KR100527307B1 - Substrate processing apparatus - Google Patents

Abstract

In the case where the processing liquid is supplied to the substrate while the substrate is being transported in the processing tank to treat the substrate, the processing liquid containing the solidified component can prevent the conveying roller, the inner wall surface of the processing tank, and the like from being contaminated. To provide.

The liquid storage container 12 is installed directly under the conveying roller 10 for supporting and transporting the substrate by contacting the bottom surface of the substrate 1, and supplying the developer into the liquid storage container to always maintain the developer solution 14 in the liquid storage container. ), And a part of the circumferential surface of the conveying roller is immersed in the developer filled in the liquid storage container.

Description

Substrate Processing Equipment {SUBSTRATE PROCESSING APPARATUS}

According to the present invention, the substrates, such as glass substrates for flat panel displays, semiconductor wafers and printed substrates, are cleaned, developed and etched with respect to the substrates while being supported and conveyed by a plurality of conveying rollers arranged in parallel. And a substrate processing apparatus for processing a thin film or the like.

For example, in the process of forming a wiring pattern on a substrate, when developing a photosensitive resist film formed on the surface of the substrate, the developer is placed on the substrate while the substrate is placed one by one and conveyed by a transfer roller. , The roller conveyance developing apparatus of the system which stops a developing reaction after predetermined time after containing a liquid is used. An example of the schematic structure of the developing apparatus is schematically shown in FIG. 8.

The developing apparatus shown in FIG. 8 includes a processing tank 2 having an inlet side opening 3a and an outlet side opening 3b, and a plurality of conveying rollers 4a and 4b inside the processing chamber 2. 4c) are provided in parallel. And the board | substrate 1 is carried in into the processing tank 2 through the inlet opening 3a, is supported by the conveying rollers 4a-4c, and is conveyed in a horizontal direction, and exits from the inside of the processing tank 2 It is carried out through the side opening 3b, and is sent to the next water washing tank (not shown). In the vicinity of the inlet side opening 3a inside the processing tank 2, a developing solution discharge nozzle 5 is provided. Moreover, in the vicinity of the exit side opening 3b in the inside of the processing tank 2, it contacts the upper surface side of the board | substrate 1 supported and conveyed by the conveyance roller 4c so that it may face the conveyance roller 4c directly on the conveyance roller 4c. The liquid limiting roller 6 to be provided is provided.

In the development apparatus of such a configuration, the substrate 1 having the photosensitive resist film exposed on the surface of the developing solution discharge nozzle 5 provided in the vicinity of the inlet side opening 3a of the processing tank 2. When passing through the position just below, the developer 7 discharged from the slit-shaped discharge port of the bottom face of the developer discharge nozzle 5 is contained on the surface. The developing reaction of the photosensitive resist film advances while the board | substrate 1 in which the liquid was carried is conveyed by the conveyance rollers 4a and 4b. When the board | substrate 1 is conveyed to the vicinity of the exit side opening 3b of the processing tank 2, the developing solution 7 is removed on the board | substrate 1 by the liquid limitation roller 6, and thereafter, a processing tank It is taken out in (2). And the board | substrate 1 is sent to the following water washing tank, and the image development reaction of a photosensitive resist film is completely stopped.

In the above-described developing apparatus, when the developing solution 7, in particular, the developing solution 7 containing a resist overflows from the surface of the substrate 1, the developing solution is formed on the circumferential surface of the conveying rollers 4a to 4c. It adheres to the inner wall surface of the processing tank 2, etc. In addition, the circumferential surface of the liquid limiting roller 6 is in a state where the developer 7 containing a resist is always attached. When the developer adhered to these members dries, the resist powder solidifies and contaminates the members. For this reason, particles generate | occur | produce, and the board | substrate 1 may be polluted, or the problem which may cause the malfunction of apparatuses, such as a sensor, may arise. On the other hand, in order to prevent these problems from occurring, it is necessary to frequently clean the inside of the treatment tank 2, but the treatment efficiency is reduced and the work is complicated.

In addition, in the case where a spray nozzle is provided in a treatment tank different from the above method, that is, a developing method in which a developer or the like is ejected into a mist shape so as to diffuse the developing solution or the like from the spray nozzle to the entire interior of the treatment tank, the conveyance is Since the surface of the inner wall of the roller, the processing tank, the sensor, or the like is always wet with the developer, the contamination by the solidified resist is less likely to occur, and the above-described problems are less likely to occur. However, when the conveyance roller etc. are provided in the location where mist, such as a developing solution, is hard to reach every corner, contamination of the conveyance roller etc. by the developing solution containing a resist also arises. In addition, the said method cannot be employ | adopted basically in the process which needs to suppress mist generation.

The present invention has been made in consideration of the above matters, and in the case where the processing liquid is supplied to the substrate while the substrate is being transported in the processing tank to process the substrate, the transfer roller is carried out by the processing liquid containing a solidified component. It is an object of the present invention to provide a substrate processing apparatus that can prevent contamination of an inner wall surface of a processing tank and the like, and prevent contamination of a substrate, malfunction of an apparatus, and the like.

