66就下降而等待下一基板。 此外’圖7顯示第四發明實施形態的一例,係顯示為顯影 處理裝置的構成單元的處理槽底部的截面圖。圖7所示的裝 置在處理槽32傾斜的内底面34的傾斜方向上部配設使吐出 口 38向内底面34的液吐出噴嘴36。例如從基板1表面上流下 到處理槽底部而回收到回數槽的顯影液由回收槽供應給此 液吐出喷嘴36。 具備圖7所示的結構的裝置從液吐出喷嘴3 6的吐出口 3 8 吐出顯影液14到處理槽3 2的内底面3 4的傾斜方向上部,其 所吐出的顯影液14沿著内底面34的傾斜在内底面34上流下 。因此,内底面34全體因顯影液14而經常成為沾濕的狀態 。因此,即使含有光阻的顯影液從基板1表面上灑落到内底 面34上,其顯影液也不會乾燥,所以光阻成分不會凝固, 可防止因凝固的光阻而污染處理槽32的内底面34。 又,上述記載係就顯影處理裝置加以說明,但本發明亦 83883.doc -22- 200403787 可適用於進行洗滌、蝕刻、剝膜等處理的基板處理裝置。 【發明之效果】 使用關於申請專利範第1至3項之各發明之基板處理裝置 ,則在處理槽内一面搬運基板,一面對於基板供應處理液-而進行基板處理的情況,可防止因如含有光阻的顯影液含. 有凝固成分的處理液而污染搬運滚筒或上部滾筒及搬運^ 筒,可防止基板污染或機件錯誤動作等。而且,也無需頻 繁進行處理槽内部的清掃作業,所以不會引起處理效 低或作業繁雜。 關於申請專利範園第4項之發明之基板處理裝置,即使搬 運滾筒及上部滚筒位於上方及下方的任—方時都處理液, 例如含有光阻的顯影液從液吐出機構的吐出口滴落,也不 擔心顯影液附著於基板上。 關於申請專利範圍第5項之發明之基板處理裝置,搬運滚 筒及上部滚筒藉由在垂直面内搖動,在上方位置和下方位 置之間移動,在上方位置藉由為搬運滚筒所支持的基板傾 斜,處理液的一部分從基板表面上流下而被除去。 關於申請專利範圍第6項之發明之基板處理裝置,利用除 液滾筒從基板除去處理液,例如含有纽的顯影液之際, 即使含有光阻的顯影液附著於除液滚筒周面,亦可防止光 阻成分在除液滾筒周面凝固。 關於中請專利範園第7項之發明之基板處理裝置,更難產 生液濺起,可更有效抑制濕潤用液的飛散。 關於申請專利範園第8项之發明之基板處理裝置,一面使 83883.doc -23- :如含有光阻的顯影液循環,—面再利用作為濕潤用液之 :的情況’可消除下述擔心:因由液吐出機構的吐出口吐 的含有光阻的顯影液而污染基板。 、關於t請專利範圍第9項之發明之基板處理裝置,可一面 防止冷染搬運滾筒或上部噴嘴管及搬運滾筒,—面減低濕 潤用液的使用量。 使用關於中請專利_第1()項之發明之基板處理裝置, 則在處理槽内-面搬運基板,—面料基板供應處理液而 2行基板處理的情況,可防止因如含有光阻的顯影液含有 凝固成分的處理液而污染處理槽的内底面,可防止基板污 染或機件錯誤動作等。而且,也無需頻繁進行處理槽内部 的清掃作業,所以不會引起處理效率降低或作業繁雜。 【圖式簡單說明】 圖1顯示第一發明實施形態的一例,係以一部分截面顯示 為顯影處理裝置的構成單元之一的搬運滾筒的一個的側面 圖0 圖2顯示第二發明實施形態的一例,係顯示為顯影處理裝 置的構成卓元之一的搬運液筒的一個的側面圖。 圖3為顯示第二發明別的實施形態的搬運滾筒的侧面圖。 圖4顯示第三發明實施形態的一例,係顯示為顯影處理裝 置的構成卓元之一的搬運浪筒及除液滾筒的側面圖。 圖5(a)、(b)顯示第三發明的變形例,係顯示為顯影處理 裝置的構成單元之一的搬運滚筒及除液滾筒的側面截面圖。 圖6顯示圖5所示的除液滚筒的正面圖。 83883.doc -24- 200403787 圖7為顯示第四發明實施形態的一例,係顯示為顯影處理 裝置的構成單元的處理槽底部的截面圖。 圖8為顯示顯影處理裝置概略結構的一例的模式圖。 【圖式代表符號說明】 1 基板 2 > 32 處理槽 10 ' 16 、 24 、 60 、 62 搬運滾筒 12 集液槽 14 顯影液 20 、 28 、 36 液吐出噴嘴 22 、 30 、 38 液吐出噴嘴的吐出口 26 除液滚筒 34 處理槽的内底面 52、54 除液滾筒 64、66 滾筒安裝構件 70 > 76 檢測裝置 74 液吐出喷嘴 75 噴嘴管 83883.doc -25-B3883.doc -21- 200403787 'The substrate 1 placed thereon also becomes an inclined posture. Thereby, most of the developing solution held on the substrate 1 flows down to the lower side and is roughly removed. Then, when most of the liquid flows down, the conveying roller 60 and the liquid removing rollers 52 and 54 are rotated and driven, and the substrate 1 is conveyed while maintaining the inclined posture to the downstream side. The outlet-side opening 3b formed in accordance with the inclined posture position is carried out and conveyed. Go to the next process. At this time, since the roller mounting members 64 and 66 are raised, the liquid ejection nozzle 74 or the vibrator 72 of the detection device 70 is positioned lower than the conveyance roller 60, and does not cause an obstacle to the substrate 1 conveyance. 74 accidentally leaks, and will not be removed from the substrate 1. The substrate 1 is carried out through the exit-side opening 3b, and the roller mounting members 64 and 66 are lowered and wait for the next substrate. In addition, FIG. 7 shows an example of a fourth embodiment of the present invention, and is a cross-sectional view showing the bottom of a processing tank as a constituent unit of a developing processing apparatus. The apparatus shown in Fig. 7 is provided with a liquid discharge nozzle 36 for discharging the discharge port 38 toward the inner bottom surface 34 at the upper portion in the oblique direction of the inner bottom surface 34 of the treatment tank 32. For example, the developer liquid flowing down from the surface of the substrate 1 to the bottom