CN1448994B - Device for treating substrate - Google Patents
Device for treating substrate Download PDFInfo
- Publication number
- CN1448994B CN1448994B CN031079911A CN03107991A CN1448994B CN 1448994 B CN1448994 B CN 1448994B CN 031079911 A CN031079911 A CN 031079911A CN 03107991 A CN03107991 A CN 03107991A CN 1448994 B CN1448994 B CN 1448994B
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- Prior art keywords
- substrate
- transfer roller
- liquid
- developer solution
- roller
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Abstract
The invention provides a device capable of preventing a carriage roller or the internal wall face of a treatment tank from being contaminated by a treatment solution containing solidification components at the time of treating a substrate by carrying the substrate in the treatment tank, and supplying the treatment solution to the substrate. A solution storage bat 12 is disposed immediately under a carriage roller 10 brought into contact with the lower face side of a substrate 1 for supporting and carrying the substrate, a developing solution is supplied to the solution storage bat, the solution storage bat is constantly filled with the developing solution 14, and a part of the peripheral face of the carriage roller is immersed in the developing solution filled in the solution storage bat.
Description
Technical field
The present invention relates to a kind of substrate board treatment, namely, will substrates such as glass substrate for plane display device, semiconductor wafer, printed substrate, the limit supports with a plurality of transfer rollers of spread configuration and slices transmit, and the substrate board treatment of processing such as cleaning, development, burn into striping is carried out on the limit to substrate.
Background technology
For example in form the operation of line pattern on substrate, when the photoresist film that forms on substrate surface is developed, what use is the roller conveying type development processing apparatus of taking a kind of like this mode, namely, the substrate that to laterally place with transfer roller is blocks of covers on substrate developer solution when transmitting, and through given time, developing reaction is stopped after covering developer solution.An example of the general configuration of this development processing apparatus is shown in Fig. 8 in a schematic way.
Development processing apparatus shown in Figure 8 possesses the treatment trough 2 with arrival end opening 3a and port of export opening 3b, in the inside for the treatment of trough 2, is provided with a plurality of transfer roller 4a, 4b, the 4c of spread configuration.And, substrate 1 is sent in treatment trough 2 by arrival end opening 3a, support and transmit in the horizontal direction with transfer roller 4a～4c, 3b sends in treatment trough 2 through port of export opening, is sent to next washing treatment trough (not shown).Near the arrival end opening 3a of the inside for the treatment of trough 2, be equiped with developer solution ejection nozzle 5.In addition, near the port of export opening 3b of the inside for the treatment of trough 2, be equiped with directly over transfer roller 4c that upper surface in opposite directions with transfer roller 4c, substrate 1 that support and transmit with transfer roller 4c contacts except liquid roller 6.
In the development processing apparatus that as above consists of, be formed with the substrate 1 of the photoresist film of overexposure when the surface, under near the developer solution ejection nozzle 5 the arrival end opening 3a that is installed in treatment trough 2 by the time, the developer solution 7 of discharging from the slit-shaped outlet of the lower surface of developer solution ejection nozzle 5 will cover in its surface.Cover the substrate 1 of developer solution, during being transmitted roller 4a, 4b transmission, carry out the developing reaction of photoresist film.When substrate 1 is sent near the port of export opening 3b for the treatment of trough 2, except liquid roller 6, the developer solution 7 on substrate 1 is removed, afterwards, send in treatment trough 2.Then, substrate 1 is sent to next washing treatment trough, the developing reaction of photoresist film is stopped fully.
In development processing apparatus as above, if developer solution 7, particularly contain resist developer solution 7 unrestrained from the surface of substrate 1, this developer solution will be attached on the surfaces such as internal face of the outer peripheral face of transfer roller 4a～4c and treatment trough 2.And the outer peripheral face that removes liquid roller 6 is in the state that contains resist development liquid 7 that is attached with all the time.After being attached to the developer solution drying on these parts, the resist composition will solidify and parts will be polluted.The particle contamination substrate 1 that therefore, can occur generating or cause the problems such as sensor equipment malfunction work.And to avoid occurring the problems referred to above, and need to frequently carry out the inside cleaning work for the treatment of trough 2, this will cause treatment effeciency to reduce, increase the complexity of operation.
And the employing mode different from aforesaid way, the atomizing ejection nozzle namely is set in treatment trough, utilize the atomizing ejection nozzle that developer solution etc. is vaporific discharge and make it occasion in a kind of like this mode of whole diffusion inside for the treatment of trough, because the surface of the internal face of transfer roller and treatment trough, sensor is in all the time by such as the wetting state of developer solution, therefore, the resist that is not easy to be cured pollutes, and is not easy to produce the problems referred to above.But, being arranged on the occasion at the position that vaporific developer solution etc. is difficult to arrive at parts such as transfer rollers, the developer solution that contains resist still can pollute the parts such as transfer roller.And this mode can't adopt in the technique that needs suppress to atomize basically.
Summary of the invention
The present invention be directed to above-mentioned situation proposes, its objective is, a kind of like this substrate board treatment is provided, namely, transmit the substrate limit at the treatment trough inner edge and supply with treatment fluid and occasion that substrate is processed to substrate, can prevent from containing the treatment fluid pollution transfer roller of cure component and the internal face for the treatment of trough etc., prevent the pollution of substrate and cause equipment malfunction work etc.