The invention according to claim 1 is a substrate processing apparatus for treating a substrate with a processing liquid while transporting the substrate in a processing tank, wherein the liquid storage container is placed directly under the transport roller that contacts the bottom surface of the substrate and supports and transports the substrate. And a liquid supply means for supplying the wet solution into the liquid storage container and always filling the inside of the liquid storage container with the wet solution, and part of the circumferential surface of the conveying roller in the wet solution filled in the liquid storage container. It is characterized by soaking (浸漬).

The invention according to claim 2 is a substrate processing apparatus for treating a substrate with a processing liquid while conveying the substrate in a processing tank, wherein the substrate is in contact with a lower surface of the substrate to be close to a conveying roller for supporting and conveying the substrate. And a liquid supply means for disposing the liquid discharge means so that the discharge port faces the conveyance roller from the height position of the substrate supported by the substrate, and supplying the wet solution to the liquid discharge means.

The invention according to claim 3 is a substrate processing apparatus for treating a substrate with a processing liquid while conveying the substrate in a processing tank, wherein the substrate is in the vicinity of a conveying roller that contacts the bottom surface of the substrate and supports and conveys the substrate. Downward from the height position of the supported substrate, the liquid discharge means is provided so as to face the conveying roller directly above the conveying roller and to face the upper roller contacting the upper surface side of the substrate conveyed by the conveying roller and being discharged, And liquid supply means for supplying the wet solution to the liquid discharge means.

According to a fourth aspect of the present invention, in the substrate processing apparatus of claim 3, the transfer roller and the upper roller are movably supported between an upper position and a lower position. When the conveying rollers and the upper rollers are positioned below the height position of the substrate supported by the conveying rollers when they are positioned, the conveying rollers are other conveyances provided upstream in the conveying direction of the substrate. At the same height as the roller, it is characterized in that the substrate is controlled so as not to contact the conveying roller and the upper roller.

According to a fifth aspect of the present invention, in the substrate processing apparatus of claim 4, the conveying roller and the upper roller are supported so as to oscillate in the vertical plane about one point on the extension line of the axis line of the conveying roller, and become an inclined posture. And between the position and the lower position of the horizontal posture.

According to a sixth aspect of the present invention, in the substrate processing apparatus of claim 4 or 5, the conveying roller and the upper roller are liquid limiting rollers, and are integrated with the liquid limiting rollers between the liquid limiting rollers and the other conveying rollers. It is characterized in that a plurality of conveying rollers, which are supported to move between an upper position and a lower position, are in contact with the lower surface of the substrate and support and convey the substrate.

According to a seventh aspect of the present invention, in the substrate processing apparatus according to any one of claims 2 to 6, the liquid supply means does not scatter the wet solution discharged from the discharge port toward the conveying roller by liquid splashing. Characterized in that the wet solution is supplied to the liquid discharge means at a low pressure of the degree.

In the invention according to claim 8, in the substrate processing apparatus according to any one of claims 2 to 7, the conveying roller is not in contact with the lower surface side of the substrate during the period of conveying the substrate and processing the substrate. When the wet solution is discharged from the discharge port of the liquid discharge means and the conveying roller is in contact with the lower side of the substrate, the wet solution is intermittently from the liquid supply means to the liquid discharge means so as not to discharge the wet solution from the discharge port of the liquid discharge means. It is characterized by supplying a wet solution.

In the invention according to claim 9, the substrate processing apparatus according to any one of claims 2 to 8, wherein the substrate is wetted intermittently from the liquid supply means to the liquid discharge means at regular intervals during a period in which the substrate is not conveyed. It is characterized by supplying a solution.

The invention according to claim 10 is a substrate processing apparatus for treating a substrate with a processing liquid in a processing tank, comprising: liquid discharging means for discharging a wet solution onto an inclined inner bottom surface of the processing tank, the upper portion being inclined in the bottom direction of the inner bottom surface; And a liquid supply means for supplying a wet solution to the liquid discharge means.

In the substrate processing apparatus of claim 1, the wet solution is supplied from the liquid supply means into the liquid storage container so that the liquid storage container is always filled with the wet solution, and the conveying roller circumferential surface in the wet solution filled in the liquid storage container. Part of is submerged. As a result, the circumferential surface of the conveying roller is always wetted with a wet solution. For this reason, even if a processing liquid, for example, a developer containing a resist overflows from the surface of the substrate and adheres to the circumferential surface of the conveying roller, the developer does not dry out, so that the resist powder does not solidify. Therefore, it can be avoided that the conveying roller is contaminated by the solidified resist. In addition, only the conveying roller is immersed in the wet solution filled in the liquid storage container, there is no fear of liquid splashing. Therefore, even when the developer containing the resist is recycled as a wet solution while circulating, for example, the resist containing developer adheres to the substrate and contaminates the substrate, or the resist-containing developer is applied to devices such as sensors. There is no case to cause malfunction by attaching.