of the processing tank and recovered in the return tank is supplied to the liquid discharge nozzle 36 from the recovery tank. The apparatus having the structure shown in FIG. 7 discharges the developer solution 14 from the discharge port 3 6 of the liquid discharge nozzle 36 to the upper portion of the inner bottom surface 34 of the processing tank 32 in an oblique direction. The developer solution 14 is discharged along the inner bottom surface. The inclination of 34 flows down on the inner bottom surface 34. Therefore, the entire inner bottom surface 34 is often wetted by the developer 14. Therefore, even if the developer containing the photoresist is spilled from the surface of the substrate 1 onto the inner bottom surface 34, the developer will not be dried, so the photoresist component will not solidify, which can prevent the treatment tank 32 from being contaminated by the solidified photoresist.内 底面 34。 The inner bottom surface 34. The above description describes the development processing apparatus, but the present invention is also applicable to a substrate processing apparatus that performs processing such as washing, etching, and film peeling. [Effects of the invention] Using a substrate processing apparatus for each of the inventions of claims 1 to 3, substrates can be transported in the processing tank while processing liquid is supplied to the substrates to prevent substrates from being processed. The developer containing photoresist contains a processing solution with a solidified component that contaminates the conveying roller or the upper roller and the conveying cylinder, which can prevent the substrate from being contaminated or the machine from malfunctioning. In addition, there is no need to perform frequent cleaning operations inside the processing tank, so there is no inefficient processing or complicated work. Regarding the substrate processing device of the patent application No. 4 of the invention, even if the conveying roller and the upper roller are located above and below, the processing liquid is used, for example, the developer containing the photoresist drips from the discharge port of the liquid discharge mechanism. There is also no concern about the developer being attached to the substrate. Regarding the substrate processing apparatus of the invention claimed in claim 5, the conveying roller and the upper roller are moved between the upper position and the lower position by shaking in a vertical plane, and the upper position is inclined by the substrate supported by the conveying roller. , A part of the processing liquid flows down from the substrate surface and is removed. Regarding the substrate processing apparatus of the invention in the sixth aspect of the patent application, the processing liquid is removed from the substrate by using a liquid removing roller. For example, when a developing solution containing a knob is used, the developing solution containing a photoresist may be attached to the peripheral surface of the liquid removing roller. Prevents the photoresist component from solidifying on the peripheral surface of the liquid removal drum. With regard to the substrate processing device of the seventh invention of the patent application, it is more difficult to generate liquid splashes, which can more effectively suppress the scattering of the wet liquid. Regarding the substrate processing device for the invention of the eighth patent application, while recycling 83883.doc -23-: if a developer containing photoresist is circulated, the surface is reused as a wetting solution: the case 'can eliminate the following Worry: the substrate is contaminated by a developer containing a photoresist discharged from the discharge port of the liquid discharge mechanism. 