JP2003229356A - Substrate treatment device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress treatment liquid from bubbling at the lower part of a treatment tub of a substrate treatment device in which the treatment liquid is supplied from above the substrate in the treatment tub. <P>SOLUTION: A development device 3 comprises a buffer plate 35 below a transfer line H. A part of development liquid, which is supplied from a development liquid supply pipe 33, that is supplied to a part where no substrate exists collides with the buffer plate 35 to reduce its speed, so that the speed with which hitting occurs against the development tub 31 or the development liquid held in the development tub 312 is reduced. Thus, bubbling of development liquid is suppressed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for carrying out a treatment by supplying a treatment liquid to the surface of a thin substrate (hereinafter simply referred to as "substrate") such as a semiconductor substrate or a glass substrate for liquid crystal or photomask. Regarding a processing device.

[0002]

2. Description of the Related Art For example, a substrate processing apparatus for supplying a processing liquid to a rectangular substrate for liquid crystal display to perform processing is shown in FIG.

That is, the substrate processing apparatus 901 supports the substrate S in a horizontal posture, and is provided above the transport line and a transport roller 902 that horizontally transports the substrate S at a predetermined altitude (referred to as a transport line). It has a spray pipe 903 for supplying the processing liquid to the substrate S and a processing tank 904 for receiving the processing liquid below the transfer line. A drain pipe 905 is connected to the processing tank 904,
The processing liquid received by the flow-down.

In such a substrate processing apparatus 901, while the substrate S is being conveyed by the conveying roller 902, the spray pipe 9
The treatment liquid is supplied from 03.

[0005]

By the way, in the substrate processing apparatus 901, while the substrate S is being transferred, the processing liquid is continuously supplied from the spray pipe 903. Therefore, in the portion below the spray pipe 903 where the substrate S has not reached or where the substrate S has passed, that is, the portion where the substrate does not exist on the transport roller 902, the supplied processing liquid contains the processing liquid 904. Inner surface or processing tank 90
It will hit the treatment liquid staying in No. 4.

Then, the supplied processing liquid foams. When a large amount of this bubble is generated, the substrate S on the transport roller 902 is also pushed up, which may cause transport failure.

In order to prevent this, a means for preventing the substrate S from being lifted by providing a pressing roller for pressing the substrate above the substrate S can be considered, but in the portion where the pressing roller is present, the processing on the substrate S is performed. There is also a problem that the supply of the liquid becomes non-uniform and the processing liquid remaining on the pressing roller is transferred to the substrate, so that it becomes impossible to ensure the uniformity of the processing.

An object of the present invention is to suppress foaming of the processing liquid in the processing tank in the substrate processing apparatus which supplies the processing liquid from above the substrate.

[0009]

According to a first aspect of the present invention, there is provided a supporting means for supporting a substrate, a processing liquid supplying means for supplying a processing liquid to the substrate from above the substrate, and a processing liquid supplying means below the substrate. A substrate processing apparatus comprising: a processing bath for receiving a processing liquid; and a buffering device that is below the substrate and relaxes a falling speed of the processing liquid by hitting the processing liquid toward the processing bath. is there.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the buffer means has a buffer surface for hitting the processing liquid supplied from the processing liquid supply means, and the buffer surface is with respect to a horizontal plane. The substrate processing apparatus is characterized by being inclined.

According to a third aspect of the present invention, in the substrate processing apparatus according to the second aspect, the buffering means has a plurality of buffering surfaces, and the buffering surfaces are arranged at intervals in the horizontal direction. The substrate processing apparatus.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to the third aspect, the buffering means has a buffering member having a buffering surface inclined with respect to a horizontal plane, and the buffering members are horizontally spaced from each other. The substrate processing apparatus is characterized in that

According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the buffer member is a plate-shaped buffer plate extending in a horizontal direction, and the buffer plate is inclined with respect to a horizontal plane. The substrate processing apparatus is characterized in that the substrate processing apparatus is arranged in the above-described state, and is also arranged at intervals in the horizontal direction.