In the substrate processing apparatus of the second aspect of the present invention, the wet roller is discharged from the discharge port of the liquid discharge unit toward the transfer roller, whereby the transfer roller is always wet with the wet solution. For this reason, even if a processing liquid, for example, a developer containing a resist overflows from the surface of the substrate and adheres to the conveying roller, the developer does not dry out, so that the resist does not solidify. Therefore, the case where the conveyance roller is contaminated by the solidified resist can be avoided. Further, since the liquid discharge means is provided in close proximity to the conveying roller, liquid splashing is unlikely to occur, and the wet solution does not scatter widely. Therefore, even if the developer containing the resist is recycled as a wet solution while circulating, for example, the resist containing developer adheres to the substrate and contaminates the substrate, or the resist-containing developer adheres to devices such as sensors. There is no case of malfunction. In addition, since the liquid ejecting means is provided below the height position of the substrate, even if a resist-containing developer flows from the ejection opening of the liquid ejecting means, the developer does not adhere to the substrate.

In the substrate processing apparatus according to claim 3, the wet roller is discharged from the discharge port of the liquid discharge unit toward the upper roller provided immediately above the transfer roller, and the upper roller is always wet with the wet solution, As the wet solution flows down the circumferential surface of the conveying roller along the circumferential surface, the conveying roller is also always wetted with the wet solution. For this reason, even if a developing solution containing a treatment solution, for example, a resist, adheres to the upper roller in contact with the upper surface side of the substrate, and the developing solution dries on the surface of the substrate and adheres to the conveying roller, the developing solution may dry out. Therefore, the resist powder does not solidify. Therefore, it is possible to avoid contamination of the upper roller and the conveying roller by the solidified resist. In addition, since the liquid discharge means is provided in the vicinity of the conveying roller, liquid splashing is unlikely to occur, and the wet solution does not scatter widely. Therefore, even when the developer containing the resist is recycled as a wet solution while circulating, for example, the resist containing developer adheres to the substrate and contaminates the substrate, or the resist-containing developer is applied to devices such as sensors. It does not cause malfunction by attaching. In addition, since the liquid discharge means is provided below the height position of the substrate, even if the resist-containing developer flows from the discharge port of the liquid discharge means, the developer does not adhere to the substrate.

In the substrate processing apparatus of the invention according to claim 4, when the conveying roller and the upper roller are located above, the liquid ejecting means is located below the height position of the substrate, so that the developer, for example, a resist is discharged from the ejection opening of the liquid ejecting means. Even if the contained developer overflows, the developer does not adhere to the substrate. On the other hand, when the conveying roller and the upper roller are located below, the substrate does not come into contact with the conveying roller and the upper roller, so that even if the resist-containing developer overflows from the discharge port of the liquid ejecting means, there is no fear that the developer will adhere onto the substrate.

In the substrate processing apparatus of Claim 5, a conveyance roller and an upper roller move between an upper position and a lower position by oscillating in a perpendicular surface centering on one point on the extension line of the axis line of a conveyance roller, and In the upper position, since the conveying roller and the upper roller are inclined, the substrate supported by the conveying roller is also inclined, so that the processing liquid flows from the surface of the substrate.

In the substrate processing apparatus of the invention according to claim 6, the developer containing the processing liquid, for example, the resist, is removed from the substrate supported by the conveying roller and conveyed by the liquid limiting roller. Even if a resist-containing developer is adhered to the circumferential surface of the roller, the liquid limiting roller is always wet with a wet solution, so that the developer does not dry out, and therefore, the resist powder does not solidify on the circumferential surface of the liquid limiting roller. .

In the substrate processing apparatus of the invention according to claim 7, the wet solution is supplied from the liquid supply means to the liquid discharge means at a low pressure such that the wet solution discharged from the discharge port of the liquid discharge means toward the conveying roller does not scatter by liquid splashing. Therefore, liquid splashing is less likely to occur, and the wet solution does not scatter widely.

In the substrate processing apparatus of Claim 8, during the process of conveying a board | substrate and processing a board | substrate, when a conveyance roller is not in contact with the lower surface side of a board | substrate, a wet solution is discharged from a discharge port of a liquid discharge means, and conveyance is carried out. Since the wet solution is not discharged from the discharge port of the liquid discharge means when the roller is in contact with the lower side of the substrate, for example, from the discharge port of the liquid discharge means when the recycling solution containing the resist is recycled and reused as the wet solution. There is no fear that the discharged resist-containing developing solution adheres to the substrate and contaminates the substrate.

In the substrate processing apparatus of the invention according to claim 9, during the period in which the substrate is not conveyed, the wet solution is intermittently supplied from the liquid supply means to the liquid discharge means every fixed time, so that the conveying roller or the upper roller and the conveying roller are wetted. While being kept wet with the solution, the amount of the wet solution used is reduced.

In the substrate processing apparatus of the present invention according to the tenth aspect, since the inner bottom surface flows down from the liquid discharge means along the inclination of the inner bottom surface of the treatment tank, the entire inner bottom surface is always wet with the wet solution.

For this reason, even if a processing liquid, for example, a developer containing a resist, overflows from the surface of the substrate onto the inner bottom surface, the developer does not dry out, so that the resist powder does not solidify. Thus, the case where the inner bottom surface of the treatment tank is contaminated by the solidified resist can be avoided.

Embodiment

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described, referring FIGS.

1 shows an example of the first embodiment, and is a side view showing, in partial cross section, one of the conveying rollers that is one of the components of the substrate processing apparatus, for example, the developing apparatus.