The invention that scheme 1 is related, belong to a kind of and transmit at the treatment trough inner edge substrate board treatment that process substrate with treatment fluid on the substrate limit, it is characterized in that, dispose liquid storage container under the transfer roller of contacting with the lower surface of substrate, substrate being supported and being transmitted, have in this liquid storage container and supply with the moistening liquid supplying device that is full of all the time moistening use liquid in liquid storage container that makes with liquid, the part outer peripheral face of said transfer roller is immersed in and is full of the moistening with in liquid of said liquid storage container.
The invention that scheme 2 is related, belong to a kind of and transmit at the treatment trough inner edge substrate board treatment that process substrate with treatment fluid on the substrate limit, it is characterized in that, below the height and position of the substrate that the transfer roller of close the contact with the lower surface of substrate, substrate being supported and being transmitted and transfer roller are supported, dispose outlet and transfer roller discharge liquid mechanism in opposite directions, have to this discharge liquid mechanism and supply with moistening liquid supplying device with liquid.
The invention that scheme 3 is related, belong to a kind of and transmit at the treatment trough inner edge substrate board treatment that process substrate with treatment fluid on the substrate limit, it is characterized in that, near the transfer roller of contacting with the lower surface of substrate, substrate being supported and being transmitted and the height and position of the substrate supported of transfer roller below, dispose outlet be configured in said transfer roller directly over and the upper surface of the substrate supporting and transmit with the transfer roller upper roll discharge liquid mechanism in opposite directions that contacts, have to this discharge liquid mechanism and supply with moistening liquid supplying device with liquid.
the invention that scheme 4 is related, belong to the said substrate board treatment of scheme 3, it is characterized in that, said transfer roller and said upper roll, be supported as up and move between position and lower position, said discharge liquid mechanism, be configured to be positioned at the below of the height and position of the substrate that transfer roller supports when transfer roller and upper roll are positioned at the top, when transfer roller and upper roll are positioned at the below, by control, said transfer roller is positioned on the position identical with other transfer roller height of upstream one side that is configured in by comparison the substrate direction of transfer, and substrate is not contacted with transfer roller and upper roll.
The invention that scheme 5 is related, belong to the said substrate board treatment of scheme 4, it is characterized in that, said transfer roller and said upper roll, be supported as can by on the extended line of the center line of transfer roller a bit centered by shake in vertical plane, thereby can move between the top position that becomes lateral attitude and the lower position that becomes horizontal attitude.
The invention that scheme 6 is related, belong to scheme 4 or the said substrate board treatment of scheme 5, it is characterized in that, said transfer roller and said upper roll are for removing the liquid roller, at this except between liquid roller and said other transfer roller, be equiped be supported as with remove the liquid roller between position and lower position, one move up, contact with the lower surface of substrate and a plurality of transfer rollers that substrate is supported and transmitted.
The invention that scheme 7 is related, belong to scheme 2 to the said substrate board treatment of the claim of one of scheme 6, it is characterized in that, said liquid supplying device, supply with the moistening liquid of use with lower pressure to said discharge liquid mechanism, this pressure is low can not be splash and the degree of dispersing everywhere with liquid to moistening from its outlet to said transfer roller discharge.
The invention that scheme 8 is related, belong to scheme 2 to the said substrate board treatment of the claim of one of scheme 7, it is characterized in that, during transmitting substrate and substrate processed, said liquid supplying device is intermittently supplied with the moistening liquid of use to discharging liquid mechanism, make when said transfer roller contact with the lower surface of substrate from the outlet discharge of said discharge liquid mechanism moistening with liquid when transfer roller contacts with the lower surface of substrate the outlet from discharge liquid mechanism do not discharge the moistening liquid of using.
The invention that scheme 9 is related belongs to scheme 2 to the said substrate board treatment of the claim of one of scheme 8, it is characterized in that, during not transmitting substrate, intermittently supplies with the moistening liquid of using by said liquid supplying device to discharging liquid mechanism at regular intervals.
The invention that scheme 10 is related, belong to a kind of and transmit at the treatment trough inner edge substrate board treatment that process substrate with treatment fluid on the substrate limit, it is characterized in that, discharge moistening discharge liquid mechanism with liquid to the inner bottom surface of the inclination of said treatment trough, be configured in the top of the incline direction of inner bottom surface, have to the moistening liquid supplying device with liquid of this discharge liquid mechanism's supply.
As the substrate board treatment of the related invention of scheme 1, supply with the moistening liquid of using by liquid supplying device in liquid storage container, make to be full of all the time the moistening liquid of using in liquid storage container, the part outer peripheral face of transfer roller is immersed in and is full of the moistening with in liquid of this liquid storage container.So the outer peripheral face of transfer roller is in all the time by moistening state with liquid wetting.Therefore, even from the surface of substrate, treatment fluid is arranged, for example to contain the developer solution of resist unrestrained and be attached on the outer peripheral face of transfer roller, developer solution also can be exhausted, thereby the resist composition can not solidify.Therefore, can avoid the resist that transfer roller is cured to pollute.In addition, due to be full of liquid storage container moistening with liquid in transfer roller just be immersed in wherein, thereby needn't worry moisteningly to splash with liquid.Therefore, even if making the developer solution circulation that for example contains resist with its as moistening with the reusable occasion of liquid, yet can not cause containing resist development liquid and be attached to and pollute substrate on substrate because splashing, perhaps contain resist development liquid and be attached on sensor equipment and cause misoperation.