The invention according to claim 6 is the substrate processing apparatus according to any one of claims 1 to 5, wherein the processing solution is a developing solution.

[0015]

1 shows a substrate processing system 1 according to the present invention. In the substrate processing system 1, a coating device coats a photoresist (hereinafter referred to as a resist) to form a resist film, an exposure device exposes a pattern on the resist film, and a heating device optionally exposes the resist film. The development processing is performed on the substrate which has been baked.

The substrate processing system 1 includes an inlet transfer device 2 for receiving a substrate S from the outside, a developing device 3 for supplying a developing solution to the substrate S to perform a developing process, and water for supplying the substrate S to remove the developing solution. At the same time, it has a water washing device 4 for removing unnecessary substances generated in the development process from the substrate S, and an outlet transport device 5 for delivering the substrate S to the outside.

<Inlet Conveying Device> The inlet conveying device 2 is a housing 2
1 has a plurality of transport rollers 22. The transport roller 22 is a roller that is orthogonal to the transport direction D of the substrate S and has a rotation axis arranged in the horizontal direction, and the plurality of transport rollers 22 are arranged such that their rotation axes are parallel to each other. Further, the arrangement heights of the plurality of transport rollers 22 are set so as to support the substrate S in a horizontal posture on the transport line H set to a predetermined height. In the entrance transport device 2, the loaded substrate S is supported in a horizontal posture and is transported in the horizontal direction along the transport direction D. Then, the substrate S is transferred to the developing device 3.

<Developing device> The developing device 3 includes a developing tank 31, a conveying roller 32, a developing solution supply pipe 33, a discharging tube 34, and a buffer plate 35.
Have and. The developing device 3 corresponds to the substrate processing apparatus of the present invention.

The developing tank 31 as a processing tank has a substantially box shape.
The lower part has a saucer shape capable of storing the developing solution, and further, the lower part has a bottom surface which becomes lower toward the drainage pipe 34.

Similar to the transport roller 22, the transport roller 32 as a support means is a roller that is orthogonal to the transport direction D and has a rotating shaft arranged in the horizontal direction, and the rotating shafts are arranged in parallel with each other. ing. Further, the arrangement heights of the plurality of conveyance rollers 32 are set so as to support the substrate S in a horizontal posture on a predetermined conveyance line H.

A developing solution supply pipe as a processing solution supply means
The reference numeral 33 is provided above the substrate S transferred on the transfer line H and has a plurality of nozzles 33a. Nozzle 33 here
a is in the form of mist or droplets and is supplied by diffusing the developing solution downward. Further, a developing solution supply source (not shown) for sending the developing solution as a processing solution is connected to the developing solution supply pipe 33.

The drainage pipe 34 is connected to the lowermost portion of the bottom surface of the developing tank 31, and drains the developing solution stored in the developing tank 31 to the outside. The discharged developing solution is discarded, or if necessary, recovered by the developing solution supply source and reused.

A plurality of buffer plates 35 as buffer means are provided below the transfer line H, that is, below the substrate S to be transferred. Details of the buffer plate 35 will be described later.
The cushion plate 35 corresponds to a cushion member.

<Water Washing Device> The water washing device has a water washing tank 41, a conveying roller 42, a washing water supply pipe 43, and a drainage pipe 44.

The washing tank 41 has a box-like shape, a lower portion thereof has a saucer shape, and the lower portion has a bottom surface which is lowered toward the drainage pipe 44.

The carrying roller 42 is similar to the carrying roller 22.
The rollers are orthogonal to the transporting direction D and have rotating shafts arranged in a horizontal direction, and the rotating shafts are arranged in parallel with each other. Further, the arrangement heights of the plurality of conveyance rollers 32 are set so as to support the substrate S in a horizontal posture on a predetermined conveyance line H.