Since the structure of the whole image development apparatus was mentioned above based on FIG. 8, the description is abbreviate | omitted, but the conveyance roller 10 shown in FIG. 1 is the processing tank among the multiple conveyance rollers 4a-4c of the image development apparatus shown in FIG. It corresponds to the conveyance roller 4b arrange | positioned near the middle of (2).

The conveyance roller 10 has comprised the circumferential shape which the circumferential surface contacts over the whole width direction of the lower surface side of the board | substrate 1. As shown in FIG. The conveying roller 10 has a function of cleaning the lower side of the substrate by rotating the substrate 1 while supporting and conveying the substrate 1 and rotating while contacting the entire lower side of the substrate 1 in the width direction. Immediately below the conveyance roller 10, a liquid storage container 12 is provided. In the liquid storage container 12, a wetting solution supplied by the supply pump 15 from the liquid supply source, for example, flows down from the surface of the substrate 1 to the bottom of the treatment tank (not shown). ), And the developer 14 which is conveyed by the supply pump 15 from the recovery tank is accommodated. The developer is continuously supplied into the liquid storage container 12, and the liquid storage container 12 is always filled with the developer 14, and the developer overflowed from the upper portion of the liquid storage container 12 is recovered and circulated. Used. Then, a part of the circumferential surface of the conveying roller 10 is immersed in the developing solution 14 filled in the liquid storage container 12.

In the apparatus having the structure shown in FIG. 1, part of the circumferential surface of the conveying roller 10 is immersed in the developing solution 14 filled in the liquid storage container 12, so that the circumferential surface of the conveying roller 10 is always wet with the developing solution 14. It becomes For this reason, even if the developer containing a resist overflows from the surface of the board | substrate 1, and adheres to the circumferential surface of the conveyance roller 10, it will not be said that the resist powder solidifies because the developing solution dries on the circumferential surface of the conveyance roller 10. Therefore, there is no fear that the conveyance roller 10 by the solidified resist will be contaminated. In addition, since only the conveyance roller 10 is immersed in the developing solution 14 filled in the liquid storage container 12, there is no fear of generating liquid splashing. Therefore, the splashing of the liquid does not occur when the developer containing the resist adheres to the substrate 1 to contaminate the substrate 1, or the resist-containing developing solution adheres to devices such as sensors to cause malfunction.

Next, FIG. 2: shows an example of embodiment of 2nd invention, and is a side view which shows one of the conveyance roller which is one of the components of a developing processing apparatus. The conveyance roller 16 shown in the said FIG. 2 is the conveyance roller arrange | positioned in the vicinity of the intermediate | middle of the processing tank 2, and the vicinity of the exit side opening 3b, among the several conveyance rollers 4a-4c of the image processing apparatus shown in FIG. It corresponds to most conveying rollers 4a except for (4b, 4c).

The conveying roller 16 has a disk shape and is fixed to a pair of both ends of the rotary support shaft 18, or a plurality of the conveying rollers 16 are fixed to the both ends and the center of the rotary support shaft 18, for example. It is. The liquid discharge nozzle 20 is provided so that the discharge port 22 faces the conveying roller 16 at a position near the conveying roller 16 and below the height position of the substrate 1 supported by the conveying roller 16. . 1, for example, the developing solution which flowed into the process tank bottom part from the surface of the board | substrate 1 from the surface of the board | substrate 1, and was collect | recovered to the recovery tank is supplied by the supply pump from a recovery tank. At this time, the pressure for supplying the developing solution to the liquid discharge nozzle 20 is set at a low pressure such that the developing solution 14 discharged from the discharge port 22 toward the conveying roller 16 does not scatter by liquid splashing.

In the period during which the discharge of the developing solution 14 directed from the discharge port 22 of the liquid discharge nozzle 20 to the transport roller 16 is being processed while transporting the substrate 1, the transport roller 16 is the lower surface of the substrate 1. At the same time, the substrate 1 is not present in the vicinity of the conveying roller 16. The developer is not discharged from the discharge port 22 of the liquid discharge nozzle 20 when the transfer roller 16 is in contact with the lower surface side of the substrate 1 and when the substrate 1 is present. In this way, when the developer is intermittently discharged, the developer containing the resist is recycled while circulating the developer containing the resist, and the resist-containing developer and the blowing bubbles discharged from the discharge port 22 of the liquid discharge nozzle 20 are separated from the substrate ( Attachment to 1) eliminates the risk of contaminating the substrate 1. On the other hand, during the period in which the substrate 1 is not conveyed, the discharge of the developing solution 14 directed from the discharge port 22 of the liquid discharge nozzle 20 to the conveying roller 16 is intermittently performed at a predetermined time. In this way, the developer is discharged intermittently at regular intervals, so that the conveyance roller 16 can be kept wet even when the substrate 1 is not being processed, thereby preventing the solidification of the resist. The usage amount can be reduced.