As the substrate board treatment of the related invention of scheme 2, owing to discharging the moistening liquid of use from the outlet of discharging liquid mechanism to transfer roller, thereby transfer roller is in all the time by the state of moistening use liquid wetting.Therefore, even treatment fluid, for example to contain resist development liquid unrestrained and be attached on transfer roller from the surface of substrate, developer solution also can be exhausted, thereby the resist composition can not solidify.Therefore, can avoid the resist that transfer roller is cured to pollute.In addition, discharge liquid mechanism and configure near transfer roller, therefore, moisteningly be not easy to splash with liquid, moisteningly disperse everywhere in can be not on a large scale with liquid.Therefore, even if making the developer solution circulation that for example contains resist as moistening with the reusable occasion of liquid, yet can not cause containing resist development liquid and be attached to and pollute substrate on substrate because splashing, perhaps contain resist development liquid and be attached on sensor equipment and cause misoperation.In addition, due to the below of discharging liquid mechanism and be configured in the substrate height position, therefore, even contain resist development liquid from discharging the outlet drippage of liquid mechanism, developer solution can not be attached on substrate yet.
Substrate board treatment as the related invention of scheme 3, owing to discharging the moistening liquid of using from the outlet of discharging liquid mechanism to the upper roll that is configured in directly over transfer roller, make upper roll be in all the time by moistening state with liquid wetting, and flow to downwards on the outer peripheral face of transfer roller with the outer peripheral face of liquid via upper roll due to moistening, make transfer roller also be in all the time by moistening state with liquid wetting.Therefore, though with upper roll that the upper surface of substrate contacts on adhered to treatment fluid, for example contained the developer solution of resist, and developer solution is unrestrained and be attached on transfer roller from the surface of substrate, developer solution also can be exhausted, thereby the resist composition can not solidify.Therefore, can avoid the resist that upper roll and transfer roller are cured to pollute.In addition, be configured near transfer roller owing to discharging liquid mechanism, therefore, moisteningly be not easy to splash with liquid, moisteningly disperse everywhere in can be not on a large scale with liquid.Therefore, even if making the developer solution circulation that for example contains resist as moistening with the reusable occasion of liquid, yet can not cause containing resist development liquid and be attached to and pollute substrate on substrate because splashing, perhaps contain resist development liquid and be attached on sensor equipment and cause misoperation.In addition, due to the below of discharging liquid mechanism and be configured in the substrate height position, therefore, even contain resist development liquid from discharging the outlet drippage of liquid mechanism, developer solution can not be attached on substrate yet.
Substrate board treatment as the related invention of scheme 4, when transfer roller and upper roll are positioned at the top, discharge liquid mechanism is positioned at the below of substrate height position, therefore, even treatment fluid, for example contain resist developer solution from discharging the outlet drippage of liquid mechanism, developer solution can not be attached on substrate yet.And when transfer roller and upper roll were positioned at the below, substrate contact with transfer roller and upper roll, therefore, dripped from the outlet of discharging liquid mechanism even contain resist development liquid, needn't worry that also developer solution can be attached on substrate.
As the substrate board treatment of the related invention of scheme 5, transfer roller and upper roll be by by on the extended line of the center line of transfer roller a bit centered by shake and mobile between position and lower position up at vertical plane.And, position up, transfer roller and upper roll are lateral attitude, and the substrate that transfer roller is supported also tilts, and therefore, treatment fluid spills out from substrate surface.
Substrate board treatment as the related invention of scheme 6, by except the liquid roller from by on transfer roller support and the substrate that sends with treatment fluid, for example contain resist development liquid and remove, even if containing resist development liquid except having adhered on the outer peripheral face of liquid roller this moment, owing to being in all the time except the liquid roller by moistening state with liquid wetting, therefore, developer solution can be exhausted, thereby the resist composition can not be solidificated on outer peripheral face except the liquid roller.
Substrate board treatment as the related invention of scheme 7, liquid supplying device is supplied with the moistening liquid of using with lower pressure to discharging liquid mechanism, this pressure is low can not be splash and the degree of dispersing everywhere with liquid to moistening from the outlet of discharging liquid mechanism to the transfer roller discharge, therefore, moisteningly be not easy to splash with liquid, moisteningly disperse everywhere in can be not on a large scale with liquid.
Substrate board treatment as the related invention of scheme 8, during transmitting substrate and substrate processed, when not contacting with the lower surface of substrate, transfer roller discharges the moistening liquid of using from the outlet of discharging liquid mechanism, discharge the outlet of liquid mechanism and do not discharge the moistening liquid of using when transfer roller contacts with the lower surface of substrate, therefore, make the developer solution circulation that for example contains resist and as moistening with the reusable occasion of liquid, needn't worry to be attached on substrate and to pollute substrate from the resist development liquid that contains that the outlet of discharging liquid mechanism is discharged.
Substrate board treatment as the related invention of scheme 9, during not transmitting substrate, intermittently supply with at regular intervals the moistening liquid of using by liquid supplying device to discharging liquid mechanism, therefore, not only transfer roller or upper roll and transfer roller can keep by moistening state with liquid wetting, and moistening use amount with liquid is reduced.