The flush water supply pipe 43 is provided above and below the substrate S transported on the transport line H, and has a plurality of nozzles 43a. The nozzle 43a here diffuses and supplies mist-like or droplet-like washing water in the direction of the substrate S. Further, a flush water supply source (not shown) for feeding flush water is connected to the flush water supply pipe 43.

The drainage pipe 44 is connected to the lowermost portion of the bottom surface of the washing tank 41 and discharges the washing water stored in the washing tank 41 to the outside. The discharged washing water is either discarded or, if necessary, recovered and reused in the washing water supply source.

<Exit Transport Device> The exit transport device 5 is a housing 5
A plurality of transport rollers 51 and an air knife 53 are provided in one unit. The transport roller 51 is a roller that is orthogonal to the transport direction D of the substrate S and has a rotation axis arranged in the horizontal direction, and the plurality of transport rollers 51 are arranged such that their rotation axes are parallel to each other. Further, the arrangement heights of the plurality of conveyance rollers 51 are set so as to support the substrate S in a horizontal posture on a predetermined conveyance line H. Air knife 5 as a drying means
Reference numeral 3 denotes a high-pressure gas (air or inert gas) jetted from a slit-shaped long hole, in a state where the long hole is arranged in a direction inclined with respect to the transport direction D in a horizontal plane. is set up. A pair of upper and lower air knives 53 are provided with the transport line H interposed therebetween.

In the outlet transfer device 5, the substrate S carried out from the water washing device 4 is supported in a horizontal posture and is horizontally transferred along the transfer direction D. Then, the air knife 53 blows off water present on both front and back surfaces of the substrate S to dry it, and
The substrate S is passed to the outside.

<Buffer Unit> FIG. 2 is a partially enlarged view of the developing device 3. Note that, for convenience, the illustration of the transport roller 32 is omitted. The buffer plate 35 is a plate-shaped member which is orthogonal to the transport direction D and whose longitudinal direction is arranged in a horizontal direction, and the main surface 35a thereof is arranged in a state of being inclined by 45 degrees with respect to the horizontal plane.

The intervals between the plurality of cushioning plates 35 in the transport direction are such that they overlap each other in a top view (when viewed in a direction orthogonal to the horizontal plane).

The main surface 35a corresponds to the buffer surface referred to in the present invention. Further, the main surface refers to a surface facing the direction in which the processing liquid arrives, and here refers to a surface of the buffer plate 35 facing upward.

<Operation of Substrate Processing System> In the substrate processing system 1 having the above-described structure, the resist film is formed on the surface, and the substrate S having the resist film subjected to the exposure processing is carried into the entrance transfer device 2. It In the entrance transport device 2, the loaded substrate S is carried into the developing device 3 by the transport roller 22.

In the developing device 3, the substrate S is horizontally supported by the transport roller 32 and horizontally transported in the transport direction D. On the other hand, the developing solution is discharged from the developing solution supply pipe 33 and supplied to the surface of the substrate S to be transported. The processing in the developing device 3 will be described later.

The substrate S processed by the developing device 3 is conveyed to the water washing device 4 by the conveying roller 32, and in the water washing device 4, the substrate S is horizontally supported by the conveying roller 42 and horizontally along the conveying direction D. Transport. On the other hand, the wash water is discharged from the wash water supply pipe 43 and supplied to both the upper and lower surfaces of the substrate S being conveyed. This makes it possible to wash away the developer adhering to the substrate and the residue generated by the development.

The substrate S processed by the water washing device 4 is conveyed by the conveying roller 52 to the exit conveying device 6. In the outlet transport device 6, gas is blown from both sides of the substrate S from an air knife to blow off moisture adhering to the substrate S to dry it. The dried substrate S is delivered from the exit carrier 6 to the outside.