In the apparatus having the configuration shown in FIG. 2, the developing solution 14 is discharged from the discharge port 22 of the liquid discharge nozzle 20 toward the conveying roller 16, so that the conveying roller 16 is always wet with the developing solution 14. It becomes For this reason, even if it adheres to the conveyance roller 16 by overflowing the developing solution containing a resist, for example on the surface of the board | substrate 1, since the developing solution does not dry, the resist powder does not solidify. Therefore, the case where the conveyance roller 16 is contaminated by the solidified resist is prevented. Further, the developing solution 14 is discharged at a low pressure from the discharge port 22 of the liquid discharge nozzle 20, and at the same time, the developing solution 14 is discharged from the proximal position of the conveying roller 16 toward the conveying roller 16. It is hard to generate | occur | produce, and the developing solution 14 does not scatter widely. Therefore, even when the developer containing the resist is recycled while being recycled, the resist-containing developer does not contaminate the substrate 1 by splashing the liquid or adhere to equipment such as a sensor to cause a malfunction. In addition, since the liquid discharge nozzle 20 is provided below the height position of the substrate 1, even if a resist-containing developer flows from the discharge port 22, there is no fear that the developer will adhere onto the substrate 1. .

3 is a side view of the conveyance roller which shows another embodiment of FIG. In the embodiment shown in FIG. 3, the discharge port 22 of the liquid discharge nozzle 20 is inclined downward. As in the embodiment shown in FIG. 2, when the liquid ejection nozzles 20 are disposed so that the ejection openings 22 face upwards, the liquid overflows from the ejection openings 22 when the liquid ejection from the ejection openings 22 is stopped. In the embodiment shown in FIG. 3, there is a possibility that the liquid overflows from the discharge port 22. However, since the liquid discharge nozzle 20 is disposed downward from the height position of the substrate 1 indicated by the double-dotted line L, the resist-containing developer that overflowed from the discharge port 22 is attached onto the substrate 1. There is no worry.

Next, FIG. 4: shows the example of embodiment of 3rd invention, and is a side view which shows the conveyance roller and liquid limiting roller which are one of the components of a developing processing apparatus. The conveyance roller 24 shown in the said FIG. 4 is the conveyance roller 4c arrange | positioned in the vicinity of the exit opening 3b of the processing tank 2 among the some conveyance rollers 4a-4c of the image processing apparatus shown in FIG. To counteract.

 The liquid limiting roller 26 provided on the conveying roller 24 so as to face the conveying roller 24 has a circumferential shape whose circumferential surface is in contact with the entire width direction of the upper surface side of the substrate 1, It rotates while contacting and rotating over the whole width direction of the upper surface side of the board | substrate 1 supported and conveyed, and has the function to remove the used developer contained on the board | substrate 1 from the board | substrate 1. Then, the liquid limiting roller 26 and the discharge port 30 are located below the height position (indicated by the dashed-dotted line L in FIG. 4) of the substrate 1 which is supported by the conveying roller 24 and conveyed. ) Is disposed so that the liquid discharge nozzles 28 face each other. Similarly to the liquid discharge nozzle 20 shown in FIG. 2, the liquid discharge nozzle 28 flows, for example, a developer from the recovery tank that flows from the surface of the substrate 1 to the bottom of the processing tank and is recovered from the recovery tank. It is supplied by the supply pump. At this time, the pressure for supplying the developing solution to the liquid discharge nozzle 28 is set to a low pressure such that the developing solution 14 discharged from the discharge port 30 toward the liquid limiting roller 26 does not scatter by liquid splashing. .

The discharge of the developing solution 14 from the discharge port 30 of the liquid discharge nozzle 28 toward the conveying roller 16 is performed during the process of conveying the substrate 1, similarly to the liquid discharge nozzle 20 shown in FIG. In this case, the conveying roller 24 and the liquid limiting roller 26 are not in contact with the substrate 1, and the substrate 1 is not present in the vicinity of the conveying roller 24. When the roller 26 is in contact with the substrate 1 or when the substrate 1 is present in the vicinity, the developer is not discharged from the discharge port 30 of the liquid discharge nozzle 28. In the period in which the substrate 1 is not conveyed, the discharge of the developing solution 14 from the discharge port 30 of the liquid discharge nozzle 28 toward the liquid limiting roller 26 is intermittently performed at a predetermined time interval. do.

In the apparatus having the configuration shown in FIG. 4, the developing solution 14 is discharged from the discharge port 30 of the liquid discharge nozzle 28 toward the liquid limiting roller 26. The roller 26 is always wet with a developing solution. In addition, the developing solution 14 discharged on the circumferential surface of the liquid limiting roller 26 flows down to the circumferential surface of the lower conveying roller 24 along the circumferential surface of the liquid limiting roller 26 to thereby develop the conveying roller 24 degrees. It always gets wet. For this reason, the developer containing the resist, for example, adheres to the liquid limiting roller 26 which contacts the upper surface side of the board | substrate 1, and the resist containing developer which overflowed on the surface of the board | substrate 1 adheres to the conveyance roller 24, for example. Even if the developer is not dried, the resist powder is not solidified. Therefore, the case where the liquid limiting roller 26 and the conveying roller 24 are contaminated by the solidified resist is prevented. In addition, the developing solution 14 is discharged at a low pressure from the discharge port 30 of the liquid discharge nozzle 28, and the developing solution 14 is discharged from the position near the conveying roller 24 toward the liquid limiting roller 26. Frying hardly occurs, and the developer 14 does not scatter widely. Therefore, even when the developer containing the resist is recycled while being recycled, the resist containing developer does not contaminate the substrate 1 by splashing the liquid or adhere to devices such as sensors to cause malfunction. In addition, since the liquid discharge nozzle 28 is provided below the height position of the substrate 1, even if a resist-containing developer flows from the discharge port 30, there is no fear that the developer will adhere to the substrate 1. .