Substrate board treatment as the related invention of scheme 10, mechanism discharges the moistening liquid of using to the top of the incline direction of the inner bottom surface for the treatment of trough from discharge liquid, the moistening of this discharge flows downward on inner bottom surface with the gradient of liquid along inner bottom surface, therefore, whole inner bottom surface is in all the time by moistening state with liquid wetting.Therefore, though treatment fluid, for example contain resist developer solution unrestrained to inner bottom surface from the surface of substrate, developer solution also can be exhausted, the resist composition can not solidify.Therefore, can avoid the resist that the inner bottom surface for the treatment of trough is cured to pollute.
Description of drawings
Fig. 1 illustrates an example of the form of implementation of the 1st scheme, is the end view that one of the transfer roller of one of the inscape to development processing apparatus is showed with the broken section form.
Fig. 2 illustrates an example of the form of implementation of the 2nd scheme, the end view that one of transfer roller that is one of the inscape to development processing apparatus is showed.
Fig. 3 is the end view of transfer roller that another form of implementation of the 2nd scheme is showed.
Fig. 4 illustrates an example of the form of implementation of the 3rd scheme, is the transfer roller of one of the inscape to development processing apparatus and the end view showed except the liquid roller.
Fig. 5 illustrates the modified example of the 3rd scheme, is the transfer roller of one of the inscape to development processing apparatus and the sectional side view showed except the liquid roller.
Fig. 6 is the front view except the liquid roller shown in Figure 5.
Fig. 7 illustrates an example of the form of implementation of the 4th scheme, is the cutaway view that the bottom of the treatment trough of the inscape of development processing apparatus is showed.
Fig. 8 is a schematic diagram that example is showed to the general configuration of development processing apparatus.
Embodiment
Below, best form of implementation of the present invention is described in conjunction with Fig. 1 to Fig. 7.
Fig. 1 illustrates an example of the form of implementation of the 1st scheme, is the end view that one of the transfer roller of one of the inscape to substrate board treatment, for example development processing apparatus is showed with the broken section form.General structure for development processing apparatus, be described in conjunction with Fig. 8, therefore its explanation is omitted, but transfer roller 10 shown in Figure 1, be corresponding to the transfer roller 4b's of the middle part that is configured in treatment trough 2 among a plurality of transfer roller 4a～4b of development processing apparatus shown in Figure 8.
As the device with structure shown in Figure 1, the part outer peripheral face of transfer roller 10 is immersed in the developer solution 14 that is full of liquid storing barrel 12, and therefore, the outer peripheral face of transfer roller 10 is in the wetting state of liquid 14 that is developed all the time.Therefore, trickle down and be attached on the outer peripheral face of transfer roller 10 from the surface of substrate 1 even contain the developer solution of resist, also the developer solution exhaustion can not occur and the phenomenon of resist composition curing on the outer peripheral face of transfer roller 10.Therefore, needn't worry that the resist that transfer roller 10 can be cured pollutes.In addition, because transfer roller 10 in the developer solution 14 that is full of liquid storing barrel 12 just is immersed in wherein, thereby needn't worry that developer solution splashes.Therefore, can not be attached to and pollute substrate 1 on substrate 1 owing to splashing the developer solution that causes containing resist, perhaps contain resist development liquid and be attached on sensor equipment and cause misoperation.
Secondly, Fig. 2 illustrates an example of the form of implementation of the 2nd scheme, the end view that one of transfer roller that is one of the inscape to development processing apparatus is showed.This transfer roller shown in Figure 2 16 is corresponding near the most transfer roller 4a that accounts among a plurality of transfer roller 4a～4c of development processing apparatus shown in Figure 8, transfer roller 4b, the 4c middle part that is configured in respectively treatment trough 2 and port of export opening 3b.
Discharging developer solution 14 for the outlet 22 of discharging liquid ejection nozzle 20 to transfer roller 16 controls like this, namely, during process on transmission substrate 1 limit, limit, do not contact with the lower surface of substrate 1 at transfer roller 16, and when also being present near this transfer roller 16, substrate 1 do not discharge, and when transfer roller 16 contacts with the lower surface of substrate 1 and substrate 1 be present near the time, discharge the outlet 22 of liquid ejection nozzle 20 and do not discharge developer solution.By the intermittent developer solution of discharging as mentioned above, make the occasion that is cycled to repeat use at the developer solution that contains resist, can avoid being attached on substrate 1 and polluting substrate 1 from contain resist development liquid or its spittle that the outlet 22 of discharging liquid ejection nozzle 20 is discharged.On the other hand, during not transmitting substrate 1, discharging the outlet 22 of liquid ejection nozzle 20 and discharge developer solution 14 to transfer roller 16, is that intermittence is carried out at regular intervals.Intermittently carry out at regular intervals by the discharge that makes as mentioned above developer solution, thereby not only can make transfer roller 16 keep wetting state to prevent that the resist composition from solidifying during the processing of not carrying out substrate 1, but also can reduce the use amount of developer solution.
As the device with structure shown in Figure 2, by discharging developer solution 14 by the outlet 22 of discharging liquid ejection nozzle 20 to transfer roller 16, make transfer roller 16 be in all the time and be developed the wetting state of liquid 14.Therefore, trickle down and be attached on transfer roller 16 from the surface of substrate 1 even for example contain the developer solution of resist, developer solution also can be exhausted, can avoid resist to solidify.Therefore, can prevent that the resist that transfer roller 16 is cured from polluting.In addition, because developer solution 14 is discharged from outlet 22 low pressure of discharging liquid ejection nozzle 20, and be to discharge developer solutions 14 from the position near transfer roller 16 to transfer roller 16, therefore, developer solution 14 is not easy to splash, and developer solution 14 disperses in can be not on a large scale everywhere.Therefore, even if be cycled to repeat the occasion of use at the developer solution that contains resist, yet can not splash the pollution that causes substrate 1 or be attached on sensor equipment and cause misoperation because containing resist development liquid.In addition, discharging liquid ejection nozzle 20 is the belows that are configured in the height and position of substrate 1, therefore, even contain resist development liquid from outlet 22 drippages, needn't worry that also this developer solution can be attached on substrate 1.