7. Regarding the invention of the substrate processing device according to item 9 of the patent scope, it is possible to prevent the cold dyeing transfer roller or the upper nozzle tube and the transfer roller while reducing the amount of the wet liquid. Using the substrate processing device of the invention of the patent claim # 1 (1), the substrate is transported in the processing tank on the surface, and the fabric substrate is supplied with the processing liquid and the substrate is processed in two rows, which can prevent The developing solution contains a solidified component processing liquid and contaminates the inner bottom surface of the processing tank, which can prevent substrate contamination or malfunction of the machine. In addition, it is not necessary to perform frequent cleaning operations inside the processing tank, so there is no reduction in processing efficiency or complicated operations. [Brief description of the drawings] FIG. 1 shows an example of the first invention embodiment, and is a side view showing one of the conveyance rollers which is one of the constituent units of the developing processing device in a partial cross-section. FIG. 2 shows an example of the second invention embodiment. , Is a side view showing one of the transfer liquid cylinders constituting one of the development units of the development processing apparatus. Fig. 3 is a side view showing a transfer drum according to another embodiment of the second invention. Fig. 4 shows an example of an embodiment of the third invention, and is a side view showing a conveyance cylinder and a liquid-removing roller, which are one of the components of a developing device. 5 (a) and 5 (b) show a modified example of the third invention, and are side sectional views of a conveyance roller and a liquid removing roller which are one of the constituent units of a developing processing apparatus. FIG. 6 is a front view of the liquid removing drum shown in FIG. 5. FIG. 83883.doc -24- 200403787 Fig. 7 is a cross-sectional view showing an example of a fourth embodiment of the invention, and is a bottom view of a processing tank shown as a constituent unit of a developing processing apparatus. FIG. 8 is a schematic diagram showing an example of a schematic configuration of a developing processing apparatus. [Illustration of representative symbols of the figure] 1 substrate 2 > 32 processing tank 10 '16, 24, 60, 62 conveying roller 12 liquid collecting tank 14 developer 20, 28, 36 liquid discharge nozzle 22, 30, 38 liquid discharge nozzle Discharge outlet 26 Liquid removing drum 34 Inner bottom surface of the processing tank 52, 54 Liquid removing drum 64, 66 Roller mounting member 70 > 76 Detection device 74 Liquid discharge nozzle 75 Nozzle tube 83883.doc -25-

Claims (1)