5 and 6 show a modification of the third invention, FIG. 5 is a side sectional view showing a conveying roller and a liquid limiting roller 26 which are one of the components of the developing apparatus, and FIG. 6 is the same front view. . The conveying roller 60 and liquid limiting rollers 52 and 54 shown in this FIG. 5 and FIG. 6 are the conveying roller 4c arrange | positioned near the exit side opening 3b of the processing tank 2 of the developing apparatus shown in FIG. It shows the vicinity.

In the development apparatus according to the above modification, the substrate 1 is conveyed in a horizontal posture in most regions in the processing bath 2, and the substrate 1 is inclined in the vicinity of the downstream side of the processing bath 2. It is carried out to the next process. Therefore, in the region except the downstream vicinity of the processing tank 2 (that is, the position close to the outlet side opening 3b), the substrate 1 is horizontally positioned by the conveying roller 62 fixed in the processing tank 2. Is returned. Moreover, in the area | region other than that, ie, the area | region near the exit side opening 3b, the board | substrate 1 is conveyed by the conveyance roller 60 and the liquid limiting rollers 52 and 54. As shown in FIG. The liquid limiting rollers 52, 54 are provided to form a fine gap therebetween so that the substrate 1 can pass therebetween. The conveying roller 60 and the liquid limiting rollers 52 and 54 are provided in the roller mounting members 64 and 66. As shown in FIG. 6, the roller mounting members 64 and 66 pass through the point on the extension line of the rotating shaft 68 of the liquid limiting roller 52, and make a straight line (point O in FIG. 6 parallel to the conveyance direction of a board | substrate). At the same time passing by the center of a straight line) perpendicular to the page, by the driving of the drive source not shown in the vertical direction a predetermined angle (angle a one-dot chain line a is and ^a, forming) by turning (旋回) is possibly installed.

In the state where the roller mounting members 64 and 66 are in the lowest position, as shown by the solid lines in Figs. 5A and 6, the conveying roller 60 and the liquid limiting rollers 52 and 54 are placed in the horizontal position. do. And between the liquid limiting roller 52 of the said horizontal position and the conveyance roller 60 which adjoins, the pendulum 72 of the detection apparatus 70 which detects that the board | substrate 1 was conveyed on the conveyance roller 60 is provided, have. Downstream of the pendulum 72, the liquid in the horizontal position A liquid discharge nozzle 74 for discharging the developing solution with respect to the limiting roller 54 is provided. The liquid discharge nozzle 74 is provided in the nozzle pipe 75 provided so that it may become substantially parallel with the liquid restriction roller 54 of a horizontal position in the column depth direction of FIG. Similarly to the liquid discharge nozzle 20 shown in FIG. 2, the nozzle tube 75 includes, for example, a developer that flows from the surface of the substrate 1 to the bottom of the treatment tank and is recovered from the recovery tank to the supply pump. It is supplied by. The detection apparatus 70 and the nozzle tube 75 are fixed to the processing tank 2 and installed. Moreover, the detection apparatus 76 which detects the board | substrate 1 is provided also between the uppermost side and the conveyance roller 62 among the conveyance rollers 60 provided in the roller mounting members 64,66. In the state where the roller mounting members 64 and 66 are in the uppermost position, as shown by the dashed-dotted line in FIGS. 5B and 6, the conveying roller 60 and the liquid limiting rollers 52 and 54 are The point O is inclined so as to be lower, and furthermore, those conveying rollers 60 and the liquid limiting rollers 52 and 54 have their lowest positions higher than the nozzles 75. In addition, in FIG.5 (b), inclination of a depth direction roller is not considered and represented.

The operation of the developing apparatus is as follows. In the developing apparatus, the substrate 1 is loaded horizontally from the inlet opening (not shown in FIG. 5) of the processing tank 2, and the developer discharged from the developer discharge nozzle 5 is placed on the substrate 1. It is conveyed to the downstream by the conveyance roller 62 in the horizontal posture state, developing in that state. At this time, the roller mounting members 64 and 66 are in the lowest position, and the conveying roller 60 and the liquid limiting rollers 52 and 54 are in the horizontal position. At this time, the developer is discharged from the liquid discharge nozzle 74, and the discharged developer is caught by the liquid limiting roller 54, and the liquid limiting roller 54 is kept wet with the developer. Further, the liquid limiting roller 52 under the liquid limiting roller 54 is also kept wet with the developer flowing down from the liquid limiting roller 54. For this reason, the liquid limiting rollers 52 and 54 do not dry, and the resist powder does not solidify.