In addition, Fig. 3 is the end view of transfer roller that another form of implementation of the 2nd scheme is showed.In form of implementation shown in Figure 3, discharge the outlet 22 of liquid ejection nozzle 20 towards oblique below.If as form of implementation shown in Figure 2, will discharge liquid ejection nozzle 20 and be arranged to outlet 22 up, when ending outlet 22 discharge liquid, needn't worry that liquid can be from outlet 22 drippages, and with respect to this, in form of implementation shown in Figure 3, liquid might be from outlet 22 drippages.But, are the belows that are configured in the height and position of substrate 1 shown in double dot dash line L owing to discharging liquid ejection nozzle 20, therefore needn't worry containing resist development liquid and can be attached on substrate 1 from outlet 22 drippages.
Secondly, Fig. 4 illustrates an example of the form of implementation of the 3rd scheme, is the transfer roller of one of the inscape to development processing apparatus and the end view showed except the liquid roller.This transfer roller shown in Figure 4 24 is corresponding near the transfer roller 4c among a plurality of transfer roller 4a～4c of development processing apparatus shown in Figure 8, port of export opening 3b that be configured in treatment trough 2.
Be configured to directly over transfer roller 24 with transfer roller 24 in opposite directions except (rolling) liquid roller 26, be its outer peripheral face contact with the whole width of the upper surface of substrate 1 cylindrical, the whole width contact edge rotation of the upper surface of the substrate 1 that limit and transfer roller 24 are supported and transmitted, thus the function that the developer solution with crossing that covers on substrate 1 is removed from substrate 1 had.And near the below of the height and position (representing with double dot dash line L in Fig. 4) of substrate 1 transfer roller 24, that transfer roller 24 is supported and transmitted disposes outlet 30 and removes liquid roller 26 discharge liquid ejection nozzle 28 in opposite directions.Discharge liquid ejection nozzle 28 for this, same with discharge liquid ejection nozzle 20 shown in Figure 2, the developer solution that for example flows to the treatment trough bottom downwards from the surface of substrate 1 and be recycled in recycling can is supplied with by giving pump from recycling can.At this moment, the pressure setting when supplying with developer solution to discharge liquid ejection nozzle 28 must be lower, the low degree of dispersing everywhere to not splashing from outlet 30 to the developer solution 14 of discharging except liquid roller 26 of this pressure.
For the outlet 30 of discharging liquid ejection nozzle 28 to discharge the control of developer solutions 14 except liquid roller 26, same with discharge liquid ejection nozzle 20 shown in Figure 2, during process on transmission substrate 1 limit, limit, do not contact with substrate 1 at transfer roller 24 and except liquid roller 26, and when also being present near this transfer roller 24, substrate 1 do not discharge, and when contacting with substrate 1 at transfer roller 24 and except liquid roller 26 and substrate 1 be present near the time, the outlet 30 of discharge liquid ejection nozzle 28 is not discharged developer solution.In addition, during not transmitting substrate 1, discharging the outlet 30 of liquid ejection nozzle 28 to discharging developer solution 14 except liquid roller 26, is intermittently to carry out at regular intervals.
As the device with structure shown in Figure 4, due to from the outlet 30 of discharging liquid ejection nozzle 28 to discharging developer solutions 14 except liquid roller 26, make to be in all the time the state that is developed liquid wetting except liquid roller 26.In addition, be discharged to except the developer solution 14 on liquid roller 26 outer peripheral faces, flow on the outer peripheral face of the transfer roller 24 that is positioned at the below downwards via the outer peripheral face except liquid roller 26, thereby make transfer roller 24 also be in all the time the state that is developed liquid wetting.Therefore, even what contact with the upper surface of substrate 1 has adhered to except on liquid roller 26 developer solution that for example contains resist, and be attached on transfer roller 24 from the unrestrained resist development liquid that contains in the surface of substrate 1, developer solution can be inexhausted yet, can prevent that the resist composition from solidifying.Therefore, can prevent that the resist that is cured except liquid roller 26 and transfer roller 24 from polluting.In addition, because developer solution 14 is discharged from outlet 30 low pressure of discharging liquid ejection nozzle 28, and be near position from transfer roller 24 to discharging developer solutions 14 except liquid roller 26, therefore, developer solution 14 is not easy to splash, developer solution 14 disperses in can be not on a large scale everywhere.Therefore, even if be cycled to repeat the occasion of use at the developer solution that contains resist, can not occur to splash and pollute substrate 1 or be attached to phenomenons such as causing misoperation on sensor equipment because containing resist development liquid yet.In addition, discharge liquid ejection nozzle 28 is configured in the height and position below than substrate 1, therefore, even contain resist development liquid from outlet 30 drippages, needn't worry that also this developer solution can be attached on substrate 1.