<Details of Processing in Developing Device> As shown in FIG. 2, in the developing device 3, the developing solution is supplied from the developing solution supply pipe 33. In the portion where the substrate S does not exist on the transport rollers 32, the supplied developing solution passes between the transport rollers 32 and drops toward the buffer plate 35. And the buffer plate 3
The developer having reached 5 hits the main surface 35a of the buffer plate 35, the falling speed thereof becomes slower, and the developer flows down along the main surface 35a. Then, the developer that has flowed down falls into the developing tank 31 from the lower end of the buffer plate 35. Since the falling developer is slower than the speed when it is supplied from the developer supply pipe 33, the speed at which the developer hits the developer tank 31 or the developer stored in the developer tank 31 also becomes slow. There is. Therefore, it is possible to prevent the developer from hitting the developer tank 31 or the developer solution stored in the developer tank 31 to generate bubbles. In addition, since the intervals between the plurality of buffer plates 35 in the transport direction are such that they overlap each other in a top view, the developer supplied from the developer supply pipe 33 does not hit the plurality of buffer plates 35, and buffers the buffer plates 35. Passing through the gap between the plates 35 is suppressed. Therefore, the generation of bubbles can be effectively suppressed.

In the developing device 3, the supply of the developing solution is stopped when the developing solution is deposited on the substrate S,
There is also a processing method called "paddle processing" in which the development processing is performed by reciprocating the substrate in the developing tank 31 along the stationary or transportation direction D, but in order to shorten the processing time, the substrate S is moved in the stationary or transportation direction. There is also a process of feeding along the D or reciprocating along the feeding direction D in the developing tank 31 and continuously supplying from the developer supply pipe 33 (referred to as continuous feeding process).

The present invention is more effective in such a continuous supply process. That is, when the developing solution is continuously supplied, it takes a long time to supply the developing solution to a portion of the transport roller 32 where the substrate S does not exist. For this reason, the amount of the developing solution that reaches below the transport line H increases, so that bubbling tends to occur in the lower part of the developing tank 31. However, in the present invention, since the buffer plate 35 is provided, the generation of bubbles can be suppressed.

When the resist film is a color resist, a continuous supply process is often used. This is because the color resist is better developed in the continuous supply process than in the paddle process. Therefore, the present invention produces a great effect during the development processing of the color resist.

<Modification> In the above embodiment, the developing device is taken as an example, but it may be a cleaning device, a peeling device, or an etching device. In the case of the cleaning device, in the developing device 3, a developing solution supply pipe 33 is used as a processing solution supply means.
A cleaning liquid supply pipe having the same structure as described above will be provided.
At this time, the cleaning liquid is supplied from the cleaning liquid supply pipe.

The peeling device is a device for removing the resist film from the substrate on which the resist film is formed. That is, in a liquid crystal or semiconductor manufacturing process, a resist solution is applied to a substrate to form a resist film, the resist film is subjected to pattern exposure, and then development is performed to form a pattern of the resist film, and the resist film is used as a mask. The thin film below the resist film is etched. After that, the resist film used as the mask is removed, but at this time, the peeling device is used. In this peeling device, in the developing device 3, a peeling liquid supply pipe having the same structure as the developing liquid supply pipe 33 is provided as a processing liquid supply means. Further, a stripping solution that dissolves the resist is supplied from the stripping solution supply pipe.

In the case of an etching device, in the developing device 3, a developing solution supply pipe 33 is used as a processing solution supply means.
An etching solution supply pipe having the same structure as described above will be provided. At this time, a chemical liquid for etching (such as hydrofluoric acid) is supplied from the etching liquid supply pipe.

In the above embodiment, a plurality of buffer plates 35 are used.
Overlap with each other in a top view, but they do not have to overlap.

In the above embodiment, the main surface 35a of the buffer plate 35 is used.
Is placed at a 45 degree angle to the horizontal plane,
The effect of the present invention can be obtained if it is tilted at least with respect to the horizontal plane.