And when the board | substrate 1 is conveyed and the pendulum 78 of the detection apparatus 76 is moved, discharge of the developing solution from the liquid discharge nozzle 74 is stopped. This is because when the substrate 1 continues to discharge the developer from the liquid discharge nozzle 74, the spray of the discharged developer may be caught on the substrate 1 and cause defects such as processing stains. When the substrate 1 is conveyed again and the pendulum 72 of the detection apparatus 70 is moved again, the rotational driving of the conveying roller 60 is stopped, and the substrate 1 stops on the conveying roller 60. Then, after that, the drive source is driven to raise the roller mounting members 64 and 66 so that the conveyance roller 60 is inclined so that the point O is lowered, and the substrate 1 on which it is also inclined is inclined. As a result, most of the developer contained on the substrate 1 flows downward and is approximately liquid limited. Then, when most of the liquid flows down, the conveying roller 60 and the liquid limiting rollers 52 and 54 are rotated again, and the substrate 1 is conveyed downward in the inclined posture, and formed in accordance with the position of the inclined posture. It is carried out from the exit side opening 3b, and is conveyed to the next process. At this time, since the roller mounting members 64 and 66 are raised, the pendulum 72 of the liquid discharge nozzle 74 and the detection apparatus 70 is located below the conveyance roller 60, and the board | substrate 1 Does not interfere with the conveyance of the liquid crystal. Moreover, even if the liquid leaks out of the liquid discharge nozzle 74, it does not adhere to the substrate 1. When the substrate 1 is taken out from the outlet opening 3b, the roller mounting members 64 and 66 descend to wait for the next substrate.

7 is a cross-sectional view showing an example of the fourth invention embodiment and showing the bottom of a processing tank that is a component of a developing apparatus. In the apparatus shown in FIG. 7, the liquid discharge nozzle 36 with the discharge port 38 facing the inner bottom face 34 is provided on the inclined upper portion of the inclined inner bottom face 34 of the treatment tank 32. The developer discharged from the recovery tank is supplied to the liquid discharge nozzle 36 by, for example, flowing from the surface of the substrate 1 to the bottom of the treatment tank and recovered in the recovery tank.

In the apparatus with the structure shown in FIG. 7, the developing solution 14 is discharged from the discharge port 38 of the liquid discharge nozzle 36 to the inclined direction upper part of the inner bottom surface 34 of the processing tank 32, and the said discharge is performed. The developed developer 14 flows down the inner bottom 34 according to the inclination of the inner bottom 34. For this reason, the entire inner bottom 34 is always wetted with the developing solution 14. Therefore, even if the developer containing the resist overflows on the inner bottom surface 34 from the surface of the substrate 1, the developer does not dry out, so that the resist powder does not solidify. Contamination of the inner bottom surface 34 of 32 is prevented.

In addition, in the above-mentioned description, although the development processing apparatus was demonstrated, this invention is applicable also to the substrate processing apparatus which processes washing | cleaning, an etching, and a thin film.

When the substrate processing apparatus of each invention of Claims 1-3 is used, when a process liquid is supplied to a board | substrate and a board | substrate is processed while conveying a board | substrate in a processing tank, it solidifies like a developing solution containing a resist. It is possible to prevent the conveying roller or the upper roller and the conveying roller from being contaminated by the treatment liquid containing the same, and to prevent contamination of the substrate, malfunction of the apparatus, and the like. In addition, since it is not necessary to frequently perform internal cleaning of the treatment tank, there is no case that the treatment efficiency is lowered or the complexity of the work is caused.

In the substrate processing apparatus of the invention according to claim 4, even when the conveying roller and the upper roller are located above and below, even if the developing solution containing the processing liquid, for example, the resist flows from the discharge port of the liquid discharging means, There is no fear to be attached on top.

In the substrate processing apparatus of Claim 5, a conveyance roller and an upper roller move between an upper position and a lower position by rocking in a perpendicular surface, and in the upper position, the board | substrate supported by a conveying roller inclines. As a result, a part of the processing liquid flows off from the surface of the substrate and is removed.

In the substrate processing apparatus of the invention according to claim 6, even if a resist-containing developer is adhered to the circumferential surface of the liquid-limiting roller when the developing solution containing the processing liquid, for example, a resist is removed from the substrate by the liquid-limiting roller, the liquid-limiting roller is limited. It is possible to prevent the resist powder from solidifying on the circumferential surface of the roller.

In the substrate processing apparatus according to the seventh aspect, liquid splashing is less likely to occur, and scattering of the wet solution can be more effectively suppressed.

In the substrate processing apparatus of the invention according to claim 8, for example, when the developer containing the resist is recycled as a wet solution, the substrate may be contaminated by the resist containing developer discharged from the discharge port of the liquid discharge means. Can be eliminated.

In the substrate processing apparatus of the invention according to claim 9, the amount of the wet solution can be reduced while preventing the conveying roller, the upper roller, and the conveying roller from being contaminated.

When the substrate processing apparatus of the invention according to claim 10 is used, when the processing liquid is supplied to the substrate while the substrate is being conveyed in the processing tank, the substrate contains a solidified component, such as a developer containing a resist. It is possible to prevent contamination of the inner bottom surface of the treatment tank by the liquid, and to prevent contamination of the substrate and malfunction of the equipment. In addition, since it is not necessary to frequently clean the inside of the treatment tank, there is no case that the treatment efficiency is lowered or the complexity of the work is caused.

1 shows an example of an embodiment of the first invention, and is a side view showing one of the conveying rollers, which is one of the components of the developing apparatus, in a partial cross section.