Fig. 5 and Fig. 6 illustrate the modified example of the 3rd scheme, and Fig. 5 is that the transfer roller of one of inscape to development processing apparatus reaches the sectional side view of being showed except the liquid roller, and Fig. 6 is its front view.This Fig. 5 and transfer roller shown in Figure 6 60 and except liquid roller 52,54, displaying be near the transfer roller 4c that configures the port of export opening 3b of the treatment trough 2 of development processing apparatus shown in Figure 8 and near roller.
The development processing apparatus that this modified example is related, transmit substrate 1 in the cardinal principle in treatment trough 2 whole zone with horizontal attitude, and send to next process after making substrate 1 become lateral attitude near the downstream for the treatment of trough 2.Therefore, the zone at (namely near port of export opening 3b place), the transfer roller 62 that substrate 1 is fixed in treatment trough 2 transmits with horizontal attitude near the downstream for the treatment of trough 2.And in zone in addition, namely near the zone of port of export opening 3b, substrate 1 is transmitted roller 60 and removes liquid roller 52,54 and transmit.Except liquid roller 52,54, be arranged in and form the minim gap that substrate 1 can therefrom pass through between them.Transfer roller 60 reaches except liquid roller 52,54, is arranged on roller installing component 64,66.Roller installing component 64,66 as shown in Figure 6, can be under the driving of not shown drive source, take from except the point 0 on the extended line of the rotating shaft 68 of liquid roller 52 through and the straight line parallel with the substrate direction of transfer (Fig. 6 for through point 0 and perpendicular to the straight line of paper) centered by, the set angle of direction rotation (single-point rule A and A ' angle) up and down.
Be positioned at roller installing component 64,66 under the state of lower position, as shown in the solid line in Fig. 5 (a) and Fig. 6, transfer roller 60 and being horizontal except liquid roller 52,54.And, on this horizontal level except between liquid roller 52 and adjacent transfer roller 60, be provided with the oscillator 72 whether detection substrate 1 is sent to the checkout gear 70 on transfer roller 60.In the downstream of oscillator 72, be provided with to the discharge liquid ejection nozzle 74 except liquid roller 54 discharge developer solutions that is positioned at horizontal level.Discharge liquid ejection nozzle 74, be arranged to horizontal level substantially on parallel ejection nozzle pipe 75, be provided with a plurality of along the depth direction of pointing to Fig. 5 paper except liquid roller 54.For this ejection nozzle pipe 75, same with discharge liquid ejection nozzle 20 shown in Figure 2, the developer solution that for example flows to the treatment trough bottom downwards from the surface of substrate 1 and be recycled in recycling can is supplied with by giving pump from recycling can.Checkout gear 70 and ejection nozzle pipe 75 are fixed on treatment trough 2.In addition, among the transfer roller 60 that is arranged on roller installing component 64,66 between the transfer roller 60 and transfer roller 62 of upstream side, also be provided with the checkout gear 76 that detects substrate 1.
Be positioned at roller installing component 64,66 under the state of uppermost position, as shown in the double dot dash line in Fig. 5 (b) and Fig. 6, transfer roller 60 and tilting as low side to put 0 one sides except liquid roller 52,54, and, this transfer roller 60 and except liquid roller 52,54 its extreme lower positions will be higher than ejection nozzle pipe 75.In Fig. 5 (b), do not draw the tilt condition of roller on the depth direction.
The operation principle of this development processing apparatus is as described below.In development processing apparatus, substrate 1 is sent into from arrival end opening (not shown Fig. 5) the one-tenth horizontal attitude for the treatment of trough 2, the developer solution that developer solution ejection nozzle 5 is discharged covers on substrate 1, and the limit keeps horizontal attitude to send to downstream under transfer roller 62 drives carrying out the development treatment limit under this state.At this moment, roller installing component 64,66 is positioned at lower position, transfer roller 60 and be positioned at horizontal level except liquid roller 52,54.And, there is this moment developer solution to discharge from discharging liquid ejection nozzle 74, the developer solution of discharge is discharged to except on liquid roller 54, keeps being developed the state of liquid wetting except liquid roller 54.In addition, be positioned at except liquid roller 54 belows except liquid roller 52, also be in by the wetting state of developer solution from flowing down except liquid roller 54.Therefore, can be because not solidifying except liquid roller 52, the 54 dry resist compositions that cause.
Afterwards, send and when making oscillator 78 action of checkout gear 76, stop discharging developer solutions from discharging liquid ejection nozzle 74 when substrate 1.This is to discharge liquid ejection nozzle 74 because, substrate 1 has approached, if developer solution continues to discharge from discharging liquid ejection nozzle 74, the spittle of the developer solution that might discharge is splashed on substrate 1 and produces and process the bad phenomenon such as irregular.Afterwards, when making oscillator 72 action of checkout gear 76 when further transmission substrate 1, the rotation of transfer roller 60 stops, and substrate 1 will stop on transfer roller 60.Afterwards, make aforementioned drive source work, roller installing component 64,66 rises and makes transfer roller 60 tilt take its point 0 one sides as low side, and the substrate 1 that is placed on above it also becomes lateral attitude.So the developer solution major part that covers on substrate 1 is trickled downwards and basically is removed.Then, after most of liquid flows down, again drive transfer roller 60 and except liquid roller 52,54 rotations, make it to keep lateral attitude to transmit downstream substrate 1, the port of export opening 3b that forms adaptably from the position with this lateral attitude sends and is sent to next process.At this moment, because roller installing component 64,66 rises, the oscillator 72 of discharge liquid ejection nozzle 74 and checkout gear 70 etc. is positioned at the below of transfer roller 60, thereby can not hinder the transmission of substrate 1, and, even liquid spills from discharging liquid ejection nozzle 74 unintentionally, can not be attached on substrate 1 yet.After substrate 1 was sent from port of export opening 3b, roller installing component 64,66 descended to wait for next substrate.