200403787 拾、申請專利範園: 1· 一種基板處理裝置,其係在處理槽内一面搬運基板,一 面以處理液處理基板者,其特徵在於: 在接觸基板下面侧支持基板而搬運的搬運滾筒正下· 面配設集液容器,並具備液供應機構,來供應濕潤用液-到集液容器内而經常以濕潤用液裝滿集液容器内,使前 述搬運滾筒周面一部分浸潰於裝滿於前述集液容器内 的濕潤用液中者。 2· —種基板處理裝置,其係在處理槽内一面搬運基板,一 面以處理液處理基板者,其特徵在於: 接近接觸基板下面側支持基板而搬運的搬運滾筒且 比為搬運滚筒所支持的基板高度位置在下方如吐出口 和搬運滚筒對向般地配設液吐出機構,並具備液供應機 構’來供應濕潤用液到其液吐出機構。 3· —種基板處理裝置,其係在處理槽内一面搬運基板,一 面以處理液處理基板者,其特徵在於: 接觸基板下面侧支持基板而搬運的搬運滚筒附近且 比為搬運滾筒所支持的基板高度位置在下方,如配設成 在前述搬運滾筒正上面和搬運滾筒對向、接觸支持於搬 運滾筒而被搬運的基板上面側的上部滾筒和吐出口對 向般地配設液吐出機構,並具備液供應機構,來供應濕 潤用液到其液吐出機構者。 4·如申請專利範圍第3項之基板處理裝置,其中在上方位置 和下方位置之間可移動地支持前述搬運滾筒及前述上 83883.doc Λ 200403787 部滾筒,前述液吐出機構配設成搬運滾筒及上部滾筒位 於上方時,比為搬運滾筒所支持的基板高度位置位於下 方,搬運滾筒及上部滚筒位於下方時,前述搬運滾筒位 於和比其配设於基板搬運方向的上游側的別的搬運滾· 筒相同的鬲度,同時控制成基板不接觸搬運滾筒及上部. 滾筒者。 5·如申請專利範圍第4項之基板處理裝置,其中前述搬運 滚筒及前述上部滚筒支持成以搬運滾筒的軸心線的延 長線上的一點為中心而在垂直面内搖動,使成為傾斜姿 勢的上方位置和成為水平姿勢的下方位置之間移動者。 6.如申請專利範圍第5項之基板處理裝置,其中前述搬運 滾筒和前述上部滾筒為除液滾筒,在其除液滾筒和前述 別的《滚筒之間配設多數搬運滚筒,其支持成和除液 滾筒一體在上方位置和下方位置之間移動,接觸基板下 面侧支持基板而搬運者。 7·如申請專利範圍第2至6項中任一項之基板處理裝置,其 中前述液供應機構以從其吐出口向前述搬運滾筒吐2 的濕潤用液不因液濺起而飛散的程度的低壓供應濕潤 用液到前述液吐出機構者。 8.如申請專利範圍第2至6項中任一項之基板處理裝置,其 中在搬運基板而處理基板的期間中,前述搬運滾筒未和 基板下面側接觸時從前述液吐出機構的吐出口吐出濕 潤用液,搬運滾筒和基板下面側接觸時不從液吐出機構 的吐出口吐出濕潤用液般地從前述液供應機構間歇地 83883.doc Λ 200403787 供應濕潤用液到液吐出機構者。 9. ίο. 如申請專利範圍第8項之基板處理裝置,其中在未搬運 基板的期間中,從前述液供應機構每一定時間間歇地供 應濕潤用液到前述液吐出機構者。 一種基板處理裝置,係在處理槽内一面搬運基板,一面 以處理液處理基板,其特徵在於·· 將吐出濕潤用液到前述處理槽傾斜的内底面上的液 吐出機構配設於内底面的傾斜方向上部,具備液供應機 構,其供應濕潤用液到其液吐出機構者。 83883.doc200403787 Patent application park: 1. A substrate processing device, which handles substrates in the processing tank while processing the substrates with processing liquid, is characterized in that: the transport roller supporting the substrates on the lower side of the substrates in contact with the substrate is transported A liquid collecting container is provided on the lower surface, and a liquid supply mechanism is provided to supply the liquid for wetting. The liquid collecting container is often filled with the liquid for humidification into the liquid collecting container, so that a part of the peripheral surface of the transfer drum is immersed in the container. It is filled in the wet liquid in the said liquid collection container. 2 · A substrate processing apparatus which handles substrates in a processing tank while processing the substrates with a processing liquid, and is characterized in that the transfer rollers that are transported close to the support substrate in contact with the lower side of the substrate are more supported than the transfer rollers. A liquid ejection mechanism is disposed below the substrate at a height position such that the ejection outlet and the conveyance roller face each other, and is provided with a liquid supply mechanism 'to supply the liquid for wetting to the liquid ejection mechanism. 3. A substrate processing device that handles substrates in a processing tank while processing the substrates with a processing liquid, and is characterized in that it is nearer than a transfer roller supported by the transfer roller while contacting and supporting the substrate on the lower side of the substrate. The substrate height position is below. If the upper roller and the ejection port of the upper surface and the ejection port of the substrate that is supported and supported by the conveying roller are arranged opposite to the conveying roller directly above the conveying roller, the liquid ejecting mechanism is arranged opposite to the conveying roller. A liquid supply mechanism is provided to supply the liquid for wetting to the liquid discharge mechanism. 