In the above embodiment, the main surface 3 of the buffer plate 35 is used.
5a was a plane. That is, although the main surface has a straight line in the vertical section (the locus of the main surface intersecting the vertical surface), it may be curved in the vertical section like the main surface 36a of the buffer plate 36 in FIG. That is, the main surface 36a may be a curve whose vertical cross section is concave toward the direction in which the processing liquid arrives.
The main surface may be a curve whose vertical cross section is convex in the direction in which the processing liquid arrives.

Further, instead of the buffer plate 35, a columnar buffer rod may be provided as a buffer means.

Further, although the longitudinal direction of the buffer plate 35 is arranged in the direction orthogonal to the carrying direction D, it may be inclined with respect to the carrying direction D or may be parallel to the carrying direction D. .

Although the longitudinal direction of the buffer plate 35 is arranged horizontally, it may be inclined with respect to the horizontal plane.

Further, the buffer plate 35 may be provided at least at the portion below the transport line H where the developing solution reaches, but it is more preferable if it is provided at all the portion where the developing solution reaches.

Further, although the substrate processing system 1 of the present embodiment conveys the substrate S in a horizontal posture, the substrate S may be conveyed in a state of being inclined with respect to the horizontal plane.

According to the substrate processing apparatus of the present invention, it is possible to suppress the foaming of the processing liquid in the processing tank, and to reliably process the substrate.

[Brief description of drawings]

FIG. 1 is a front view of a substrate processing system 1.

FIG. 2 is a diagram showing details of a developing device 3.

FIG. 3 is a diagram showing a buffer plate 36.

FIG. 4 is a diagram showing a conventional substrate processing apparatus.

[Explanation of symbols]

1 Substrate processing system 2 entrance carrier 3 developing device 4 water washing device 5 exit carrier 21, 51 housing 22, 32, 42, 52 Conveyor rollers 31 developing tank 33 Developer Supply Pipe 34, 44 drainage pipe 35, 36 buffer plate 35a, 36a main surface 41 Washing tank 43 Rinsing water supply pipe 53 Air knife 901 Substrate processing apparatus 902 Conveyor roller 903 spray pipe 904 treatment tank 905 drain H transport line S board

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takayoshi Takishita             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company F-term (reference) 2H096 AA25 GA23                 4F040 AA02 AA12 AA14 AB14 AC01                       BA38                 5F031 CA02 CA05 FA01 FA02 FA07                       FA15 GA53 MA23 MA24 MA26                       MA27 PA30                 5F046 LA11

Claims (6)

[Claims] 1. A support means for supporting a substrate, a processing liquid supply means for supplying a processing liquid to the substrate from above the substrate, a processing tank for receiving the processing liquid below the substrate, and a processing tank above the substrate. A substrate processing apparatus, comprising: a buffer unit that is provided below to absorb a processing liquid that advances toward a processing tank to reduce a falling speed of the processing liquid. 2. The substrate processing apparatus according to claim 1, wherein the buffering means has a buffering surface that is in contact with the processing liquid supplied from the processing liquid supply means, and the buffering surface is inclined with respect to a horizontal plane. And a substrate processing apparatus. 3. The substrate processing apparatus according to claim 2, wherein the buffering means has a plurality of buffering surfaces, and the buffering surfaces are arranged at intervals in the horizontal direction. 4. The substrate processing apparatus according to claim 3, wherein the buffering means has a buffering member having a buffering surface inclined with respect to a horizontal plane, and the buffering members are arranged at intervals in the horizontal direction. And a substrate processing apparatus. 5. The substrate processing apparatus according to claim 4, wherein the buffer member is a plate-shaped buffer plate extending in a horizontal direction, and the buffer plate is arranged in a state inclined with respect to a horizontal plane. In addition, the substrate processing apparatus is characterized in that it is arranged at intervals in the horizontal direction. 6. The substrate processing apparatus according to claim 1, wherein the processing solution is a developing solution.