Fig. 2 shows an example of the second invention and is a side view showing one of the conveying rollers which is one of the components of the developing apparatus.

It is a side view of the roller which shows another embodiment of 2nd invention.

4 shows an example of the embodiment of the third invention, and is a side view showing a conveying roller and a liquid limiting roller which are one of the components of the developing apparatus.

Fig. 5 is a side sectional view showing a modification of the third invention and showing a conveying roller and a liquid limiting roller which are one of the components of the developing apparatus.

FIG. 6 is a front view of the liquid limiting roller shown in FIG. 5. FIG.

7 shows an example of the embodiment of the fourth invention, and is a cross-sectional view showing a bottom portion of a treatment tank that is a component of a developing apparatus.

8 is a schematic view showing an example of a schematic configuration of a developing apparatus.

(Explanation of the sign)

1 ... substrate 2, 32 ... processing tank

10,16,24,60,62 ... conveying roller 12 ... liquid storage container

14 ... developer 20, 28, 36 ... liquid discharge nozzle

22, 30, 38 ... discharge port of liquid discharge nozzle 26 ... liquid limiting roller

34 ... inner bottom of treatment tank 52, 54 ... liquid limiting roller

64.66 ... roller mounting member 70, 76 ... detection device

74 ... liquid discharge nozzle 75 ... nozzle tube

Claims (11)

In the substrate processing apparatus which processes a board | substrate with a process liquid, conveying a board | substrate in a processing tank, A liquid storage container is provided directly under the conveying roller 10 that contacts and lowers the substrate to support and convey the substrate, and wets the component to be solidified in the processing liquid into the liquid storage container. And a liquid supply means for supplying a solution to fill the liquid storage container with a wet solution at all times, and immersing a part of the circumferential surface of the conveying roller in the wet solution filled in the liquid storage container. Substrate processing apparatus. In the substrate processing apparatus which processes a board | substrate with a process liquid, conveying a board | substrate in a processing tank, The liquid discharge means is provided so that the discharge port faces the conveying roller downward from the height position of the substrate supported by the conveying roller while being close to the conveying roller that supports and conveys the substrate in contact with the lower surface side of the substrate. And a liquid supply means for supplying the wet solution to the means. In the substrate processing apparatus which processes a board | substrate with a process liquid, conveying a board | substrate in a processing tank, It is in the vicinity of the conveying roller which is in contact with the lower surface side of the substrate and is supported by the conveying roller and installed below the height position of the substrate supported by the conveying roller, directly above the conveying roller. And a liquid supply means for supplying a wet solution to the liquid ejecting means, the liquid ejecting means being provided so that the upper roller contacting the upper surface side of the substrate to be conveyed and the ejection port face each other. The method of claim 3, wherein The conveying roller and the upper roller are movably supported between an upper position and a lower position, and the liquid ejecting means is located from a height position of a substrate supported by the conveying roller when the conveying roller and the upper roller are positioned upward. When the conveying roller and the upper roller are positioned downward, the conveying roller is located at the same level as other conveying rollers installed upstream in the conveying direction of the substrate, and at the same time, the conveying roller and the upper roller Substrate processing apparatus, characterized in that the substrate is controlled so as not to contact. The method of claim 4, wherein The conveying roller and the upper roller are supported so as to oscillate in the vertical plane about one point on the extension line of the axis line of the conveying roller, and move between an upper position inclined posture and a lower position in horizontal posture. Substrate processing apparatus. The method of claim 5, The conveying roller and the upper roller are liquid limiting rollers, and are supported between the liquid limiting rollers and the other conveying rollers so as to move between the upper limiting position and the lower position integrally with the liquid limiting roller and beneath the substrate. A substrate processing apparatus characterized by comprising a plurality of conveying rollers for supporting and conveying a substrate in contact with the surface. The method according to any one of claims 2 to 6, And the liquid supply means supplies the wet solution to the liquid discharge means at a low pressure such that the wet solution discharged from the discharge port toward the conveying roller does not scatter by liquid splashing. The method according to any one of claims 2 to 6, During the period of conveying the substrate and processing the substrate, when the conveying roller is not in contact with the lower side of the substrate, the wet solution is discharged from the discharge port of the discharging means, and the conveying roller is in contact with the lower side of the substrate. Wherein the wet solution is intermittently supplied from the liquid supply means to the liquid discharge means so as not to discharge the wet solution from the discharge port of the liquid discharge means, and not to discharge the wet solution from the liquid supply means. Device. The method of claim 8, The substrate processing apparatus characterized by supplying a wet solution intermittently every fixed time from said liquid supply means to said liquid discharge means in a period in which the substrate is not conveyed. In the substrate processing apparatus which processes a board | substrate with a process liquid, conveying a board | substrate in a processing tank, And a liquid supply means for discharging the wet solution onto the inclined inner bottom surface of the treatment tank at an upper portion in the inclined direction of the inner bottom surface and supplying the wet solution to the liquid discharging means. Substrate processing apparatus. The method of claim 1, The substrate processing apparatus characterized by supplying a process liquid from the upper surface side of the board | substrate conveyed in the said processing tank, and processing of the board | substrate.