4. If the substrate processing device according to item 3 of the patent application scope, wherein the above-mentioned conveying rollers and the above-mentioned 83883.doc Λ 200403787 units are movably supported between the upper position and the lower position, the liquid ejection mechanism is configured as a conveying roller When the upper roller is positioned above, the substrate is positioned lower than the height of the substrate supported by the transfer roller, and when the transfer roller and the upper roller are positioned below, the transfer roller is positioned at a position other than the other transfer roller disposed upstream of the substrate transfer direction. · The same angle of the cylinder, and at the same time control so that the substrate does not contact the transport roller and the upper roller. 5. The substrate processing apparatus according to item 4 of the scope of patent application, wherein the conveyance roller and the upper roller are supported to swing in a vertical plane around a point on an extension line of the axis line of the conveyance roller, so that the conveyance roller is inclined. Move between the upper position and the lower position in the horizontal position. 6. The substrate processing device according to item 5 of the patent application, wherein the transfer roller and the upper roller are liquid removal rollers, and a large number of transfer rollers are arranged between the liquid removal roller and the other rollers, which support Cheng and The liquid removing roller is integrally moved between the upper position and the lower position, and contacts the substrate supporting side of the substrate and the carrier. 7. The substrate processing apparatus according to any one of the items 2 to 6 of the scope of application for a patent, wherein the liquid supply mechanism is to such an extent that the wet liquid discharged from the discharge port to the conveying roller 2 does not scatter due to liquid splashing. The wetting liquid is supplied to the liquid discharge mechanism at a low pressure. 8. The substrate processing apparatus according to any one of claims 2 to 6, in a period during which the substrate is transferred and the substrate is processed, the transfer roller is discharged from the discharge outlet of the liquid discharge mechanism when the transfer roller is not in contact with the lower surface of the substrate. The wetting liquid does not discharge the wetting liquid from the ejection port of the liquid ejecting mechanism when the conveying roller is in contact with the lower surface of the substrate. The wetting liquid is intermittently supplied from the liquid supply mechanism 83883.doc Λ 200403787. 9. ίο. The substrate processing apparatus according to item 8 of the scope of patent application, wherein during the period when the substrate is not being transported, the wetting liquid is intermittently supplied from the liquid supply mechanism to the liquid discharge mechanism at a constant time. The invention relates to a substrate processing device, which carries a substrate in a processing tank while processing the substrate with a processing liquid, and is characterized in that a liquid discharge mechanism that discharges a wet liquid onto the inclined inner bottom surface of the processing tank is arranged on the inner bottom surface. The upper part in the oblique direction is provided with a liquid supply mechanism for supplying a moisturizing liquid to the liquid discharge mechanism. 83883.doc
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JP3987362B2 (en) 2007-10-10

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