In addition, Fig. 7 illustrates an example of the form of implementation of the 4th scheme, is the cutaway view that the bottom of the treatment trough of the inscape of development processing apparatus is showed.In device shown in Figure 7, the top at the incline direction of the inner bottom surface 34 of the inclination for the treatment of trough 32 disposes outlet 38 towards the discharge liquid ejection nozzle 36 of inner bottom surface 34.Discharge liquid ejection nozzle 36 for this, with for example flowing to the treatment trough bottom downwards from the surface of substrate 1 and being recycled to developer solution in recycling can, supply with from recycling can.
As the device with structure shown in Figure 7, discharge developer solution 14 from the outlet 38 of discharging liquid ejection nozzle 36 to the top of the incline direction of the inner bottom surface 34 for the treatment of trough 32, the developer solution 14 of this discharge flows downward on inner bottom surface 34 along the gradient of inner bottom surface 34.Therefore, whole inner bottom surface 34 is in the wetting state of liquid 14 that is developed all the time.Therefore, even the developer solution that contains resist is unrestrained on inner bottom surface 34 from the surface of substrate 1, this developer solution also can be exhausted, thereby resist can not solidify, and can prevent that the resist that the inner bottom surface 34 for the treatment of trough 32 is cured from polluting.
Abovely be illustrated with regard to development processing apparatus, but the present invention also can be applied to carry out the substrate board treatment processed such as cleaning, burn into striping etc.
The effect of invention
When operational version 1 during to substrate board treatment of related each of scheme 3 invention, transmit the substrate limit at the treatment trough inner edge and supply with to substrate the occasion that treatment fluid is processed substrate, can prevent from containing the such treatment fluid that contains cure component of the developer solution of resist pollutes transfer roller or upper roll and transfer roller, can prevent that substrate from being polluted, the equipment that prevents produces misoperation etc.And, due to the inside cleaning work that needn't frequently carry out treatment trough, thereby can not reduce treatment effeciency, can not make operation become numerous and diverse.
Substrate board treatment as the related invention of scheme 4, on any position above or below no matter transfer roller and upper roll are positioned at, even treatment fluid, for example contain resist developer solution from discharging the outlet drippage of liquid mechanism, needn't worry that also developer solution can be attached on substrate.
Substrate board treatment as the related invention of scheme 5, transfer roller and upper roll can be shaken in vertical plane and be moved between position and lower position up, when being positioned at the top position, the substrate run-off the straight that transfer roller is supported, thus the treatment fluid on substrate flows down some and be removed.
Substrate board treatment as the related invention of scheme 6, even with except the liquid roller with treatment fluid, the developer solution that for example contains resist contains resist development liquid and is attached on outer peripheral face except the liquid roller when substrate is removed, can prevent that also the resist composition from solidifying except on the outer peripheral face of liquid roller.
As the substrate board treatment of the related invention of scheme 7, moisteningly splash with liquid is more difficult, can more effectively suppress moistening and disperse everywhere with liquid.
As the substrate board treatment of the related invention of scheme 8,, can worry from what the outlet of discharging liquid mechanism was discharged to contain resist development liquid and can pollute substrate as the moistening occasion that is recycled with liquid making the developer solution circulation that for example contains resist.
As the substrate board treatment of the related invention of scheme 9, not only can prevent that transfer roller or upper roll and transfer roller from being polluted, but also can reduce moistening use amount with liquid.
When the substrate board treatment of the related invention of operational version 10, transmit the substrate limit at the treatment trough inner edge and supply with to substrate the occasion that treatment fluid is processed substrate, can prevent from containing the such treatment fluid that contains cure component of the developer solution of resist pollutes the inner bottom surface for the treatment of trough, prevent that substrate from being polluted, prevent equipment malfunction work etc.And, due to the inside cleaning work that needn't frequently carry out treatment trough, thereby can not reduce treatment effeciency, can not make operation become numerous and diverse.
Claims (8)
1. substrate development processing apparatus transmits the substrate limit at the treatment trough inner edge and with developer solution, substrate is carried out development treatment, it is characterized in that,
The downside of the said substrate of contact and support said substrate and the transfer roller that transmits under dispose liquid storage container, have and supply with developer solution in this liquid storage container and make the liquid supplying device that is full of all the time developer solution in liquid storage container, keep moistening thereby the part outer peripheral face of said transfer roller is immersed in the outer peripheral face that makes said transfer roller in the developer solution that is full of said liquid storage container.
2. substrate development processing apparatus transmits the substrate limit at the treatment trough inner edge and with developer solution, substrate is carried out development treatment, it is characterized in that,
The downside that approaches the said substrate of contact and support said substrate and the height and position of the transfer roller that transmits and the substrate supported by said transfer roller below, dispose outlet and said transfer roller discharge liquid mechanism in opposite directions, have by supply with developer solution to this discharge liquid mechanism and discharge developer solution to the liquid supplying device of said transfer roller from said discharge liquid mechanism.
3. substrate development processing apparatus transmits the substrate limit at the treatment trough inner edge and with developer solution, substrate is carried out development treatment, it is characterized in that,
The downside of the said substrate of contact and support said substrate and the transfer roller that transmits near and the height and position of the substrate supported by said transfer roller below, dispose outlet be configured in said transfer roller directly over transfer roller in opposite directions and the upper surface of the substrate of supporting and transmitting with the transfer roller upper roll discharge liquid mechanism in opposite directions that contacts, have by supply with developer solution to this discharge liquid mechanism and discharge developer solution to the liquid supplying device of said transfer roller from said discharge liquid mechanism.
4. substrate development processing apparatus as claimed in claim 3, it is characterized in that, said transfer roller and said upper roll, be supported as up and move between position and lower position, said discharge liquid mechanism, be configured to be positioned at the below of the height and position of the substrate that transfer roller supports when transfer roller and upper roll are positioned at the top, when transfer roller and upper roll are positioned at the below, by control, said transfer roller is positioned on the position identical with other transfer roller height of upstream one side that is configured in by comparison the substrate direction of transfer, and substrate is not contacted with transfer roller and upper roll.
5. substrate development processing apparatus as claimed in claim 4, it is characterized in that, said transfer roller and said upper roll, be supported as can by on the extended line of the center line of transfer roller a bit centered by shake in vertical plane, thereby can move between the top position that becomes lateral attitude and the lower position that becomes horizontal attitude.
6. substrate development processing apparatus as claimed in claim 5, it is characterized in that, said transfer roller and said upper roll are for removing the liquid roller, at this except between liquid roller and said other transfer roller, be equiped be supported as with remove the liquid roller between position and lower position, one move up, contact with the lower surface of substrate and a plurality of transfer rollers that substrate is supported and transmitted.
7. said substrate development processing apparatus as arbitrary in claim 2 to 6, it is characterized in that, during transmitting substrate and substrate processed, said liquid supplying device is intermittently supplied with developer solution to discharging liquid mechanism, make when said transfer roller contact with the lower surface of substrate from the outlet of said discharge liquid mechanism discharge developer solution and when transfer roller contacts with the lower surface of substrate the outlet from discharge liquid mechanism do not discharge developer solution.
8. substrate development processing apparatus as claimed in claim 7, is characterized in that, during not transmitting substrate, intermittently supplies with developer solution by said liquid supplying device to discharging liquid mechanism at regular intervals.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002092462A JP3987362B2 (en) | 2002-03-28 | 2002-03-28 | Substrate processing equipment |
| JP92462/02 | 2002-03-28 | ||
| JP92462/2002 | 2002-03-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1448994A CN1448994A (en) | 2003-10-15 |
| CN1448994B true CN1448994B (en) | 2013-06-19 |
Family
ID=28786161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN031079911A Expired - Lifetime CN1448994B (en) | 2002-03-28 | 2003-03-28 | Device for treating substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3987362B2 (en) |
| KR (1) | KR100527307B1 (en) |
| CN (1) | CN1448994B (en) |
| TW (1) | TWI225676B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4045214B2 (en) * | 2003-08-12 | 2008-02-13 | 株式会社 日立ディスプレイズ | Display element manufacturing method and manufacturing apparatus |
| DE102005057109A1 (en) * | 2005-11-26 | 2007-05-31 | Kunze-Concewitz, Horst, Dipl.-Phys. | Continuous wet chemical processing, e.g. cleaning, etching, stripping, coating or drying of flat, thin, fragile substrates comprises transporting and processing substrates using absorbent rollers |
| JP5444667B2 (en) * | 2008-09-08 | 2014-03-19 | 日本電気硝子株式会社 | Glass plate adhering liquid removing apparatus and glass plate adhering liquid removing method |
| KR101279376B1 (en) * | 2011-07-20 | 2013-07-24 | 주식회사 디엠에스 | Apparatus for treating substrate |
| CN103021905B (en) | 2011-07-20 | 2016-12-21 | 显示器生产服务株式会社 | Substrate board treatment |
| TWI745566B (en) * | 2017-03-29 | 2021-11-11 | 美商康寧公司 | Substrate coating apparatus and methods |
| JP2021004149A (en) * | 2019-06-26 | 2021-01-14 | 日本電気硝子株式会社 | Glass plate cleaning apparatus and glass plate manufacturing process |
| JP7204788B2 (en) * | 2021-01-22 | 2023-01-16 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate transport device, developing device and developing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6309517B1 (en) * | 1998-11-25 | 2001-10-30 | Oliver Sales Company | Apparatus for inline plating |
-
2002
- 2002-03-28 JP JP2002092462A patent/JP3987362B2/en not_active Expired - Lifetime
-
2003
- 2003-03-22 KR KR10-2003-0017990A patent/KR100527307B1/en active IP Right Grant
- 2003-03-27 TW TW092106948A patent/TWI225676B/en not_active IP Right Cessation
- 2003-03-28 CN CN031079911A patent/CN1448994B/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6309517B1 (en) * | 1998-11-25 | 2001-10-30 | Oliver Sales Company | Apparatus for inline plating |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030078662A (en) | 2003-10-08 |
| TW200403787A (en) | 2004-03-01 |
| JP2003289036A (en) | 2003-10-10 |
| TWI225676B (en) | 2004-12-21 |
| JP3987362B2 (en) | 2007-10-10 |
| KR100527307B1 (en) | 2005-11-09 |
| CN1448994A (en) | 2003-10-15 |
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